CN1971260A - Testing method of thermal resistance of heat-conducting material and testing clamp - Google Patents
Testing method of thermal resistance of heat-conducting material and testing clamp Download PDFInfo
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- CN1971260A CN1971260A CN 200510101731 CN200510101731A CN1971260A CN 1971260 A CN1971260 A CN 1971260A CN 200510101731 CN200510101731 CN 200510101731 CN 200510101731 A CN200510101731 A CN 200510101731A CN 1971260 A CN1971260 A CN 1971260A
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Abstract
A testing method for thermal resistance of heat conducting material is disclosed. The testing jig which consist of heating unit and dissipating heat unit is set, the heat conducting material is clipped between the heating unit and dissipating heat unit; the testing jig clipping the heat conducting material is located in the environmental test box, and the parameters of the environmental test box is set to do environmental test; the testing jig tested by the environmental test is heated by the heating unit, the heat is transferred to the dissipating heat unit through the heat conducting material, the temperature of the heating unit and dissipating heat unit is measured; when the temperature is stable, the thermal resistance is calculated by calculating the power consumption of the heating unit and the temperature difference of the heating unit and dissipating heat unit. In the invention the testing jig which consists of the heating unit and dissipating heat unit is provided. The invention can test the reliability of the thermal resistance in different condition and improve the measuring accuracy.
Description
Technical field
The present invention relates to technical field of measurement and test, relate in particular to a kind of thermal resistance of heat-conducting material method of testing and test fixture.
Background technology
The high-power day by day and miniaturization along with electron device has brought stern challenge for the heat radiation and the insulation of electron device.The Treatment Design at hot interface is extremely important for the life-span that prolongs heater members and its reliability of enhancing.
When thermal design designs at the heat sink conception analog simulation, often the performance with Heat Conduction Material is to regard invariant as, but in fact Heat Conduction Material is in the condition of high temperature or high low temperature circulation use down basically always, Heat Conduction Material for a long time in the condition of high temperature use meeting too much occur because of silicone oil oozes out driedly exhausting, problem such as heat conduction particle separation, thereby cause the thermal resistance of Heat Conduction Material to increase, and then influence the reliability of electron device.So the unfailing performance test that Heat Conduction Material is carried out under the various environmental baselines seems more and more important.
As shown in Figure 1, the great majority measurement instrument and equipment that temperature conductivity adopted is an integral body that can not be split in the prior art, during test with heat conductive pad, Heat Conduction Material such as heat conducting film or heat-conducting silicone grease 40 places on worktable 30 planes, downwards heat block 20 is pressed onto on the Heat Conduction Material 40 by fixed mechanism 10, give heat block 20 heating then, heat is delivered to Heat Conduction Material 40 by heat block 20, Heat Conduction Material with thermal conduction characteristic is again with the worktable 30 of heat transferred to its underpart, behind the temperature stabilization of to be heated 20 and worktable 30, last point for measuring temperature A that is positioned at heat block and the following point for measuring temperature B that is positioned at worktable are carried out temperature test, and write down the temperature data of going up point for measuring temperature A and following point for measuring temperature B, calculate the heat conductivility of Heat Conduction Material by the power consumption of surveying heat block 20.
Thermal resistance R computing method are: R=Δ T (temperature difference)/P (power consumption)
Temperature conductivity K computing method are: K=h (material thickness)/(thermal resistance R * material area S)
The shortcoming of prior art is:
1, because the thermo-resistance measurement device of Heat Conduction Material is the integral body that can't split, therefore heat block and worktable can not be separated, Heat Conduction Material can't be put environmental test chamber into after fixing on the worktable of testing tool, cause proving installation can only act under the normal temperature, Heat Conduction Material can not be through the test of various environmental baselines such as excess temperature, time, so can not assess the long-term reliability of Heat Conduction Material.
2, because test process carries out under calm condition,, operating temperature is assembled raise, cause the test result low precision if the lower table heat can not loose in time.
Summary of the invention
The invention provides a kind of thermal resistance of heat-conducting material method of testing and test clip anchor clamps, to realize that Heat Conduction Material is carried out thermo-resistance measurement under the varying environment condition.
The present invention solves the problems of the technologies described above the technical scheme that is adopted to be:
This thermal resistance of heat-conducting material method of testing may further comprise the steps:
The test fixture that setting is made up of heat-generating units and heat-sink unit is clamped in Heat Conduction Material between described heat-generating units and the heat-sink unit;
The test fixture of clamping Heat Conduction Material is placed in the environmental test chamber, and the parameter that environmental test chamber is set is carried out environmental test;
To test fixture,, conduct heat to heat-sink unit by Heat Conduction Material, and the temperature of heat-generating units and heat-sink unit is measured respectively by the heat-generating units heating through environmental test;
When temperature stabilization, calculate the power consumption of heat-generating units and the temperature difference of heat-generating units and heat-sink unit, thereby calculate thermal resistance.
