CN105817765B - 构图方法及构图加工物品 - Google Patents

构图方法及构图加工物品 Download PDF

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Publication number
CN105817765B
CN105817765B CN201610033573.3A CN201610033573A CN105817765B CN 105817765 B CN105817765 B CN 105817765B CN 201610033573 A CN201610033573 A CN 201610033573A CN 105817765 B CN105817765 B CN 105817765B
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CN
China
Prior art keywords
film
transparent member
laser beam
patterning process
elastomeric element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610033573.3A
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English (en)
Chinese (zh)
Other versions
CN105817765A (zh
Inventor
青山良次
村松健次
森本哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Publication of CN105817765A publication Critical patent/CN105817765A/zh
Application granted granted Critical
Publication of CN105817765B publication Critical patent/CN105817765B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Surface Treatment Of Optical Elements (AREA)
CN201610033573.3A 2015-01-23 2016-01-19 构图方法及构图加工物品 Expired - Fee Related CN105817765B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-011778 2015-01-23
JP2015011778A JP6474623B2 (ja) 2015-01-23 2015-01-23 パターニング方法、およびパターニング加工物品

Publications (2)

Publication Number Publication Date
CN105817765A CN105817765A (zh) 2016-08-03
CN105817765B true CN105817765B (zh) 2018-04-20

Family

ID=56512339

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610033573.3A Expired - Fee Related CN105817765B (zh) 2015-01-23 2016-01-19 构图方法及构图加工物品

Country Status (2)

Country Link
JP (1) JP6474623B2 (enrdf_load_stackoverflow)
CN (1) CN105817765B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396558B (zh) * 2017-06-30 2021-05-04 捷开通讯(深圳)有限公司 实现壳体表面纹理的方法及终端
CN108817686A (zh) * 2018-07-03 2018-11-16 京东方科技集团股份有限公司 基板承载台及切割装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3210251B2 (ja) * 1996-07-09 2001-09-17 シャープ株式会社 レーザーパターニング装置
JP2000296698A (ja) * 1999-04-14 2000-10-24 Art Laser Giken:Kk 文字又は絵柄等の描画方法
JP2001009583A (ja) * 1999-06-29 2001-01-16 Canon Inc レーザ加工装置
JP4287560B2 (ja) * 1999-11-16 2009-07-01 株式会社カネカ 薄膜光電変換モジュールの製造方法
CA2469500A1 (en) * 2001-12-21 2003-07-10 Ifire Technology Inc. Method of laser ablation for patterning thin film layers for electroluminescent displays
JP2006216820A (ja) * 2005-02-04 2006-08-17 Advanced Lcd Technologies Development Center Co Ltd レーザ加工方法、レーザ加工装置および結晶化装置
JP4872503B2 (ja) * 2005-11-16 2012-02-08 株式会社デンソー ウェハおよびウェハの加工方法
US20090190225A1 (en) * 2006-06-30 2009-07-30 Kazuhiro Yamada Optical member and optical device including the optical member
JP2009101384A (ja) * 2007-10-23 2009-05-14 Olympus Corp レーザ加工方法
US20110155219A1 (en) * 2009-12-29 2011-06-30 Du Pont Apollo Limited Thin film solar cell and method for fabricating the same
CN202114400U (zh) * 2011-04-27 2012-01-18 瑞世达科技(厦门)有限公司 激光光刻机
US9182660B2 (en) * 2012-06-01 2015-11-10 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for electron beam patterning

Also Published As

Publication number Publication date
JP6474623B2 (ja) 2019-02-27
JP2016135504A (ja) 2016-07-28
CN105817765A (zh) 2016-08-03

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