CN105842486A - Semiconductor element testing connection mechanism - Google Patents
Semiconductor element testing connection mechanism Download PDFInfo
- Publication number
- CN105842486A CN105842486A CN201510017306.2A CN201510017306A CN105842486A CN 105842486 A CN105842486 A CN 105842486A CN 201510017306 A CN201510017306 A CN 201510017306A CN 105842486 A CN105842486 A CN 105842486A
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- CN
- China
- Prior art keywords
- semiconductor element
- bindiny mechanism
- element test
- pin
- structure body
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- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to a semiconductor element testing connection mechanism, and the mechanism is used for connecting a testing head and a prober. The mechanism comprises a supporting part, a main body part, and a lantern ring part. The supporting part is fixedly disposed on the testing head, and comprises a connection plate and a plurality of sliding studs, wherein each sliding stud is fixedly disposed on the connection plate. The main body part comprises a structural main body with a plurality of chutes, a plurality of buffering parts, and a plurality of buckling parts, wherein each buffering part is connected with the connection plate and the structural main body. The buckling parts are fixedly disposed on a lantern ring part on the prober in a cooperative manner, and is provided with a plurality of buckling grooves which are respectively in clamping connection with the buckling parts, and is also provided with a plurality of inclined grooves which can be used for the sliding arrangement of the corresponding guide columns. Therefore, the mechanism brings convenience to a user for the installation, maintenance and use of a probe, can enable the structural main body to be horizontally lapped with the prober, and improves the precision of connection positioning.
Description
Technical field
The present invention is about a kind of semiconductor element test bindiny mechanism, and espespecially one is applicable to link survey
The semiconductor element test bindiny mechanism of machine surveyed by examination head and pin.
Background technology
Several shortcomings, first light source supply dress have been there are about known semiconductor element test bindiny mechanism
Put block probe card pick and place path so that light source supply device must be moved by operator every time
After opening, just can be replaced operation, convenience has to be strengthened.Secondly, this kind connects alignment mode,
Lacking buffering and Regulation mechanism, be easily generated deviation in connecting position fixing process, precision is the highest.Furthermore,
Various flat cable and measuring head must be utilized on circuit board to make to be connected, in maintenance process, easily pull or
Bend and cause the test signal of transmission extremely, reduce the stability of test.
Invention popularity, because in this, this is in the spirit of actively invention, is urgently thought one and can be solved the problems referred to above
Semiconductor element test bindiny mechanism, several times research experiment is eventually to completing the present invention.
Summary of the invention
The main object of the present invention is to provide a kind of semiconductor element test bindiny mechanism, this connection machine
The main structure body of structure is disposed on measuring head, therefore the two coaxially can overturn according to a pivotal axis, has
Do not survey, with pin, the design pattern that machine is connected in traditional structure main body, be thus easy to user installation, maintenance
And pick and place probe card, micro-adjusting mechanism time simultaneously by connecting so that main structure body energy level overlap joint pin
Survey machine, improves the precision connecting location.
For reaching above-mentioned purpose, the semiconductor element test bindiny mechanism of the present invention, for connecting a survey
Machine surveyed by examination head and a pin, includes a supporting part, a main part and a collar portion.Supporting part is fixedly arranged on
Measuring head, includes a web and multiple traveller, and each traveller is to be fixedly arranged on web respectively, with
Sliding rail when sliding as main part.Main part include a main structure body with multiple chute,
Multiple bolsters and multiple fastener, each bolster is to connect web and main structure body, can conduct
Fine setting buffering when machine link and removal surveyed by main structure body and pin, and each fastener is disposed on
On main structure body, it is provided that a buckle assembly of elements, can be a latch in the present invention so that structure master
Body can be connected with collar portion.Above-mentioned fastener is to cooperate with the collar portion being fixedly arranged on pin survey machine, its tool
Have can respectively with multiple buckle slots of each fastener clamping, and sliding respectively to set each guide posts many
Individual oblique slot.Thus, utilize the mode rotating engaging by the two secure bond.
Additionally, aforementioned body portion can also include a smooth source supply device, it is arranged at the one of main structure body
In accommodation space, and electrically connect measuring head.This light source supply device can be LED light source, is as shadow
Light source supply device as test.Thus, light source supply device is arranged at main part and can promote replacing
Or the convenience of detection probe card, properly utilize the accommodation space in constructional device simultaneously.
Aforementioned body portion can more be installed with multiple circuit board, and it is around the side surface being arranged at main structure body
On, and electrically connect measuring head.Wherein, circuit board is used to carry out image test, and it is exposed is fixed on
On the side surface of main structure body, radiating effect can be increased and be easy to check the state of appearance of circuit board.
Wherein, above-mentioned smooth source supply device can also include hole, multiple location, and machine surveyed by its corresponding pin that connects
Multiple alignment pins.This each circuit board also includes multiple slot, and it is many that it corresponding can connect this pin survey machine
Individual location contact.Thus, each parts of main structure body can be connected on pin survey machine more accurately, carry
For the most perfect detection environment, the situation of light source supply device generation light leak also can be avoided to produce simultaneously.
Furthermore, above-mentioned each bolster can be a spring, utilizes the characteristic of telescopic spring deformation, can change
Uneven force during kind main structure body para-position joint pin survey machine or out-of-flatness state.Further, on
Stating each bolster can be a pneumatic cylinder, by the reciprocal action of pneumaticpiston bar Yu air cushion gas, carries
Adjusting for the buffering on longitudinally, that can improve that main structure body para-position engages when machine surveyed by pin equally uneven executes
Power or out-of-flatness state.
A flexible member being coated on traveller can be respectively provided with in above-mentioned each chute.Thus, it is provided that knot
Structure main body para-position engages buffer displacement in the horizontal direction when machine surveyed by pin, promotes the precision engaged.
Accompanying drawing explanation
It is to further illustrate this that outlined above and ensuing detailed description is all exemplary in nature
Bright claim.And other objects and advantages for the present invention, by follow-up explanation with
Accompanying drawing is illustrated by, wherein:
Fig. 1 is that the engagement state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention stands
Body figure.
Fig. 2 is that the released state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention is stood
Body figure.
Fig. 3 is the partial enlarged drawing of the released state of the semiconductor element test bindiny mechanism of Fig. 2.
Fig. 4 is the lock-out state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
A-A sectional view.
Fig. 5 is the removal state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
A-A sectional view.
Fig. 6 is the lock-out state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
A-A partial sectional view.
Fig. 7 is the removal state of the semiconductor element test bindiny mechanism of a preferred embodiment of the present invention
A-A partial sectional view.
Fig. 8 is the axonometric chart of the semiconductor element test bindiny mechanism of another preferred embodiment of the present invention.
Detailed description of the invention
Refer to Fig. 1 to Fig. 3, be that the semiconductor element test of a preferred embodiment of the present invention connects machine
The engagement state axonometric chart of structure, released state axonometric chart and the partial enlarged drawing of released state.Fig. 1-
Fig. 3 shows a kind of semiconductor element test bindiny mechanism 1, is disposed on semiconductor element test
In device 10, it is mainly used in connecting a measuring head 20 of this device and machine 40 surveyed by a pin, wherein, survey
Examination 20 is to be hubbed at pin with a support arm 101 to survey on a pivotal axis 102 of machine 40, but, because of
One main structure body 31 of semiconductor element test bindiny mechanism 1 is disposed on measuring head 20, therefore two
Person coaxially can overturn according to described pivotal axis 102, is different from traditional structure main body and surveys machine phase with pin
Design pattern even, the situation of its upset can compare shown in Fig. 1 and Fig. 2.
Then, referring to Fig. 2 and Fig. 3, the semiconductor element test bindiny mechanism 1 of the present invention is main
Including three parts, include and be fixedly arranged on a supporting part 2 of measuring head 20, be equiped with electricity at outer surface
The main part 3 of road version 6 and be fixedly arranged on pin and survey a collar portion 4 of machine 40.Aforesaid circuit board 6,
It is to be arranged on main part 3 with the configuration mode of exposed structure, radiating effect can be increased and be easy to check
The state of appearance of circuit board.
