CN106380183A - 一种无线通讯微波陶瓷介质谐振器及其制备方法和应用 - Google Patents

一种无线通讯微波陶瓷介质谐振器及其制备方法和应用 Download PDF

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CN106380183A
CN106380183A CN201610841442.8A CN201610841442A CN106380183A CN 106380183 A CN106380183 A CN 106380183A CN 201610841442 A CN201610841442 A CN 201610841442A CN 106380183 A CN106380183 A CN 106380183A
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microwave
wireless telecommunications
ceramic material
resonator
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张术生
胡玲莉
李婷婷
胡蓉
张桃生
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Shenzhen Square Material Technology Co Ltd
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Abstract

本发明公开了一种无线通讯微波陶瓷介质谐振器及其制备方法和应用，所述无线通讯微波陶瓷介质谐振器采用微波陶瓷材料制成，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O315‑25％，TiO225‑35％，SiO23‑10％，MgO 15‑30％，ZnO 5‑15％，CaO 5‑15％，SrO 0.001‑0.5％，CuO 0.001‑0.5％，Mn 0.001‑0.5％。将微波陶瓷材料中的各组分经混料、合成、细磨、喷雾造粒、成型、烧成和金属化制成。本发明无线通讯微波陶瓷介质谐振器，原料经人工合成，形成了复杂的化学及晶体结构；本发明不仅介电常数较高，品质因数好，温漂系数优越，而且价格优势明显，具有很高的性价比。

Description

一种无线通讯微波陶瓷介质谐振器及其制备方法和应用
技术领域
本发明涉及电子通讯领域，具体是一种无线通讯微波陶瓷介质谐振器及其制备方法和应用。
背景技术
目前，随着无线通讯技术的发展，对无线通讯网络中基地站的性能要求越来越高，其中滤波器是重要的器件之一。电源滤波器是由电容、电感和电阻组成的滤波电路。滤波器可以对电源线中特定频率的频点或该频点以外的频率进行有效滤除，得到一个特定频率的电源信号，或消除一个特定频率后的电源信号。原来的滤波器是金属空腔滤波器，它存在体积大，品质因素低，为了提高滤波器的性能，充分利用频道资源和体积，人们发明了在金属腔中加入微波陶瓷介质谐振器的介质腔滤波器。这样的介质谐振器做成的滤波器可以使原有的金属腔滤波器体积缩小，性能得以提高并使频率稳定度更好。
发明内容
本发明的目的在于提供一种介电常数较高、品质因数好、温漂系数优越、性价比高的无线通讯微波陶瓷介质谐振器及其制备方法和应用，以解决上述背景技术中提出的问题。
为实现上述目的，本发明提供如下技术方案：
一种无线通讯微波陶瓷介质谐振器，采用微波陶瓷材料制成，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O315-25％，TiO225-35％，SiO23-10％，MgO 15-30％，ZnO 5-15％，CaO 5-15％，SrO 0.001-0.5％，CuO 0.001-0.5％，Mn 0.001-0.5％。
作为本发明进一步的方案：该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O318-22％，TiO228-32％，SiO25-8％，MgO 20-25％，ZnO 5-15％，CaO 5-15％，SrO0.001-0.5％，CuO 0.001-0.5％，Mn 0.001-0.5％。
作为本发明进一步的方案：所述的无线通讯微波陶瓷介质谐振器的介电常数为εr＝15～17，品质因数和频率乘积即Q×f＝45000～55000GHz，在-45℃～+105℃内的温漂系数为τf＝-20～20ppm/℃。
本发明的另一目的是提供一种无线通讯微波陶瓷介质谐振器的制备方法，将微波陶瓷材料中的各组分经混料、合成、细磨、喷雾造粒、成型、烧成和金属化制成的。
作为本发明进一步的方案：所述无线通讯微波陶瓷介质谐振器的制备方法，依次包括以下步骤：
1)混料、合成：称取上述原料组分按照比例混合均匀，在1000～1050℃下煅烧一次；
2)细磨：研磨使细度达到D90≤5μm；
3)喷雾造粒：加入粘结剂混合得到浆料，喷雾造粒；
4)成型：5MPa～10Mpa下压制成型得到生坯；
5)烧成：生坯在1250～1350℃下烧结3～5小时；
6)金属化：在烧结成型的微波陶瓷材料表面的一端金属化，即制得微波介质谐振器。
步骤3)中，粘结剂为质量分数7.5％PVA溶液；其中粘结剂的加入量为各组分总质量的5～12％。
本发明还提供了无线通讯微波陶瓷介质谐振器在无线网络微波陶瓷介质谐振器的应用。
所述的用于无线网络的微波介质陶瓷谐振器所处的功率较小，尺寸较小，为单端采取金属化的管状结构，外径(A)10～20mm，内径(C)3～8mm，高(B)20～40mm。
与现有技术相比，本发明的有益效果是：
本发明无线通讯微波陶瓷介质谐振器，原料经人工合成，形成了复杂的化学及晶体结构；其中是金属氧化物Al2O3和MgO，TiO2，CaO，ZnO，SiO2为主体，其它微量添加的元素如SrO、CuO、Mn2O3等有助于改善烧成条件和材料的温漂系数；本发明不仅介电常数较高，品质因数好，温漂系数优越，而且价格优势明显，具有很高的性价比。
附图说明
图1是本发明的无线通讯微波陶瓷介质谐振器的结构示意图。
具体实施方式
下面将结合本发明实施例，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
本发明实施例中，如图1所示，无线通讯微波陶瓷介质谐振器后加工得到用于无线网络的微波陶瓷介质谐振器，为单端采取金属化的管状结构，外径A为16mm，高度B为28mm，中心孔C的内径为7mm。无线通讯微波陶瓷介质谐振器采用微波陶瓷材料制成，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O321.498％，TiO225％，SiO23％，MgO 30％，ZnO15％，CaO 5％，SrO 0.001％，CuO 0.5％，Mn 0.001％。
无线通讯微波陶瓷介质谐振器的制备方法，依次包括以下步骤：1)混料、合成：称取上述原料组分按照比例混合均匀，在1050℃下煅烧一次；2)细磨：研磨使细度达到D90≤5μm；3)喷雾造粒：加入占原料总质量的5％的质量分数7.5％PVA溶液作为粘结剂混合得到浆料，喷雾造粒；4)成型：5MPa下压制成型得到生坯；5)烧成：生胚在1320℃下烧结4小时烧结成型；6)金属化：在烧结成型的陶瓷表面的一端金属化，即制得微波介质谐振器；最后组装得到如图1所示的无线通讯微波陶瓷介质谐振器。
对本实施例制得的无线通讯微波陶瓷介质谐振器进行测试，介电常数εr＝16.7，f＝1650MHz时，Q＝33000，τf＝-5～+5ppm/℃(-45℃～+105℃)。
实施例2
本发明实施例中，如图1所示，无线通讯微波陶瓷介质谐振器后加工得到用于无线网络的微波陶瓷介质谐振器，为单端采取金属化的管状结构，外径A为16mm，高度B为28mm，中心孔C的内径为7mm。无线通讯微波陶瓷介质谐振器，采用微波陶瓷材料制成，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O318.999％，TiO235％，SiO210％，MgO 15％，ZnO 5％，CaO 15％，SrO 0.5％，CuO 0.001％，Mn 0.5％。
所述无线通讯微波陶瓷介质谐振器的制备方法，依次包括以下步骤：1)混料、合成：称取上述原料组分按照比例混合均匀，在1000℃下煅烧一次。2)细磨：研磨使细度达到D90≤5μm。3)喷雾造粒：加入粘结剂混合得到浆料，喷雾造粒，粘结剂为质量分数7.5％PVA溶液；其中粘结剂的加入量为各组分总质量的12％。4)成型：10Mpa下压制成型得到生坯。5)烧成：生坯在1250℃下烧结3小时。6)金属化：在烧结成型的微波陶瓷材料表面的一端金属化，即制得微波介质谐振器。
对本实施例制得的无线通讯微波陶瓷介质谐振器进行测试，介电常数为εr＝15～17，f＝1650MHz时，Q＝33000，τf＝-20～20ppm/℃(-45℃～+105℃)。
实施例3
本发明实施例中，如图1所示，无线通讯微波陶瓷介质谐振器后加工得到用于无线网络的微波陶瓷介质谐振器，为单端采取金属化的管状结构，外径A为16mm，高度B为28mm，中心孔C的内径为7mm。无线通讯微波陶瓷介质谐振器，采用微波陶瓷材料制成，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O322％，TiO232％，SiO25％，MgO20.498％，ZnO15％，CaO 5％，SrO 0.001％，CuO 0.5％，Mn 0.001％。
所述无线通讯微波陶瓷介质谐振器的制备方法，依次包括以下步骤：1)混料、合成：称取上述原料组分按照比例混合均匀，在1000℃下煅烧一次。2)细磨：研磨使细度达到D90≤5μm。3)喷雾造粒：加入粘结剂混合得到浆料，喷雾造粒，粘结剂为质量分数7.5％PVA溶液；其中粘结剂的加入量为各组分总质量的6％。4)成型：7Mpa下压制成型得到生坯。5)烧成：生坯在1350℃下烧结5小时。6)金属化：在烧结成型的微波陶瓷材料表面的一端金属化，即制得微波介质谐振器。
对本实施例制得的无线通讯微波陶瓷介质谐振器进行测试，介电常数为εr＝16.7，f＝1700MHz时，Q＝31000，τf＝-20～20ppm/℃(-45℃～+105℃)。
实施例4
本发明实施例中，如图1所示，无线通讯微波陶瓷介质谐振器后加工得到用于无线网络的微波陶瓷介质谐振器，为单端采取金属化的管状结构，外径A为16mm，高度B为28mm，中心孔C的内径为7mm。无线通讯微波陶瓷介质谐振器，采用微波陶瓷材料制成，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O318.999％，TiO228％，SiO28％，MgO 24％，ZnO5％，CaO 15％，SrO0.5％，CuO 0.001％，Mn 0.5％。
所述无线通讯微波陶瓷介质谐振器的制备方法，依次包括以下步骤：1)混料、合成：称取上述原料组分按照比例混合均匀，在1050℃下煅烧一次。2)细磨：研磨使细度达到D90≤5μm。3)喷雾造粒：加入粘结剂混合得到浆料，喷雾造粒，粘结剂为质量分数7.5％PVA溶液；其中粘结剂的加入量为各组分总质量的10％。4)成型：8Mpa下压制成型得到生坯。5)烧成：生坯在1350℃下烧结5小时。6)金属化：在烧结成型的微波陶瓷材料表面的一端金属化，即制得微波介质谐振器。
对本实施例制得的无线通讯微波陶瓷介质谐振器进行测试，介电常数为εr＝17，f＝1700MHz时，Q＝32000，τf＝-20～20ppm/℃(-45℃～+105℃)。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (6)

1.一种无线通讯微波陶瓷介质谐振器，采用微波陶瓷材料制成，其特征在于，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O3 15-25％，TiO2 25-35％，SiO2 3-10％，MgO 15-30％，ZnO 5-15％，CaO 5-15％，SrO 0.001-0.5％，CuO 0.001-0.5％，Mn 0.001-0.5％。
2.根据权利要求1所述的无线通讯微波陶瓷介质谐振器，其特征在于，该微波陶瓷材料由以下按照质量百分比的组分组成：Al2O3 18-22％，TiO2 28-32％，SiO2 5-8％，MgO 20-25％，ZnO 5-15％，CaO 5-15％，SrO 0.001-0.5％，CuO 0.001-0.5％，Mn 0.001-0.5％。
3.根据权利要求1-2任一所述的无线通讯微波陶瓷介质谐振器，其特征在于，所述的无线通讯微波陶瓷介质谐振器的介电常数为εr＝15～17，品质因数和频率乘积即Q×f＝45000～55000GHz，在-45℃～+105℃内的温漂系数为τf＝-20～20ppm/℃。
4.一种如权利要求1-2任一所述的无线通讯微波陶瓷介质谐振器的制备方法，其特征在于，将微波陶瓷材料中的各组分经混料、合成、细磨、喷雾造粒、成型、烧成和金属化制成。
5.根据权利要求4所述的无线通讯微波陶瓷介质谐振器的制备方法，其特征在于，依次包括以下步骤：
1)混料、合成：称取上述原料组分按照比例混合均匀，在1000～1050℃下煅烧一次；
2)细磨：研磨使细度达到D90≤5μm；
3)喷雾造粒：加入粘结剂混合得到浆料，喷雾造粒；
4)成型：5MPa～10Mpa下压制成型得到生坯；
5)烧成：生坯在1250～1350℃下烧结3～5小时；
6)金属化：在烧结成型的微波陶瓷材料表面的一端金属化，即制得微波介质谐振器。
步骤3)中，粘结剂为质量分数7.5％PVA溶液；其中粘结剂的加入量为各组分总质量的5～12％。
6.如权利要求1-2任一所述的无线通讯微波陶瓷介质谐振器在无线网络微波陶瓷介质谐振器的应用。
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