CN105704981B - 复合材料与电子设备 - Google Patents
复合材料与电子设备 Download PDFInfo
- Publication number
- CN105704981B CN105704981B CN201510747115.1A CN201510747115A CN105704981B CN 105704981 B CN105704981 B CN 105704981B CN 201510747115 A CN201510747115 A CN 201510747115A CN 105704981 B CN105704981 B CN 105704981B
- Authority
- CN
- China
- Prior art keywords
- insulation
- composite material
- heat
- heat sink
- graphite flake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 50
- 238000009413 insulation Methods 0.000 claims abstract description 118
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910002012 Aerosil® Inorganic materials 0.000 claims abstract description 28
- 239000000835 fiber Substances 0.000 claims abstract description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 59
- 229910002804 graphite Inorganic materials 0.000 claims description 59
- 239000010439 graphite Substances 0.000 claims description 59
- 239000000853 adhesive Substances 0.000 claims description 15
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- 239000000243 solution Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 108010025899 gelatin film Proteins 0.000 description 6
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
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- 210000002268 wool Anatomy 0.000 description 1
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Abstract
本发明提供一种复合材料,该复合材料即使在电子设备的壳体内的狭小空间内也能够充分发挥绝热效果,有效地减少从发热部件向壳体的传热。使用一种复合材料,其具有:散热片;绝热件,其位于散热片表面;以及支承层,其位于散热片的一个面与绝热件的一个面中的至少一方,其中,绝热件的外周区域仅为纤维,绝热件的内周区域在纤维中内包有二氧化硅气凝胶,散热片与绝热件通过纤维而固定。另外,使用在壳体与发热部件之间配置有上述复合材料的电子设备。
Description
技术领域
本发明涉及一种在电子设备、精密设备等的壳体内使伴随于发热而自电子部件(以下,称为发热部件)产生的热散发的技术。尤其涉及一种能够有效地降低从发热部件向壳体的传热的复合材料。
背景技术
近年来,随着智能手机、平板终端、笔记本电脑等电子设备的高性能化,来自发热部件的发热密度急剧增加,这些电子设备的热扩散技术逐渐成为必需。
特别是,小型的便携式设备与人体直接接触的机会多,其壳体外侧的温度上升逐渐成为严重的问题。作为由便携式设备的壳体外表面的温度上升引起的问题之一,可举出低温烫伤。低温烫伤是人体长时间置于比体温高的温度而引起的烫伤的一种,有在44℃的情况下6小时产生烫伤且每上升1℃达到烫伤的时间减半这样的报告。低温烫伤与普通的烫伤相比,绝大多数情况下当事人会很晚才注意到症状的发展,当发现时皮肤已受到重度的损伤的情况也很多。
