CN105842486B - Semiconductor element test bindiny mechanism - Google Patents
Semiconductor element test bindiny mechanism Download PDFInfo
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- CN105842486B CN105842486B CN201510017306.2A CN201510017306A CN105842486B CN 105842486 B CN105842486 B CN 105842486B CN 201510017306 A CN201510017306 A CN 201510017306A CN 105842486 B CN105842486 B CN 105842486B
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- semiconductor element
- bindiny mechanism
- element test
- structure body
- prober
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
It includes a support portion, a main part and a collar portion that the invention relates to a kind of semiconductor element test bindiny mechanisms for connecting a measuring head and a prober.Support portion is fixedly arranged on measuring head, includes a link plate and multiple travellers, and each traveller is to be fixedly arranged on link plate respectively.Main part includes main structure body, multiple bolsters and a multiple fastener with multiple sliding slots, and each bolster is connection link plate and main structure body.Fastener is the collar portion that cooperation is fixedly arranged in prober, has multiple buckle slots that can respectively with the clamping of each fastener, and can slide the multiple oblique slots for setting each guide posts respectively.Promote user's installation, maintenance as a result, and pick and place the convenience of probe card, while main structure body level can be made to overlap prober, improves the precision of connection positioning.
Description
Technical field
The present invention relates to a kind of semiconductor element test bindiny mechanism, espespecially a kind of connection measuring head that is suitable for is surveyed with needle
The semiconductor element test bindiny mechanism of machine.
Background technology
There are several disadvantages about known semiconductor element test bindiny mechanism, light source feeding mechanism first blocks spy
Needle card picks and places path so that operating personnel must remove light source feeding mechanism every time after, could carry out replacement operation, just
Profit has to be strengthened.Secondly, such connection alignment mode lacks buffering and Regulation mechanism, is also easy to produce in connecting position fixing process
Deviation, precision be not high.Furthermore it must be connected with measuring head using various flat cables on circuit board, in maintenance process, easily
It pulls or bends and cause the test signal of transmission abnormal, reduce the stability of test.
Invention popularity is because in this, this urgently thinks one kind and can solve the above problem semiconductor element in the spirit actively invented
Part tests bindiny mechanism, and several times research experiment is of the invention to completing eventually.
Invention content
The main object of the present invention is to provide a kind of semiconductor element test bindiny mechanism, the structure master of the bindiny mechanism
Body is disposed on measuring head, therefore the two can coaxially be overturn according to a pivotal axis, be different from traditional structure main body and prober
Thus connected design pattern is convenient for user's installation, maintenance and picks and places probe card, while passing through micro-adjusting mechanism when connection,
The horizontal overlap joint prober of main structure body, raising is enable to connect the precision of positioning.
To reach above-mentioned purpose, semiconductor element test bindiny mechanism of the invention, for connecting a measuring head and a needle
Survey machine includes a support portion, a main part and a collar portion.Support portion is fixedly arranged on measuring head, includes a link plate and more
A traveller, each traveller are to be fixedly arranged on link plate respectively, sliding rail when being slided as main part.Main part includes a tool
It is to connect link plate and main structure body to have the main structure body, multiple bolsters and multiple fasteners of multiple sliding slots, each bolster,
Main structure body and fine tuning buffering when prober connection and removal are can be used as, and each fastener is disposed on main structure body
On, a buckle assembly of elements is provided, can be a bolt in the present invention so that main structure body and the connectable knot of collar portion.It is above-mentioned
Fastener is cooperation collar portion, has multiple buckle slots that can respectively with the clamping of each fastener, and respectively it is sliding set it is each
Multiple oblique slots of guide posts.As a result, by the two secure bond in the way of rotation engaging.
In addition, aforementioned body portion can further include a light source feeding mechanism, it is set in an accommodating space of main structure body,
And it is electrically connected measuring head.The light source feeding mechanism can be LED light source, be the light source feeding mechanism as image test.As a result, will
Light source feeding mechanism, which is set to main part, can promote the convenience of replacement or detection probe card, while properly using in constructional device
Accommodating space.
Aforementioned body portion can more be installed with multiple circuit boards, surround and be set on the side surface of main structure body, and be electrically connected
Connect measuring head.Wherein, circuit board be for carrying out image test, it is exposed to be fixed on the side surface of main structure body, can increase
Heat dissipation effect and convenient for check circuit board state of appearance.
Wherein, above-mentioned light source feeding mechanism can further include multiple location holes, be correspondingly connected with multiple positioning pins of prober.
