CN105606647A - Device and method for detecting thermal migration performance of interconnected welding spots - Google Patents
Device and method for detecting thermal migration performance of interconnected welding spots Download PDFInfo
- Publication number
- CN105606647A CN105606647A CN201610173135.7A CN201610173135A CN105606647A CN 105606647 A CN105606647 A CN 105606647A CN 201610173135 A CN201610173135 A CN 201610173135A CN 105606647 A CN105606647 A CN 105606647A
- Authority
- CN
- China
- Prior art keywords
- thermophoresis
- solder joint
- conducting plate
- performance
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a device and a method for detecting the thermal migration performance of interconnected welding spots. The device sequentially comprises a cooling mechanism, an upper heat conduction plate, a lower heat conduction plate and a heating plate from top to bottom, namely, the cooling mechanism is arranged at the upper part of the upper heat conduction plate and the lower heat conduction plate is arranged at the upper part of the heating plate; and a sample is arranged in a space between the upper heat conduction plate and the lower heat conduction plate. A temperature control device of the heating plate is adjusted to obtain the temperature required by the heating plate; a rotating speed adjusting device of a cooling fan is adjusted to adjust the air volume of the fan so as to change the temperature of the hot and cold ends of the sample, and the required temperature gradient can be obtained according to the height of the welding spot. The device and the method have high safety reliability, the structure is simple and can be operated easily, the cost is low, popularization can be realized easily, electromigration interference can be effectively avoided, and the temperature gradient can be effectively controlled by control of the temperature difference of the cold and hot ends.
Description
Technical field
The present invention relates to Electronic Packaging field, relate in particular to a kind of dress that detects interconnection solder joint thermophoresis performancePut and method.
Background technology
Along with electronic product is to miniaturization, multifunction future development, the feature of electronic package interconnections solder jointSize is more and more less, and the current density that the solder joint that causes interconnecting stands and the thermograde at solder joint two ends are all sharplyIncrease, thereby cause electromigration and the thermophoresis effect in solder joint, cause solder joint tissue deterioration and structure completeWhole property damage, greatly reduces welding spot reliability.
For a long time, people ignore the impact of thermophoresis in the time of research electromigration always, and this may be early stageResearch think that the atomic mobility that thermophoresis causes is little more many than electromigration always. But recent is up-to-dateResearch shows, along with constantly reducing of interconnection solder joint characteristic size, thermograde is increasing, works as temperatureWhen gradient is enough large, the atomic migration effect that thermophoresis causes is greater than the atomic migration effect that electromigration causesShould. Although electromigratory research has been obtained to greater advance, because thermoelectricity coupling causes experimental designDifficulty, to the research of thermophoresis still in the starting stage.
Summary of the invention
The object of the invention is to overcome the shortcoming and defect of above-mentioned prior art, provide a kind of simple in structure,The apparatus and method of the detection interconnection solder joint thermophoresis performance that security reliability is good, simple to operation, can haveThe impact of avoiding the thermophoresis bringing from electromigration of effect.
The present invention is achieved through the following technical solutions:
A device that detects interconnection solder joint thermophoresis performance, this device comprises cooler from top to bottom successivelyStructure, upper heat-conducting plate 4, lower heat-conducting plate 6 and heating plate 7, described cooling body is arranged on heat-conducting plate 4Top, described lower heat-conducting plate 6 is arranged on the top of heating plate 7; Described upper heat-conducting plate 4 and lower heat conductionSpace between plate 6 is used for placing sample 5.
On the corresponding surface of upper heat-conducting plate 4 and lower heat-conducting plate 6, symmetry offers for burying thermoelectricity underground respectivelyThe groove 8,9 of even probe; In the time that sample 5 is placed between upper heat-conducting plate 4 and lower heat-conducting plate 6, this thermoelectricityEven probe can contact with this sample 5; Described thermocouple probe connects outside temperature measuring equipment by transmission line.
Described cooling body comprises fin 2, is arranged on the radiator fan 1 on fin 2 tops, is arranged onThe semiconductor chilling plate 3 of fin 2 bottoms; Described semiconductor chilling plate 3 is connected with upper heat-conducting plate 4.
Described for burying the length of groove 8,9 of thermocouple probe underground, be upper heat-conducting plate 4 or lower heat-conducting plate 61/2nd of length.
Described heating plate 7 is electric boiling plate, and it is provided with temperature control equipment.
Described radiator fan 1 is provided with speed setting unit.
A kind of interconnection solder joint thermophoresis performance method that detects, specifically comprises the steps:
(1) thermocouple probe is put into respectively to the groove 8,9 of upper heat-conducting plate 4 and lower heat-conducting plate 6, andThe transmission line of thermocouple probe is connected to temperature measuring equipment; Relative with lower heat-conducting plate 6 at upper heat-conducting plate 4 respectivelyOn two surfaces of answering, apply one deck heat-conducting silicone grease, sample 5 is placed on to upper heat-conducting plate 4 and lower heat-conducting plate 6Between; Connect the power supply of heating plate 7 and radiator fan 1;
(2) by regulating the temperature control equipment of heating plate 7, obtain the required temperature of heating plate 7; LogicalOverregulate the speed setting unit of radiator fan 1, to regulate the air force of fan, pass through air forceChange the required temperature of the cold and hot end of sample 5, obtain the thermograde needing according to solder joint height;
(3) start the thermophoresis performance of sample 5 to test.
The described beginning of step (3) tested the thermophoresis performance of sample 5, is to weld by slice analysisGrowth change, Microstructures Evolvement and the tension test of point interface I MC, obtain welding point interface IMC'sGrowth rate and the maximum shear stress, thereby the thermophoresis performance of judgement interconnection solder joint.
The preparation process of described sample 5 is:
(1) two metal substrates are carried out to surface treatment;
(2) wherein the surface treated substrate surface of a slice is except treating welding zone, and remainder is coated withUpper solder resist;
(3) solder ball is placed in to the district to be welded of two metal substrates, and is required solder joint by two thicknessThe sheet glass of height is placed between two metal substrates, then by fastening two metal substrates of hold assembly;
It is consistent that described sheet glass is used for maintaining solder joint height, and the thickness of this sheet glass be the height of solder joint;
(4) two metal substrates fastening in step (3) are put into the reflow soldering that presets temperatureCarry out soldering, after soldering finishes, to be cooled to room temperature, unclamp the hold assembly of two metal substrates,To sample 5.
Described solder ball is selected the lead solder that has of the lead-free brazing of unlike material or unlike material, to detectThe thermophoresis performance data of the solder joint of the metal substrate of unlike material and solder combination.
The present invention, with respect to prior art, has following advantage and effect:
By regulating the temperature control equipment of heating plate and the speed setting unit of radiator fan; Realize welderingThe temperature of the cold and hot end of point regulates, and obtains different thermogrades, also can be for different solder joint heights,Obtain identical thermograde. Upper heat-conducting plate and lower heat-conducting plate are demountable structure, in the time that thermophoresis is testedBetween arrive set time cycle time, can conveniently unload sample and detect.
On the corresponding surface of upper heat-conducting plate and lower heat-conducting plate, offer the groove for burying thermocouple probe underground,Thermocouple probe connects outside temperature measuring equipment, can facilitate reading temperature data.
The test of thermophoresis performance, drills by growth change, the microscopic structure of slice analysis welding point interface IMCBecome and tension test, obtain growth rate and the maximum shear stress of welding point interface IMC, thereby sentenceThe thermophoresis performance of disconnected interconnection solder joint.
Sample to be tested adopts by two copper bases of surface-treated or other metal substrate, and solder is optionalWith lead-free brazing and have lead solder, to detect the thermophoresis performance of solder joint of different substrate-solder combination.
It is good that the present invention has security reliability, simple in structure easy to operate, with low cost, be easy to promote etc. excellentPoint; Not only can effectively avoid from electromigratory interference, and can be by controlling the temperature of cold and hot endThe poor thermograde of effectively controlling of degree.
Brief description of the drawings
Fig. 1 is the apparatus structure schematic diagram that the present invention detects interconnection solder joint thermophoresis performance.
Fig. 2 is Fig. 1 partial structurtes enlarged diagrams.
Fig. 3 is the plan structure schematic diagram of Fig. 1 radiator fan and fin.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is more specifically described in detail.
Embodiment
As shown in Figures 1 to 3. The invention discloses a kind of device that detects interconnection solder joint thermophoresis performance,This device comprises cooling body, upper heat-conducting plate 4, lower heat-conducting plate 6 and heating plate 7 from top to bottom successively,Described cooling body is arranged on the top of heat-conducting plate 4 (aluminium material), described lower heat-conducting plate 6 (aluminium material)Be arranged on the top of heating plate 7; Space between described upper heat-conducting plate 4 and lower heat-conducting plate 6 is for placingSample 5.
On the corresponding surface of upper heat-conducting plate 4 and lower heat-conducting plate 6, symmetry offers for burying thermoelectricity underground respectivelyThe groove 8,9 of even probe; In the time that sample 5 is placed between upper heat-conducting plate 4 and lower heat-conducting plate 6, this thermoelectricityEven probe can contact with this sample 5; Described thermocouple probe connects outside temperature measuring equipment by transmission line.
Described cooling body comprises fin 2, is arranged on the radiator fan 1 on fin 2 tops, is arranged onThe semiconductor chilling plate 3 of fin 2 bottoms; Described semiconductor chilling plate 3 is connected with upper heat-conducting plate 4.
Described for burying the length of groove 8,9 of thermocouple probe underground, be upper heat-conducting plate 4 or lower heat-conducting plate 61/2nd of length.
Described heating plate 7 is electric boiling plate, and it is provided with temperature control equipment.
Described radiator fan 1 is provided with speed setting unit.
By following three for example, further illustrate the present invention and detect the method for interconnection solder joint thermophoresis performance.
One, the sample interconnection solder joint height adopting is 0.8mm, and metal substrate is Cu, and solder is Sn0.7Cu.Place after sample (being placed between heat-conducting plate 4 and lower heat-conducting plate 6), regulate heating plate 7 temperature to beHot junction 235 DEG C time (lower heat-conducting plate 6) thermocouple probe records 1150 DEG C of temperature T. Regulate radiator fan 1It is T250 DEG C that rotating speed makes cold junction (upper heat-conducting plate 4) temperature, and now solder joint two ends temperature difference is that T2-T1 is100 DEG C, the thermograde that now obtains solder joint two ends is 1250 DEG C/cm. Determine the thermophoresis time be 250,500、750、1000h。
Sample after thermophoresis is found along with thermophoresis by slice analysis interface I MC and tension testThe increase of time, hot junction interface I MC is attenuate and cold junction progressive additive and the increase along with the thermophoresis time graduallyThe tensile strength of solder joint reduces gradually.
Two, the sample interconnection solder joint height adopting is 0.4mm, and metal substrate is Cu, and solder is Sn0.7Cu.Place after sample, while regulating heating plate 7 temperature to be 205 DEG C, hot junction thermocouple probe records temperature T 1100 DEG C. Regulating radiator fan 1 rotating speed to make cold junction temperature is T250 DEG C, and now solder joint two ends temperature difference isT2-T1 is 100 DEG C, and the thermograde that now obtains solder joint two ends is 1250 DEG C/cm. While determining thermophoresisBetween be 250,500,750,1000h.
Sample after thermophoresis is found along with thermophoresis by slice analysis interface I MC and tension testThe increase of time, hot junction interface I MC gradually attenuate and cold junction progressive additive and rate of change increases, along with heatThe tensile strength of the increase solder joint of transit time reduces gradually but to reduce amplitude little.
Three, the sample interconnection solder joint height adopting is 0.8mm, and metal substrate is Cu and Ni, and solder is pureSn. Place after sample, while regulating heating plate 7 temperature to be 220 DEG C, hot junction thermocouple records temperature T 1140 DEG C. Regulating radiator fan 1 rotating speed to make cold junction temperature is T255 DEG C, now obtains the temperature at solder joint two endsDegree gradient is 1062.5 DEG C/cm. Determine the thermophoresis time be 250,500,750,1000h.
Sample after thermophoresis is found along with thermophoresis by slice analysis interface I MC and tension testThe increase of time, all progressive additives and going out at Cu/Sn interface in the time of thermophoresis 750h of cold and hot end interface I MCShow obvious cavity. The maximum shear stress is also to reduce gradually.
As mentioned above, by detecting the IMC (metal at the interface of solder joint under the different thermophoresis load timeBetween compound) the maximum shear stress of growth change speed and tension test, thereby explanation mutually qualitativelyConnect the thermophoresis performance of solder joint. It is good that the present invention has security reliability, simple to operation, with low cost,Be easy to the advantages such as popularization; Not only can effectively avoid from electromigratory interference, and can be by controlThe temperature difference in refrigeration hot junction is effectively controlled thermograde.
Embodiments of the present invention are not restricted to the described embodiments, other are any do not deviate from of the present inventionThe change done under Spirit Essence and principle, modification, substitute, combination, simplify, all should be putting of equivalenceChange mode, within being included in protection scope of the present invention.
Claims (10)
1. a device that detects interconnection solder joint thermophoresis performance, is characterized in that, this device from top to bottomComprise successively cooling body, upper heat-conducting plate (4), lower heat-conducting plate (6) and heating plate (7), described coldBut mechanism is arranged on the top of heat-conducting plate (4), and described lower heat-conducting plate (6) is arranged on heating plate (7)Top;
Space between described upper heat-conducting plate (4) and lower heat-conducting plate (6) is used for placing sample (5).
2. the device that detects according to claim 1 interconnection solder joint thermophoresis performance, is characterized in that,On the corresponding surface of upper heat-conducting plate (4) and lower heat-conducting plate (6), symmetry offers for burying heat underground respectivelyThe groove (8,9) of galvanic couple probe; When sample (5) is placed on upper heat-conducting plate (4) and lower heat-conducting plate (6)Between time, this thermocouple probe can contact with this sample (5); Described thermocouple probe connects by transmission lineConnect outside temperature measuring equipment.
3. the device that detects according to claim 1 interconnection solder joint thermophoresis performance, is characterized in that,Described cooling body comprises fin (2), is arranged on the radiator fan (1) on fin (2) top, establishesPut the semiconductor chilling plate (3) in fin (2) bottom; Described semiconductor chilling plate (3) with on leadHot plate (4) connects.
4. according to the device that detects interconnection solder joint thermophoresis performance described in claim 1 or 2 or 3, itsBe characterised in that, described for burying the length of groove (8,9) of thermocouple probe underground, be upper heat-conducting plate (4)Or lower heat-conducting plate (6) length 1/2nd.
5. the device that detects according to claim 4 interconnection solder joint thermophoresis performance, is characterized in that,Described heating plate (7) is electric boiling plate, and it is provided with temperature control equipment.
6. the device that detects according to claim 3 interconnection solder joint thermophoresis performance, is characterized in that,Described radiator fan (1) is provided with speed setting unit.
7. detect a method for interconnection solder joint thermophoresis performance, it is characterized in that adopting claim 1 toIn 6, described in any one, detect the device of interconnection solder joint thermophoresis performance and realize, specifically comprise the steps:
(1) thermocouple probe is put into respectively upper heat-conducting plate (4) and lower heat-conducting plate (6) groove (8,9) in, and the transmission line of thermocouple probe is connected to temperature measuring equipment; Respectively upper heat-conducting plate (4) and underHeat-conducting plate (6) applies one deck heat-conducting silicone grease on corresponding two surfaces, and sample (5) is placed on and is ledBetween hot plate (4) and lower heat-conducting plate (6); Connect the power supply of heating plate (7) and radiator fan (1);
(2) by regulating the temperature control equipment of heating plate (7), obtain the required temperature of heating plate (7)Degree; By regulating the speed setting unit of radiator fan (1), to regulate the air force of fan, pass throughAir force changes the required temperature of the cold and hot end of sample (5), obtains the temperature needing according to solder joint heightGradient;
(3) start the thermophoresis performance of sample (5) to test.
8. the method that detects according to claim 7 interconnection solder joint thermophoresis performance, is characterized in that,The described beginning of step (3) tested the thermophoresis performance of sample (5), is to weld by slice analysisGrowth change, Microstructures Evolvement and the tension test of point interface I MC, obtain welding point interface IMC'sGrowth rate and the maximum shear stress, thereby the thermophoresis performance of judgement interconnection solder joint.
9. the method that detects according to claim 7 interconnection solder joint thermophoresis performance, is characterized in that,The preparation process of sample (5) is:
(1) two metal substrates are carried out to surface treatment;
(2) wherein the surface treated substrate surface of a slice is except treating welding zone, and remainder is coated withUpper solder resist;
(3) solder ball is placed in to the district to be welded of two metal substrates, and is required solder joint by two thicknessThe sheet glass of height is placed between two metal substrates, then by fastening two metal substrates of hold assembly;
It is consistent that described sheet glass is used for maintaining solder joint height, and the thickness of this sheet glass be the height of solder joint;
(4) two metal substrates fastening in step (3) are put into the reflow soldering that presets temperatureIn carry out soldering, after soldering finishes, to be cooled to room temperature, unclamp the hold assembly of two metal substrates,Obtain sample (5).