另外,在便携式设备的显示元件中使用液晶显示器、有机EL显示器。然而,这些显示元件不耐热。来自发热部件的发热若传递至这些显示元件,则成为显示器的亮度不均、寿命降低的主要原因。因此,为了同时实现便携式设备的高性能化与小型、薄型化,需要有效地降低向显示元件的传热。
并且,最近,在膝上长时间使用小型笔记本电脑时形成低温烫伤的症例较多。今后,在设备的小型化、便携化日益发展的状况下,即使将设备表面的温度降低1℃也是非常重要的。
另一方面,作为防止设备表面的温度上升的方法,可以考虑使用绝热构件,从而使来自设备的壳体内部的发热部件的热不向壳体传递。
例如,在图4所示的以往的层叠结构的复合材料中,考虑从发热部件406朝向壳体407使用粘合剂层405/导热性层404/粘合剂层403/绝热性层402/粘合剂层401这样的层叠结构的复合材料,从而使来自设备的壳体内部的发热部件406的热不向壳体407传递。另外,作为导热性层404讨论了金属片、石墨片等,作为绝热性层402讨论了无纺布、含有玻璃珠等内包有空气的囊(capsule)的树脂片等。
由此,进行了减少向壳体407的传热而使壳体407内的温度分布平均化的尝试(专利文献1)。
在先技术文献
专利文献1:日本特愿2012-504484号公报
然而,在专利文献1记载的方法中,在发热部件与绝热性层之间、绝热性层与导热性层之间、以及导热性层与壳体之间具有粘合剂层,因此具有阻碍电子设备的薄型化、小型化的课题。
发明内容
发明所要解决的课题
鉴于上述的在先技术的情况,本发明的目的在于提供一种复合材料与使用了该复合材料的电子设备,该复合材料即使在电子设备的壳体内的狭小空间内也能够充分发挥绝热效果,有效地减少从发热部件向壳体的传热。
用于解决课题的方案
为了解决上述课题,使用了一种复合材料,其具有:散热片;绝热件,其位于散热片表面;以及支承层,其位于散热片的一个面与绝热件的一个面中的至少一方,其中,绝热件的外周区域仅为纤维,绝热件的内周区域在纤维中内包有二氧化硅气凝胶,散热片与绝热件通过纤维而固定。
另外,使用在壳体与发热部件之间配置有上述复合材料的电子设备。
发明效果
根据本发明,能够提供一种复合材料,该复合材料即使在电子设备的壳体内的狭小空间内也能够充分发挥绝热效果,有效地减少从发热部件向壳体的传热。
附图说明
图1是实施方式的复合材料的图。
图2的(a)~(c)是对实施方式的复合材料的热压接工艺进行说明的图。
图3是对实施方式的复合材料的层叠顺序进行说明的图。
图4是以往的层叠结构的复合材料的图。
附图标记说明:
100 电子设备
101A 支承层
101B 支承层
102 石墨片
103 绝热件
106 复合材料
107 无纺布
108 二氧化硅气凝胶
201 热压接工具
401 粘合剂层
402 绝热性层
403 粘合剂层
404 导热性层
405 粘合剂层
406 发热部件
407 壳体
具体实施方式
在图1中示出实施方式的电子设备100的内部的剖视图。复合材料106包括作为散热片的石墨片102、和设置在该石墨片102的一面上的绝热件103。并且,在上下表面上具有薄片状的支承层101A、支承层101B。从上表面观察(俯视观察)时,绝热件103的面积比石墨片102的面积大。
绝热件103整体具有无纺布107,二氧化硅气凝胶(silica aerogel)108位于其内周部分。在绝热件103的外周部分不存在二氧化硅气凝胶108,仅有无纺布107。利用热压接将无纺布107、支承层101A以及支承层101B固定,从而能够在不使用粘合剂层的情况下将层叠体固定。
该复合材料106设置在壳体407与发热部件406之间而使用。使发热部件406的热扩散,抑制发热部件406的温度上升,并且抑制壳体407的局部的温度上升。
<无纺布107>
无纺布107不限于无纺布,也可以为将纤维规则地编织而成的材料。可以是各种编织方式的纤维片。但是,与各种编织方式的纤维片相比,无纺布更容易导入气凝胶,故而优选。无纺布107由聚乙烯、聚丙烯、聚酯、芳纶等树脂纤维构成。
<石墨片102>
石墨片102是散热片。使作为热源的发热部件406的热在石墨片102内扩散,从而对热源进行冷却。石墨片102例如可以是金属片、铝片。但是,下述石墨片102导热特性优异故而优选。
<石墨片102的面方向的导热率>
优选所使用的石墨片102的面方向的导热率为1000W/m·K以上。若该导热率小于1000W/m·K,则不产生朝向面方向的足够的热扩散,从而热在厚度方向上传递。需要说明的是,石墨片102的导热率能够通过下式(1)进行计算。
λ=α×d×Cp ...(1)
这里,λ表示导热率,α表示热扩散率,d表示密度,并且Cp表示比热容。
<石墨片102的厚度方向的导热率>
石墨片102的厚度方向的导热率取决于所使用的石墨片102的厚度。为了使来自热源的发热有效地向面内方向分散,在厚度为100μm以下的情况下,优选厚度方向的导热率为20W/m·K以下。换句话说,若厚度较薄,则抑制了厚度方向的导热率,从而不向厚度方向导热。
若其厚度方向的导热率比20W/m·K大,则使来自发热部件406的发热在面内扩散的效果减弱,导致热向壳体407侧传递。
同样地,在厚度为80μm以下的情况下,优选厚度方向的导热率为18W/m·K以下。
<石墨片102的厚度>
近年来的电子设备100的薄型化不断发展,在设备的壳体407内能够搭载电子部件的空间变得非常狭小。因此,难以将100μm以上的厚度的膜向电子设备100的壳体407内组装。
因此,由于电子设备100的壳体407内的空间的关系而优选所使用的石墨片102的厚度比100μm薄。
<石墨片102的制造方法>
石墨片102使用从芳香族聚酰亚胺、芳香族聚酰胺、以及聚噁二唑中选出的厚度为1μm以上且400μm以下的范围内的高分子膜作为原料。高分子膜的厚度优选处于1μm以上且125μm以下的范围。需要说明的是,虽然取决于条件,但能够由厚度为75μm的高分子膜制作出约100μm的石墨片。
经过在450℃以上2000℃以下的温度范围内进行热处理而转换为碳质膜的碳质膜转换工序、将在碳质膜转换工序中得到的碳质膜重叠多张的重叠工序、以及对在所述重叠工序中得到的重叠的碳质膜进行热压的工序,从而制造出高分子膜。
热压工序包括在2800℃以下的温度范围内施加20kg/cm2以下的压力的第一热压工序、和在2800℃以上的温度范围内施加20kg/cm2以上的压力的第二热压工序。
<绝热件103>
绝热件103是在厚度为0.05~1.0mm的无纺布107中内包有具有纳米尺寸的多孔质结构的二氧化硅气凝胶的绝热片。导热率为0.01~0.1W/mK。
通常,无纺布的导热率为0.030~0.060W/mK,该值被视为无纺布纤维的固体导热成分与存在于无纺布的空隙中的空气(氮气分子)的传热成分的大致总和。
通过在无纺布的空隙中内包二氧化硅气凝胶作为低导热率材料(一般为0.010~0.015W/mK),能够实现上述低导热率。
一般来说,常温下的静止空气的导热率为0.026W/mK左右,无纺布107的导热率比该静止空气的值大。
绝热件103的特征在于是导热率比静止空气的导热率小的唯一的绝热片。
绝热件103除绝热性以外,还具有憎水性、吸音性,若选择无纺布的种类(例如玻璃棉、石棉等无机类纤维),则还能够赋予阻燃性、耐热性。
<绝热件103的导热率>
在本实施方式中所使用的绝热件103的导热率处于0.01~0.1W/m·K的范围内。
从在厚度为0.5mm以下的空间中使用这样的观点出发,优选导热率处于0.01~0.05W/m·K的范围内。绝热件103优选处于更低的导热率的范围。
另外,从在厚度为0.3mm以下的空间中使用这样的观点出发,更优选导热率处于0.01~0.03W/m·K的范围内。绝热件103优选处于更低的导热率的范围。
绝热件103的导热率越低则其绝热效果越高。若绝热件103的导热率变低,则能够减小为了获得相同的绝热效果所需的绝热件103的厚度。这在狭小的空间中使用绝热件103时优选。
另一方面,若绝热件103的导热率比0.1W/m·K大,则绝热件103的绝热效果降低,为了获得所需的绝热效果而必需增大绝热件103的厚度,故而不优选。
<绝热件103的厚度>
绝热件103的厚度处于0.05mm~1mm的范围内,优选处于0.05mm~0.2mm的范围内。
在绝热件103的厚度比0.05mm薄的情况下,厚度方向的绝热效果降低。因此,若不选择导热率(目前不可能存在的程度)非常低的低导热材料,则无法良好地降低从绝热件103的一面朝向另一面的厚度方向的传热。
另一方面,若绝热件103的厚度比1mm厚,则如关于石墨片102的厚度所述地那样,难以向近年来的薄型电子设备内组装。
在智能手机、平板终端等便携式设备中,若绝热件103的厚度比0.2mm厚,则绝热件103与石墨片102复合而成的复合材料106的厚度将变得更厚。其结果是,更加难以向设备组装。
<绝热件103的材质>
作为绝热件103(无纺布107)的材质,能够利用无机纤维类的玻璃棉、石棉;天然类的羊毛绝热件、纤维素绝热件、发泡陶瓷、炭化发泡软木;作为树脂类绝热件的尿烷泡沫、酚醛泡沫、聚苯乙烯泡沫等。
