CN105728986B - 一种免洗型助焊剂 - Google Patents

一种免洗型助焊剂 Download PDF

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Publication number
CN105728986B
CN105728986B CN201610271786.XA CN201610271786A CN105728986B CN 105728986 B CN105728986 B CN 105728986B CN 201610271786 A CN201610271786 A CN 201610271786A CN 105728986 B CN105728986 B CN 105728986B
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parts
scaling powder
leave
rosin resin
sebacic acid
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CN201610271786.XA
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CN105728986A (zh
Inventor
谭钰良
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Guangzhou City Kaite Electronic Material Co., Ltd.
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GUANGZHOU CITY KAITE ELECTRONIC MATERIAL CO Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

本发明公开了一种免洗型助焊剂，由以下重量份的原料组成：松香树脂10‑15份、醋酸丁酯5‑10份、碳酸钠1‑3份、葵二酸1‑3份、脂肪酸甘油酯1‑2份、氧化锌1‑5份、1,4‑二(2‑乙基己基)丁二酸酯磺酸钠盐3‑5份、二季铵化聚二甲基硅氧烷5‑10份。本发明的免洗助焊剂焊接效果好、无腐蚀性，无需清洗，且无卤素，无毒使用安全。

Description

一种免洗型助焊剂
技术领域
本发明涉及电子试剂领域，特别是涉及一种免洗型助焊剂。
背景技术
助焊剂通常是以松香为主要成分的混合物，是保证焊接过程顺利进行的辅助材料。焊接是电子装配中的主要工艺过程，助焊剂是焊接时使用的辅料，助焊剂的主要作用是清除焊料和被焊母材表面的氧化物，使金属表面达到必要的清洁度.它防止焊接时表面的再次氧化，降低焊料表面张力，提高焊接性能.助焊剂性能的优劣，直接影响到电子产品的质量。
近几十年来，在电子产品生产锡焊工艺过程中，一般多使用主要由松香、树脂、含卤化物的活性剂、添加剂和有机溶剂组成的松香树脂系助焊剂.这类助焊剂虽然可焊性好，成本低，但焊后残留物高.其残留物含有卤素离子，会逐步引起电气绝缘性能下降和短路等问题，要解决这一问题，必须对电子印制板上的松香树脂系助焊剂残留物进行清洗.这样不但会增加生产成本，而且清洗松香树脂系助焊剂残留的清洗剂主要是氟氯化合物.这种化合物是大气臭氧层的损耗物质，属于禁用和被淘汰之列.仍有不少公司沿用的工艺是属于前述采用松香树指系助焊剂焊锡再用清洗剂清洗的工艺，效率较低而成本偏高。
发明内容
针对上述，本发明的目的是提供一种免洗型助焊剂。
本发明采取的技术方案是：
一种免洗型助焊剂，由以下重量份的原料组成：
松香树脂10-15份
醋酸丁酯5-10份
碳酸钠1-3份
葵二酸1-3份
脂肪酸甘油酯1-2份
氧化锌1-5份
1,4-二(2-乙基己基)丁二酸酯磺酸钠盐3-5份
二季铵化聚二甲基硅氧烷5-10份。
优选地，一种免洗型助焊剂，由以下重量份的原料组成：
松香树脂12.5份
醋酸丁酯7.5份
碳酸钠2份
葵二酸2份
脂肪酸甘油酯1.5份
氧化锌3份
1,4-二(2-乙基己基)丁二酸酯磺酸钠盐4份
二季铵化聚二甲基硅氧烷7.5份。
由于有机酸类活化剂的活性不如卤化物活化剂，本发明经多次试验发现碳酸钠作为活化剂，协同葵二酸有机酸类活化剂使用，可以达到一样的活化效果。
本发明的有益效果是：本发明的免洗助焊剂焊接效果好、无腐蚀性，无需清洗，且无卤素，无毒使用安全。
具体实施方式
下面对本发明的较佳实施例进行详细阐述，以使本发明的优点和特征能更易于被本领域技术人员理解，从而对本发明的保护范围做出更为清楚明确的界定。
实施例1
一种免洗型助焊剂，由以下重量份的原料组成：
松香树脂10份
醋酸丁酯5份
碳酸钠1份
葵二酸1份
脂肪酸甘油酯1份
氧化锌1份
1,4-二(2-乙基己基)丁二酸酯磺酸钠盐3份
二季铵化聚二甲基硅氧烷5份。
实施例2
一种免洗型助焊剂，由以下重量份的原料组成：
松香树脂12.5份
醋酸丁酯7.5份
碳酸钠2份
葵二酸2份
脂肪酸甘油酯1.5份
氧化锌3份
1,4-二(2-乙基己基)丁二酸酯磺酸钠盐4份
二季铵化聚二甲基硅氧烷7.5份。
实施例3
一种免洗型助焊剂，由以下重量份的原料组成：
松香树脂15份
醋酸丁酯10份
碳酸钠3份
葵二酸3份
脂肪酸甘油酯2份
氧化锌5份
1,4-二(2-乙基己基)丁二酸酯磺酸钠盐5份
二季铵化聚二甲基硅氧烷10份。

