CN110517997A - Electronic component cooling device - Google Patents
Electronic component cooling device Download PDFInfo
- Publication number
- CN110517997A CN110517997A CN201910896347.1A CN201910896347A CN110517997A CN 110517997 A CN110517997 A CN 110517997A CN 201910896347 A CN201910896347 A CN 201910896347A CN 110517997 A CN110517997 A CN 110517997A
- Authority
- CN
- China
- Prior art keywords
- component
- tube
- connecting tube
- liquid collecting
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 239000002826 coolant Substances 0.000 claims abstract description 16
- 239000000945 filler Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005265 energy consumption Methods 0.000 description 4
- 238000002309 gasification Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of electronic component cooling devices, it includes liquid collecting component, gas collection component, heat sink, fin component and multiple connecting tubes, is equipped with air collecting chamber in the gas collection component；It is equipped with liquid collecting cavity in the liquid collecting component, there is cooling medium in the liquid collecting cavity；The upper end of the connecting tube is connected on the gas collection component, and the lower end of the connecting tube is connected on the liquid collecting component, is equipped in the connecting tube multiple for being connected to the circulation passage of the air collecting chamber and liquid collecting cavity；Electronic component is installed on the heat sink, and is connected to the lower end of a side of the connecting tube, so that the heat transfer that generates appliance component gives the lower end of the connecting tube；The fin component is connected to the upper end of another side of the connecting tube.The present invention can be improved radiating efficiency, save space, reduces heat dissipation cost, and can be avoided damage electronic component, improves the safety of heat dissipation.
Description
Technical field
The present invention relates to a kind of electronic component cooling devices.
Background technique
Currently, the GPU on video card has been able to sending and the comparable heat of CPU with the fast development of video card technology, because
The heat dissipation of this electronic component is not only to be directed to CPU, equally has radiating requirements for high-power chip.Industry is main at present
Reach the heat dissipation of electronic component with heat sink, water-cooled radiator or mini air conditioner system, but heat sink radiating efficiency
Low, water-cooled radiator contacts leakage directly with electronic component to damage the risk of electronic component, mini air conditioner system
At high cost, occupied space is greatly, energy consumption is high.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies of existing technologies, a kind of cooling dress of electronic component is provided
It sets, it can be improved radiating efficiency, save space, reduces heat dissipation cost, and can be avoided damage electronic component, improves and dissipate
The safety of heat.
In order to solve the above-mentioned technical problem, the technical scheme is that a kind of electronic component cooling device, it includes
Liquid collecting component, gas collection component, heat sink, fin component and multiple connecting tubes, wherein
Air collecting chamber is equipped in the gas collection component；
It is equipped with liquid collecting cavity in the liquid collecting component, there is cooling medium in the liquid collecting cavity；
The upper end of the connecting tube is connected on the gas collection component, and the lower end of the connecting tube is connected to the liquid collecting portion
It is equipped on part, in the connecting tube multiple for being connected to the circulation passage of the air collecting chamber and liquid collecting cavity；
Electronic component is installed on the heat sink, and is connected to the lower end of a side of the connecting tube, so as to will be electric
The heat transfer that device component generates gives the lower end of the connecting tube；
The fin component is connected to the upper end of another side of the connecting tube.
Further for the effect for improving heat dissipation, on the length direction of the connecting tube, the heat sink and the company
The lower semisection of adapter tube is bonded, and the fin component is bonded with the upper semisection of the connecting tube.
Further for convenient for filling cooling medium, be additionally provided on the liquid collecting component it is being connected with the liquid collecting cavity plus
Geat.
A kind of concrete scheme of liquid collecting component is further provided for, the liquid collecting component is the collector tube that both ends block,
The lower end of the connecting tube is connected in turn on the collector tube along the length direction of the collector tube.
A kind of concrete scheme of gas collection component is further provided for, the gas collection component is the gas collecting tube that both ends block,
The upper end of the connecting tube is connected in turn on the gas collecting tube along the length direction of the gas collecting tube.
A kind of concrete scheme of connecting tube is further provided for, the connecting tube is flat tube, and the circulation passage is along institute
The width direction for stating flat tube is set gradually；
The heat sink is connected to the one end in the width direction of the flat tube, and the fin component is connected to the flat tube
The other end in width direction.
