CN107123627B - Device and method for enhancing heat transfer by spraying cooling active induced bubble in single-phase region - Google Patents
Device and method for enhancing heat transfer by spraying cooling active induced bubble in single-phase region Download PDFInfo
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- CN107123627B CN107123627B CN201710429958.6A CN201710429958A CN107123627B CN 107123627 B CN107123627 B CN 107123627B CN 201710429958 A CN201710429958 A CN 201710429958A CN 107123627 B CN107123627 B CN 107123627B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A device and a method for enhancing heat transfer by spraying and cooling active induced bubbles in a single-phase region belong to the field of enhancing heat transfer by high heat flux density and mainly solve the problem of enhancing heat transfer by spraying and cooling in the single-phase region. The device comprises a first electromagnetic valve, a nozzle, a porous high-heat-conductivity material, an air inlet loop, a gas channel, a heat sink surface, a second electromagnetic valve, a controller and related pipeline accessories. The device uses the mechanism of strengthening heat transfer by using the two-phase region spray cooling to nucleate bubbles, a gas channel and a porous high heat conduction material are arranged on the surface of a heat sink in the single-phase region spray cooling process, the pulse control of a controller on a second electromagnetic valve is combined, the pulse high-frequency air supply on the surface of the heat sink is realized, the bubbles are actively induced in a liquid film, the spray liquid drops are utilized to quickly break the bubbles to form a vacuum region, the liquid film is caused to turbulent motion at a high speed, and the heat exchange is strengthened. Compared with the conventional single-phase area spray cooling method, the method provided by the invention has the advantages of uniform bubble generation and high heat transfer coefficient.
Description
Technical Field
The invention relates to the field of enhanced heat transfer of high heat flux density, in particular to a device and a method for enhancing heat transfer of active induced bubble by single-phase region spray cooling.
Background
The spray cooling is used as a high-efficiency high-heat-flux heat dissipation mode, and has wide application prospect under the heat dissipation conditions of high-heat flux density, such as high-power laser weapons, high-integration electronic components and the like. The two-phase zone spray cooling process was investigated to include four heat transfer mechanisms (as shown in fig. 4): the liquid drop hits the surface to exchange heat, the liquid film washes the surface to exchange heat, the surface exchanges heat with the environment, the boiling heat exchange in the liquid film (wherein the boiling bubble is divided into wall surface nucleation bubble and secondary nucleation bubble). One of the main factors in the two-phase region spray cooling over the single-phase region is the nucleation of bubbles. The mechanism of nucleation bubble enhanced heat transfer is: the quantity of the spray cooling nucleation bubbles is large, and a vacuum area formed by breaking the nucleation bubbles by spray liquid drops induces high-speed turbulence of the liquid film, so that heat exchange between the surface of the heat sink and the liquid film is enhanced.
It is generally believed that when the temperature of the electronic component reaches above 80 ℃, its working capacity will drop rapidly until it fails, which results in failure of the refrigerant, represented by water, to achieve spray cooling heat exchange in the two-phase region under normal pressure conditions. The patent is intended to be based on an enhanced heat transfer mechanism of nucleation bubbles, adopts a pulse gas injection mode in the spray cooling process of a single-phase region, actively promotes bubbles in a liquid film, and enhances the spray cooling performance of the single-phase region.
Disclosure of Invention
In order to solve the problems of the spray cooling in the single-phase area and the spray cooling in the two-phase area, the invention provides a device and a method for enhancing heat transfer by spraying cooling in the single-phase area and actively accelerating bubble generation.
According to the invention, the number of the nozzles is 1-5, the number of the nozzles can be 1 or more according to the heat dissipation area of a heat source, and the plurality of nozzles adopt dot matrix layout to ensure the overall coverage of a spray area on the heat dissipation surface.
According to the invention, the air inlet loop is tangent to the air inlet, and the air inlet is tangent to the air inlet loop, so that uniform flow distribution is ensured when the air in the air inlet loop enters each air channel.
According to the invention, the number of the gas channels is 1-10, and on the premise that the gas resistance meets the requirement and the flow distribution is uniform, the diameters of the channels are not too large and the number of the channels is not too large, so that the heat of a heat source is prevented from causing excessive heat resistance in the transmission process, and the rapid heat dissipation is influenced.
