CN110117776A - It is a kind of to measure sputtering target material temperature device indirectly in real time - Google Patents
It is a kind of to measure sputtering target material temperature device indirectly in real time Download PDFInfo
- Publication number
- CN110117776A CN110117776A CN201910473427.6A CN201910473427A CN110117776A CN 110117776 A CN110117776 A CN 110117776A CN 201910473427 A CN201910473427 A CN 201910473427A CN 110117776 A CN110117776 A CN 110117776A
- Authority
- CN
- China
- Prior art keywords
- thermally conductive
- heat
- copper billet
- pedestal
- real time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005477 sputtering target Methods 0.000 title claims abstract description 20
- 239000013077 target material Substances 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 52
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000523 sample Substances 0.000 claims abstract description 15
- 238000005259 measurement Methods 0.000 claims abstract description 14
- 239000000498 cooling water Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 230000005347 demagnetization Effects 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000048 melt cooling Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Sputtering target material temperature device is measured indirectly in real time the invention discloses a kind of, including being bonded the heat-conduction fixing device being arranged on target copper pedestal and the temp sensor device being arranged on heat-conduction fixing device, the heat-conduction fixing device include upper thermally conductive fixed copper billet and under thermally conductive fixed copper billet, the upper thermally conductive fixed copper billet and under thermally conductive fixed copper billet by fixed screw be arranged in target copper pedestal inner side；The temp sensor device includes temperature sensor probe, the waterproof heat-resisting cable being connected with temperature sensor probe and the display being connected with waterproof heat-resisting cable.The beneficial effects of the present invention are: the device is ingenious in design, it is structurally reasonable, it is easy to use, it is that sample carries out magnetron sputtering plating using the present apparatus, keep coating process safer, the personal safety for having ensured experimenter ensure that the stability and accuracy of the film of measurement and the binding force of matrix, have great importance to the research field of film.
Description
Technical field
The present invention relates to vacuum magnetron sputtering coating film technical fields, and in particular to a kind of to measure sputtering target material temperature indirectly in real time
Spend device.
Background technique
Magnetron sputtering is one kind of physical vapour deposition (PVD) (Physical Vapor Deposition, PVD), general to splash
The method of penetrating can be used for preparing more materials such as metal, semiconductor, insulator, and with equipment is simple, easily controllable, plated film area is big
The advantages that strong with adhesive force, and the magnetron sputtering method that the 70's of last century grow up is even more to realize high speed, low temperature, low damage
Wound.Because being to carry out high-speed sputtering at low pressure, it is necessary to effectively improve the ionization level of gas.Magnetron sputtering passes through in target yin
Pole surface introduces magnetic field, improves plasma density to the constraint of charged particle using magnetic field to increase sputtering raste.
The magnetron sputtering plating instrument applied at present is unable to the temperature of real-time measurement target, however the temperature of target is to Guan Chong
Want, if target temperature is excessively high, gently if make strong magnet demagnetization in magnetic control sputtering device, it is heavy then melt cooling water inlet and outlet pipes,
Cause safety accident.The present invention is directed to measure the temperature of sputtering target material, the temperature being directly installed in inside target copper pedestal indirectly in real time
It spends sensor compared to the prior art, can accurately measure the real-time working temperature of sputtering target material indirectly.
Summary of the invention
For the above-mentioned problems in the prior art, the purpose of the present invention is to provide measure sputtering target material indirectly in real time
Temperature device, to realize the temperature for measuring target efficiently, safely and in real time.
Technical solution of the present invention is as follows:
It is a kind of to measure sputtering target material temperature device indirectly in real time, which is characterized in that be arranged on target copper pedestal including fitting
Heat-conduction fixing device and the temp sensor device being arranged on heat-conduction fixing device, the heat-conduction fixing device include upper thermally conductive
Fixed copper billet and under thermally conductive fixed copper billet, the upper thermally conductive fixed copper billet and under thermally conductive fixed copper billet existed by fixed screw setting
Target copper pedestal inner side；The temp sensor device includes temperature sensor probe, is connected with temperature sensor probe
Waterproof heat-resisting cable and the display that is connected with waterproof heat-resisting cable.
A kind of measurement sputtering target material temperature device indirect in real time, which is characterized in that the upper thermally conductive fixed copper billet
Have semi-circular recesses under and on thermally conductive fixed copper billet respectively, and upper thermally conductive fixed copper billet and under semicircle on thermally conductive fixed copper billet
Groove is spliced to form circular groove, and the temperature sensor probe is embedded in circular groove.
A kind of measurement sputtering target material temperature device indirect in real time, which is characterized in that below the target copper pedestal
Equipped with pedestal, the target copper pedestal and pedestal enclose and connect composition airtight cavity, to form cooling water tank.
