CN105801163A - 低温固相烧成碳化硅泡沫陶瓷及其制备方法 - Google Patents
低温固相烧成碳化硅泡沫陶瓷及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种低温固相烧成碳化硅泡沫陶瓷及其制备方法，按质量份数计算，碳化硅微粉颗粒45‑60份和粘结剂25‑45份为制备原料;聚氨酯海绵为模板。本发明利用磷酸二氢铝作为粘结剂来制备SiC泡沫陶瓷，它能实现泡沫陶瓷的低成本低温制备。明所制得的碳化硅泡沫陶瓷具有烧成温度低，抗折强度高、孔隙率高，平均孔径在0.3～3.5mm之间且孔径分布均匀的特点。本发明的制备方法可以大大降低成本、且工艺实施简单、容易过度到大批量生产，有效地避免了传统碳化硅泡沫陶瓷制备工艺复杂，烧成温度高的难题。
Description
技术领域
本发明属于陶瓷材料制备技术领域，涉及一种低温固相烧成碳化硅泡沫陶瓷及其制备方法。
背景技术
碳化硅泡沫陶瓷因其三维立体网络骨架和贯通气孔结构，具有密度低、强度高、孔隙率高、渗透性高、比表面积大、抗腐蚀、抗氧化、隔热性良好、抗热震次数和耐高温性优异等特点，已广泛应用于过滤、吸音、化工填料、生物陶瓷和催化剂载体等领域。碳化硅是一种具有强共价键的无机非金属材料，与氧化物相比，它有好的热导率、抗热震性和耐磨性。介于碳化硅泡沫陶瓷材料在低温下很难烧成，即便添加烧成助剂，大多烧成温度都在1400℃以上，聚碳硅烷虽能满足低温下烧成，但产品线收缩率大、成本极高，限制了其应用。
磷酸盐粘结剂具有耐水性好、固化收缩率小、高温强度大以及可在较低温度下固化等优点，已广泛应用于耐火材料、铸造和无机涂料等邻域。
发明内容
本发明的目的是：提供了一种低温固相烧成碳化硅泡沫陶瓷及其制备方法，它具有烧成温度低、抗折强度高、孔隙率高、孔径分布均匀的特点，并且其制备工艺简单、成本低廉，以克服现有技术的不足。
本发明是这样实现的：低温固相烧成碳化硅泡沫陶瓷，以聚氨酯海绵为泡沫陶瓷模板，浆料的组成按质量份数计算包括碳化硅微粉颗粒45-60份及粘结剂25-45份。
所述聚氨酯海绵开气孔率>99%，孔径为0.2～3.5mm。
所述碳化硅微粉颗粒为α-SiC
微粉或β-SiC微粉，粒度为0.3-20μm，纯度为98.2%以上。
所述的粘接剂为磷酸二氢铝溶液或磷酸二氢铝粉末。
低温固相烧成碳化硅泡沫陶瓷的制备方法，按上述质量份数取各组分；将碳化硅微粉颗粒与粘结剂混合后，充分搅拌后困料24小时，获得预制体浆料；然后用聚氨酯泡沫在预制体浆料中进行挂浆，用辊压机以3:1～6:1的挤压比去除聚氨酯海绵上多余的浆料后，得到泡沫预制体，将泡沫预制体放在45～55℃恒温烘箱中干燥40-55h后，再将干燥后的泡沫预制体置于箱式炉内，在空气或惰性气氛中以100～200℃/h升温速率升温至700～1000℃，保温2h，随炉自然冷却至室温得到碳化硅泡沫陶瓷。
所述的惰性气氛为氮气、氩气或氦气。
碳化硅微粉颗粒与粘结剂混合后，加入去离子水，使浆料中粘结剂的质量百分比调整为25～45%，碳化硅的质量百分比调整为45～60%。
由于采用了上述技术方案，与现有技术相比，本发明利用磷酸二氢铝作为粘结剂来制备SiC泡沫陶瓷，它能实现泡沫陶瓷的低成本低温制备。明所制得的碳化硅泡沫陶瓷具有烧成温度低，抗折强度高、孔隙率高，平均孔径在0.3～3.5mm之间且孔径分布均匀的特点。本发明的制备方法可以大大降低成本、且工艺实施简单、容易过度到大批量生产，有效地避免了传统碳化硅泡沫陶瓷制备工艺复杂，烧成温度高的难题。
附图说明
附图1为本发明的实施例1的产品的微观结构图；
附图2为本发明的实施例3的产品的微观结构图。
具体实施方式
下面结合附图对本发明作进一步的详细说明，但不作为对本发明的任何限制
本发明的实施例1：低温固相烧成碳化硅泡沫陶瓷，按质量份数计算，碳化硅微粉颗粒60份及粘结剂40份为浆料的制备原料，聚氨酯海绵为模板；所述聚氨酯海绵开气孔率>99%，孔径为0.2～0.8mm；所述碳化硅微粉颗粒采用市售的α-SiC型号的产品，其平均粒度D50= 5μm，纯度为98.2%；所述的粘接剂为磷酸二氢铝溶液，磷酸二氢铝的质量百分比为80%。
低温固相烧成碳化硅泡沫陶瓷的制备方法，按上述质量份数取各组分；将磷酸二氢铝溶液加入碳化硅微粉颗粒进行混合，充分搅拌后困料24小时，获得预制体浆料；将聚氨酯泡沫裁剪为50mm×15mm×15mm的长方体，将裁剪好的聚氨酯泡沫挤压排除空气后浸泡到预制体浆料中，让其自由伸展并不断搅拌挤压揉搓，使浆料均匀地涂挂在聚氨酯海绵上，捞出聚氨酯海绵，用辊压机以4:1的挤压比（指原始泡沫平均厚度与对辊间距的比值）去除聚氨酯海绵上多余的浆料后，得到泡沫预制体；将泡沫预制体放在50℃恒温烘箱中干燥48h，使其水份缓慢蒸发防止泡沫预制体变形，再将干燥后的泡沫预制体置于箱式炉内，在空气气氛中以100℃/h升温速率升温至800℃，保温2h，随炉自然冷却至室温得到碳化硅泡沫陶瓷。
经检测，得到的产品体积密度为0.491g/cm3，抗折强度为1.24MPa。
本发明的实施例2：低温固相烧成碳化硅泡沫陶瓷，按质量份数计算，碳化硅微粉颗粒60份及粘结剂30份为浆料的制备原料，聚氨酯海绵为模板；所述聚氨酯海绵开气孔率>99%，孔径为0.2～0.8mm；所述碳化硅微粉颗粒采用市售的α-SiC型号的产品，其平均粒度D50= 10μm，纯度为98.2%；所述的粘接剂为磷酸二氢铝溶液，磷酸二氢铝的质量百分比为80%。
低温固相烧成碳化硅泡沫陶瓷的制备方法，按上述质量份数取各组分；将磷酸二氢铝溶液加入碳化硅微粉颗粒进行混合，并加入10份去离子水，充分搅拌后困料24小时，获得预制体浆料；将聚氨酯泡沫裁剪为50mm×15mm×15mm的长方体，将裁剪好的聚氨酯泡沫挤压排除空气后浸泡到预制体浆料中，让其自由伸展并不断搅拌挤压揉搓，使浆料均匀地涂挂在聚氨酯海绵上，捞出聚氨酯海绵，用辊压机以4:1的挤压比（指原始泡沫平均厚度与对辊间距的比值）去除聚氨酯海绵上多余的浆料后，得到泡沫预制体；将泡沫预制体放在50℃恒温烘箱中干燥48h，使其水份缓慢蒸发防止泡沫预制体变形，再将干燥后的泡沫预制体置于箱式炉内，在空气气氛中以100℃/h升温速率升温至800℃，保温2h，随炉自然冷却至室温得到碳化硅泡沫陶瓷。
经检测，得到的产品体积密度为0.313g/cm3，抗弯强度为0.77MPa。
本发明的实施例3：低温固相烧成碳化硅泡沫陶瓷，按质量份数计算，碳化硅微粉颗粒55份及粘结剂45份为浆料的制备原料，聚氨酯海绵为模板；所述聚氨酯海绵开气孔率>99%，孔径为0.2～0.8mm；所述碳化硅微粉颗粒采用市售的α-SiC型号的产品，其平均粒度D50= 5μm，纯度为98.2%；所述的粘接剂为磷酸二氢铝溶液，磷酸二氢铝的质量百分比为80%。
低温固相烧成碳化硅泡沫陶瓷的制备方法，按上述质量份数取各组分；将磷酸二氢铝溶液加入碳化硅微粉颗粒进行混合，并加入10份去离子水，充分搅拌后困料24小时，获得预制体浆料；将聚氨酯泡沫裁剪为50mm×15mm×15mm的长方体，将裁剪好的聚氨酯泡沫挤压排除空气后浸泡到预制体浆料中，让其自由伸展并不断搅拌挤压揉搓，使浆料均匀地涂挂在聚氨酯海绵上，捞出聚氨酯海绵，用辊压机以4:1挤压比（指原始泡沫平均厚度与对辊间距的比值）为去除聚氨酯海绵上多余的浆料后，得到泡沫预制体；将泡沫预制体放在50℃恒温烘箱中干燥48h，使其水份缓慢蒸发防止泡沫预制体变形，再将干燥后的泡沫预制体置于箱式炉内，在惰性气氛中以200℃/h升温速率升温至1000℃，保温2h，随炉自然冷却至室温得到碳化硅泡沫陶瓷。
经检测，得到的产品体积密度为0.393g/cm3，抗弯强度为2.06MPa，显气孔率为78.8%。
Claims (7)
1.一种低温固相烧成碳化硅泡沫陶瓷，其特征在于：以聚氨酯海绵为泡沫陶瓷模板，浆料的组成按质量份数计算包括碳化硅微粉颗粒45-60份及粘结剂25-45份。
2.根据权利要求1所述的低温固相烧成碳化硅泡沫陶瓷，其特征在于：所述聚氨酯海绵开气孔率>99%，孔径为0.2～3.5mm。
3.根据权利要求1所述的低温固相烧成碳化硅泡沫陶瓷，其特征在于：所述碳化硅微粉颗粒为α-SiC或β-SiC微粉，粒度为0.3-20μm之间。
4.根据权利要求1所述的低温固相烧成碳化硅泡沫陶瓷，其特征在于：所述的粘接剂为磷酸二氢铝溶液或是磷酸二氢铝粉末。
5.一种如权利要求1所述的低温固相烧成碳化硅泡沫陶瓷的制备方法，其特征在于：按上述质量份数取各组分；将碳化硅微粉颗粒与粘结剂混合后，充分搅拌后困料24小时，获得预制体浆料；然后用聚氨酯泡沫在预制体浆料中进行挂浆，再用辊压机以3:1～6:1的挤压比去除聚氨酯海绵上多余的浆料后，得到泡沫预制体，将泡沫预制体放在45～55℃恒温烘箱中干燥40～55h后，再将干燥后的泡沫预制体置于箱式炉内，在空气或惰性气氛中以100～200℃/h升温速率升温至700～1000℃，保温2h，随炉自然冷却至室温得到碳化硅泡沫陶瓷。
6.根据权利要求5所述的制备方法,其特征在于：所述的惰性气氛为氮气、氩气或氦气。
7.根据权利要求5所述的制备方法，其特征在于：碳化硅微粉颗粒与粘结剂混合后，加入去离子水，使浆料中粘结剂的质量百分比调整为25～45%，碳化硅的质量百分比调整为45～60%。
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