在这些材料中,为了确保与石墨片102的良好的紧贴性,需要具有比较平坦的表面。因此,更优选树脂类绝热件。
另外,绝热件103的导热率越低,则与石墨片102复合时的绝热效果越高,如上述所示那样,优选为0.01~0.05W/m·K左右。
具体而言,更优选使用在无纺布中浸渗有气凝胶的绝热件(0.01~0.024W/m·K),该气凝胶具有限制空气分子的运动的纳米尺寸的空隙结构。
<绝热件103的制造方法>
示出绝热件103的制造方法的一例。
(1)原料混合:向高摩尔硅酸钠(硅酸水溶液,Si浓度为14%)添加1.4wt%的浓盐酸(12N)作为催化剂并进行搅拌,配制出溶胶溶液。
(2)浸渗:向无纺布(材质PET,厚度规格90μm,单位面积质量12g/m2,尺寸□12cm)注入溶胶溶液,利用辊将溶胶溶液压入无纺布从而使溶胶溶液浸渗。
(3)用PP膜(厚度50μm×2张,尺寸B6)夹持浸渗有溶胶溶液的无纺布,在室温23℃下放置约20分钟而使溶胶凝胶化。
(4)厚度限制:在确认凝胶化后,针对每张膜而使浸渗无纺布通过将间隙设定为190μm(包括膜厚)的双轴辊,从无纺布上挤出多余的凝胶,从而以100μm为目标对厚度进行限制。
(5)养护:针对每张膜而将凝胶片放入容器中,为了防止干燥,放入85℃/85RH%的恒温恒湿槽中3小时,使二氧化硅粒子生长(硅烷醇的脱水缩合反应)从而形成多孔质结构。
(6)膜剥除:从养护容器中取出片,并将膜剥除。
(7)疏水化1(盐酸浸渍工序):将凝胶片浸渍于盐酸(6~12当量)后,在常温23℃下放置1小时使盐酸进入凝胶片中。
(8)疏水化2(硅氧烷处理工序):将凝胶片浸渍于例如作为硅烷化剂的八甲基三硅氧烷与作为两亲性溶剂的2-丙醇(IPA)的混合液中,放入55℃的恒温槽中反应2小时。当开始形成三甲基硅氧烷键时,从凝胶片排出盐酸水,进行二液分离(上层为硅烷化剂,下层为盐酸水)。
(9)干燥:将凝胶片移至150℃的恒温槽中干燥2小时。
<石墨片102与绝热件103的厚度>
优选为,石墨片102的厚度约为0.1mm,绝热件103的厚度约为0.2mm。换句话说,按照比率优选为1∶2。范围优选为1∶1~1∶3的范围。
若比1∶1小,则绝热件103的强度变弱,无法确保绝热性。若比1∶3大,则具有足够的绝热性,但无用的气凝胶变多。
<支承层101A>
石墨片102具有导电性,因此在电子设备100内使用的情况下,有时会引起与电子部件的接触导致的短路。在实施方式的复合材料106中,在采用石墨片102向电子设备内部露出的方式的情况下,优选在石墨片102表面上设置有绝缘膜作为支承层101A。
作为绝缘膜,使用聚酰亚胺(PI)、聚对苯二甲酸乙二醇酯(PET)、聚乙烯(PE)、聚丙烯(PP)、聚酯(SP)等的片,详细情况在后述的<石墨片102与绝热件103的复合方法>中进行说明,若考虑与无纺布的PET热粘接性,则优选相同的材质即PET。
<支承层101B>
如上述那样,绝热件103采取在无纺布107中内包有具有纳米尺寸的多孔质结构的二氧化硅气凝胶108的方式,然而由于二氧化硅气凝胶108本身具有非常脆的性质,因此存在从无纺布107脱离的可能性。
因此,在实施方式的复合材料106中,在采取绝热件103向电子设备内部露出的方式的情况下,优选在绝热件103表面上设置有绝缘膜作为支承层101B。
作为绝缘膜,使用聚酰亚胺(PI)、聚对苯二甲酸乙二醇酯(PET)、聚乙烯(PE)、聚丙烯(PP)、聚酯(SP)等的片,详细情况在后述的<石墨片102与绝热件103的复合方法>中进行说明,若考虑与无纺布的PET热粘接性,则优选相同的材质即PET。
<石墨片102与绝热件103的复合方法>
不使用粘合剂而使石墨片102与绝热件103复合化。换句话说,在实施方式的复合材料106中,采用热压接工艺将复合材料106的外周部固定。若使用粘合剂,则存在热特性变差、工序增加、厚度增加等问题。通过使无纺布107的纤维熔化而粘合。不额外使用粘合剂等。
就接合而言,不利用石墨片102而在石墨片102的周边的无纺布107与上下的支承层101A、支承层101B之间进行粘接。关于固定方法,使用图2(a)~图2(c)进行说明。
为了进行固定,可以仅在绝热件103的周边部分的4个顶点(拐角部)进行热压接。然而,为了更加稳定地进行固定,优选在4边进行热压接。优选对整周进行热压接,完全覆盖内侧的二氧化硅气凝胶108。二氧化硅气凝胶108的碎片等不会向外部露出。
更详细而言,优选在使石墨片102与绝热件103复合时,如图2(a)所示,使绝热件103在平面方向上比石墨片102大,并且,内包于绝热件103中的二氧化硅气凝胶108的区域在平面方向上为与石墨片102大致相同的大小。