The supporting part 2 of measuring head 20, is by the main part 3 of lower section bindiny mechanism with a web 21
Support is fixed on measuring head 20, is separately installed with four travellers 22 on web 21 simultaneously, to make
Sliding rail when sliding for main part 3.
Again, main part 3 include a main structure body 31 with multiple chute 311 (as shown in Figure 4),
Multiple bolsters 32 and multiple fastener 33, in the present embodiment, above-mentioned bolster 32 is for a bullet
Spring, but be not limited, every component that main structure body 31 1 cushioning effect power is provided, such as:
The elements such as pneumatic cylinder, all in the scope of the claims of present invention protection.And described each bolster 32 is
Web 21 and main structure body 31 is connected with hook.It addition, each fastener 33 is disposed on this knot
In structure main body 31, it is provided that a buckle assembly of elements, it can be a latch in the present invention so that structure
Main body 31 can be connected with collar portion 4.The main structure body 31 of main part 3 is for a hollow support body,
It has an accommodation space 312, is available for depositing different protos test suite PROTOSs, in the present embodiment, above-mentioned
Accommodation space 312 is provided with a smooth source supply device 5, and it is a LED light source, and electrically connects measuring head
20, as the light source supply of image test.
More than for each portion component being connected with measuring head 20, finally it is to be emphasized again that said structure is to pivot
Axle 102 is pivot axis, possesses the characteristic that can coaxially overturn, and the most turning more than 90 degree.
Then, referring to Fig. 2 and Fig. 3, the collar portion 4 being arranged on pin survey machine includes multiple card
Catching groove 41 and multiple oblique slot 42, wherein, multiple buckle slots 41 are in main structure body 31 and collar portion
During about 4 engage, can first engage in advance with fastener 33 so that collar portion 4 and structure master
After the structure that body 31 is integrally forming, recycling rotates the mode of engaging so that said structure is led to
Cross the downward sliding of track respectively along each oblique slot 42 of multiple guide posts 43, and complete globality
Joining process.
Refer to Fig. 4 and Fig. 5, be that the semiconductor element test of a preferred embodiment of the present invention connects machine
The A-A sectional view of the lock-out state of structure and the A-A sectional view of removal state.As it was previously stated, at this
In bright, after multiple buckle slots 41 engage in advance with fastener 33, engage to reach level
Step, following two situation can be included during the course, one is lock-out state, it is two for removal
State.
In the locked state, as shown in Figure 4, total main body 31 and collar portion 4 engage down
Policy surveys machine 40, and the corresponding guide posts 43 on one side of this each oblique slot 42 carries out Relative sliding and reaches
Lock-out state, the most in the vertical, the bolster 32 linking supporting part 2 and main structure body 31 will be with
Integral position to move down and be and then elongated so that between web 21 and main structure body 31
Every distance D, in the present embodiment up to 30 millimeters.In the horizontal, because of the bindiny mechanism of the present invention
It is in the sliding of multiple chute 311 by multiple travellers 22, and is filled with therebetween flexible member 23,
In the present embodiment, be coated with a spring at traveller 22, be can effectively prevent unnecessary horizontal
Skew, promotes the accuracy of para-position.
Under removal state, as it is shown in figure 5, total main body 31 and collar portion 4 have disengaged from down
Policy surveys machine 40, and the corresponding guide posts 43 on one side of this each oblique slot 42 carries out Relative sliding and returns to
Removal state, the most in the vertical, link the bolster 32 of supporting part 2 and main structure body 31 along with
Integral position moves up and recovers former length so that collar portion 4 and pin are surveyed and be spaced between machine 40 surface
One distance D, in the present embodiment up to 30 millimeters.Thus, by above-mentioned fine setting buffer gear, make
Obtaining main structure body and can survey machine by level overlap joint pin in a steady statue, it is accurate that raising connection positions
Degree.
Further, refer to Fig. 6 and Fig. 7, be the semiconductor element of a preferred embodiment of the present invention
The A-A partial sectional view of the lock-out state of test bindiny mechanism and the A-A broken section of removal state
Figure, also can refer to Fig. 3 simultaneously, and it comprises the architectural feature of inside.As shown in Figure 6, light source supply
Device 5 is in an accommodation space 312 of main structure body 31.In the locked state, in order to keep away
The phenomenon exempting to occur in test light source light leak produces, it is necessary to ensure that described smooth source supply device 5 can be close to
The probe card 7 in machine 40 surveyed by pin.Therefore, many except arranging on the shell of light source supply device 5
Hole, individual location 51 is used outside multiple alignment pins 401 that machine 40 surveyed by para-position pin, and the present invention is structure master
Body 31 and light source supply device 5 are additionally provided with multiple part 52 that pushes, and are similarly multiple in the present embodiment
Spring, by the compression thrust of spring, said two devices is the most closely sealed, light source light leak can be prevented effectively from
Phenomenon.Additionally, include multiple location contact 402 in probe card 7, in the locked state can be corresponding
Connect the slot 61 of each circuit board 6 so that circuit board 6 is put with vertical direction insertion level
In the slot 61 of probe card 7, so that provide image detecting signal to enter the wafer being connected to probe card
In, use and filter out defective products in order to carrying out follow-up encapsulation engineering.
In like manner, as it is shown in fig. 7, under removal state, when main structure body 31 with collar portion 4 upwards
After mobile aforesaid distance D, no matter in the hole, location 51 of light source supply device 5 or at circuit board 6
On slot 61, all can depart from, additionally, multiple with corresponding alignment pin 401 and location contact 402
Push part 52 can recover to raw footage, suspend this light source supply device 5 in midair.By above-mentioned design, this
Each parts of main structure body can be connected in pin by bright semiconductor element test bindiny mechanism more accurately
On survey machine, it is provided that the most perfect detection environment, also can avoid light source supply device generation light leak simultaneously
Situation produces.
As shown in Figure 8, it is the semiconductor element test bindiny mechanism of another preferred embodiment of the present invention
Axonometric chart.Semiconductor element test bindiny mechanism 9 is arranged at a pin and surveys on machine 94 (Prober), mainly
Include a main structure body 931, multiple circuit board 96 and corresponding alignment pin 941 and slot
942.Wherein, this main structure body 931 is to be hubbed in a pivot bearings 902 so that main structure body
931 is for a kind of monolateral fixing lifting type lid, and is installed with multiple circuit board 96 in its surrounding,
This circuit board electrical connection measuring head, to provide image test signal to control.Additionally, when main structure body 931
When lid back stitching surveys machine 94, said structure main body 931 and circuit board 96 correspondence are snapped into alignment pin 941
And slot 942, test jobs can be carried out after completing；Otherwise when main structure body 931 is in upper lifting state
State and after being removed by light source supply device 95, can carry out the replacing operation of probe card, or for interior
Portion's component keeps in repair or updates.
Above-described embodiment explanation merely for convenience and illustrate, the interest field that the present invention is advocated
From being as the criterion with described in right, rather than it is only limitted to above-described embodiment.
Claims (9)
1. a semiconductor element test bindiny mechanism, surveys machine, bag for connecting a measuring head and a pin
Include:
One supporting part, is fixedly arranged on this measuring head, including a web and multiple traveller, and this each traveller
It is fixedly arranged on this web respectively；
One main part, has the main structure body of multiple chute, multiple bolster and multiple buckle including one
Part, this each bolster connects this web and this main structure body, and this each fastener is arranged at this knot
In structure main body；And
One collar portion, is fixedly arranged on this pin and surveys machine, and having can multiple with this each fastener clamping respectively
Buckle slot, and the sliding multiple oblique slots setting each guide posts respectively.
2. semiconductor element test bindiny mechanism as claimed in claim 1, wherein, this main part is also
Including a smooth source supply device, it is arranged in an accommodation space of this main structure body, and electrical connection should
Measuring head.
3. semiconductor element test bindiny mechanism as claimed in claim 1, wherein, this main part is solid
Being provided with multiple circuit board, it is around being arranged on the side surface of this main structure body, and electrically connects this test
Head.
4. semiconductor element test bindiny mechanism as claimed in claim 2, wherein, this light source is supplied
Device also includes hole, multiple location, and it corresponding can connect this pin and survey multiple alignment pins of machine.
5. semiconductor element test bindiny mechanism as claimed in claim 3, wherein, this each circuit
Plate also includes multiple slot, and it corresponding can connect this pin and survey multiple location contact of machine.
6. semiconductor element test bindiny mechanism as claimed in claim 1, wherein, this each buffering
Part is a spring.
7. semiconductor element test bindiny mechanism as claimed in claim 1, wherein, this each buffering
Part is a pneumatic cylinder.
8. semiconductor element test bindiny mechanism as claimed in claim 1, wherein, in each chute
It is respectively provided with a flexible member being coated on this traveller.
9. semiconductor element test bindiny mechanism as claimed in claim 1, wherein, this fastener is
One latch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510017306.2A CN105842486B (en) | 2015-01-14 | 2015-01-14 | Semiconductor element test bindiny mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510017306.2A CN105842486B (en) | 2015-01-14 | 2015-01-14 | Semiconductor element test bindiny mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105842486A true CN105842486A (en) | 2016-08-10 |
| CN105842486B CN105842486B (en) | 2018-09-21 |
Family
ID=56579780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510017306.2A Active CN105842486B (en) | 2015-01-14 | 2015-01-14 | Semiconductor element test bindiny mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105842486B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109900931A (en) * | 2017-12-08 | 2019-06-18 | 京元电子股份有限公司 | Semiconductor component test connecting interface |
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| JPH10221403A (en) * | 1997-02-07 | 1998-08-21 | Advantest Corp | Handler coupling mechanism |
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| US7301326B1 (en) * | 2004-07-13 | 2007-11-27 | Intest Corporation | Modular interface |
| CN201417291Y (en) * | 2009-06-11 | 2010-03-03 | 英华达（上海）科技有限公司 | Test device |
| TW201107756A (en) * | 2009-08-27 | 2011-03-01 | King Yuan Electronics Co Ltd | Pogo tower |
| CN103760389A (en) * | 2014-01-06 | 2014-04-30 | 东莞市沃德精密机械有限公司 | Turning and downward pressing positioning mechanism |
| CN103969026A (en) * | 2013-02-04 | 2014-08-06 | 京元电子股份有限公司 | Tester with rotary light source mechanism and dynamic test equipment and method using tester |
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2015
- 2015-01-14 CN CN201510017306.2A patent/CN105842486B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10221403A (en) * | 1997-02-07 | 1998-08-21 | Advantest Corp | Handler coupling mechanism |
| CN2613799Y (en) * | 2003-03-13 | 2004-04-28 | 鸿富锦精密工业（深圳）有限公司 | Mainboard test machine |
| US7301326B1 (en) * | 2004-07-13 | 2007-11-27 | Intest Corporation | Modular interface |
| CN201417291Y (en) * | 2009-06-11 | 2010-03-03 | 英华达（上海）科技有限公司 | Test device |
| TW201107756A (en) * | 2009-08-27 | 2011-03-01 | King Yuan Electronics Co Ltd | Pogo tower |
| CN103969026A (en) * | 2013-02-04 | 2014-08-06 | 京元电子股份有限公司 | Tester with rotary light source mechanism and dynamic test equipment and method using tester |
| CN103760389A (en) * | 2014-01-06 | 2014-04-30 | 东莞市沃德精密机械有限公司 | Turning and downward pressing positioning mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109900931A (en) * | 2017-12-08 | 2019-06-18 | 京元电子股份有限公司 | Semiconductor component test connecting interface |
| CN109900931B (en) * | 2017-12-08 | 2021-03-30 | 京元电子股份有限公司 | Semiconductor assembly test connection interface |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105842486B (en) | 2018-09-21 |
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