10. the method that detects according to claim 9 interconnection solder joint thermophoresis performance, is characterized in that,Described solder ball is selected the lead solder that has of the lead-free brazing of unlike material or unlike material, to detect differenceThe thermophoresis performance data of the solder joint of the metal substrate of material and solder combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610173135.7A CN105606647B (en) | 2016-03-23 | 2016-03-23 | A kind of apparatus and method for detecting interconnection solder joint thermal mobility energy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610173135.7A CN105606647B (en) | 2016-03-23 | 2016-03-23 | A kind of apparatus and method for detecting interconnection solder joint thermal mobility energy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105606647A true CN105606647A (en) | 2016-05-25 |
| CN105606647B CN105606647B (en) | 2018-06-22 |
Family
ID=55986750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610173135.7A Expired - Fee Related CN105606647B (en) | 2016-03-23 | 2016-03-23 | A kind of apparatus and method for detecting interconnection solder joint thermal mobility energy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105606647B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106918538A (en) * | 2017-04-13 | 2017-07-04 | 中国电子产品可靠性与环境试验研究所 | The Forecasting Methodology and system of Lead-Free Solder Joint interface metal compound growth thickness |
| CN108646159A (en) * | 2018-03-14 | 2018-10-12 | 北京工业大学 | A kind of miniature solder joint coupled thermomechanics test method |
| CN108663402A (en) * | 2018-03-14 | 2018-10-16 | 北京工业大学 | A kind of miniature solder joint thermophoresis test method |
| CN109282908A (en) * | 2018-11-05 | 2019-01-29 | 连云港神舟新能源有限公司 | A kind of string welding machine welding temperature uniformity detection |
| CN109738483A (en) * | 2019-01-23 | 2019-05-10 | 重庆理工大学 | Solder joint thermophoresis experimental provision and method under the conditions of extreme temperature gradient |
| CN109813752A (en) * | 2019-02-20 | 2019-05-28 | 重庆理工大学 | A kind of method for evaluating reliability of Electronic Packaging microbonding point |
| CN110117776A (en) * | 2019-05-31 | 2019-08-13 | 浙江工业大学 | It is a kind of to measure sputtering target material temperature device indirectly in real time |
| CN110320121A (en) * | 2019-08-14 | 2019-10-11 | 北华航天工业学院 | A kind of auxiliary device for the measurement of microbonding point alternating temperature impression |
| CN114152862A (en) * | 2021-11-19 | 2022-03-08 | 北京工业大学 | Test assembly for avoiding thermal influence in electromigration process of linear welding spot and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971260A (en) * | 2005-11-21 | 2007-05-30 | 华为技术有限公司 | Testing method of thermal resistance of heat-conducting material and testing clamp |
| CN201681119U (en) * | 2010-03-26 | 2010-12-22 | 北京工业大学 | Data collecting system for electro-migration voltage at welding spot |
| CN102217414A (en) * | 2008-02-27 | 2011-10-12 | 莫列斯日本有限公司 | Heater device, measuring device, and method of estimating heat conductivity |
| CN102323451A (en) * | 2011-05-30 | 2012-01-18 | 华南理工大学 | A kind of method and device that detects interconnection solder joint electric migration performance |
| CN203310936U (en) * | 2013-05-30 | 2013-11-27 | 江阴长电先进封装有限公司 | Structure for testing electromigration lifetime of solder joint |
| CN205720070U (en) * | 2016-03-23 | 2016-11-23 | 华南理工大学 | A kind of device detecting interconnection solder joint thermophoresis performance |
-
2016
- 2016-03-23 CN CN201610173135.7A patent/CN105606647B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1971260A (en) * | 2005-11-21 | 2007-05-30 | 华为技术有限公司 | Testing method of thermal resistance of heat-conducting material and testing clamp |
| CN102217414A (en) * | 2008-02-27 | 2011-10-12 | 莫列斯日本有限公司 | Heater device, measuring device, and method of estimating heat conductivity |
| CN201681119U (en) * | 2010-03-26 | 2010-12-22 | 北京工业大学 | Data collecting system for electro-migration voltage at welding spot |
| CN102323451A (en) * | 2011-05-30 | 2012-01-18 | 华南理工大学 | A kind of method and device that detects interconnection solder joint electric migration performance |
| CN203310936U (en) * | 2013-05-30 | 2013-11-27 | 江阴长电先进封装有限公司 | Structure for testing electromigration lifetime of solder joint |
| CN205720070U (en) * | 2016-03-23 | 2016-11-23 | 华南理工大学 | A kind of device detecting interconnection solder joint thermophoresis performance |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106918538B (en) * | 2017-04-13 | 2019-11-08 | 中国电子产品可靠性与环境试验研究所 | The prediction technique and system of Lead-Free Solder Joint interface metal compound growth thickness |