According to the invention, the controller controls the first electromagnetic valve to be opened and closed through a switching signal, controls the second electromagnetic valve to be opened and closed through a pulse signal, and determines whether the second electromagnetic valve is opened or not by collecting the signal of the first electromagnetic valve; when the electromagnetic valve II is opened, the controller gives out a pulse signal to control the electromagnetic valve II to intermittently feed air at high frequency, so that the phenomenon that air cannot bubble in a liquid film during continuous air feeding is prevented.
The invention provides a method for using a device for enhancing heat transfer by actively accelerating bubble generation through spray cooling in a single-phase region.
The invention relates to a device and a method for enhancing heat transfer by spraying and cooling active induced bubbles in a single-phase region, which are used for enhancing the heat transfer by spraying and cooling nucleation bubbles in a two-phase region. Compared with the conventional single-phase area spray cooling method, the method provided by the invention has the advantages of uniform bubble generation and high heat transfer coefficient.
Drawings
FIG. 1 is a system diagram of a single-phase region spray cooling active bubble-inducing enhanced heat transfer device of the present invention.
Fig. 2 is a surface structure diagram of a composite heat sink of the present invention.
Fig. 3 is a cross-sectional view of a composite heat sink surface structure of the present invention.
FIG. 4 is a schematic diagram of a two-phase zone spray cooling heat transfer mechanism.
Reference numerals in the drawings: 1. a first electromagnetic valve; 2. a nozzle; 3. porous high thermal conductivity material; 4. an air intake loop; 5. a gas channel; 6. a heat sink surface; 7. a second electromagnetic valve; 8. and a controller.
Detailed Description
The invention is described in further detail below with reference to the attached drawings and detailed description:
the invention provides a device and a method for enhancing heat transfer of active induced bubble by single-phase region spray cooling, which are based on an enhanced heat transfer mechanism of nucleation bubbles, adopt a pulse gas injection mode in the single-phase region spray cooling process, actively induce bubbles in a liquid film, enhance the spray cooling performance of the single-phase region, solve the problem that the spray cooling heat transfer coefficient of the single-phase region is lower than that of the two-phase region, and have the advantages of uniform induced bubbles and high heat transfer coefficient.
As shown in fig. 1, the spray cooling active bubble promoting and strengthening heat transfer device of the single-phase area in the invention is composed of a first electromagnetic valve 1, a nozzle 2, a porous high heat conduction material 3, an air inlet loop 4, a gas channel 5, a heat sink surface 6, a second electromagnetic valve 7, a controller 8 and related pipeline accessories, and the specific implementation process of the device is described by taking solid cone single-nozzle single-phase area spray cooling as an example.
The composite heat sink surface is machined to the structural form shown in fig. 2-3 according to the heat source heat dissipation area requirements. Wherein: the porous high heat conduction material 3 is embedded into the heat sink surface 6 in a vacuum diffusion welding mode, the heat conduction coefficient of the porous high heat conduction material is equivalent to that of the heat sink surface 6, and the heat of high heat flux density emitted by a heat source is effectively transferred; meanwhile, the porous high heat conduction material 3 is connected with a gas channel 5 in the heat sink surface 6, and gas overflows from the upper part of the porous high heat conduction material 3 and forms bubbles in a liquid film; the interface between the gas channel 5 and the porous high heat conduction material 3 is radial on the surface, so that the gas flow is ensured to be uniformly sent out on the surface of the porous high heat conduction material 3; the bottom of the heat sink surface is bonded with a heat source by adopting heat conducting glue.
The air inlet loop 4 is fixedly connected to the peripheral side of the heat sink surface 6 in a full-welded mode; the air inlet is tangential to the air inlet loop 4, so that the uniform flow distribution of the air in the air inlet loop 4 when the air enters each air channel 5 is ensured.
When the heat source needs to generate heat with high heat flux density due to working, the heat is conducted through the heat sink surface 6 and the porous high heat conduction material 3, at the moment, the controller 8 controls the first electromagnetic valve 1 to start the spray cooling device, atomized liquid drops reach the porous high heat conduction material 3 to form a liquid film, meanwhile, the controller 8 controls the second electromagnetic valve 7 to intermittently supply air with high frequency through pulse signals, the air flows through the air inlet loop 4, the air channel 5 and the porous high heat conduction material 3 to enter the liquid film and form bubbles, the bubbles are rapidly broken under the action of the sprayed liquid drops, and the original bubble area forms a vacuum area to induce the liquid film to strongly turbulent, so that the heat transfer coefficient of the convection surface between the liquid film and the heat surface is enhanced, and heat exchange is enhanced.
The above description is only of the preferred embodiment of the present invention, and is not intended to limit the present invention in any other way, but is intended to cover any modifications or equivalent variations according to the technical spirit of the present invention, which fall within the scope of the present invention as defined by the appended claims.