由此,石墨片102的热不会向二氧化硅气凝胶108以外传递,不会使预想以外的部分的温度上升。并且,即使热传递至石墨片102的端部,热也不会向预想以外的部位传递。
此外,如图2(b)所示,在不存在内包于绝热件103中的二氧化硅气凝胶108的外周区域的支承层101A或者支承层101B上通过热压接工具201进行加热、压接。
由此,如图2(c)所示,通过无纺布107、支承层101A或支承层101B、以及支承层101A或支承层101B的有机成分熔化,从而支承层101A、绝热件103中的不存在二氧化硅气凝胶108的无纺布107、以及支承层101B热粘接。其结果是,能够在不使用粘合剂的情况下使石墨片102与绝热件103复合化。由于将绝热件103的外周密封,因此绝热件103内部的二氧化硅气凝胶108不会向外部露出,不会对周围造成影响。
另外,无纺布107使二氧化硅气凝胶108、支承层101A、以及支承层101B结合而一体化,从而使强度稳定化。在二氧化硅气凝胶108与石墨片102之间不存在粘合剂等进行连接的材料,能够薄型化,热特性也优异。
热压接的温度、压力并不特别限定,但作为至少支承层101A、支承层101B所使用的绝缘膜的材质的熔点附近的温度,需要一边进行位置限制一边瞬间地加温至例如250~280℃左右。
这里,关于制造方法,参照上述的<绝热件103的制造方法>进行说明。
在绝热件103中,控制存在二氧化硅气凝胶108的区域的方法具有如下两个方法。
第一个方法为,在上述的<绝热件103的制造方法>中的(2)的浸渗中,对不期望存在二氧化硅气凝胶108的部分进行遮挡,不使溶胶溶液浸渗。未浸渗溶胶溶液的部分能够作为无纺布107露出的部分而残留。
第二个方法为,在上述的<绝热件103的制造方法>中的(8)的疏水化2中,对不期望存在二氧化硅气凝胶108的部分进行遮挡。由此,该部分不与硅烷化剂接触。通过不进行三甲基硅氧烷键合,从而不形成三甲基硅氧烷键,该部分的二氧化硅气凝胶在干燥后,通过吸收大气中的水分而自我破坏,轻易地脱离,从而形成无纺布露出的部分。
<复合材料的层叠顺序>
在图1的实施方式的复合材料106中,在发热部件406与绝热件103之间存在石墨片102的情况下,使来自发热部件406的传热有效地扩散从而降低峰值温度。
在壳体407与石墨片102之间存在绝热件103的情况下,防止向壳体407的传热的绝热效果高。
因此,如图3所示,在从发热部件406侧观察时,优选以支承层101A/石墨片102/绝热件103/支承层101B的顺序层叠。
这里,为了防止因石墨片102导致的漏电,支承层101A不可缺少。
另一方面,为了防止绝热件103的二氧化硅气凝胶的脱落,支承层101B不可缺少,但在无纺布107与二氧化硅气凝胶108的紧贴稳定的情况下、或需要削减电子设备壳体内的空间的情况下,支承层101B并不一定不可缺少。
<发热部件406与复合材料106的距离>
在图3中,关于发热部件406与复合材料106的距离,发热部件406与石墨片102可以接触。
但是,由于因接触导致峰值温度成为更高的温度,因此优选发热部件406与复合材料106尽可能不接触。
<总结、效果>
本实施方式的复合材料106包括:厚度为100μm以下、面方向的导热率为1000W/m·K以上、厚度方向的导热率为20W/m·K以下的石墨片102;和厚度在0.05mm~1mm的范围内、导热率在0.01~0.05W/m·K的范围内的绝热件103。
另外,为了使石墨片102与绝热件103复合化,将绝热件103设为比石墨片102大,并且将内包于绝热件103中的二氧化硅气凝胶的区域设为与石墨片102大致相同的大小,此外,在通过热压接工艺进行热粘接的部分不存在二氧化硅气凝胶。
由此,利用热压接工艺使支承层101A、101B与绝热件103中的不存在二氧化硅气凝胶的无纺布露出的部分热粘接,从而在不使用粘接剂、粘合剂的情况下使石墨片102与绝热件103复合化。
另外,在包含内包发热部件406的壳体407的电子设备中,通过利用本实施方式的复合材料106作为其绝热构件,能够有效地减少从发热部件406向壳体407的传热。
<壳体的温度>
通过将使石墨片102与绝热件103复合而成的复合材料106粘贴在壳体407的内表面上,能够大幅降低壳体407的温度。
其原因在于,通过绝热件103尽可能地抑制来自发热部件406的传热,并且通过面方向的导热率高的石墨片102使通过该绝热件103的剩余的热扩散,因此热几乎不会传递至壳体407。
