CN105723477B - 基板中的螺线管电感器 - Google Patents

基板中的螺线管电感器 Download PDF

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Publication number
CN105723477B
CN105723477B CN201480061884.XA CN201480061884A CN105723477B CN 105723477 B CN105723477 B CN 105723477B CN 201480061884 A CN201480061884 A CN 201480061884A CN 105723477 B CN105723477 B CN 105723477B
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CN
China
Prior art keywords
pad
group
implementations
coil
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480061884.XA
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English (en)
Chinese (zh)
Other versions
CN105723477A (zh
Inventor
D·D·金
Y·K·宋
X·张
J·金
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Qualcomm Inc
Original Assignee
Qualcomm Inc
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Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN105723477A publication Critical patent/CN105723477A/zh
Application granted granted Critical
Publication of CN105723477B publication Critical patent/CN105723477B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0053—Printed inductances with means to reduce eddy currents

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Micromachines (AREA)
CN201480061884.XA 2013-11-13 2014-11-06 基板中的螺线管电感器 Expired - Fee Related CN105723477B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/079,488 US9806144B2 (en) 2013-11-13 2013-11-13 Solenoid inductor in a substrate
US14/079,488 2013-11-13
PCT/US2014/064299 WO2015073295A1 (en) 2013-11-13 2014-11-06 Solonoid inductor in a substrate

Publications (2)

Publication Number Publication Date
CN105723477A CN105723477A (zh) 2016-06-29
CN105723477B true CN105723477B (zh) 2019-09-10

Family

ID=51947506

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480061884.XA Expired - Fee Related CN105723477B (zh) 2013-11-13 2014-11-06 基板中的螺线管电感器

Country Status (5)

Country Link
US (1) US9806144B2 (enExample)
EP (1) EP3069356B1 (enExample)
JP (1) JP6367939B2 (enExample)
CN (1) CN105723477B (enExample)
WO (1) WO2015073295A1 (enExample)

Cited By (1)

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US12149217B2 (en) * 2021-07-16 2024-11-19 Murata Manufacturing Co., Ltd. Transmission/reception module

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JP6432531B2 (ja) * 2015-03-27 2018-12-05 株式会社村田製作所 積層コイル部品
US10249580B2 (en) 2016-06-22 2019-04-02 Qualcomm Incorporated Stacked substrate inductor
US10490348B2 (en) 2016-06-24 2019-11-26 Qualcomm Incorporated Two-dimensional structure to form an embedded three-dimensional structure
US10163771B2 (en) * 2016-08-08 2018-12-25 Qualcomm Incorporated Interposer device including at least one transistor and at least one through-substrate via
KR20180085219A (ko) * 2017-01-18 2018-07-26 삼성전기주식회사 인덕터 및 그 제조 방법
US10978240B2 (en) 2017-05-01 2021-04-13 Qualcomm Incorporated Inductor with embraced corner capture pad
US10134671B1 (en) * 2017-05-02 2018-11-20 Micron Technology, Inc. 3D interconnect multi-die inductors with through-substrate via cores
US20180323369A1 (en) 2017-05-02 2018-11-08 Micron Technology, Inc. Inductors with through-substrate via cores
US10872843B2 (en) 2017-05-02 2020-12-22 Micron Technology, Inc. Semiconductor devices with back-side coils for wireless signal and power coupling
US11817239B2 (en) * 2017-12-15 2023-11-14 Qualcomm Incorporated Embedded vertical inductor in laminate stacked substrates
KR102064044B1 (ko) * 2017-12-26 2020-01-08 삼성전기주식회사 코일 부품
US11011461B2 (en) * 2018-02-12 2021-05-18 Qualcomm Incorporated Perpendicular inductors integrated in a substrate
CN108347229A (zh) * 2018-03-19 2018-07-31 南京邮电大学 一种具有高性能电容、电感的ltcc正交型耦合器
KR102163060B1 (ko) * 2019-01-16 2020-10-08 삼성전기주식회사 인덕터 및 인덕터를 포함하는 저잡음 증폭기
US11881449B2 (en) * 2019-07-19 2024-01-23 Texas Instruments Incorporated High performance high voltage isolators
US11296022B2 (en) * 2020-08-25 2022-04-05 Qualcomm Incorporated Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape
JP7736428B2 (ja) * 2020-09-30 2025-09-09 オムロン株式会社 基板コイル及びトランス
US11348884B1 (en) * 2020-11-13 2022-05-31 Taiwan Semiconductor Manufacturing Company Limited Organic interposer including a dual-layer inductor structure and methods of forming the same
JP7342892B2 (ja) * 2021-01-25 2023-09-12 株式会社村田製作所 インダクタ部品