A kind of concrete scheme of heat sink is further provided for, the heat sink is equipped with to be corresponded with the flat tube
And the fitting groove being adapted to corresponding flat tube, the one end scarf of the width direction of the flat tube is in corresponding fitting groove.
Further for heat dissipation effect is improved, in the width direction of the flat tube, the flat tube is fitted in the assembly
Part in slot accounts for the 1/3 of the width of the flat tube.
A kind of concrete scheme of fin component is further provided for, the fin component includes several fins；
The flat tube is connected in turn between the liquid collecting component and gas collection component, is connected between two flat tubes of arbitrary neighborhood
One fin, the fin fit with the other end in the width direction of two flat tubes.
Further for heat dissipation effect is improved, in the width direction of the flat tube, the fin is bonded with the flat tube
Part account for the flat tube width 2/3.
After above-mentioned technical proposal, the circulation passage is successively uniformly arranged along the width direction of the flat tube, In
In the width direction of the flat tube, the part that the flat tube is fitted in the fitting groove accounts for the 1/3 of the width of the flat tube, institute
State the part that fin is bonded with the flat tube accounts for the width of the flat tube 2/3 so that in the flat tube about 1/3 circulation passage
In the fitting groove, the circulation passage of residue about 2/3 is located in the fin component.The heat that the electronic component generates
Amount pass to the heat sink, and then pass to the flat tube lower end and the liquid collecting component so that in the liquid collecting cavity
Cooling medium endothermic gasification, then from be located at the fitting groove in circulation passage flow in the air collecting chamber, the fin
Component has biggish heat exchange surface area, the heat dissipation of the upper end of the flat tube is accelerated, so that the gaseous state in the air collecting chamber
Cooling medium be pre-chilled liquefaction, and by gravity from be located at the fin component in circulation passage flow to the liquid collecting cavity
In, a heat transfer cycle is formed, the cooling electronic component is played the role of.Entire radiation processes are reduced without energy consumption
Heat dissipation cost, and radiating efficiency is high, it is small in size, space is saved, and cooling medium does not connect directly with electronic component
Touching, avoids damage electronic component, improves the safety of heat dissipation.
Detailed description of the invention
Fig. 1 is the right view of electronic component cooling device of the invention；
Fig. 2 is the main view of electronic component cooling device of the invention；
Fig. 3 is the structural schematic diagram of electronic component cooling device of the invention；
Fig. 4 is the structural schematic diagram of heat sink of the invention.
Specific embodiment
In order that the present invention can be more clearly and readily understood, right below according to specific embodiment and in conjunction with attached drawing
The present invention is described in further detail.
As shown in Fig. 1 ~ 4, a kind of electronic component cooling device, it include liquid collecting component 1, gas collection component 2, heat sink 3,
Fin component 4 and multiple connecting tubes, wherein
Air collecting chamber is equipped in the gas collection component 2；
It is equipped with liquid collecting cavity in the liquid collecting component 1, there is cooling medium in the liquid collecting cavity；
The upper end of the connecting tube is connected on the gas collection component 2, and the lower end of the connecting tube is connected to the liquid collecting
It is equipped on component 1, in the connecting tube multiple for being connected to the circulation passage 5 of the air collecting chamber and liquid collecting cavity；
Electronic component is installed on the heat sink 3, and is connected to the lower end of a side of the connecting tube, so as to will be electric
The heat transfer that device component generates gives the lower end of the connecting tube；
The fin component 4 is connected to the upper end of another side of the connecting tube, and for accelerating the connecting tube
The heat dissipation of end；Specifically, the heat transfer of the electronic component generation gives the heat sink 3, and then pass to the company
The lower end of adapter tube and the liquid collecting component 1, so that the cooling medium endothermic gasification in the liquid collecting cavity, and from the connecting tube
In flow in the air collecting chamber close to the circulation passage 5 of the heat sink 3, the fin component 4 has biggish heat transfer sheet
Area accelerates the heat dissipation of the upper end of the connecting tube, so that liquefaction is pre-chilled in the gaseous cooling medium in the air collecting chamber,
And flow in the liquid collecting cavity by gravity from the circulation passage 5 close to the fin component 4 in the connecting tube, it is formed
One heat transfer cycle, plays the role of the cooling electronic component, entire radiation processes without energy consumption, reduce heat dissipation at
This, and radiating efficiency is high, it is small in size, space is saved, and cooling medium does not contact directly with electronic component, avoids
Electronic component is damaged, the safety of heat dissipation is improved.