实际上,作为智能手机、平板终端的低温烫伤的预防,有时要求不向壳体407过度传递热量的对策。然而,为了减少从发热部件406向壳体407的传热,通过使用本实施方式的复合材料106能够应对这种要求。
<发热部件的温度>
通过本实施方式的复合材料106还能够降低发热部件406本身的温度。
这是体现了石墨片102的热扩散产生的冷却效果的结果,发热部件406与石墨片102的距离越近则该冷却效果越大。即,在欲将发热部件406本身的温度也抑制为较低时,本实施方式的复合材料106也是有用的。
工业实用性
本发明的复合材料广泛用于电子设备内。并且还应用于信息设备、便携设备、显示器等与热相关的产品。
Claims (9)
1.一种复合材料,其具有:
散热片;
绝热件,其通过该绝热件的一面而配置在所述散热片的一面上;以及
支承层,其配置在所述散热片的另一面与所述绝热件的另一面这两方上,其中,
所述绝热件的内周区域在纤维中内包有二氧化硅气凝胶,
所述绝热件的外周区域由所述纤维构成,
所述散热片与所述绝热件通过所述纤维而固定,
所述支承层是绝缘膜。
2.根据权利要求1所述的复合材料,其中,
所述支承层是与所述纤维相同的材质。
3.根据权利要求1所述的复合材料,其中,
所述绝热件的面积比所述散热片的面积大,
所述二氧化硅气凝胶的区域的面积与所述散热片的面积相同,
所述外周区域的纤维与所述支承层通过热粘接而固定。
4.根据权利要求1所述的复合材料,其中,
在所述散热片与所述绝热件之间不存在粘接构件。
5.根据权利要求1所述的复合材料,其中,
在所述绝热件的整体中配置有所述纤维。
6.根据权利要求1所述的复合材料,其中,
所述支承层与所述外周区域的所述纤维通过热粘接而固定。
7.根据权利要求1所述的复合材料,其中,
所述散热片是石墨片,
所述石墨片的厚度为100μm以下,面方向的导热率为1000W/m·K以上,厚度方向的导热率为20W/m·K以下,
所述绝热件的厚度处于0.05mm~1mm的范围内,导热率处于0.01~0.1W/m·K的范围内。
8.一种复合材料,其具有:
散热片;
绝热件,其通过该绝热件的一面而配置在所述散热片的一面上;以及
支承层,其配置在所述散热片的另一面与所述绝热件的另一面这两方上,其中,
所述绝热件的内周区域在纤维中内包有二氧化硅气凝胶,
所述绝热件的外周区域由所述纤维构成,
所述散热片与所述绝热件通过所述纤维而固定,
在所述绝热件的整个外周区域不存在所述二氧化硅气凝胶。
9.一种电子设备,其中,
在壳体与发热部件之间配置有权利要求1所述的复合材料。
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CN109642697A (zh) * | 2017-05-15 | 2019-04-16 | 松下知识产权经营株式会社 | 绝热材料和使用其的绝热结构体 |
KR101911188B1 (ko) * | 2017-11-28 | 2018-10-23 | 주식회사 엘지화학 | 에어로겔을 포함한 복합 단열 시트 |
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CN112703346A (zh) * | 2018-11-15 | 2021-04-23 | 松下知识产权经营株式会社 | 绝热片及其制造方法 |
CN109699163A (zh) * | 2019-02-25 | 2019-04-30 | 英业达科技有限公司 | 隔热结构 |
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CN1306993C (zh) * | 2000-12-22 | 2007-03-28 | 思攀气凝胶公司 | 带有纤维胎的气凝胶复合材料 |
CN101795857A (zh) * | 2007-07-23 | 2010-08-04 | 3M创新有限公司 | 气凝胶复合材料 |
CN102792442A (zh) * | 2010-03-10 | 2012-11-21 | 日东电工株式会社 | 绝热散热片及装置内结构 |
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CN101795857A (zh) * | 2007-07-23 | 2010-08-04 | 3M创新有限公司 | 气凝胶复合材料 |
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