CN105825911B - 一种叠层片式电感内电极银浆及其制备方法 - Google Patents
一种叠层片式电感内电极银浆及其制备方法 Download PDFInfo
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- CN105825911B CN105825911B CN201610315615.2A CN201610315615A CN105825911B CN 105825911 B CN105825911 B CN 105825911B CN 201610315615 A CN201610315615 A CN 201610315615A CN 105825911 B CN105825911 B CN 105825911B
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- silver powder
- silver
- inner electrode
- silver paste
- laminated inductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Abstract
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Claims (6)
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CN201610315615.2A CN105825911B (zh) | 2016-05-13 | 2016-05-13 | 一种叠层片式电感内电极银浆及其制备方法 |
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CN201610315615.2A CN105825911B (zh) | 2016-05-13 | 2016-05-13 | 一种叠层片式电感内电极银浆及其制备方法 |
Publications (2)
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CN105825911A CN105825911A (zh) | 2016-08-03 |
CN105825911B true CN105825911B (zh) | 2017-05-31 |
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CN201610315615.2A Active CN105825911B (zh) | 2016-05-13 | 2016-05-13 | 一种叠层片式电感内电极银浆及其制备方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107052326A (zh) * | 2017-02-20 | 2017-08-18 | 江苏瑞德新能源科技有限公司 | 银微粉及其制备方法和应用 |
CN113226595B (zh) * | 2018-12-26 | 2023-07-28 | 昭荣化学工业株式会社 | 银浆 |
US20220089885A1 (en) * | 2018-12-26 | 2022-03-24 | Shoei Chemical Inc. | Silver paste |
CN111145935B (zh) * | 2019-12-16 | 2022-07-15 | 中国人民解放军国防科技大学 | 一种银电极浆料及其制备方法和应用 |
CN113658756B (zh) * | 2021-08-10 | 2023-06-20 | 上海银浆科技有限公司 | 一种5g陶瓷基座滤波器用电极银浆的制备方法 |
CN116525480B (zh) * | 2023-05-10 | 2023-11-10 | 广东空天科技研究院(南沙) | 一种基于显微图像的激光栅线成形质量自动检测方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1159731C (zh) * | 2000-08-28 | 2004-07-28 | 广东肇庆风华电子工程开发有限公司 | 片式电感器用内电极浆料 |
CN101599349A (zh) * | 2009-04-14 | 2009-12-09 | 贵阳晶华电子材料有限公司 | 片式电感器用内电极银浆及其制备方法 |
CN103310872A (zh) * | 2013-05-13 | 2013-09-18 | 广东风华高新科技股份有限公司 | 电极浆料及其制备方法 |
CN103915132A (zh) * | 2014-02-24 | 2014-07-09 | 西北稀有金属材料研究院 | 一种叠层片式电感器用内电极银浆及其制备方法 |
CN104751942A (zh) * | 2015-04-23 | 2015-07-01 | 江苏欧耐尔新型材料有限公司 | 太阳能电池细线丝网印刷用无铅导电浆料及其制备方法 |
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2016
- 2016-05-13 CN CN201610315615.2A patent/CN105825911B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1159731C (zh) * | 2000-08-28 | 2004-07-28 | 广东肇庆风华电子工程开发有限公司 | 片式电感器用内电极浆料 |
CN101599349A (zh) * | 2009-04-14 | 2009-12-09 | 贵阳晶华电子材料有限公司 | 片式电感器用内电极银浆及其制备方法 |
CN103310872A (zh) * | 2013-05-13 | 2013-09-18 | 广东风华高新科技股份有限公司 | 电极浆料及其制备方法 |
CN103915132A (zh) * | 2014-02-24 | 2014-07-09 | 西北稀有金属材料研究院 | 一种叠层片式电感器用内电极银浆及其制备方法 |
CN104751942A (zh) * | 2015-04-23 | 2015-07-01 | 江苏欧耐尔新型材料有限公司 | 太阳能电池细线丝网印刷用无铅导电浆料及其制备方法 |
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CN105825911A (zh) | 2016-08-03 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: The invention relates to a silver paste for an inner electrode of a laminated chip inductor and a preparation method thereof Effective date of registration: 20210808 Granted publication date: 20170531 Pledgee: Wenzhou Financing Guarantee Co.,Ltd. Pledgor: ZHEJIANG GONDA ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021330001101 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220915 Granted publication date: 20170531 Pledgee: Wenzhou Financing Guarantee Co.,Ltd. Pledgor: ZHEJIANG GONDA ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2021330001101 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Silver paste for inner electrode of laminated chip inductor and its preparation method Effective date of registration: 20221010 Granted publication date: 20170531 Pledgee: Wenzhou Financing Guarantee Co.,Ltd. Pledgor: ZHEJIANG GONDA ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022990000718 |