As shown in Figure 1, 2, on the length direction of the connecting tube, the lower semisection of the heat sink 3 and the connecting tube
Fitting, the fin component 4 is bonded with the upper semisection of the connecting tube, to obtain optimal heat dissipation effect.
As shown in Figure 1, be additionally provided with the filler 6 being connected with the liquid collecting cavity on the liquid collecting component 1, so as to described
The cooling medium is filled in liquid collecting cavity.
As shown in Figure 1, 2, the collector tube that the liquid collecting component 1 can block for both ends, the lower end edge of the connecting tube
The length direction of the collector tube is connected in turn on the collector tube.
As shown in Figure 1, 2, the gas collecting tube that the gas collection component 2 can block for both ends, the upper end edge of the connecting tube
The length direction of the gas collecting tube is connected in turn on the gas collecting tube.
As shown in Fig. 1 ~ 3, the connecting tube be flat tube 7, the circulation passage 5 along the flat tube 7 width direction successively
Setting；
The heat sink 3 is connected to the one end in the width direction of the flat tube 7, and the fin component 4 is connected to described flat
Do not make in the present embodiment specifically, the specific structure of the flat tube 7 is the prior art the other end in the width direction of pipe 7
It specifically repeats, in the present embodiment, the flat tube 7 uses microchannel aluminium flat conduit.
As shown in Fig. 1,3,4, the heat sink 3 is equipped with and the flat tube 7 is corresponded and is adapted to corresponding flat tube 7
Fitting groove 8, the one end scarf of the width direction of the flat tube 7 is in corresponding fitting groove 8.
In the present embodiment, in the width direction of the flat tube 7, the flat tube 7 is fitted in the portion in the fitting groove 8
Divide and account for the 1/3 of the width of the flat tube 7, to improve heat dissipation performance.
As shown in Fig. 1 ~ 3, the fin component 4 includes several fins 9, and the contact area of the fin 9 and air is big,
It can accelerate to transfer heat in air；
The flat tube 7 is connected in turn between the liquid collecting component 1 and gas collection component 2, is connected between two flat tubes 7 of arbitrary neighborhood
It is connected to the fin 9, the fin 9 fits with the other end in the width direction of two flat tubes 7, at this
In embodiment, the fin 9 is corrugated fins, and the corrugated fins are process by the aluminium foil of 0.07mm.
As shown in figure 3, the part that the fin 9 is bonded with the flat tube 7 accounts for institute in the width direction of the flat tube 7
State the 2/3 of the width of flat tube 7；Specifically, the circulation passage 5 is successively uniformly arranged along the width direction of the flat tube 7, in institute
In the width direction for stating flat tube 7, the part that the flat tube 7 is fitted in the fitting groove 8 accounts for the 1/3 of the width of the flat tube 7,
The part that the fin 9 is bonded with the flat tube 7 accounts for the 2/3 of the width of the flat tube 7 so that in the flat tube 7 about 1/3 stream
Circulation passage 5 is located in the fitting groove 8, and the circulation passage 5 of residue about 2/3 is located in the fin component 4, best to reach
Cooling effect, wherein after cooling medium endothermic gasification from be located at the fitting groove 8 in circulation passage 5 flow to the gas collection
In chamber, gaseous cooling medium pre-cooling liquefaction is flow in the liquid collecting cavity from the circulation passage 5 being located in the fin component 4.
In the present embodiment, pass through soldering connection between all components.
Working principle of the present invention is as follows:
The circulation passage 5 is successively uniformly arranged along the width direction of the flat tube 7, in the width direction of the flat tube 7, institute
The part that flat tube 7 is fitted in the fitting groove 8 accounts for the width of the flat tube 7 1/3 is stated, the fin 9 is pasted with the flat tube 7
The part of conjunction accounts for the 2/3 of the width of the flat tube 7, so that about 1/3 circulation passage 5 is located at the fitting groove 8 in the flat tube 7
In, the circulation passage 5 of residue about 2/3 is located in the fin component 4.The heat transfer that the electronic component generates is to described
Heat sink 3, so pass to the flat tube 7 lower end and the liquid collecting component 1 so that the cooling medium in the liquid collecting cavity
Then endothermic gasification is flow in the air collecting chamber from the circulation passage 5 being located in the fitting groove 8, the fin component 4 has
Biggish heat exchange surface area accelerates the heat dissipation of the upper end of the flat tube 7, so that gaseous cooling Jie in the air collecting chamber
Matter pre-cooling liquefaction, and flow in the liquid collecting cavity by gravity from the circulation passage 5 being located in the fin component 4, it is formed
One heat transfer cycle plays the role of the cooling electronic component.Entire radiation processes without energy consumption, reduce heat dissipation at
This, and radiating efficiency is high, it is small in size, space is saved, and cooling medium does not contact directly with electronic component, avoids
Electronic component is damaged, the safety of heat dissipation is improved.