Described environmental test chamber parameter comprises the environmental test chamber temperature parameter at least, perhaps further comprises time parameter.
Described environmental test is undertaken by in described environmental test chamber parameter different parameter values being set, and tests and calculate the thermal resistance of Heat Conduction Material respectively, and test result is compared the thermal resistance reliability of estimating Heat Conduction Material.
Described heat-generating units can adopt and comprise heat-conducting metal body and the heat-generating electronic elements that is fixed on this heat-conducting metal body.Described heat-generating electronic elements can adopt voltage stabilizing diode, and described heat-conducting metal body can adopt copper billet, and the voltage stabilizing diode bottom is welded on the described copper billet.
Described heat-sink unit can be made up of a heat-conducting metal body and the heat radiator that is installed in this heat-conducting metal body bottom.When carrying out temperature test, can adopt the cooling of lowering the temperature of external refrigeration mode to described heat-sink unit.The external refrigeration mode can be to adopt fan that heat-sink unit is cooled off.
Corresponding a kind of thermal resistance of heat-conducting material test fixture, comprise heat-generating units and heat-sink unit, heat-generating units and heat-sink unit have the heat-conducting metal body that is used for the clamping Heat Conduction Material respectively, on the heat-conducting metal body of described heat-generating units heat-generating electronic elements is set, the heat-conducting metal body bottom of described heat-sink unit is provided with heat radiator.
Described heat-generating electronic elements can adopt voltage stabilizing diode, and the heat-conducting metal body of described heat-generating units can adopt copper billet, and described voltage stabilizing diode bottom is welded on the described copper billet.
Beneficial effect of the present invention is: the invention provides a kind of test thermal resistance of heat-conducting material method, and a kind of test fixture that can satisfy hot environment is provided; Heat Conduction Material actual application environment condition can be provided, Heat Conduction Material is carried out testing its thermal resistance again after the hot test in environmental test chamber, thereby record the performance change behind the Heat Conduction Material process varying environment condition test, assessing for the long-term reliability of Heat Conduction Material provides a kind of feasible method of testing and anchor clamps.And, utilize heat-sink unit of the present invention soon heat to be loose, can not cause temperature to assemble, improved measuring accuracy.
Description of drawings
Fig. 1 is existing testing tool principle of work synoptic diagram;
Fig. 2 is a test philosophy synoptic diagram of the present invention;
Fig. 3 is a heating unit heater circuit synoptic diagram of the present invention;
Fig. 4 is a heating unit structural representation of the present invention;
Fig. 5 is a heating unit plan structure synoptic diagram of the present invention;
Fig. 6 is a test fixture structural representation of the present invention;
Fig. 7 tests the syndeton synoptic diagram for the present invention.
Embodiment
With embodiment the present invention is described in further detail with reference to the accompanying drawings below:
As Fig. 2 and shown in Figure 7, the invention provides a kind of thermal resistance of heat-conducting material method for testing reliability, may further comprise the steps:
The test fixture that can put into environmental test chamber that setting is made up of heat-generating units 50 and heat-sink unit 60 is clamped in Heat Conduction Material 40 between described heat-generating units 50 and the heat-sink unit 60;
The test fixture of clamping Heat Conduction Material 40 is put into environmental test chamber, and the parameter that environmental test chamber is set is carried out environmental test;
From environmental test chamber, take out test fixture, be cooled to begin to test behind the normal temperature, conduct heat to heat-sink unit 60 by heat-generating units 50 heating and by Heat Conduction Material 40, and adopt temperature measuring device that the heat-generating units 50 and the temperature of heat-sink unit 60 are measured respectively;
When temperature stabilization, calculate the power consumption of heat-generating units 50 and the temperature difference of heat-generating units 50 and heat-sink unit 60, thereby carry out data processing, calculate thermal resistance.
The environmental test chamber parameter can comprise temperature and time, different environmental test chamber parameters is set carries out environmental test respectively, such as 50 ℃ of environmental test chamber temperature are set, time is to carry out environmental test in 2 hours, after environmental test finishes, the test fixture taking-up is cooled to normal temperature, test is also calculated thermal resistance, and then through the environmental test under the different parameters, such as 60 ℃ of environmental test chamber temperature are set, time after being 3 hours takes out test fixture, is cooled to test and calculate thermal resistance again behind the normal temperature, each test result is compared, the thermal resistance that just obtains Heat Conduction Material changes, thereby the performance change behind the assessment Heat Conduction Material process varying environment condition test is assessed the long-term reliability of Heat Conduction Material.
