CN207124808U - Automatic wire bonding machine base plate self-cleaning device - Google Patents
Automatic wire bonding machine base plate self-cleaning device Download PDFInfo
- Publication number
- CN207124808U CN207124808U CN201721130103.5U CN201721130103U CN207124808U CN 207124808 U CN207124808 U CN 207124808U CN 201721130103 U CN201721130103 U CN 201721130103U CN 207124808 U CN207124808 U CN 207124808U
- Authority
- CN
- China
- Prior art keywords
- air
- pipe
- cda
- inlet pipe
- air inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 17
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 241000486406 Trachea Species 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 210000003437 trachea Anatomy 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000002347 injection Methods 0.000 abstract 3
- 239000007924 injection Substances 0.000 abstract 3
- 238000007664 blowing Methods 0.000 abstract 2
- 239000000126 substance Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Die Bonding (AREA)
Abstract
The utility model provides an automatic wire bonding machine base plate self-cleaning device, include: the air supply system comprises a CDA air inlet pipe, an electromagnetic valve, an air injection device and an air suction device, wherein the CDA air inlet pipe is provided with the electromagnetic valve, one end of the CDA air inlet pipe is connected with a compressed dry air generating device, and the air injection device and the air suction device are respectively connected with the electromagnetic valve through a No. 1 air pipe and a No. 2 air pipe; the gas injection device comprises: the air blowing pipe is connected with the air jet port at one end, far away from the No. 1 air pipe, of the air blowing pipe; the suction device includes: an air suction pipe and a vacuum generator; the air suction pipe is connected with a vacuum generator; the utility model discloses simple structure, compactness, reasonable have effectively avoided the bad problem that takes place because of the foreign matter among the bonding wire machine operation process to the bad problem and the improve equipment work rate of transferring that produce in the operation have been reduced.
Description
Technical field
The present invention relates to cleaning device, more particularly to a kind of automatic bonding equipment substrate automatic cleaning apparatus.
Background technology
In the chip mounter of semiconductor packaging chip, substrate enters the iron plate that equipment carries out chip, and baseplate material is due to making
During making process, preceding engineer operation, movement etc., foreign substances are had（The foreign substances such as substrate chip, thread）Remain on substrate,
So as to during paster product bound fraction produce bubble or chip damage occur, chip mounter without apparatus for cleaning substrate, it is difficult to
Ensureing the product of operation does not have exception.Therefore, for effectively avoid in bonding equipment operation process because foreign substances occur it is bad
The problem of, it is extremely urgent to research and develop a kind of automatic bonding equipment substrate automatic cleaning apparatus.
Utility model content
In view of the above the shortcomings that prior art, the purpose of this utility model is to provide a kind of automatic bonding equipment substrate
Automatic cleaning apparatus, solve the problems, such as in existing bonding equipment operation process because foreign substances occur it is bad, to achieve the above object
And other related purposes, the utility model provide a kind of automatic bonding equipment substrate automatic cleaning apparatus, including：CDA air inlet pipe 1,
Magnetic valve 2, air jet system and getter device, it is characterised in that magnetic valve 2 is installed, the CDA enters in the CDA air inlet pipe 1
One end of tracheae 1 is connected with compression drying air generating device 3, and the air jet system and getter device pass through No. 1 tracheae 4 respectively
It is connected with No. 2 tracheaes 5 with magnetic valve 2；
The air jet system includes：Gas blow pipe 6 and puff prot 7, the described one end of gas blow pipe 6 away from No. 1 tracheae 4 are connected with
Puff prot 7；
The getter device includes：Air intake duct 8 and vacuum generator 9；Vacuum is connected and installed with the air intake duct 8
Device 9.
Preferably, choke valve 10 is installed on the gas blow pipe 6.
Preferably, the puff prot 7 is double mesoporous metal air jet pipe.
The beneficial effects of the utility model：The utility model is simple in construction, compact, reasonable, and magnetic valve is connected with power supply, makes
Obtain compression drying air generating device to open, compressed air flows to metal tube by pipeline, so as to which compressed air is blown in base
On plate, foreign substances above are blown off, ensure the cleanliness factor of substrate；Air intake duct carries out the same of air-breathing to the foreign substances on substrate simultaneously
When the pollution sources that gas blow pipe 5 is blown afloat are siphoned away, further ensure the cleanliness factor of substrate surface, effectively avoid bonding wire machine operation mistake
In journey because foreign substances occur it is bad the problem of.