Particular embodiments described above, pair present invention solves the technical problem that, technical scheme and beneficial effects carry out
It is further described, it should be understood that the above is only a specific embodiment of the present invention, is not limited to this
Invention, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should be included in this hair
Within bright protection scope.
In the description of the present invention, it is to be understood that, indicating position or the term of positional relationship are based on shown in attached drawing
Orientation or positional relationship, be merely for convenience of description of the present invention and simplification of the description, rather than the equipment of indication or suggestion meaning
Or element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, or be somebody's turn to do
Invention product using when the orientation or positional relationship usually put, be merely for convenience of description of the present invention and simplification of the description, without
It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore not
It can be interpreted as limitation of the present invention.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and cannot manage
Solution is indication or suggestion relative importance.
In addition, the terms such as term "horizontal", "vertical", " pendency " are not offered as requiring component abswolute level or pendency, and
It is that can be slightly tilted.It is not to indicate the structure if "horizontal" only refers to that its direction is more horizontal with respect to for "vertical"
It has to fully horizontally, but can be slightly tilted.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be on or below second feature
Directly contacted including the first and second features, also may include the first and second features be not direct contact but by them it
Between other characterisation contact.Moreover, fisrt feature is on second feature, top and above include fisrt feature second spy
Right above sign and oblique upper, or first feature horizontal height is merely representative of higher than second feature.Fisrt feature second feature it
Under, lower section and fisrt feature included below be directly below and diagonally below the second feature, or be merely representative of first feature horizontal height
Less than second feature.
Claims (10)
1. a kind of electronic component cooling device, which is characterized in that it includes liquid collecting component (1), gas collection component (2), heat sink
(3), fin component (4) and multiple connecting tubes, wherein
Air collecting chamber is equipped in the gas collection component (2)；
It is equipped with liquid collecting cavity in the liquid collecting component (1), there is cooling medium in the liquid collecting cavity；
The upper end of the connecting tube is connected on the gas collection component (2), and the lower end of the connecting tube is connected to the collection
It is equipped on liquid component (1), in the connecting tube multiple for being connected to the circulation passage (5) of the air collecting chamber and liquid collecting cavity；
Electronic component is installed on the heat sink (3), and is connected to the lower end of a side of the connecting tube, to incite somebody to action
The heat transfer that appliance component generates gives the lower end of the connecting tube；
The fin component (4) is connected to the upper end of another side of the connecting tube.
2. electronic component cooling device according to claim 1, which is characterized in that in the length direction of the connecting tube
On, the heat sink (3) is bonded with the lower semisection of the connecting tube, the upper semisection of fin component (4) and the connecting tube
Fitting.
3. electronic component cooling device according to claim 1, which is characterized in that also set on the liquid collecting component (1)
There is the filler (6) being connected with the liquid collecting cavity.
4. electronic component cooling device according to claim 1, which is characterized in that the liquid collecting component (1) is both ends
The lower end of the collector tube of closure, the connecting tube is connected in turn on the collector tube along the length direction of the collector tube.
5. electronic component cooling device according to claim 1, which is characterized in that the gas collection component (2) is both ends
The upper end of the gas collecting tube of closure, the connecting tube is connected in turn on the gas collecting tube along the length direction of the gas collecting tube.
6. electronic component cooling device according to claim 1, which is characterized in that
The connecting tube is flat tube (7), and the circulation passage (5) sets gradually along the width direction of the flat tube (7)；
The heat sink (3) is connected to the one end in the width direction of the flat tube (7), and the fin component (4) is connected to
The other end in the width direction of the flat tube (7).
7. electronic component cooling device according to claim 6, which is characterized in that the heat sink (3) be equipped with
The fitting groove (8) that the flat tube (7) corresponds and is adapted to corresponding flat tube (7), the one of the width direction of the flat tube (7)
End scarf is in corresponding fitting groove (8).