As shown in Figure 4 and Figure 5, heat-generating units 50 comprises heat-generating electronic elements (adopting voltage stabilizing diode 51) and heat-conducting metal body 53 as copper billet, and voltage stabilizing diode 51 bottoms are welded on the copper billet, because scolding tin 52 thermal conductivity ratios are higher, so little to the test result influence.Because the general area of voltage stabilizing diode is all very little, if directly to the Heat Conduction Material heating, the upper and lower temperature difference value that then tests out is very little, for improving measuring accuracy, so the present invention adds the metal that the large tracts of land temperature conductivity is high below voltage stabilizing diode, voltage stabilizing diode 51 bottoms are welded on the copper billet 53.
Heat-generating units when heating, can adopt circuit as shown in Figure 3 voltage stabilizing diode 51 to be powered up according to the load voltage value of load, generate heat after the voltage stabilizing diode work, by copper billet 53 with thermal conductance to Heat Conduction Material 40.And, calculate the power consumption of heat-generating units according to the voltage of this current value and voltage stabilizing diode 51 by the galvanometer detected current value.
Heat-sink unit 60 is made up of heat-conducting metal body 61 and the heat radiator 62 that is installed in heat-conducting metal body 61 bottoms, is dispelled the heat by heat radiator 62.When carrying out temperature test, can adopt the cooling of lowering the temperature of external refrigeration mode to described heat-sink unit, as adopting the cooling of drying of 70 pairs of heat-sink units 60 of fan.Utilize heat radiator 62 and fan 70 that following heat can be loose very soon, make upper and lower temperature difference big like this, obtain ideal results easily, otherwise upper and lower temperature difference is too little, thermal behavior can not compare well.
When carrying out temperature test, adopt temperature measurer respectively the temperature of last test point C (voltage stabilizing diode housing) and following test point D (heat-sink unit) to be tested by thermopair 81,82, when temperature stabilization, read temperature value, carry out the calculating of thermal resistance according to the temperature difference and power consumption.
Thermal resistance R=Δ T (temperature difference)/P (power consumption)
Temperature conductivity K=h (material thickness)/(thermal resistance R * material area S)
As shown in Figure 6, the present invention also provides a kind of thermal resistance of heat-conducting material reliability testing anchor clamps, comprise heat-generating units 50 and heat-sink unit 60, heat-generating units 50 and heat-sink unit 60 have the heat-conducting metal body 53,61 that is used for the clamping Heat Conduction Material respectively, on the heat-conducting metal body 53 of heat-generating units 50 heat-generating electronic elements is set, heat-conducting metal body 61 bottoms of heat-sink unit 60 are provided with heat radiator 62, and the size of heat-generating units 50 and heat-sink unit 60 can be put into environmental test chamber after making its clamping Heat Conduction Material 40.Heat-generating electronic elements can adopt voltage stabilizing diode 51, and the heat-conducting metal body 53 of heat-generating units 50 can adopt copper billet, and voltage stabilizing diode 51 bottoms are welded on the described copper billet.
Heat Conduction Material 40 has a variety of forms, and as materials such as heat conductive pad, heat conducting film, heat-conducting glue, heat-conducting silicone greases, size can be selected and heat-conducting metal body 53 bottom area equal and opposite in directions.Different Heat Conduction Material mounting meanss is different, and heat conductive pad, heat conducting film can directly stick, and heat-conducting glue, heat-conducting silicone grease then need coating method.
Utilize test process of the present invention can adopt following form:
1) at first the voltage stabilizing diode bottom is welded on the copper billet of heat-generating units;
2) Heat Conduction Material is installed in heat-sink unit derby surface;
3) will weld good copper billet bottom again and be pressed onto the Heat Conduction Material surface, form a test fixture;
4) then test fixture is put in the environmental test chamber;
5) parameter (temperature, time) that environmental test chamber is set is carried out environmental test;
6) by the time setting-up time test fixture is taken out;
7) connect input signal (offering the voltage of voltage stabilizing diode), temperature measuring device, fan power supply etc. and start working, promptly energising back voltage stabilizing diode, fan are started working, and temperature measurer begins to collect data.