Claims (2)
1. The utility model provides a device of single-phase district spray cooling initiative induced bubble heat transfer enhancement, includes solenoid valve one (1), nozzle (2), porous high heat conduction material (3), air inlet loop (4), gas channel (5), heat sink surface (6), solenoid valve two (7) and controller (8), set up gas channel (5) and porous high heat conduction material (3) on heat sink surface (6), controller (8) pass through signal control solenoid valve one (1) and solenoid valve two (7), porous high heat conduction material (3) imbeds in heat sink surface (6) through the mode of vacuum diffusion welding, and its coefficient of heat conduction is equivalent with the coefficient of heat sink surface (6), porous high heat conduction material (3) are connected with gas channel (5) in heat sink surface (6), heat sink surface (6) top fixed mounting has nozzle (2), air inlet loop (4) are connected through solenoid valve one (1) to the intake port, and air inlet connects air inlet loop (4) through solenoid valve two (7);
1-5 nozzles (2);
the air inlet loop (4) is tangential to the air inlet;
the gas channel (5) has 1-10 pairs;
the controller (8) controls the opening and closing of the first electromagnetic valve (1) through a switch signal, and controls the opening and closing of the second electromagnetic valve (7) through a pulse signal.
2. The method for using the device for enhancing heat transfer by spraying and cooling active induced bubbles in single-phase area according to claim 1, wherein the method comprises the following steps: when the heat source needs to generate heat with high heat flux density in the working process, the heat is conducted through the heat sink surface (6) and the porous high heat conduction material (3), at the moment, the controller (8) controls the first electromagnetic valve (1) to start the spray cooling device, mist liquid drops reach the porous high heat conduction material (3) to form a liquid film, meanwhile, the controller (8) controls the second electromagnetic valve (7) to intermittently supply air with high frequency through pulse signals, the air flows through the air inlet loop (4), the air channel (5) and the porous high heat conduction material (3) to enter the liquid film and form a large number of bubbles, the bubbles are rapidly broken under the action of the spray liquid drops, the original bubble area forms a vacuum area to induce the liquid film to strongly turbulent motion, the heat transfer coefficient of the convection surface between the liquid film and the heat surface is enhanced, and heat exchange is enhanced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710429958.6A CN107123627B (en) | 2017-06-09 | 2017-06-09 | Device and method for enhancing heat transfer by spraying cooling active induced bubble in single-phase region |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710429958.6A CN107123627B (en) | 2017-06-09 | 2017-06-09 | Device and method for enhancing heat transfer by spraying cooling active induced bubble in single-phase region |
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| Publication Number | Publication Date |
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| CN107123627A CN107123627A (en) | 2017-09-01 |
| CN107123627B true CN107123627B (en) | 2023-06-30 |
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| CN109737771A (en) * | 2019-02-26 | 2019-05-10 | 南京工业大学 | A kind of airborne spray cooling system using radiant panel and loop circuit heat pipe cooling spray medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201467614U (en) * | 2009-08-12 | 2010-05-12 | 中国科学院工程热物理研究所 | High-efficiency phase-change heating device with combined spry cooling and microflute group phase-change heat exchange |
| CN202799551U (en) * | 2012-09-26 | 2013-03-13 | 上海理工大学 | Sealed spray cooling and testing device |
| CN103441422A (en) * | 2013-08-30 | 2013-12-11 | 中国人民解放军国防科学技术大学 | Device and method for high-power laser heat management based on spray evaporation |
| CN205566950U (en) * | 2016-03-18 | 2016-09-07 | 苏州大景能源科技有限公司 | Quick -witted case of integral liquid cooling heat dissipation |
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2017
- 2017-06-09 CN CN201710429958.6A patent/CN107123627B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201467614U (en) * | 2009-08-12 | 2010-05-12 | 中国科学院工程热物理研究所 | High-efficiency phase-change heating device with combined spry cooling and microflute group phase-change heat exchange |
| CN202799551U (en) * | 2012-09-26 | 2013-03-13 | 上海理工大学 | Sealed spray cooling and testing device |
| CN103441422A (en) * | 2013-08-30 | 2013-12-11 | 中国人民解放军国防科学技术大学 | Device and method for high-power laser heat management based on spray evaporation |
| CN205566950U (en) * | 2016-03-18 | 2016-09-07 | 苏州大景能源科技有限公司 | Quick -witted case of integral liquid cooling heat dissipation |
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