CN105593800B - 触控传感器装置 - Google Patents

触控传感器装置 Download PDF

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Publication number
CN105593800B
CN105593800B CN201480054704.5A CN201480054704A CN105593800B CN 105593800 B CN105593800 B CN 105593800B CN 201480054704 A CN201480054704 A CN 201480054704A CN 105593800 B CN105593800 B CN 105593800B
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CN
China
Prior art keywords
layer
touch sensing
metal
sensing device
sensor
Prior art date
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Active
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CN201480054704.5A
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English (en)
Chinese (zh)
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CN105593800A (zh
Inventor
哈拉尔德·科斯腾鲍尔
多米尼克·洛伦茨
布鲁斯·曾
约尔格·温克勒
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Panshi Austrian Co
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Panshi Austrian Co
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Publication of CN105593800A publication Critical patent/CN105593800A/zh
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Position Input By Displaying (AREA)
  • Physical Vapour Deposition (AREA)
CN201480054704.5A 2013-10-04 2014-10-01 触控传感器装置 Active CN105593800B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM319/2013 2013-10-04
ATGM319/2013U AT13879U1 (de) 2013-10-04 2013-10-04 Berührungssensoranordnung
PCT/AT2014/000178 WO2015048828A1 (de) 2013-10-04 2014-10-01 Berührungssensoranordnung

Publications (2)

Publication Number Publication Date
CN105593800A CN105593800A (zh) 2016-05-18
CN105593800B true CN105593800B (zh) 2019-11-08

Family

ID=51660823

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480054704.5A Active CN105593800B (zh) 2013-10-04 2014-10-01 触控传感器装置

Country Status (6)

Country Link
JP (1) JP6747970B2 (enExample)
KR (1) KR102388979B1 (enExample)
CN (1) CN105593800B (enExample)
AT (1) AT13879U1 (enExample)
TW (1) TWI623871B (enExample)
WO (1) WO2015048828A1 (enExample)

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WO2016159602A1 (ko) * 2015-03-27 2016-10-06 주식회사 엘지화학 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극
US11293088B2 (en) * 2015-12-07 2022-04-05 Lg Chem, Ltd. Conductive structure, method for manufacturing same, and electrode comprising conductive structure
JP6575601B2 (ja) * 2016-04-01 2019-09-18 凸版印刷株式会社 印刷体、印刷体管理装置、情報出力システム、及び印刷体のページ識別方法、ブックカバー、印刷体の表紙
KR102573333B1 (ko) * 2016-06-28 2023-08-31 삼성디스플레이 주식회사 표시 장치
US10151953B2 (en) * 2017-02-22 2018-12-11 A. U. Vista, Inc. In-plane switching display having protrusion electrodes with metal enhanced adhesion
CN108121098B (zh) 2017-12-19 2019-08-06 友达光电股份有限公司 金属结构及其制作方法与应用的显示面板
CN110872687B (zh) * 2018-09-03 2022-07-19 大同特殊钢株式会社 层叠体及靶材
TWI722860B (zh) * 2020-04-08 2021-03-21 新唐科技股份有限公司 氣體感測材料與氣體感測器
CN114510167B (zh) * 2020-11-17 2024-04-12 瀚宇彩晶股份有限公司 触控感测面板
CN112680967B (zh) * 2020-12-15 2022-02-18 武汉纺织大学 具有单向导湿作用的压阻传感织物及其制备方法

Citations (3)

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JPH11119676A (ja) * 1997-10-08 1999-04-30 Ulvac Seimaku Kk ブランクス及びブラックマトリクス
WO2012134174A2 (ko) * 2011-03-28 2012-10-04 주식회사 엘지화학 전도성 구조체， 터치패널 및 이의 제조방법
CN103168285A (zh) * 2010-10-19 2013-06-19 Lg化学株式会社 包括导电图形的触摸面板及其制备方法

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US7378146B1 (en) * 1998-08-05 2008-05-27 International Business Machines Corporation Transparent hard coats for optical elements
JP3735814B2 (ja) * 2001-09-28 2006-01-18 Ｈｏｙａ株式会社 液晶表示パネル用対向基板、及び液晶表示パネル
US8243027B2 (en) 2006-06-09 2012-08-14 Apple Inc. Touch screen liquid crystal display
TWI450237B (zh) * 2010-01-14 2014-08-21 Wintek Corp 觸控顯示裝置
AT11941U1 (de) * 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
CN102243553B (zh) * 2010-05-16 2015-06-10 宸鸿科技(厦门)有限公司 电容式触控面板及降低其金属导体可见度的方法
EP2402481A1 (en) * 2010-06-29 2012-01-04 Applied Materials, Inc. Method and system for manufacturing a transparent body for use in a touch panel
US8449817B2 (en) * 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
KR101367569B1 (ko) * 2010-12-29 2014-02-28 주식회사 엘지화학 터치 스크린 및 이의 제조방법
JP2012173799A (ja) * 2011-02-17 2012-09-10 Sumitomo Chemical Co Ltd 透明導電性基板、それを用いた電子デバイスおよびタッチパネル
US9363888B2 (en) * 2011-03-28 2016-06-07 Lg Chem, Ltd. Conductive substrate and touch screen having same
JP2013020347A (ja) * 2011-07-08 2013-01-31 Toppan Printing Co Ltd タッチパネルおよびタッチパネルの製造方法
KR101415583B1 (ko) * 2011-12-16 2014-07-07 엘지이노텍 주식회사 터치 패널 및 그 제조 방법
TWM472245U (zh) * 2013-07-31 2014-02-11 Wintek Corp 觸控面板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11119676A (ja) * 1997-10-08 1999-04-30 Ulvac Seimaku Kk ブランクス及びブラックマトリクス
CN103168285A (zh) * 2010-10-19 2013-06-19 Lg化学株式会社 包括导电图形的触摸面板及其制备方法
WO2012134174A2 (ko) * 2011-03-28 2012-10-04 주식회사 엘지화학 전도성 구조체， 터치패널 및 이의 제조방법

Also Published As

Publication number Publication date
AT13879U1 (de) 2014-10-15
KR20160067849A (ko) 2016-06-14
TWI623871B (zh) 2018-05-11
JP6747970B2 (ja) 2020-08-26
WO2015048828A1 (de) 2015-04-09
CN105593800A (zh) 2016-05-18
KR102388979B1 (ko) 2022-04-20
TW201528096A (zh) 2015-07-16
JP2016533562A (ja) 2016-10-27

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