Claims (2)

1.一种免洗型助焊剂，其特征在于由以下重量份的原料组成：
松香树脂 10-15份
醋酸丁酯 5-10份
碳酸钠 1-3份
葵二酸 1-3份
脂肪酸甘油酯 1-2份
氧化锌 1-5份
1,4-二(2-乙基己基)丁二酸酯磺酸钠盐3-5份
二季铵化聚二甲基硅氧烷5-10份。
2.根据权利要求1所述的免洗型助焊剂，其特征在于由以下重量份的原料组成：
松香树脂 12.5份
醋酸丁酯 7.5份
碳酸钠 2份
葵二酸 2份
脂肪酸甘油酯 1.5份
氧化锌 3份
1,4-二(2-乙基己基)丁二酸酯磺酸钠盐 4份
二季铵化聚二甲基硅氧烷 7.5份。
CN201610271786.XA 2016-04-27 2016-04-27 一种免洗型助焊剂 Expired - Fee Related CN105728986B (zh)

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Publication number Priority date Publication date Assignee Title
CN107498214B (zh) * 2016-11-29 2019-06-14 广东剑鑫科技股份有限公司 网络变压器外pin专用免洗助焊剂及其制备方法
CN109465571A (zh) * 2018-11-16 2019-03-15 华普通用技术研究（广州）有限公司 一种高性能助焊剂的松香熔化装置及其制备工艺
CN109366041B (zh) * 2018-11-16 2021-04-23 桐庐明泽电子有限公司 一种高性能助焊剂的配方及其制备工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607369A (en) * 1968-09-11 1971-09-21 Union Carbide Corp Method for forming porous aluminum layer
CN101412166A (zh) * 2008-11-28 2009-04-22 廖龙根 一种无卤助焊剂
JP2010162599A (ja) * 2008-06-30 2010-07-29 Kaiho Giken:Kk 半自動アーク溶接におけるスパッタ付着防止剤の発明。
CN102049633A (zh) * 2010-07-13 2011-05-11 横店集团浙江英洛华电声有限公司 扬声器音圈线焊接用助焊剂及其制备方法
CN104084714A (zh) * 2014-07-30 2014-10-08 广西众昌树脂有限公司 松香助焊剂

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020046627A1 (en) * 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607369A (en) * 1968-09-11 1971-09-21 Union Carbide Corp Method for forming porous aluminum layer
JP2010162599A (ja) * 2008-06-30 2010-07-29 Kaiho Giken:Kk 半自動アーク溶接におけるスパッタ付着防止剤の発明。
CN101412166A (zh) * 2008-11-28 2009-04-22 廖龙根 一种无卤助焊剂
CN102049633A (zh) * 2010-07-13 2011-05-11 横店集团浙江英洛华电声有限公司 扬声器音圈线焊接用助焊剂及其制备方法
CN104084714A (zh) * 2014-07-30 2014-10-08 广西众昌树脂有限公司 松香助焊剂

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Address after: 510700 room 205, No. 13, 828 Maogang Road, Whampoa District, Guangzhou, Guangdong (for office use only)

Applicant after: Guangzhou City Kaite Electronic Material Co., Ltd.

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