Brief description of the drawings
Fig. 1 is a kind of structural representation of automatic bonding equipment substrate automatic cleaning apparatus of the utility model
In figure：1- CDA air inlet pipe；2- magnetic valves；3- compression drying air generating devices；4-1 tracheaes 4；5-2 gas
Pipe；6- gas blow pipes；7- puff prots；8- air intake ducts；9- vacuum generators；10- choke valves.
Embodiment
It is specific embodiment of the utility model and with reference to accompanying drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these examples.
As shown in figure 1, a kind of automatic bonding equipment substrate automatic cleaning apparatus, including：CDA air inlet pipe 1, magnetic valve 2, jet
Device and getter device, it is characterised in that magnetic valve 2, one end of the CDA air inlet pipe 1 are installed in the CDA air inlet pipe 1
It is connected with compression drying air generating device 3, the air jet system and getter device pass through No. 1 tracheae 4 and No. 2 tracheaes 5 respectively
It is connected with magnetic valve 2；
The air jet system includes：Gas blow pipe 6 and puff prot 7, the described one end of gas blow pipe 6 away from No. 1 tracheae 4 are connected with
Puff prot 7；
The getter device includes：Air intake duct 8 and vacuum generator 9；Vacuum is connected and installed with the air intake duct 8
Device 9.
In the present embodiment, it is preferred that choke valve 10 is installed on the gas blow pipe 6；By adjusting the big of choke valve 10
It is small to control tolerance, avoid causing tolerance excessive.
In the present embodiment, it is preferred that the puff prot 7 is double mesoporous metal air jet pipe；Tracheae uses metal material, no
Perishable, low cost, good endurance, puff prot 7 uses double-row hole, increase cleaning area, saves cleaning time.
It the foregoing is only preferred embodiment mode of the present utility model, it is impossible to protected to limit the utility model with this
Scope, the change and replacement of any unsubstantiality that those skilled in the art is done on the basis of the utility model belong to
The utility model scope claimed.
Claims (3)
1. a kind of automatic bonding equipment substrate automatic cleaning apparatus, including：CDA air inlet pipe（1）, magnetic valve（2）, air jet system and suction
Device of air, it is characterised in that the CDA air inlet pipe（1）On magnetic valve is installed（2）, the CDA air inlet pipe（1）One end with
Compression drying air generating device（3）Connection, the air jet system and getter device pass through No. 1 tracheae respectively（4）With No. 2 tracheaes
（5）With magnetic valve（2）Connection；
The air jet system includes：Gas blow pipe（6）And puff prot（7）, the gas blow pipe（6）Away from No. 1 tracheae（4）One end connect
It is connected to puff prot（7）；
The getter device includes：Air intake duct（8）And vacuum generator（9）；The air intake duct（8）On be connected and installed with vacuum hair
Raw device（9）.
A kind of 2. automatic bonding equipment substrate automatic cleaning apparatus according to claim 1, it is characterised in that the gas blow pipe
（6）On choke valve is installed（10）.
A kind of 3. automatic bonding equipment substrate automatic cleaning apparatus according to claim 1, it is characterised in that the puff prot
（7）For double mesoporous metal air jet pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721130103.5U CN207124808U (en) | 2017-09-05 | 2017-09-05 | Automatic wire bonding machine base plate self-cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721130103.5U CN207124808U (en) | 2017-09-05 | 2017-09-05 | Automatic wire bonding machine base plate self-cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207124808U true CN207124808U (en) | 2018-03-20 |
Family
ID=61602762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721130103.5U Active CN207124808U (en) | 2017-09-05 | 2017-09-05 | Automatic wire bonding machine base plate self-cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207124808U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111097749A (en) * | 2018-10-28 | 2020-05-05 | 海太半导体（无锡）有限公司 | Automatic cleaning device for appearance detection equipment products |
| CN114571140A (en) * | 2020-12-02 | 2022-06-03 | 细美事有限公司 | Cleaning unit, welding module and welding equipment |
-
2017
- 2017-09-05 CN CN201721130103.5U patent/CN207124808U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111097749A (en) * | 2018-10-28 | 2020-05-05 | 海太半导体（无锡）有限公司 | Automatic cleaning device for appearance detection equipment products |
| CN114571140A (en) * | 2020-12-02 | 2022-06-03 | 细美事有限公司 | Cleaning unit, welding module and welding equipment |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |