CN105873352A - 高频通信用基板及其制造方法 - Google Patents
高频通信用基板及其制造方法 Download PDFInfo
- Publication number
- CN105873352A CN105873352A CN201510750173.XA CN201510750173A CN105873352A CN 105873352 A CN105873352 A CN 105873352A CN 201510750173 A CN201510750173 A CN 201510750173A CN 105873352 A CN105873352 A CN 105873352A
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- CN
- China
- Prior art keywords
- base material
- frequency communication
- layer
- substrate
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (30)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510750173.XA CN105873352B (zh) | 2015-11-06 | 2015-11-06 | 高频通信用基板及其制造方法 |
Applications Claiming Priority (1)
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---|---|---|---|
CN201510750173.XA CN105873352B (zh) | 2015-11-06 | 2015-11-06 | 高频通信用基板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105873352A true CN105873352A (zh) | 2016-08-17 |
CN105873352B CN105873352B (zh) | 2019-02-01 |
Family
ID=56624253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510750173.XA Active CN105873352B (zh) | 2015-11-06 | 2015-11-06 | 高频通信用基板及其制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN105873352B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108411247A (zh) * | 2018-03-30 | 2018-08-17 | 武汉光谷创元电子有限公司 | Lcp基挠性覆铜板的制造方法及其制品 |
CN109137035A (zh) * | 2018-08-29 | 2019-01-04 | 谢新林 | 一种铝基覆铜板的制备方法 |
CN110600849A (zh) * | 2018-06-12 | 2019-12-20 | 比亚迪股份有限公司 | 波导管及其制备方法以及电子设备 |
JP2020516771A (ja) * | 2017-04-05 | 2020-06-11 | 武漢光谷創元電子有限公司Richview Electronics Co.,Ltd. | マイクロ波誘電部材及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070281566A1 (en) * | 2006-05-30 | 2007-12-06 | Nof Corporation | Prepreg and conductive layer-laminated substrate for printed wiring board |
CN101534605A (zh) * | 2009-04-11 | 2009-09-16 | 黄威豪 | 一种高频覆铜板的制造方法 |
CN101956171A (zh) * | 2010-09-30 | 2011-01-26 | 深圳市信诺泰创业投资企业(普通合伙) | 离子注入和等离子体沉积设备以及采用等离子体处理薄膜的方法 |
CN102717554A (zh) * | 2012-07-02 | 2012-10-10 | 富景资本有限公司 | 一种两层型挠性覆铜板 |
-
2015
- 2015-11-06 CN CN201510750173.XA patent/CN105873352B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070281566A1 (en) * | 2006-05-30 | 2007-12-06 | Nof Corporation | Prepreg and conductive layer-laminated substrate for printed wiring board |
CN101534605A (zh) * | 2009-04-11 | 2009-09-16 | 黄威豪 | 一种高频覆铜板的制造方法 |
CN101956171A (zh) * | 2010-09-30 | 2011-01-26 | 深圳市信诺泰创业投资企业(普通合伙) | 离子注入和等离子体沉积设备以及采用等离子体处理薄膜的方法 |
CN102717554A (zh) * | 2012-07-02 | 2012-10-10 | 富景资本有限公司 | 一种两层型挠性覆铜板 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11552617B2 (en) | 2017-04-05 | 2023-01-10 | Richview Electronics Co., Ltd. | Microwave dielectric component and manufacturing method thereof |
JP2020516771A (ja) * | 2017-04-05 | 2020-06-11 | 武漢光谷創元電子有限公司Richview Electronics Co.,Ltd. | マイクロ波誘電部材及びその製造方法 |
EP3608439A4 (en) * | 2017-04-05 | 2020-12-02 | Richview Electronics Co., Ltd. | DIELECTRIC MICROWAVE COMPONENT AND MANUFACTURING METHOD FOR IT |
JP2022046488A (ja) * | 2017-04-05 | 2022-03-23 | 武漢光谷創元電子有限公司 | マイクロ波誘電部材及びその製造方法 |
JP7284096B2 (ja) | 2017-04-05 | 2023-05-30 | 武漢光谷創元電子有限公司 | マイクロ波誘電部材及びその製造方法 |
JP2021517367A (ja) * | 2018-03-30 | 2021-07-15 | 武漢光谷創元電子有限公司Richview Electronics Co.,Ltd. | Lcpベースのフレキシブル銅張積層板の製造方法およびその製品 |
TWI739076B (zh) * | 2018-03-30 | 2021-09-11 | 大陸商武漢光谷創元電子有限公司 | 液晶聚合物(lcp)基撓性覆銅板的製造方法及其製品 |
CN108411247A (zh) * | 2018-03-30 | 2018-08-17 | 武汉光谷创元电子有限公司 | Lcp基挠性覆铜板的制造方法及其制品 |
JP7492498B2 (ja) | 2018-03-30 | 2024-05-29 | 武漢光谷創元電子有限公司 | Lcpベースのフレキシブル銅張積層板の製造方法およびその方法により製造されたlcpベースのフレキシブル銅張積層板 |
US12012660B2 (en) | 2018-03-30 | 2024-06-18 | Richview Electronics Co., Ltd. | Method for manufacturing LCP-based flexible copper-clad plate, and article thereof |
CN110600849A (zh) * | 2018-06-12 | 2019-12-20 | 比亚迪股份有限公司 | 波导管及其制备方法以及电子设备 |
CN109137035A (zh) * | 2018-08-29 | 2019-01-04 | 谢新林 | 一种铝基覆铜板的制备方法 |
CN109137035B (zh) * | 2018-08-29 | 2020-10-30 | 谢新林 | 一种铝基覆铜板的制备方法 |
Also Published As
Publication number | Publication date |
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CN105873352B (zh) | 2019-02-01 |
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Address after: 519040 Guangdong province Zhuhai Sanzao Science and Technology Industrial Park, building A building B, Jinwan District No. 1-2 Applicant after: ZHUHAI RICHVIEW ELECTRONICS CO.,LTD. Address before: 519040 Guangdong province Zhuhai Sanzao Science and Technology Industrial Park, building A building B, Jinwan District No. 1-2 Applicant before: Zhuhai Chuangyuan Kaiyao Electronic Material Co.,Ltd. |
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Effective date of registration: 20180115 Address after: East Lake Development Zone 430070 Hubei city of Wuhan Province East Road No. 18 hi tech building 10 floor Applicant after: RICHVIEW ELECTRONICS Co.,Ltd. Address before: 519040 Guangdong province Zhuhai Sanzao Science and Technology Industrial Park, building A building B, Jinwan District No. 1-2 Applicant before: ZHUHAI RICHVIEW ELECTRONICS CO.,LTD. |
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Effective date of registration: 20230918 Address after: No. 501, 5th Floor, Gaoke Building, No. 2 Jiayuan Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430073 Patentee after: Wuhan Xinchuangyuan Semiconductor Co.,Ltd. Address before: 430070 10th floor, Gaoke building, 18 guandongyuan Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee before: RICHVIEW ELECTRONICS Co.,Ltd. |
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