CN105792543A - Method of improving golden finger broken section position gold seeping - Google Patents
Method of improving golden finger broken section position gold seeping Download PDFInfo
- Publication number
- CN105792543A CN105792543A CN201610284098.7A CN201610284098A CN105792543A CN 105792543 A CN105792543 A CN 105792543A CN 201610284098 A CN201610284098 A CN 201610284098A CN 105792543 A CN105792543 A CN 105792543A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- gold
- joint position
- time
- processes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
Abstract
The invention belongs to the circuit board processing field and especially relates to a method of improving golden finger broken section position gold seeping. The method comprises the following steps of during external layer graph processing, etching a broken section position line; then connecting conductive lead wires to two ends of a golden finger; and then carrying out electric gold processing. By using the method, a broken section position line gap of the golden finger is increased to minimum 0.08mm from minimum 0.12mm; a broken-section golden finger board broken section position gold seeping short circuit is improved; and a great market prospect and an economic value are possessed.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to a kind of improve golden finger break joint position ooze gold method.
Background technology
Along with the development of PCB, relying plug golden finger to design more and more, such as built-in golden finger, long and short golden finger, disconnected joint golden finger, golden finger kenel is different, and flow scheme design and critical technological point are also different, saves the making ability of position as disconnected joint golden finger breaks.
In prior art, conventional preparation method is: disconnected joint position silk-screen anti-electricity bronze ink, electricity gold retreats film, then etches, and minimum clearance is 0.12mm.Idiographic flow is as follows: front operation-outer graphics (1)-graphic plating-etching (1)-silk-screen welding resistance-silk-screen anti-electricity bronze ink-outer graphics (2)-electricity gold-move back film outer graphics (3)-etching (2)-rear operation.But, adopt in this way, golden finger disconnected joint position gap minimum making 0.12mm, and easily ooze gold short circuit herein；Therefore this technical bottleneck is the instant thing that this area is presently required solution.
Summary of the invention
For this, the technical problem to be solved is in that to overcome the joint position of breaking of wiring board in prior art easily to ooze the technical bottleneck of gold, breaks the method that joint position oozes gold thus proposing a kind of golden finger that improves.
For solving above-mentioned technical problem, the invention discloses a kind of golden finger that improves and break the method that joint position oozes gold, it is characterised in that described method: first when outer graphics processes, etch out by the disconnected joint position line；Then at the two ends of described golden finger, conductive lead wire is connected；Then carry out electricity gold again to process.
Preferably, described method order comprises the steps:
S1, first time outer graphics process；
S2, graphic plating process；
S3, first time etch processes, etch out by the disconnected joint position line, and at the two ends of golden finger, connect conductive lead wire；
S4, silk-screen anti-electricity bronze ink processes；
S5, second time outer graphics process；
S6, electricity gold process；
S7, third time are moved back film outer graphics and are processed；
S8, second time etch processes, it is necessary to the moment falls lead-in wire.
Preferably, the gap of the described disconnected joint position line is minimum for 0.08mm.
Preferably, during described second time outer graphics processes, it is necessary to only expose golden finger position and conductive lead wire position, remaining part is covered, carry out graphics process.
Preferably, described first time etch processes speed is 6.5m/min.
Being more highly preferred to, described silk-screen anti-electricity bronze ink processes and is specially；Windowing in the pipe nipple position of described golden finger ink for screen printing, thickness is more than 20-30um；Then adopt film exposure, after development, adopt 800mj exposure energy to return exposure once.
The technique scheme of the present invention has the following advantages compared to existing technology, and described method makes the disconnected joint position line gap of described golden finger be risen to minimum 0.08mm by minimum 0.12mm；Improve disconnected joint gold finger plate disconnected joint position and ooze gold short circuit；There is great market prospect and economic worth.
Detailed description of the invention
Embodiment 1 present embodiment discloses a kind of improve golden finger break joint position ooze gold method, described method order comprise the steps:
S0, front operation；
S1, first time outer graphics process；
S2, graphic plating process；
S3, first time etch processes, it is necessary to the position needing disconnected joint is etched out, and at the two ends of golden finger, designs conductive lead wire；Etching speed is 6.5m/min.
S4, silk-screen anti-electricity bronze ink processes；Windowing in the pipe nipple position of described golden finger ink for screen printing, thickness is more than 20-30um；Then adopt film exposure, after development, adopt 800mj exposure energy to return exposure once.
S5, second time outer graphics process, and cover elsewhere, only expose golden finger position and conductive lead wire position；
S6, electricity gold process；
S7, third time are moved back film outer graphics and are processed；
S8, second time etch processes, it is necessary to the moment falls lead-in wire；
S9, rear operation.
Preferably, described first time etch processes speed is 6.5m/min.
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the apparent change thus extended out or variation are still among the protection domain of the invention.
Claims (6)
1. one kind is improved golden finger and breaks the method that joint position oozes gold, it is characterised in that described method: first when outer graphics processes, etch out by the disconnected joint position line；Then at the two ends of described golden finger, conductive lead wire is connected；Then carry out electricity gold again to process.
2. improve as claimed in claim 1 golden finger break joint position ooze gold method, it is characterised in that described method order comprise the steps:
S1, first time outer graphics process；
S2, graphic plating process；
S3, first time etch processes, etch out by the disconnected joint position line, and at the two ends of golden finger, connect conductive lead wire；
S4, silk-screen anti-electricity bronze ink processes；
S5, second time outer graphics process；
S6, electricity gold process；
S7, third time are moved back film outer graphics and are processed；
S8, second time etch processes, it is necessary to the moment falls lead-in wire.
3. improve as claimed in claim 2 golden finger break joint position ooze gold method, it is characterised in that the gap of the described disconnected joint position line is minimum for 0.08mm.
4. improve golden finger as claimed in claim 3 to break the method that joint position oozes gold, it is characterised in that during described second time outer graphics processes, it is necessary to only expose golden finger position and conductive lead wire position, remaining part covered, carry out graphics process.
5. improve as claimed in claim 4 golden finger break joint position ooze gold method, it is characterised in that described first time etch processes speed is 6.5m/min.
6. improve as claimed in claim 5 golden finger break joint position ooze gold method, it is characterised in that described silk-screen anti-electricity bronze ink process be specially；Windowing in the pipe nipple position of described golden finger ink for screen printing, thickness is more than 20-30um；Then adopt film exposure, after development, adopt 800mj exposure energy to return exposure once.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610284098.7A CN105792543A (en) | 2016-04-29 | 2016-04-29 | Method of improving golden finger broken section position gold seeping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610284098.7A CN105792543A (en) | 2016-04-29 | 2016-04-29 | Method of improving golden finger broken section position gold seeping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105792543A true CN105792543A (en) | 2016-07-20 |
Family
ID=56400374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610284098.7A Pending CN105792543A (en) | 2016-04-29 | 2016-04-29 | Method of improving golden finger broken section position gold seeping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105792543A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076181A (en) * | 2011-01-25 | 2011-05-25 | 东莞生益电子有限公司 | Manufacturing method of graded golden finger |
| CN103929900A (en) * | 2014-03-31 | 2014-07-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for disconnected golden finger |
| CN104981113A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of circuit board gold finger, and gold finger circuit board |
-
2016
- 2016-04-29 CN CN201610284098.7A patent/CN105792543A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076181A (en) * | 2011-01-25 | 2011-05-25 | 东莞生益电子有限公司 | Manufacturing method of graded golden finger |
| CN103929900A (en) * | 2014-03-31 | 2014-07-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for disconnected golden finger |
| CN104981113A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of circuit board gold finger, and gold finger circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160720 |