A kind of measurement sputtering target material temperature device indirect in real time, which is characterized in that the cooling water tank is equipped with
Cooling water inlet pipe and cooling water outlet pipe are partially disposed in cooling water tank on the waterproof heat-resisting cable, under partially pass through
Cooling water inlet pipe is placed in air.
A kind of measurement sputtering target material temperature device indirect in real time, which is characterized in that the waterproof heat-resisting cable
Waterproof heat-resisting glue adhesive seal is used with cooling water inlet pipe contact portion.
A kind of measurement sputtering target material temperature device indirect in real time, which is characterized in that be fixedly installed on the pedestal
There is magnet.
The beneficial effects of the present invention are: the device is ingenious in design, and it is structurally reasonable, it is easy to use, it is sample using the present apparatus
Magnetron sputtering plating is carried out, keeps coating process safer, has ensured the personal safety of experimenter, ensure that the film of measurement
With the stability and accuracy of the binding force of matrix, have great importance to the research field of film.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is thermally conductive copper billet and sensor probe configuration schematic diagram of the invention；
Fig. 3 is vacuum cavity integral installation schematic diagram of the invention；
In figure: the upper thermally conductive copper billet of 1-, thermally conductive copper billet under 2-, 3- waterproof heat-resisting cable, 4- temperature sensor probe, the fixed spiral shell of 5-
Silk, 6- magnet, 7- first base screw, 8- second base screw, 9- third base screw, 10- pedestal, the water outlet of 11- cooling water
Pipe, 12- cooling water inlet pipe, 13- display, 14- target copper pedestal, 15- vacuum cavity, 16- exhaust outlet, 17- support, 18-
Air inlet, 19- print, 20- target.
Specific embodiment
Technical solution of the present invention is further described below in conjunction with Figure of description:
As shown in Figure 1-3, magnetic control sputtering film plating device include vacuum cavity 15, the print 19 that the top of vacuum cavity 15 is set and
The target frame of 15 bottom of vacuum cavity is set, and 15 two sides of vacuum cavity are respectively equipped with exhaust outlet 16, air inlet 18；The target
Frame is arranged on target 20, and target 20 and 19 face of print；Wherein target frame includes target copper pedestal 14, pedestal 10 and support
17, support 17 is solid on 15 inner wall of vacuum cavity, and pedestal 10 is fixed on support 17, is fixedly installed magnet on the pedestal 10
6；Target copper pedestal 14 is fixed on pedestal 10, and target copper pedestal 14 and pedestal 10 enclose and connect composition sealing structure, and are formed cold
But water tank.
Sputtering target material temperature device is measured indirectly in real time, including being bonded the thermally conductive fixed dress being arranged on target copper pedestal 14
The temp sensor device on heat-conduction fixing device is set and is arranged in, the heat-conduction fixing device includes upper thermally conductive fixed copper billet 1
Thermally conductive fixed copper billet 2 under and, the upper thermally conductive fixed copper billet 1 and under thermally conductive fixed copper billet 2 by fixed screw 5 be arranged in target
14 inner side of copper pedestal；The temp sensor device includes temperature sensor probe 4, is connected with temperature sensor probe 4
Waterproof heat-resisting cable 3 and the display 13 that is connected with waterproof heat-resisting cable 3.
Upper thermally conductive fixed copper billet 1 and under have semi-circular recesses, and upper thermally conductive fixed copper billet 1 respectively on thermally conductive fixed copper billet 2
Semi-circular recesses under and on thermally conductive fixed copper billet 2 are spliced to form circular groove, and the temperature sensor probe 4 is embedded in circle
In groove.
Cooling water tank is equipped with cooling water inlet pipe 12 and cooling water outlet pipe 11,3 top of waterproof heat-resisting cable
Be placed in cooling water tank, under partially pass through cooling water inlet pipe 11 and be placed in air.Wherein waterproof heat-resisting cable 3 and cooling
12 contact portion of water water inlet pipe uses waterproof heat-resisting glue adhesive seal.
The course of work:
Firstly, then, equipment working power starting device is opened, when equipment is normal when opening the circulating cooling taps of equipment
When work, at this time the rare gas of 20 top of target understands starter, and generates a large amount of heat, so that the temperature of target 20 is quick
It increases, the heat of target 20 is transmitted on the cooling copper pedestal 14 of target by heat exchange pattern from target 20, then is transmitted to cold
But in water.Upper thermally conductive fixed copper billet 1 and the cooling copper pedestal 14 of target are in close contact at this time, thus temperature sensor can in real time between
The temperature for connecing the cooling copper pedestal 14 of measurement target, can be with the temperature of indirect reaction target 20.The temperature of temperature sensor can be
Real-time display on display 13 facilitates observation.
Claims (6)
1. a kind of measure sputtering target material temperature device indirectly in real time, which is characterized in that be arranged including fitting in target copper pedestal
(14) heat-conduction fixing device on and the temp sensor device being arranged on heat-conduction fixing device, the heat-conduction fixing device packet
Include thermally conductive fixed copper billet (1) and under thermally conductive fixed copper billet (2), the upper thermally conductive fixed copper billet (1) and under thermally conductive fixed copper billet
(2) it is arranged by fixed screw (5) in target copper pedestal (14) inner side；The temp sensor device includes temperature sensing
Device probe (4), the waterproof heat-resisting cable (3) that is connected with temperature sensor probe (4) and it is connected with waterproof heat-resisting cable (3)
Display (13).
2. a kind of measurement sputtering target material temperature device indirect in real time according to claim 1, which is characterized in that led on described
Heat fixation copper billet (1) and under have semi-circular recesses on thermally conductive fixed copper billet (2) respectively, and upper thermally conductive fixed copper billet (1) and under lead
Semi-circular recesses on heat fixation copper billet (2) are spliced to form circular groove, and the temperature sensor probe (4) is embedded round recessed
In slot.
3. a kind of measurement sputtering target material temperature device indirect in real time according to claim 1, which is characterized in that the target
Pedestal (10) are equipped with below copper pedestal (14), the target copper pedestal (14) and pedestal (10) enclose and connect composition airtight cavity, thus
Form cooling water tank.
4. a kind of measurement sputtering target material temperature device indirect in real time according to claim 3, which is characterized in that the cooling
Water tank is equipped with cooling water inlet pipe (12) and cooling water outlet pipe (11), is partially disposed on the waterproof heat-resisting cable (3)
In cooling water tank, under partially pass through cooling water inlet pipe (11) and be placed in air.
5. a kind of measurement sputtering target material temperature device indirect in real time according to claim 4, which is characterized in that the waterproof
High temperature resistant cable (3) and cooling water inlet pipe (12) contact portion use waterproof heat-resisting glue adhesive seal.
6. a kind of measurement sputtering target material temperature device indirect in real time according to claim 4, which is characterized in that the pedestal
(10) magnet (6) are fixedly installed on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910473427.6A CN110117776B (en) | 2019-05-31 | 2019-05-31 | Device for indirectly measuring temperature of sputtering target in real time |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910473427.6A CN110117776B (en) | 2019-05-31 | 2019-05-31 | Device for indirectly measuring temperature of sputtering target in real time |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110117776A true CN110117776A (en) | 2019-08-13 |
| CN110117776B CN110117776B (en) | 2024-05-14 |
Family
ID=67523556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910473427.6A Active CN110117776B (en) | 2019-05-31 | 2019-05-31 | Device for indirectly measuring temperature of sputtering target in real time |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110117776B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115011938A (en) * | 2022-04-19 | 2022-09-06 | 无锡尚积半导体科技有限公司 | Magnetron sputtering equipment capable of measuring temperature of shielding piece |
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|---|---|---|---|---|
| JPH0578839A (en) * | 1991-09-19 | 1993-03-30 | Mitsubishi Electric Corp | Sputtering method and device therefor |
| KR20020016283A (en) * | 2000-08-25 | 2002-03-04 | 윤종용 | Sputtering apparatus |
| JP2003138374A (en) * | 2001-11-01 | 2003-05-14 | Hitachi High-Technologies Corp | Sputtering apparatus and sputtering method |
| US6811662B1 (en) * | 2003-08-22 | 2004-11-02 | Powership Semiconductor Corp. | Sputtering apparatus and manufacturing method of metal layer/metal compound layer by using thereof |
| CN101812667A (en) * | 2010-04-19 | 2010-08-25 | 中国南玻集团股份有限公司 | Magnetron sputtering plating film cathode device |
| CN201762436U (en) * | 2010-07-07 | 2011-03-16 | 中国科学院金属研究所 | Movable type arc discharge ion plating device |
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-
2019
- 2019-05-31 CN CN201910473427.6A patent/CN110117776B/en active Active
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| KR20020016283A (en) * | 2000-08-25 | 2002-03-04 | 윤종용 | Sputtering apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115011938A (en) * | 2022-04-19 | 2022-09-06 | 无锡尚积半导体科技有限公司 | Magnetron sputtering equipment capable of measuring temperature of shielding piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110117776B (en) | 2024-05-14 |
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