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CN102270532A (zh) * 2010-06-01 2011-12-07 台湾积体电路制造股份有限公司 3d电感器和变压器
CN103050483A (zh) * 2011-10-13 2013-04-17 台湾积体电路制造股份有限公司 垂直定向的半导体器件及其屏蔽结构
TW201340136A (zh) * 2011-12-29 2013-10-01 英特爾股份有限公司 積體電路裝置用的集成電感器
CN103377795A (zh) * 2012-04-24 2013-10-30 乾坤科技股份有限公司 电磁器件及其制作方法

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JP2005191191A (ja) * 2003-12-25 2005-07-14 Tdk Corp 積層型チップインダクタ
TWI296845B (en) * 2006-05-17 2008-05-11 Via Tech Inc Multilayer winding inductor
JP2007317838A (ja) * 2006-05-25 2007-12-06 Sanyo Electric Co Ltd 回路装置および表面実装コイル
US8093983B2 (en) * 2006-08-28 2012-01-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Narrowbody coil isolator
JP2008098552A (ja) * 2006-10-16 2008-04-24 Seiko Epson Corp パターン形成方法
US7750435B2 (en) 2008-02-27 2010-07-06 Broadcom Corporation Inductively coupled integrated circuit and methods for use therewith
US20100019300A1 (en) 2008-06-25 2010-01-28 The Trustees Of Columbia University In The City Of New York Multilayer integrated circuit having an inductor in stacked arrangement with a distributed capacitor
US7811919B2 (en) 2008-06-26 2010-10-12 International Business Machines Corporation Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitor
US8079134B2 (en) 2008-08-01 2011-12-20 International Business Machines Corporation Method of enhancing on-chip inductance structure utilizing silicon through via technology
EP4234001A3 (en) 2009-03-09 2023-10-18 NuCurrent, Inc. System and method for wireless power transfer in implantable medical devices
JP2012064683A (ja) * 2010-09-15 2012-03-29 Murata Mfg Co Ltd 積層型コイル
US20130300529A1 (en) * 2012-04-24 2013-11-14 Cyntec Co., Ltd. Coil structure and electromagnetic component using the same

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
CN102270532A (zh) * 2010-06-01 2011-12-07 台湾积体电路制造股份有限公司 3d电感器和变压器
CN103050483A (zh) * 2011-10-13 2013-04-17 台湾积体电路制造股份有限公司 垂直定向的半导体器件及其屏蔽结构
TW201340136A (zh) * 2011-12-29 2013-10-01 英特爾股份有限公司 積體電路裝置用的集成電感器
CN103377795A (zh) * 2012-04-24 2013-10-30 乾坤科技股份有限公司 电磁器件及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12149217B2 (en) * 2021-07-16 2024-11-19 Murata Manufacturing Co., Ltd. Transmission/reception module

Also Published As

Publication number Publication date
JP2016538721A (ja) 2016-12-08
EP3069356A1 (en) 2016-09-21
US9806144B2 (en) 2017-10-31
WO2015073295A1 (en) 2015-05-21
US20150130021A1 (en) 2015-05-14
CN105723477A (zh) 2016-06-29
JP6367939B2 (ja) 2018-08-01
EP3069356B1 (en) 2019-10-30

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Granted publication date: 20190910

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