| CN106918538A (en) * | 2017-04-13 | 2017-07-04 | 中国电子产品可靠性与环境试验研究所 | The Forecasting Methodology and system of Lead-Free Solder Joint interface metal compound growth thickness |
| CN108646159A (en) * | 2018-03-14 | 2018-10-12 | 北京工业大学 | A kind of miniature solder joint coupled thermomechanics test method |
| CN108663402A (en) * | 2018-03-14 | 2018-10-16 | 北京工业大学 | A kind of miniature solder joint thermophoresis test method |
| CN108646159B (en) * | 2018-03-14 | 2020-06-16 | 北京工业大学 | Micro welding spot thermoelectric coupling test method |
| CN109282908A (en) * | 2018-11-05 | 2019-01-29 | 连云港神舟新能源有限公司 | A kind of string welding machine welding temperature uniformity detection |
| CN109738483A (en) * | 2019-01-23 | 2019-05-10 | 重庆理工大学 | Solder joint thermophoresis experimental provision and method under the conditions of extreme temperature gradient |
| CN109813752A (en) * | 2019-02-20 | 2019-05-28 | 重庆理工大学 | A kind of method for evaluating reliability of Electronic Packaging microbonding point |
| CN110117776A (en) * | 2019-05-31 | 2019-08-13 | 浙江工业大学 | It is a kind of to measure sputtering target material temperature device indirectly in real time |
| CN110117776B (en) * | 2019-05-31 | 2024-05-14 | 浙江工业大学 | Device for indirectly measuring temperature of sputtering target in real time |
| CN110320121A (en) * | 2019-08-14 | 2019-10-11 | 北华航天工业学院 | A kind of auxiliary device for the measurement of microbonding point alternating temperature impression |
| CN114152862A (en) * | 2021-11-19 | 2022-03-08 | 北京工业大学 | Test assembly for avoiding thermal influence in electromigration process of linear welding spot and manufacturing method thereof |
| CN114152862B (en) * | 2021-11-19 | 2024-01-12 | 北京工业大学 | Test assembly for avoiding thermal influence of linear welding spot electromigration process and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105606647B (en) | 2018-06-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105606647A (en) | Device and method for detecting thermal migration performance of interconnected welding spots | |
| JP3489811B2 (en) | Method for manufacturing semiconductor device | |
| Ye et al. | Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing | |
| US5541524A (en) | Burn-in technologies for unpackaged integrated circuits | |
| US20170312841A1 (en) | Chip joining by induction heating | |
| CN100418190C (en) | Method for controlling temperature and device | |
| CN102000896B (en) | Al-Cu transient liquid phase diffusion bonding method of Al alloy | |
| WO2002080263A2 (en) | Flip chip interconnection using no-clean flux | |
| CN104919585A (en) | Power module substrate, power module substrate with heat sink, and power module with heat sink | |
| CN106896842A (en) | Temperature control mechanism and method of electronic element jointing device and test equipment applied by temperature control mechanism | |
| CN103252548B (en) | The disposable welding of a kind of power semiconductor modular | |
| CN205720070U (en) | A kind of device detecting interconnection solder joint thermophoresis performance | |
| CN104844248B (en) | Semiconductor refrigerating member welding machine | |
| CN108663402A (en) | A kind of miniature solder joint thermophoresis test method | |
| US11495568B2 (en) | IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures | |
| Too et al. | Indium thermal interface material development for microprocessors | |
| TW200402811A (en) | Manufacturing apparatus of electronic device, manufacturing method of electronic device, and manufacturing program of electronic device | |
| Ehrhardt et al. | Active power cycling results using copper tin TLPB joints as new die-attach technology | |
| TW201809697A (en) | Temperature control device for press-bonding unit of electronic component and testing device using the same capable of keeping the temperature difference between primary and secondary effect surfaces of a cooling chip within a better range | |
| Gu et al. | Effects of electromigration on the growth of intermetallic compounds in Cu/SnBi/Cu solder joints | |
| US5651495A (en) | Thermoelectric cooler assisted soldering | |
| CN115116902A (en) | Suction nozzle heating accurate die bonding head suitable for chip independent eutectic | |
| Cong et al. | Failure analysis on SAC305 large-size BGA components attached with SnPb solder | |
| Langlois et al. | Chip rework on ceramic and organic modules | |
| CN111103209A (en) | Rapid test method for fatigue resistance of ceramic lining plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180622 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |