CN105837203A - 微波陶瓷材料、用该材料制备的介质谐振器及其制备方法 - Google Patents

微波陶瓷材料、用该材料制备的介质谐振器及其制备方法 Download PDF

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CN105837203A
CN105837203A CN201610160027.6A CN201610160027A CN105837203A CN 105837203 A CN105837203 A CN 105837203A CN 201610160027 A CN201610160027 A CN 201610160027A CN 105837203 A CN105837203 A CN 105837203A
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dielectric resonator
ceramic material
microwave ceramic
described dielectric
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薛冰
薛凌
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NANJING ZHIYUAN MICROWAVE SCIENCE & TECHNOLOGY Co Ltd
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Abstract

本发明涉及一种陶瓷材料，具体涉及一种微波陶瓷材料、用该材料制备的介质谐振器及其制备方法，所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.01‑1.0％、CoO 0.01‑5.0％、TiO220.0‑35.0％、Na2O 0.01‑1.0％、SiO20.1‑3.0％、BaO 0.01‑1.0％、MgO 0.01‑2.0％、Al2O35.0‑12.0％、ZrO20.01‑0.1％、CaO 15.0‑35.0％、La2O30.01‑40.0％、SrO 0.01‑1.0％、Sm2O30.01‑40.0％、ZnO0.01‑1.0％、Fe2O30.01‑1.0％、Ce2O30.01‑40.0％、MnO 0.01‑1.0％、CdO 0.01‑1.0％。本发明采用采用相对廉价的CaO、TiO2、Sm2O3、La2O3、Ce2O3、Al2O3等为主要原料，在控制成本的前提下，提高材料的性能。

Description

微波陶瓷材料、用该材料制备的介质谐振器及其制备方法
技术领域
本发明涉及一种陶瓷材料，具体涉及一种微波陶瓷材料、用该材料制备的介质谐振器及其制备方法。
背景技术
在现代通信技术中，微波通信占用十分重要的地位，它在军事和民用两方面都有广泛的应用，如雷达，卫星导航，卫星通讯，移动通信以及无线网络等方面。微波陶瓷材料及元器件是微波通信中重要的组成部分，它可以提高通讯设备的性能并可使元器件以至整机的小型化，因此研发新型的高性能微波陶瓷材料以及元器件是当今发达国家十分关注的研究方向。
发明内容
本发明主要提供了一种微波陶瓷材料、用该材料制备的介质谐振器及其制备方法，该种微波陶瓷材料采用相对廉价的CaO、TiO2、Sm2O3、La2O3、Ce2O3、Al2O3等为主要原料，在控制成本的前提下，提高材料的性能。其技术方案如下：一种微波陶瓷材料，按重量百分比计，其包含以下组分：K2O 0.01-1.0％、CoO0.01-5.0％、TiO2 20.0-35.0％、Na2O 0.01-1.0％、SiO2 0.1-3.0％、BaO 0.01-1.0％、MgO 0.01-2.0％、Al2O3 5.0-12.0％、ZrO2 0.01-0.1％、CaO 15.0-35.0％、La2O30.01-40.0％、SrO 0.01-1.0％、Sm2O3 0.01-40.0％、ZnO 0.01-1.0％、Fe2O3 0.01-1.0％、Ce2O3 0.01-40.0％、MnO 0.01-1.0％、CdO 0.01-1.0％。
优选的，按重量百分比计，其包含以下组分：K2O 0.05-0.08％、CoO 1-5.0％、TiO2 20.0-30.0％、Na2O 0.01-0.2％、SiO2 0.1-2％、BaO 0.01-0.08％、MgO 0.01-1.0％、Al2O3 8.0-12.0％、ZrO2 0.01-0.07％、CaO 20.0-35.0％、La2O3 5-30.0％、SrO0.05-0.08％、Sm2O3 10-30.0％、ZnO 0.01-0.05％、Fe2O3 0.01-0.03％、Ce2O3 10-35％、MnO 0.6-1.0％、CdO 0.03-0.07％。
一种使用所述微波陶瓷材料制备的介质谐振器，所述介质谐振器呈实心圆柱状结构，所述介质谐振器的外径为5-20mm，高为2-8mm。
一种使用所述微波陶瓷材料制备的介质谐振器，所述介质谐振器呈中心设有通孔的圆柱状结构，所述介质谐振器的外径为10-100mm，内径为3-20mm，高为5-50mm。
一种使用所述微波陶瓷材料制备的介质谐振器，所述介质谐振器呈长管状结构，所述介质谐振器的外径为5-50mm，内径为0-35mm，高为5-60mm，所述介质谐振器的一端或两端金属化。
一种介质谐振器的制备方法，包括以下步骤：
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1400-1500℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
采用上述微波陶瓷材料，本发明具有以下优点：
通过对材料配方的精炼，采用相对廉价的CaO、TiO2、Sm2O3、La2O3、Ce2O3、Al2O3等为主要原料，在控制成本的前提下，实现了在较低的烧成温度(1400～1500度)，实现较高的Qo×fo值，及可调整的Tf值，拥有较高的性价比。
附图说明
图1为实施例1或3中介质谐振器的结构示意图；
图2为实施例2或5中介质谐振器的结构示意图；
图3为实施例3或6中介质谐振器的结构示意图。
其中，1、介质谐振器。
具体实施方式
1.微波陶瓷材料配方
所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.01-1.0％、CoO0.01-5.0％、TiO2 20.0-35.0％、Na2O 0.01-1.0％、SiO2 0.1-3.0％、BaO 0.01-1.0％、MgO 0.01-2.0％、Al2O3 5.0-12.0％、ZrO2 0.01-0.1％、CaO 15.0-35.0％、La2O30.01-40.0％、SrO 0.01-1.0％、Sm2O3 0.01-40.0％、ZnO 0.01-1.0％、Fe2O3 0.01-1.0％、Ce2O3 0.01-40.0％、MnO 0.01-1.0％、CdO 0.01-1.0％。
2.微波陶瓷材料制成的介质谐振器的制备方法
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1400-1500℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
具体实施例
实施例1
1.微波陶瓷材料配方
所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.10％、CoO0.1％、TiO2 32.2％、Na2O 0.1％、SiO2 0.2％、BaO 0.1％、MgO 0.01％、Al2O3 10.3％、ZrO2 0.04％、CaO 26.5％、La2O3 0.05％、SrO 0.12％、Sm2O3 29.07％、ZnO 0.5％、Fe2O3 0.2％、Ce2O3 0.01％、MnO 0.3％、CdO 0.1％。
2.介质谐振器
该介质谐振器使用上述材料制成，如图1所示，所述介质谐振器呈实心圆柱状结构，所述介质谐振器的外径为20mm，高为8mm。
3.微波陶瓷材料制成的介质谐振器的制备方法
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1400℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
4.性能检测
制备完成的介质谐振器一般在频率较高时使用，当使用频率为10GHz时，其性能情况如下：
fo＝10.0GHz±0.05，Qo＝4500-5800,
τf＝0±4ppm/℃(-45℃-+105℃)
实施例2
1.微波陶瓷材料配方
所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.08％、CoO 0.5％、TiO2 33％、Na2O 0.1％、SiO2 0.3％、BaO 0.07％、MgO 0.2％、Al2O3 9.5％、ZrO2 0.1％、CaO 21％、La2O3 32％、SrO 1％、Sm2O3 0.2％、ZnO 0.02％、Fe2O3 0.03％、Ce2O3 0.20％、MnO 1％、CdO 0.7％。
2.介质谐振器
该介质谐振器使用上述材料制成，如图2所示，所述介质谐振器呈中心设有通孔的圆柱状结构，所述介质谐振器的外径为100mm，内径为20mm，高为50mm。
3.微波陶瓷材料制成的介质谐振器的制备方法
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1500℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
4.性能检测
当使用频率为2.4GHz时，其性能情况如下：
fo＝2.4GHz±0.05，Qo＝9000-15000,
τf＝0±3ppm/℃(-45℃-+105℃)
实施例3
1.微波陶瓷材料配方
所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.10％、CoO0.1％、TiO2 32.0％、Na2O 0.1％、SiO2 0.2％、BaO 0.1％、MgO 0.01％、Al2O3 10.3％、ZrO2 0.04％、CaO 26.4％、La2O3 0.05％、SrO 0.14％、Sm2O3 29.3％、ZnO 0.5％、Fe2O3 0.2％、Ce2O3 0.06％、MnO 0.3％、CdO 0.1％。
2.介质谐振器
该介质谐振器使用上述材料制成，如图3所示，所述介质谐振器呈长管状结构，所述介质谐振器的外径为50mm，内径为35mm，高为60mm，所述介质谐振器的一端或两端金属化。
3.微波陶瓷材料制成的介质谐振器的制备方法
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1400℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
4.性能检测
当使用频率在2.0GHz时，其性能情况如下：
fo＝2.0GHz±0.05，Qo＝10000～12000,
τf＝0±5ppm/℃(-45℃-+105℃)
实施例4
1.微波陶瓷材料配方
所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.10％、CoO0.1％、TiO2 32.6％、Na2O 0.1％、SiO2 0.5％、BaO 0.1％、MgO 0.01％、Al2O3 10％、ZrO2 0.01％、CaO 26％、La2O3 0.01％、SrO 0.12％、Sm2O3 29.24％、ZnO 0.5％、Fe2O3 0.2％、Ce2O3 0.01％、MnO 0.3％、CdO 0.1％。
2.介质谐振器
该介质谐振器使用上述材料制成，如图1所示，所述介质谐振器呈实心圆柱状结构，所述介质谐振器的外径为20mm，高为8mm。
3.微波陶瓷材料制成的介质谐振器的制备方法
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1450℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
4.性能检测
制备完成的介质谐振器一般在频率较高时使用，当使用频率为10GHz时，其性能情况如下：
fo＝10.0GHz±0.05，Qo＝4500-5800,
τf＝0±4ppm/℃(-45℃-+105℃)
实施例5
1.微波陶瓷材料配方
所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.05％、CaO 26％、TiO2 19.01％、Na2O 0.02％、SiO2 1％、BaO 0.8％、MgO 0.14％、Al2O3 3％、ZrO20.05％、CaO 15％、La2O3 8％、SrO 0.8％、Sm2O3 5％、ZnO 0.2％、Fe2O3 0.05％、Ce2O3 20％、MnO 0.08％、CdO 0.8％。
2.介质谐振器
该介质谐振器使用上述材料制成，如图2所示，所述介质谐振器呈中心设有通孔的圆柱状结构，所述介质谐振器的外径为10mm，内径为3mm，高为5mm。
3.微波陶瓷材料制成的介质谐振器的制备方法
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1500℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
4.性能检测
当使用频率为2.4GHz时，其性能情况如下：
fo＝2.4GHz±0.05，Qo＝9000-15000,
τf＝0±3ppm/℃(-45℃-+105℃)
实施例6
1.微波陶瓷材料配方
所述微波陶瓷材料按重量百分比计，其包含以下组分：K2O 0.04％、CoO 0.1％、TiO2 28％、Na2O 0.01％、SiO2 0.5％、BaO 0.01％、MgO 0.1％、ZrO20.01％、CaO 28％、La2O3 1％、SrO 0.01％、Sm2O3 32％、ZnO 0.05％、Al2O3 9.3％、Ce2O3 0.1％、MnO 0.67％、CdO 0.1％。
2.介质谐振器
该介质谐振器使用上述材料制成，如图3所示，所述介质谐振器呈长管状结构，所述介质谐振器的外径为5mm，内径为1mm，高为5mm，所述介质谐振器的一端或两端金属化。
3.微波陶瓷材料制成的介质谐振器的制备方法
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1400℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
4.性能检测
当使用频率在2.0GHz时，其性能情况如下：
fo＝2.0GHz±0.05，Qo＝10000～12000,
τf＝0±5ppm/℃(-45℃-+105℃)
对本领域的技术人员来说，可根据以上描述的技术方案以及构思，做出其它各种相应的改变以及形变，而所有的这些改变以及形变都应该属于本发明权利要求的保护范围之内。

Claims (6)

1.一种微波陶瓷材料，其特征在于：按重量百分比计，其包含以下组分：K2O 0.01-1.0％、CoO 0.01-5.0％、TiO2 20.0-35.0％、Na2O 0.01-1.0％、SiO2 0.1-3.0％、BaO 0.01-1.0％、MgO 0.01-2.0％、Al2O3 5.0-12.0％、ZrO2 0.01-0.1％、CaO15.0-35.0％、La2O3 0.01-40.0％、SrO 0.01-1.0％、Sm2O3 0.01-40.0％、ZnO 0.01-1.0％、Fe2O3 0.01-1.0％、Ce2O3 0.01-40.0％、MnO 0.01-1.0％、CdO 0.01-1.0％。
2.根据权利要求1所述的微波陶瓷材料，其特征在于：按重量百分比计，其包含以下组分：K2O 0.05-0.08％、CoO 1-5.0％、TiO2 20.0-30.0％、Na2O0.01-0.2％、SiO2 0.1-2％、BaO 0.01-0.08％、MgO 0.01-1.0％、Al2O3 8.0-12.0％、ZrO2 0.01-0.07％、CaO 20.0-35.0％、La2O3 5-30.0％、SrO 0.05-0.08％、Sm2O310-30.0％、ZnO 0.01-0.05％、Fe2O3 0.01-0.03％、Ce2O3 10-35％、MnO 0.6-1.0％、CdO 0.03-0.07％。
3.一种使用如权利要求1中的微波陶瓷材料制备的介质谐振器，其特征在于：所述介质谐振器呈实心圆柱状结构，所述介质谐振器的外径为5-20mm，高为2-8mm。
4.一种使用如权利要求1中的微波陶瓷材料制备的介质谐振器，其特征在于：所述介质谐振器呈中心设有通孔的圆柱状结构，所述介质谐振器的外径为10-100mm，内径为3-20mm，高为5-50mm。
5.一种使用如权利要求1中的微波陶瓷材料制备的介质谐振器，其特征在于：所述介质谐振器呈长管状结构，所述介质谐振器的外径为5-50mm，内径为0-35mm，高为5-60mm，所述介质谐振器的一端或两端金属化。
6.一种如权利要求5所述的介质谐振器的制备方法，其特征在于：包括以下步骤：
(1)将配方量的各组分于球磨机中混合，混合完成后，在窑炉内进行预烧合成处理，预烧合成后出料进行细磨处理，磨细后的粉料加粘结剂和水制成浆料，输送到喷雾造粒机进行造粒处理；
(2)将粉粒填充至自动成型机模具内进行压制成型；
(3)压制成型的瓷件毛坯进行烧结处理，烧结温度为1400-1500℃；
(4)烧成后将瓷件研磨，然后进行清洗烘干，完成后组装得到介质谐振器，对成品进行测试完成后包装即可。
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