8) treat that the monitoring temperature of upper and lower monitoring point is stable after, note data;
9) calculate thermal resistance;
10), repeat 4 again according to different environmental baselines)～9 step, compare after calculating thermal resistance respectively, if find at environmental test chamber greatlyyer, this thermal resistance of heat-conducting material poor reliability is described then through hot test after heat resistiveization.
The invention provides the reliability method of a kind of test thermal resistance of heat-conducting material, and a kind of test fixture that can satisfy hot environment is provided; Heat Conduction Material actual application environment condition can be provided, can in environmental test chamber, carry out testing its thermal resistance after the hot test to Heat Conduction Material, thereby record Heat Conduction Material through the performance change after testing under the varying environment condition, assessing for the long-term reliability of Heat Conduction Material provides a kind of feasible method of testing and anchor clamps.Utilize heat-sink unit of the present invention soon heat to be loose, can not cause temperature to assemble like this, improved measuring accuracy.
Those skilled in the art do not break away from essence of the present invention and spirit, can there be the various deformation scheme to realize the present invention, the above only is the preferable feasible embodiment of the present invention, be not so limit to interest field of the present invention, the equivalence that all utilizations instructions of the present invention and accompanying drawing content are done changes, and all is contained within the interest field of the present invention.
Claims (10)
1, a kind of thermal resistance of heat-conducting material method of testing is characterized in that, may further comprise the steps:
The test fixture that setting is made up of heat-generating units and heat-sink unit is clamped in Heat Conduction Material between described heat-generating units and the heat-sink unit;
The test fixture of clamping Heat Conduction Material is placed in the environmental test chamber, and the parameter that environmental test chamber is set is carried out environmental test;
To test fixture,, conduct heat to heat-sink unit by Heat Conduction Material, and the temperature of heat-generating units and heat-sink unit is measured respectively by the heat-generating units heating through environmental test;
When temperature stabilization, calculate the power consumption of heat-generating units and the temperature difference of heat-generating units and heat-sink unit, thereby calculate thermal resistance.
2, thermal resistance of heat-conducting material method of testing according to claim 1 is characterized in that: described environmental test chamber parameter comprises the environmental test chamber temperature parameter at least, perhaps further comprises time parameter.
3, thermal resistance of heat-conducting material method of testing according to claim 2, it is characterized in that: described environmental test is undertaken by in described environmental test chamber parameter different parameter values being set, test and calculate the thermal resistance of Heat Conduction Material respectively, and test result is compared the thermal resistance reliability of estimating Heat Conduction Material.
4, according to claim 1,2 or 3 described thermal resistance of heat-conducting material method of testings, it is characterized in that: described heat-generating units comprises heat-conducting metal body and the heat-generating electronic elements that is fixed on this heat-conducting metal body.
5, thermal resistance of heat-conducting material method of testing according to claim 4 is characterized in that: described heat-generating electronic elements adopts voltage stabilizing diode, and described heat-conducting metal body adopts copper billet, and the voltage stabilizing diode bottom is welded on the described copper billet.
6, thermal resistance of heat-conducting material method of testing according to claim 4 is characterized in that: described heat-sink unit is made up of a heat-conducting metal body and the heat radiator that is installed in this heat-conducting metal body bottom.
7, thermal resistance of heat-conducting material method of testing according to claim 6 is characterized in that: when carrying out temperature test, described heat-sink unit is adopted the cooling of lowering the temperature of external refrigeration mode.
8, thermal resistance of heat-conducting material method of testing according to claim 7 is characterized in that: described external refrigeration mode is cooled off heat-sink unit for adopting fan.
9, a kind of thermal resistance of heat-conducting material test fixture, it is characterized in that: comprise heat-generating units and heat-sink unit, heat-generating units and heat-sink unit have the heat-conducting metal body that is used for the clamping Heat Conduction Material respectively, on the heat-conducting metal body of described heat-generating units heat-generating electronic elements is set, the heat-conducting metal body bottom of described heat-sink unit is provided with heat radiator.
10, thermal resistance of heat-conducting material test fixture according to claim 9, it is characterized in that: described heat-generating electronic elements adopts voltage stabilizing diode, the heat-conducting metal body of described heat-generating units adopts copper billet, and described voltage stabilizing diode bottom is welded on the described copper billet.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200510101731A CN100578206C (en) | 2005-11-21 | 2005-11-21 | Testing method of thermal resistance of heat-conducting material and testing clamp |
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| CN200510101731A CN100578206C (en) | 2005-11-21 | 2005-11-21 | Testing method of thermal resistance of heat-conducting material and testing clamp |
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| CN100578206C CN100578206C (en) | 2010-01-06 |
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