Each circuit board further includes multiple slots, can be correspondingly connected with multiple positioning contacts of the prober.It as a result, can be by structure master
Each component of body is more accurately connected in prober, provides most perfect detection environment, while also can avoid light source supply dress
Set the situation generation that light leakage occurs.
Furthermore above-mentioned each bolster can be a spring can improve main structure body pair using the characteristic of telescopic spring deformation
Uneven force when the engagement prober of position or out-of-flatness state.Further, above-mentioned each bolster can be a pneumatic cylinder, lead to
The reciprocation for crossing pneumaticpiston bar and air cushion gas provides longitudinal buffering adjustment, can equally improve main structure body contraposition
Uneven force when engagement prober or out-of-flatness state.
An elastic element for being coated on traveller can be respectively set in above-mentioned each sliding slot.Main structure body contraposition is provided as a result,
Buffer displacement when engagement prober in the horizontal direction, promotes the precision of engagement.
Description of the drawings
Outlined above with next detailed description be all exemplary in nature is that application in order to further illustrate the present invention is special
Sharp range.And other objects and advantages for the present invention, it will be illustrated with attached drawing in subsequent explanation, wherein：
Fig. 1 is the engagement state stereogram of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention.
Fig. 2 is the discrete state stereogram of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention.
Fig. 3 is the partial enlarged view of the discrete state of the semiconductor element test bindiny mechanism of Fig. 2.
Fig. 4 is the A-A sectional views of the lock-out state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention.
Fig. 5 is the A-A sectional views of the removal state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention.
Fig. 6 is the A-A partial cutaways of the lock-out state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
View.
Fig. 7 is the A-A partial cutaways of the removal state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
View.
Fig. 8 is the stereogram of the semiconductor element test bindiny mechanism of another preferred embodiment of the present invention.
Specific implementation mode
It please refers to Fig.1 to Fig.3, is the engagement state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
The partial enlarged view of stereogram, discrete state stereogram and discrete state.Show a kind of semiconductor element test company in Fig. 1-Fig. 3
Connection mechanism 1 is disposed in semiconductor element test device 10, is mainly used for connecting a measuring head 20 of the device and a needle
Survey machine 40, wherein measuring head 20 is hubbed on a pivotal axis 102 of prober 40 with a support arm 101, however, because partly leading
One main structure body 31 of body element test bindiny mechanism 1 is disposed on measuring head 20, therefore the two can be according to the pivotal axis 102
Coaxially overturn, be different from the design pattern that traditional structure main body is connected with prober, the situation of overturning can compares figure 1 and
Shown in Fig. 2.
Then, Fig. 2 and Fig. 3 is please referred to, semiconductor element test bindiny mechanism 1 of the invention includes mainly three parts,
Include the support portion 2 for being fixedly arranged on measuring head 20, be installed with the main part 3 and a collar portion 4 of circuit version 6 in outer surface.
Circuit board 6 above-mentioned is set on main part 3 with the configuration mode of exposed structure, can increase heat dissipation effect and convenient for checking
The state of appearance of circuit board.
The support portion 2 of measuring head 20 is that test is fixed in the support of main part 3 of lower section bindiny mechanism with a link plate 21
On first 20, while four travellers 22 are separately installed on link plate 21, sliding rail when being slided as main part 3.
Again, main part 3 includes main structure body 31, a multiple bolster 32 with multiple sliding slots 311 (as shown in Figure 4)
And multiple fasteners 33, in the present embodiment, above-mentioned bolster 32 is for a spring, and but not limited to this, every to provide knot
The component of 31 1 cushioning effect power of structure main body, such as：The elements such as pneumatic cylinder, all in the scope of the claims that the present invention protects.And institute
It is to connect link plate 21 and main structure body 31 with hook to state each bolster 32.In addition, each fastener 33 is disposed on the knot
In structure main body 31, a buckle assembly of elements is provided, can be a bolt in the present invention so that main structure body 31 can with collar portion 4
It is connected.The main structure body 31 of main part 3 is that have an accommodating space 312 for a hollow frame body, for storing different surveys
External member is tried, in the present embodiment, above-mentioned accommodating space 312 is equipped with a light source feeding mechanism 5, is a LED light source, and be electrically connected
Measuring head 20, the light source as image test are supplied.
It is each portion's component being connected with measuring head 20 above, finally it is to be emphasized again that it is to pivot that above structure, which is with pivotal axis 102,
Axis has the characteristic that can coaxially overturn, and at least may be reversed 90 degree or more.Then, it referring to Fig. 2 and Fig. 3, is set to
Collar portion 4 in prober includes multiple buckle slots 41 and multiple oblique slots 42, wherein multiple buckle slots 41 are in main structure body
During 31 engage with about 4 collar portion, can first engage in advance with fastener 33 so that collar portion 4 and main structure body 31 at
After the structure being integrated, recycle rotation engaging mode so that above structure be able to by multiple guide posts 43 respectively along
The track of each oblique slot 42 slides downwards, and completes the joining process of globality.
Fig. 4 and Fig. 5 is please referred to, is the lock-out state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
A-A sectional views and removal state A-A sectional views.As previously mentioned, in the present invention, when multiple buckle slots 41 and fastener 33
In advance after engaging, in order to reach horizontal the step of engaging, following two situations have been will include in the process, one is locking
State, secondly be removal state.
In the locked state, as shown in figure 4, total main body 31 and collar portion 4 have engaged lower section prober 40, this is every
The guide posts 43 that one oblique slot 42 corresponds to one side carry out Relative sliding and reach lock-out state, in the longitudinal direction at this time, connection support
The bolster 32 of portion 2 and main structure body 31 will be moved down with integral position and will and then be elongated so that link plate 21 and knot
D at a distance between structure main body 31, in the present embodiment up to 30 millimeters.In the horizontal, because the bindiny mechanism of the present invention is
It is slid in multiple sliding slots 311 by multiple travellers 22, and filling has elastic component 23 therebetween, in the present embodiment, in cunning
Column 22 is coated with a spring, is that can effectively prevent unnecessary lateral shift, promotes the accuracy of contraposition.
Under removal state, as shown in figure 5, total main body 31 and collar portion 4 have disengaged from lower section prober 40, this is every
The guide posts 43 that one oblique slot 42 corresponds to one side carry out Relative sliding and return to removal state, in the longitudinal direction at this time, connection support
Portion 2 and the bolster 32 of main structure body 31 restore former length as integral position moves up so that collar portion 4 and prober 40
D at a distance between surface, in the present embodiment up to 30 millimeters.Pass through above-mentioned fine tuning buffer gear as a result, so that structure
Main body horizontal can overlap prober in a stable state, improve the precision of connection positioning.
Further, Fig. 6 and Fig. 7 is please referred to, is the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
Lock-out state A-A partial sectional views and removal state A-A partial sectional views, also can simultaneously refering to Fig. 3, it includes inside
Structure feature.As shown in fig. 6, light source feeding mechanism 5 is in an accommodating space 312 of main structure body 31.In locking shape
Under state, in order to avoid there is a phenomenon where light source light leakages to generate in test, it is necessary to ensure that the light source feeding mechanism 5 can be close to needle survey
A probe card 7 in machine 40.Therefore, contraposition needle is used in addition to multiple location holes 51 are arranged on the shell of light source feeding mechanism 5
Multiple positioning pins 401 of survey machine 40 it is outer, the present invention is additionally provided in main structure body 31 and light source feeding mechanism 5 and multiple pushes part
52, it is similarly multiple springs in the present embodiment, it is by the compression thrust of spring that said two devices are closely sealed each other, it can effectively avoid
The phenomenon that light source light leakage.In addition, including multiple positioning contacts 402 in probe card 7, can be correspondingly connected in the locked state each
The slot 61 of circuit board 6 so that circuit board 6 is in the slot 61 for the probe card 7 put with vertical direction insertion level, so that carrying
Enter for image detecting signal and be connected in the wafer of probe card, uses and filter out defective products with the subsequent encapsulation work of profit progress
Journey.
Similarly, as shown in fig. 7, under removal state, when main structure body 31 and collar portion 4 move up distance D above-mentioned
Afterwards, no matter in the location hole 51 of light source feeding mechanism 5 or the slot 61 on circuit board 6, all can with corresponding positioning pin 401 and
It positions contact 402 to be detached from, in addition, multiple parts 52 that push can restore to raw footage, suspends the light source feeding mechanism 5 in midair.By above-mentioned
Each component of main structure body can be more accurately connected in prober by design, semiconductor element test bindiny mechanism of the invention
On, most perfect detection environment is provided, while also can avoid the situation generation that light leakage occurs for light source feeding mechanism.
As shown in figure 8, being the stereogram of the semiconductor element test bindiny mechanism of another preferred embodiment of the present invention.Partly lead
Body element test bindiny mechanism 9 is set in a prober 94 (Prober), mainly includes a main structure body 931, Duo Ge electricity
Road plate 96 and corresponding positioning pin 941 and slot 942.Wherein, which is to be hubbed at a pivot bearings 902
On so that main structure body 931 is and to be installed with multiple circuit boards 96 in its surrounding for a kind of unilateral fixed lifting type lid,
The circuit board electrical connection measuring head, to provide the control of image test signal.In addition, when main structure body 931 covers back prober 94,
Above structure main body 931 and the correspondence of circuit board 96 are snapped into positioning pin 941 and slot 942, test work can be carried out after the completion
Industry；Otherwise after main structure body 931 is in upper lifting state state and removes light source feeding mechanism 95, you can carry out the replacement of probe card
Operation, or repair or update for internal component.
It is only for the sake of illustration for above-described embodiment, and the interest field that the present invention is advocated certainly should be with right
Subject to described in claimed range, not just the above examples.
Claims (9)
1. a kind of semiconductor element test bindiny mechanism includes for connecting a measuring head and a prober：
One support portion, is fixedly arranged on the measuring head, including a link plate and multiple travellers, which is fixedly arranged on the connection respectively
Plate；
One main part includes main structure body, multiple bolsters and a multiple fasteners with multiple sliding slots, each bolster
The link plate and the main structure body are connected, which is set on the main structure body；And
One collar portion has the multiple buckle slots that can be clamped respectively with each fastener, and cunning sets each guide posts respectively
Multiple oblique slots, which is fixedly arranged in the prober, and making the collar portion that can be corresponded to by each oblique slot should
Each guide posts carry out Relative sliding, form a lock-out state or a removal state.
2. semiconductor element test bindiny mechanism as described in claim 1, wherein the main part further includes light source supply dress
It sets, is set in an accommodating space of the main structure body, and be electrically connected the measuring head.
3. semiconductor element test bindiny mechanism as described in claim 1, wherein the main part is installed with multiple circuit boards,
It surround and is set on the side surface of the main structure body, and is electrically connected the measuring head.
4. semiconductor element test bindiny mechanism as claimed in claim 2, wherein the light source feeding mechanism further includes multiple fixed
Position hole, can be correspondingly connected with multiple positioning pins of the prober.
5. semiconductor element test bindiny mechanism as claimed in claim 3, wherein each circuit board further includes multiple inserts
Slot can be correspondingly connected with multiple positioning contacts of the prober.
6. semiconductor element test bindiny mechanism as described in claim 1, wherein each bolster is a spring.
7. semiconductor element test bindiny mechanism as described in claim 1, wherein each bolster is a pneumatic cylinder.
8. semiconductor element test bindiny mechanism as described in claim 1, wherein be respectively set one in each sliding slot and be coated on
The elastic element of the traveller.
9. semiconductor element test bindiny mechanism as described in claim 1, wherein the fastener is a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510017306.2A CN105842486B (en) | 2015-01-14 | 2015-01-14 | Semiconductor element test bindiny mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510017306.2A CN105842486B (en) | 2015-01-14 | 2015-01-14 | Semiconductor element test bindiny mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105842486A CN105842486A (en) | 2016-08-10 |
| CN105842486B true CN105842486B (en) | 2018-09-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510017306.2A Active CN105842486B (en) | 2015-01-14 | 2015-01-14 | Semiconductor element test bindiny mechanism |
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| CN (1) | CN105842486B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109900931B (en) * | 2017-12-08 | 2021-03-30 | 京元电子股份有限公司 | Semiconductor assembly test connection interface |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3369891B2 (en) * | 1997-02-07 | 2003-01-20 | 株式会社アドバンテスト | Handler connection mechanism |
| CN2613799Y (en) * | 2003-03-13 | 2004-04-28 | 鸿富锦精密工业（深圳）有限公司 | Mainboard test machine |
| US7301326B1 (en) * | 2004-07-13 | 2007-11-27 | Intest Corporation | Modular interface |
| CN201417291Y (en) * | 2009-06-11 | 2010-03-03 | 英华达（上海）科技有限公司 | Test device |
| TWI386646B (en) * | 2009-08-27 | 2013-02-21 | King Yuan Electronics Co Ltd | Pogo tower |
| TWI424174B (en) * | 2013-02-04 | 2014-01-21 | King Yuan Electronics Co Ltd | A testing machine which is provided with a rotation light structure and a testing equipment and a method using the same |
| CN103760389B (en) * | 2014-01-06 | 2016-09-28 | 东莞市沃德精密机械有限公司 | Detent mechanism is pressed under Fan Zhuan |
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| CN105842486A (en) | 2016-08-10 |
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