8. electronic component cooling device according to claim 7, which is characterized in that in the width side of the flat tube (7)
Upwards, the part that the flat tube (7) is fitted in the fitting groove (8) accounts for the 1/3 of the width of the flat tube (7).
9. electronic component cooling device according to claim 6, which is characterized in that
The fin component (4) includes several fins (9)；
The flat tube (7) is connected in turn between the liquid collecting component (1) and gas collection component (2), two flat tubes of arbitrary neighborhood
(7) fin (9), the fin (9) and the other end in the width direction of two flat tubes (7) are connected between
Portion fits.
10. electronic component cooling device according to claim 9, which is characterized in that in the width side of the flat tube (7)
Upwards, the part that the fin (9) is bonded with the flat tube (7) accounts for the 2/3 of the width of the flat tube (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910896347.1A CN110517997A (en) | 2019-09-23 | 2019-09-23 | Electronic component cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910896347.1A CN110517997A (en) | 2019-09-23 | 2019-09-23 | Electronic component cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110517997A true CN110517997A (en) | 2019-11-29 |
Family
ID=68633341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910896347.1A Pending CN110517997A (en) | 2019-09-23 | 2019-09-23 | Electronic component cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110517997A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005085998A (en) * | 2003-09-09 | 2005-03-31 | Toyota Motor Corp | Cooling device for electronic component |
| CN106440530A (en) * | 2016-06-15 | 2017-02-22 | 苏州纵贯线换热器有限公司 | Compact type micro-channel bending flat pipe heat exchanger |
| CN109612315A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
| CN210349822U (en) * | 2019-09-23 | 2020-04-17 | 常州常发制冷科技有限公司 | Electronic component cooling device |
-
2019
- 2019-09-23 CN CN201910896347.1A patent/CN110517997A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005085998A (en) * | 2003-09-09 | 2005-03-31 | Toyota Motor Corp | Cooling device for electronic component |
| CN106440530A (en) * | 2016-06-15 | 2017-02-22 | 苏州纵贯线换热器有限公司 | Compact type micro-channel bending flat pipe heat exchanger |
| CN109612315A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
| CN210349822U (en) * | 2019-09-23 | 2020-04-17 | 常州常发制冷科技有限公司 | Electronic component cooling device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101861079A (en) | Heat radiating device | |
| CN206193668U (en) | High -efficient heat abstractor of CPU module | |
| CN108718509A (en) | A kind of controller for electric vehicle having high heat dispersion | |
| CN203964739U (en) | Thermal siphon loop heat abstractor | |
| CN112188808A (en) | Two-phase immersed liquid cooling case based on thermoelectric refrigeration | |
| CN110517997A (en) | Electronic component cooling device | |
| CN105138098A (en) | Aluminum-copper explosion cladding CPU cooling fin device | |
| CN209447654U (en) | A kind of power matching network transformer cooling device | |
| CN105914191B (en) | A kind of integrated antenna package of water-cooling | |
| CN213485457U (en) | Two-phase immersed liquid cooling case based on thermoelectric refrigeration | |
| CN105957848A (en) | Base plate with integrated heat tubes and module device thereof | |
| CN210349822U (en) | Electronic component cooling device | |
| CN107507811B (en) | Chip heat dissipation cooling device for cooling and coupling flat plate heat tube bundle with semiconductor | |
| CN210014474U (en) | Radiator, air condensing units and air conditioner | |
| CN114637382A (en) | Aluminum alloy liquid cooling radiator of ultra-high-power GPU server | |
| CN210014482U (en) | Air condensing units and air conditioner | |
| CN212970511U (en) | Electrical equipment applying heat dissipation device | |
| CN208521920U (en) | A kind of Novel fin formula liquid cooling heat radiator | |
| CN208781835U (en) | A kind of high power transistor water-cooling heat radiating device | |
| CN208352701U (en) | A kind of laser cooling device | |
| CN207011177U (en) | A kind of heat abstractor of high-power paster | |
| CN207704389U (en) | A kind of finned liquid cooling heat radiator | |
| CN213462774U (en) | Liquid cooling computer configuration cabinet | |
| JP3077903U (en) | Micro thin plate type water cooling device usable for computer CPU | |
| CN215500189U (en) | Power module and cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |