CN105810611A - 可旋转可加热放置工具和包括这种放置工具的芯片焊接机 - Google Patents

可旋转可加热放置工具和包括这种放置工具的芯片焊接机 Download PDF

Info

Publication number
CN105810611A
CN105810611A CN201610136865.XA CN201610136865A CN105810611A CN 105810611 A CN105810611 A CN 105810611A CN 201610136865 A CN201610136865 A CN 201610136865A CN 105810611 A CN105810611 A CN 105810611A
Authority
CN
China
Prior art keywords
place tool
holding element
insulator
container
placement tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610136865.XA
Other languages
English (en)
Inventor
乔齐姆·特灵克斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Die Bonding GmbH
Original Assignee
Kulicke and Soffa Die Bonding GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Die Bonding GmbH filed Critical Kulicke and Soffa Die Bonding GmbH
Publication of CN105810611A publication Critical patent/CN105810611A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种可在垂直于衬底的z轴方向上移动的放置工具，包括：芯片保持元件，保持元件包括加热元件；保持元件的容器，容器相对于z轴可旋转地安装在放置工具处并包括由热绝缘材料制成的绝缘体；容器的驱动装置，驱动装置能够使容器绕z轴旋转；冷却流体的供给装置，保持元件的容器可通过供给装置被冷却。

Description

可旋转可加热放置工具和包括这种放置工具的芯片焊接机
技术领域
本发明属于半导体组装领域。其涉及一种根据独立专利权利要求的前序部分的可旋转可加热放置工具并且涉及一种包括这种放置工具的芯片组装设备。
背景技术
当通过芯片组装设备(通常被称为芯片焊接机(diebonder))在衬底上安装半导体器件(通常被称为芯片)时，通常在单个芯片与衬底之间设置包括粘合剂和焊接剂的粘合层。所述粘合层通常还可以以液体形式应用—“分配”—至衬底上。可选地，胶带可用作粘合层。在这种情况下，可以在放置芯片之前将胶带层压至衬底上。胶带还可以被层压至半导体晶片的背面，已经通过切割(通常被称为划片)从半导体晶片获得芯片。后一种情况被称为晶片背面层压(waferbacksidelamination,WBL)或线上可流动膜(filmoverwire,FOW)。
为了在芯片与衬底之间获得尽可能稳定和可靠的粘合，常常需要对粘合层进行加热。为此，可以例如对芯片和/或衬底进行加热。美国公开出版物2005/0081986A1(其全部内容通过引用并入本文)描述了被加热的组装头(被称为粘合头)，芯片的保持元件(被称为芯片夹头)被插入该组装头内。
该设备的一个缺点是，粘合头中的加热元件距离保持元件用于接触芯片的支撑面较远。如果支撑面的温度需要随着时间变化，具体地，则整个保持元件的较大热容量导致等待时间变得必要，等待时间降低可获得的生产量。具体地，如果粘合头还从半导体晶片的支撑台拾取待粘合的芯片，就会发生这种情况，因为尤其对于具有背面层压的半导体晶片，不期望在支撑台上加热芯片。
即使通过为该目的单独提供的拾取工具而不是依靠粘合头从供给台拾取待粘合的芯片，在某种情况下也期望支撑面的温度随时间变化以防止芯片与支撑面粘在一起。如果粘合头从枢轴工具或从中间台拾取芯片，这也适用。2007/118511A1和WO2007/033701A1中分别描述了相关的芯片焊接机，它们的全部内容通过引用并入本文。
另一个缺点在于，无论是粘合头还是保持元件都不能绕垂直于晶片或衬底的轴旋转。因此既不能执行角度修正来修正晶圆与衬底之间的微小歪斜，也不能将不同芯片以不同方向放置在衬底上。
发明内容
因此本发明的目的是描述一种不具有上述缺点的芯片焊接机以及芯片焊接机的放置工具。
该目的被一种放置工具以及包括这种放置工具的芯片焊接机实现，该放置工具可在垂直于衬底的z轴方向上移动，其包括：芯片的保持元件，保持元件包括加热元件；保持元件的容器，容器相对于z轴可旋转地安装在放置工具处并包括由热绝缘材料制成的绝缘体；容器的驱动装置，驱动装置能够使容器绕z轴旋转；冷却流体的供给装置，保持元件的容器可通过供给装置被冷却。
下面将结合附图在优选实施方式的描述中详细说明本发明的前述和进一步的目的、优点和特征。
附图说明
图1示出根据本发明的可加热可旋转放置工具的立体代表图；
图2示出图1的可加热可旋转放置工具的另一个立体代表图；
图3示出图1和图2的可加热可旋转放置工具的横截面图；
图4示出图3的彩色版本；以及
图5示出图4的具有参考标号的可选版本。
具体实施方式
图1和图2分别从不同角度示出根据本发明的可旋转可加热放置工具1的立体代表图。放置工具1可通过其所附接的滑动件2沿着z方向位移。放置工具1包括芯片的保持元件11，其中保持元件包括由Al2O3制成的加热元件12，至少一个薄膜电阻器已经被应用至加热元件。
保持元件11被插入可绕z方向旋转的容器(receptacle)13。容器13包括由陶瓷制成的绝缘体，该绝缘体拧紧至第一金属支撑件132。为了冷却，可通过供给装置151向容器供给空气，从而空气可在容器内循环并且随后通过出口152排出。第二金属支撑件133设置在容器13面向保持元件11的一侧。保持元件11的温度可通过设置在第二金属支撑件133内的热电传感器测量或估计。第二金属保持器133内的热电传感器的设置允许容易地更换保持元件11。此外，第二金属支撑件133内设置有螺纹以通过螺钉S1固定保持元件11。第二金属支撑件133转而被陶瓷套管134包围以避免由放置工具在操作中执行的x或y方向上的快速移动而导致的热损失。绝缘体中的开口135充当热电传感器和加热元件12的连接线缆的通孔，电流通过弹簧承载的、镀金铜触针136供给至热电传感器和加热元件。
在本发明的优选实施方式中，对排出的空气量进行监测的传感器位于出口中或出口处。此外，保护电路被设置以当排出的空气量降至预定极限值之下时降低或中断加热元件12的发热量。通过这种方法，能够在供给管出现泄漏的情况下避免损害。
放置工具1以其可以绕x和y方向旋转的方式安装至滑动件2用于校准目的。
为了使放置工具1绕x方向旋转，需要松开夹紧螺钉S2。随后可以通过调整螺钉S3来实现位置修正。随后，夹紧螺钉S2需要再次上紧。通过调整元件3安装在设置在滑动件2上的圆柱形突起5上的放置工具1使在x方向上的旋转成为可能。
为了使放置工具1绕y方向旋转，需要松开夹紧螺钉S2。随后可以通过另外的调整螺钉来实现位置修正。放置工具通过叶片弹簧4相对于调整元件3被预加载，并且被可绕y方向旋转地安装至调整元件3上。
图3示出穿过根据图1和图2的可旋转可加热放置工具的横截面。第一金属支撑件132连接至空心轴7，空心轴转而连接至电机转子62，转子62可与定子61协作实现绕z方向的旋转运动。真空通道10允许向设置在保持元件11下侧的真空通道施加真空。通过这种方法，芯片能够依靠吸力被拾取并放置在位于放置工具1下方的衬底上。真空通过设置在第一金属支撑件132中和绝缘体131中的槽孔传递给保持元件11。
虽然此处参照特定实施方式示出并描述本发明，但本发明不限于所示的细节。相反，在不背离本发明并且在权利要求的等同范围内，可以对细节进行各种修改。

Claims (6)

1.一种在垂直于衬底的z轴方向上可移动的放置工具，包括：
a)用于芯片的保持元件，所述保持元件包括加热元件；
b)用于所述保持元件的容器，所述容器相对于z轴可旋转地安装在所述放置工具处并包括由热绝缘材料制成的绝缘体；
c)用于所述容器的驱动装置，所述驱动装置能够使所述容器绕z轴旋转；以及
d)冷却流体的供给装置，用于所述保持元件的所述容器可通过所述供给装置被冷却。
2.根据权利要求1所述的放置工具，其中，空气用作冷却流体。
3.根据前述权利要求之一所述的放置工具，其中，所述容器包括使所述保持元件与所述放置工具热绝缘的绝缘体。
4.根据权利要求3所述的放置工具，其特征在于，所述绝缘体由陶瓷构成。
5.根据前述权利要求之一所述的放置工具，其特征在于，所述绝缘体附接至可以绕z轴旋转的第一金属支撑件。
6.一种包括根据前述权利要求之一所述的放置工具的芯片焊接机。
CN201610136865.XA 2008-09-09 2009-09-08 可旋转可加热放置工具和包括这种放置工具的芯片焊接机 Pending CN105810611A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9541708P 2008-09-09 2008-09-09
US61/095,417 2008-09-09
CN2009801353737A CN102217053A (zh) 2008-09-09 2009-09-08 可旋转可加热放置工具和包括这种放置工具的芯片焊接机

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2009801353737A Division CN102217053A (zh) 2008-09-09 2009-09-08 可旋转可加热放置工具和包括这种放置工具的芯片焊接机

Publications (1)

Publication Number Publication Date
CN105810611A true CN105810611A (zh) 2016-07-27

Family

ID=41226316

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610136865.XA Pending CN105810611A (zh) 2008-09-09 2009-09-08 可旋转可加热放置工具和包括这种放置工具的芯片焊接机
CN2009801353737A Pending CN102217053A (zh) 2008-09-09 2009-09-08 可旋转可加热放置工具和包括这种放置工具的芯片焊接机

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009801353737A Pending CN102217053A (zh) 2008-09-09 2009-09-08 可旋转可加热放置工具和包括这种放置工具的芯片焊接机

Country Status (4)

Country Link
EP (1) EP2327090B1 (zh)
KR (1) KR101658252B1 (zh)
CN (2) CN105810611A (zh)
WO (1) WO2010029075A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW510507U (en) * 2002-04-22 2002-11-11 Ind Tech Res Inst Chip accessing device with position, speed and force controls
CN1548361A (zh) * 2003-05-13 2004-11-24 大连理工大学 塑料微流控芯片键合前的预联接方法和装置
US20060196912A1 (en) * 2003-05-29 2006-09-07 Fujitsu Limited Method and apparatus for mounting and removing an electronic component
CN101055846A (zh) * 2006-04-12 2007-10-17 中南大学 热超声倒装芯片键合机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268051A (ja) * 1993-03-10 1994-09-22 Mitsubishi Electric Corp ウエハ剥し装置
JP3627011B2 (ja) * 2001-02-13 2005-03-09 インターナショナル・ビジネス・マシーンズ・コーポレーション 接合方法
JP3581684B2 (ja) * 2001-12-04 2004-10-27 Ｎｅｃマシナリー株式会社 ダイボンダ
JP3809125B2 (ja) * 2002-04-11 2006-08-16 新光電気工業株式会社 半導体チップボンディング用ヘッドおよび半導体チップボンディング方法
JP3704113B2 (ja) * 2002-09-26 2005-10-05 住友大阪セメント株式会社 ボンディングステージ及び電子部品実装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW510507U (en) * 2002-04-22 2002-11-11 Ind Tech Res Inst Chip accessing device with position, speed and force controls
CN1548361A (zh) * 2003-05-13 2004-11-24 大连理工大学 塑料微流控芯片键合前的预联接方法和装置
US20060196912A1 (en) * 2003-05-29 2006-09-07 Fujitsu Limited Method and apparatus for mounting and removing an electronic component
CN101055846A (zh) * 2006-04-12 2007-10-17 中南大学 热超声倒装芯片键合机

Also Published As

Publication number Publication date
KR20110081815A (ko) 2011-07-14
KR101658252B1 (ko) 2016-09-22
EP2327090B1 (de) 2020-11-04
WO2010029075A1 (de) 2010-03-18
EP2327090A1 (de) 2011-06-01
CN102217053A (zh) 2011-10-12

Similar Documents

Publication Publication Date Title
CN102959695B (zh) 电子器件安装装置以及电子器件安装方法
TWI363301B (en) Manufacturing apparatus for ic chip package
KR100993079B1 (ko) 접합장치
TW496961B (en) Device testing apparatus
CN102918936B (zh) 电子器件安装装置及其方法
CN104335336B (zh) 覆晶接合器以及覆晶接合方法
US9120169B2 (en) Method for device packaging
JP4999002B2 (ja) 高低温化装置及び高低温化装置を備えたテストハンドラ
JP5364065B2 (ja) 半導体チップの取り付け
US20170347504A1 (en) Electronic-component mounting apparatus and electronic-component mounting method
CN105810611A (zh) 可旋转可加热放置工具和包括这种放置工具的芯片焊接机
JP2012129300A (ja) 電子部品の実装装置及び実装方法
US8921157B2 (en) Printed substrate manufacturing equipment and manufacturing method
CN113748494B (zh) 半导体装置的制造装置及制造方法
CN103811398B (zh) 可调整拾取头和用于制造器件的方法
JP2001144233A (ja) 半導体ユニット、冷却装置およびそれらの製造方法
CN102479882B (zh) 半导体单元的导线连接装置及连接方法
US20170263490A1 (en) Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
US10893638B2 (en) Dispensing head having a nozzle heater device, system and method
JP2008270359A (ja) ダイボンダおよびボンディング方法
CN102789992B (zh) 使用掩模将导电性球搭载到工件上的方法及球搭载装置
CN115424947B (zh) 一种半导体芯片贴片工艺及设备
EP0798764B1 (en) Hollow package manufacturing apparatus
US20240098957A1 (en) Cooling stage for cooling down a heated carrier
US20220102187A1 (en) Die bonding system with heated automatic collet changer

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160727

WD01 Invention patent application deemed withdrawn after publication