TWI623871B - 觸控感測器配置 - Google Patents

觸控感測器配置 Download PDF

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Publication number
TWI623871B
TWI623871B TW103128585A TW103128585A TWI623871B TW I623871 B TWI623871 B TW I623871B TW 103128585 A TW103128585 A TW 103128585A TW 103128585 A TW103128585 A TW 103128585A TW I623871 B TWI623871 B TW I623871B
Authority
TW
Taiwan
Prior art keywords
touch sensor
layer
metal
contact structure
metal oxynitride
Prior art date
Application number
TW103128585A
Other languages
English (en)
Chinese (zh)
Other versions
TW201528096A (zh
Inventor
哈拉德 胡斯頓堡爾
多明尼克 羅倫茲
曾柏誠
傑格 溫克勒
Original Assignee
攀時歐洲公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 攀時歐洲公司 filed Critical 攀時歐洲公司
Publication of TW201528096A publication Critical patent/TW201528096A/zh
Application granted granted Critical
Publication of TWI623871B publication Critical patent/TWI623871B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Position Input By Displaying (AREA)
  • Physical Vapour Deposition (AREA)
TW103128585A 2013-10-04 2014-08-20 觸控感測器配置 TWI623871B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??ATGM319/2013 2013-10-04
ATGM319/2013U AT13879U1 (de) 2013-10-04 2013-10-04 Berührungssensoranordnung

Publications (2)

Publication Number Publication Date
TW201528096A TW201528096A (zh) 2015-07-16
TWI623871B true TWI623871B (zh) 2018-05-11

Family

ID=51660823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103128585A TWI623871B (zh) 2013-10-04 2014-08-20 觸控感測器配置

Country Status (6)

Country Link
JP (1) JP6747970B2 (enExample)
KR (1) KR102388979B1 (enExample)
CN (1) CN105593800B (enExample)
AT (1) AT13879U1 (enExample)
TW (1) TWI623871B (enExample)
WO (1) WO2015048828A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11926558B2 (en) 2015-03-27 2024-03-12 Lg Chem Ltd. Conductive structure, manufacturing method therefor, and electrode comprising conductive structure
WO2017099476A1 (ko) * 2015-12-07 2017-06-15 주식회사 엘지화학 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극
WO2017170862A1 (ja) 2016-04-01 2017-10-05 凸版印刷株式会社 印刷体、印刷体管理装置、情報出力システム、及び印刷体のページ識別方法
KR102573333B1 (ko) * 2016-06-28 2023-08-31 삼성디스플레이 주식회사 표시 장치
US10151953B2 (en) * 2017-02-22 2018-12-11 A. U. Vista, Inc. In-plane switching display having protrusion electrodes with metal enhanced adhesion
CN108121098B (zh) 2017-12-19 2019-08-06 友达光电股份有限公司 金属结构及其制作方法与应用的显示面板
CN110872687B (zh) * 2018-09-03 2022-07-19 大同特殊钢株式会社 层叠体及靶材
TWI722860B (zh) * 2020-04-08 2021-03-21 新唐科技股份有限公司 氣體感測材料與氣體感測器
CN114510167B (zh) * 2020-11-17 2024-04-12 瀚宇彩晶股份有限公司 触控感测面板
CN112680967B (zh) * 2020-12-15 2022-02-18 武汉纺织大学 具有单向导湿作用的压阻传感织物及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201124961A (en) * 2010-01-14 2011-07-16 Wintek Corp Touch-sensing display device
TW201226593A (en) * 2010-06-29 2012-07-01 Applied Materials Inc Method and system for manufacturing a transparent body for use in a touch panel
TW201233272A (en) * 2010-10-19 2012-08-01 Lg Chemical Ltd Touch panel comprising conducting pattern and method for manufacturing the same
TWM472245U (zh) * 2013-07-31 2014-02-11 Wintek Corp 觸控面板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4071849B2 (ja) * 1997-10-08 2008-04-02 アルバック成膜株式会社 ブランクス及びブラックマトリクス
US7378146B1 (en) * 1998-08-05 2008-05-27 International Business Machines Corporation Transparent hard coats for optical elements
JP3735814B2 (ja) * 2001-09-28 2006-01-18 Ｈｏｙａ株式会社 液晶表示パネル用対向基板、及び液晶表示パネル
US8552989B2 (en) 2006-06-09 2013-10-08 Apple Inc. Integrated display and touch screen
AT11941U1 (de) * 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
CN102243553B (zh) * 2010-05-16 2015-06-10 宸鸿科技(厦门)有限公司 电容式触控面板及降低其金属导体可见度的方法
US8449817B2 (en) * 2010-06-30 2013-05-28 H.C. Stark, Inc. Molybdenum-containing targets comprising three metal elements
US8822865B2 (en) * 2010-12-29 2014-09-02 Lg Chem, Ltd. Touch screen and method for manufacturing the same
JP2012173799A (ja) * 2011-02-17 2012-09-10 Sumitomo Chemical Co Ltd 透明導電性基板、それを用いた電子デバイスおよびタッチパネル
WO2012134174A2 (ko) * 2011-03-28 2012-10-04 주식회사 엘지화학 전도성 구조체， 터치패널 및 이의 제조방법
TW201506738A (zh) * 2011-03-28 2015-02-16 Lg Chemical Ltd 導電基板及包含其之觸控螢幕
JP2013020347A (ja) * 2011-07-08 2013-01-31 Toppan Printing Co Ltd タッチパネルおよびタッチパネルの製造方法
KR101415583B1 (ko) * 2011-12-16 2014-07-07 엘지이노텍 주식회사 터치 패널 및 그 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201124961A (en) * 2010-01-14 2011-07-16 Wintek Corp Touch-sensing display device
TW201226593A (en) * 2010-06-29 2012-07-01 Applied Materials Inc Method and system for manufacturing a transparent body for use in a touch panel
TW201233272A (en) * 2010-10-19 2012-08-01 Lg Chemical Ltd Touch panel comprising conducting pattern and method for manufacturing the same
TWM472245U (zh) * 2013-07-31 2014-02-11 Wintek Corp 觸控面板

Also Published As

Publication number Publication date
CN105593800B (zh) 2019-11-08
JP6747970B2 (ja) 2020-08-26
KR102388979B1 (ko) 2022-04-20
CN105593800A (zh) 2016-05-18
TW201528096A (zh) 2015-07-16
WO2015048828A1 (de) 2015-04-09
KR20160067849A (ko) 2016-06-14
JP2016533562A (ja) 2016-10-27
AT13879U1 (de) 2014-10-15

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