CN105575270A - 配备成用于室外用途的室内smd led - Google Patents

配备成用于室外用途的室内smd led Download PDF

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CN105575270A
CN105575270A CN201510753207.0A CN201510753207A CN105575270A CN 105575270 A CN105575270 A CN 105575270A CN 201510753207 A CN201510753207 A CN 201510753207A CN 105575270 A CN105575270 A CN 105575270A
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smdled
indoor
coverture
outdoor
led
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陈居礼
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HUIZHOU LIGHTHOUSE PHOTOELECTRIC TECHNOLOGY Co Ltd
Lighthouse Technologies Huizhou Ltd
Lighthouse Technologies Ltd
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Lighthouse Technologies Ltd
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Abstract

设计用于室内用途的SMD？LED通过封装在真空形成和/或罩模制的覆盖物中而被配备用于室外用途，真空形成和/或罩模制的覆盖物位于室内SMD？LED上方，并且通过排空而形成在其上。如此配备的室内SMD？LED因而可以以与更昂贵和严苛设计的室外SMD？LED同样的方式使用。

Description

配备成用于室外用途的室内SMD LED
相关申请的交叉引用
本申请要求2014年11月7日提交的美国专利申请No.62/077,044的权益，通过引用将该申请并入本文中。
技术领域
本发明涉及初始设计成室内用途、但被特别配备成用于室外用途的SMD(表面安装器件)LED(发光二极管)。
背景技术
如公知的那样，发光二极管(LED)是固态半导体部件，当对其供以适当的电流时，其发出光。众所周知，LED具有高效率和长寿命，这使得LED的应用越来越多，其中，先前使用的是传统的白炽灯泡。
SMDLED由安装在电路板表面上的大量独立的LED构成。电路板通常是印刷电路板，其是平坦的，并且除了安装LED之外，还用于适当地电连接LED。印刷电路板还可以具有辅助部件，这些辅助部件用于驱动LED，但LED驱动电路也可能被分离地(远程地)安装。
相比之下，传统安装的LED具有将其连接到电路板的引线。通常，SMD摒弃了这些引线，使得整个封装紧凑。
SMDLED可以大体上分为以下类别：设计用于室内用途的器件以及设计用于室外用途的器件。这些器件的典型的室外用途是作为视频显示器。为了承受可能影响或损坏这种室外器件的运行的环境因素，室外SMDLED通常设计成具有比室内SMDLED更重和更牢固的部件，这使得室外SMDLED更加昂贵。室外SMDLED必须能够承受的室外环境可以包括水、UV灰尘以及其他使性能降低或使材料退化的污染物。
已经尝试封装或以其他方式保护用于室内用途的SMDLED设计，从而使得这种室内SMDLED适于室外用途，以便受益于室内SMDLED的更低的成本。一种这样的方法是在室内SMDLED产品的整体上提供透明罩。这种方法的缺点在于：这种罩中的许多裂缝或其他开口通过允许例如水到达罩的内部而有损于整个器件的整体性，并且，难以确保这些裂缝或开口在远早于产品的期望使用寿命时不会在罩中发展。换言之，这种罩可预计的保持完整的期间小于室外SMDLED产品的常规预计的使用期间。此外，鉴于所需的完整密封，在使用SMDLED期间产生的热量难以释放，并且在这种升高的温度环境中连续使用SMDLED会导致SMDLED的寿命缩短。
发明内容
本发明的一个目的在于提供一种改进的室外SMDLED，其克服了SMDLED的上述缺陷。
在第一方面，室外SMDLED包括室内SMDLED；及覆盖物，该覆盖物通过所述覆盖物和所述SMDLED之间的排空而保持在所述室内SMDLED上方。
在另一方面，所述覆盖物是真空形成的覆盖物或罩模制的覆盖物。
在又一方面，所述覆盖物由塑料或硅树脂制成。
在第二方面，一种室外SMDLED显示器，包括印刷电路板；多个LED，该多个LED安装在所述电路板的同一表面上，并且与所述电路板一起形成室内LED显示器；以及真空形成的和/或罩模制的覆盖物，其位于所述印刷电路板的所述表面上的所述LED的上方，并且通过排空所述覆盖物和所述电路板上的所述LED之间的容积而保持在所述印刷电路板上的所述LED的上方，由此形成所述室内LED显示器的保护，以允许其室外操作。
在另一方面，所述真空形成的和/或罩模制的覆盖物由塑料或硅树脂制成。
在第三方面，一种将室内SMDLED配备成室外操作的方法，其包括：提供室内SMDLED；及在所述室内SMDLED上真空形成和/或罩模制一覆盖物，由此保护所述室内SMDLED以用于室外操作。
在又一方面，其中，所述罩由塑料或硅树脂制成。
附图说明
附图仅用于展示的目的，并且未必按比例绘制。然而，可以结合附图参考下文中详细说明而更好地理解本发明本身，附图中：
图1示出了在形成显示器的实施方式中的位于印刷电路板上的室内SMDLED。
图2示出了根据本发明的用于覆盖图1的SMDLED显示器的真空形成片。
图3示出了在覆盖图1的器件过程中的真空形成片。
图4示出了由真空形成片覆盖的图1的器件的角部。
图5是示出了根据本发明的在排空过程中由真空形成片覆盖的图1的器件的视图。
图6是示出了根据本发明的由真空形成片完全覆盖的图1的器件的第二视图。
具体实施方式
根据本发明，SMDLED通过真空形成和/或罩模制片而被封装，该真空形成和/或罩模制片通过排空而被保持在安装有LED的印刷电路板(PCB)的上方。在图1所示的实例中，示出了被真空形成和/或罩模制片覆盖之前的器件(在这种情况下是LED显示器1)。图1中所示的器件被设计为室内器件，即，其自身将不能够室外使用，因为其不能够经受室外环境。LED显示器1具有位于PCB2上的多个LED3。
片可以由塑料(例如聚碳酸酯塑料)、硅或类似物制成。片可以是透明或半透明的，可以具有一种或多种颜色，并且/或者可以被压花有能够帮助引导光的一个或多个图案。片可以具有至少一个抗紫外线层。
片可以是真空形成片、罩模制片或者真空形成及罩模制片。
如注意到的那样，尽管图1中示出的器件被配置为显示器，但本发明可以用于配备任何设计用于室内用途的SMDLED，从而使得室内使用的SMDLED可以承受室外环境，并且由此可以用作室外SMDLED。
图2示出了根据本发明的真空形成和/或罩模制的透明片4，其用于覆盖图1中示出的器件。如图2中可见，该片形成有多个凹陷5，这些凹陷5独立地并且分别地套在图1中的PCB2上的各个LED3上。
图3示出了片4，其被压入就位在图1中示出的显示器1上。图4示出了完全覆盖图1中示出的显示器的片4，但处于排空之前的状态。
图5示出了根据本发明的在通过排空片4和显示器之间的容积而被配备成室外用途的过程中从室内SMDLED上方观察的视图。如图5中所示，随着以已知的方式进行排空，左下角4a的容积仍然存在于罩和具有LED的PCB之间，从而片4最终紧密地覆盖并且封闭室内SMDLED显示器1，由此完全地保护室内SMDLED不受室外环境中常见的侵袭因素的影响，并且由此生产完全室外的SMDLED显示器6。
尽管本领域技术人员可以提供其他改进和变化，但申请人的意图是将在其对本领域贡献范围内的所有合理且适当的变化和改进都包括在本发明的范围内。

Claims (7)

1.一种室外SMDLED，其包括：
室内SMDLED；及
覆盖物，该覆盖物通过所述覆盖物和所述SMDLED之间的排空而保持在所述室内SMDLED的上方。
2.如权利要求1所述的室外SMDLED，其中，所述覆盖物是真空形成的覆盖物或者罩模制的覆盖物。
3.如权利要求2所述的室外SMDLED，其中，所述覆盖物由塑料或硅树脂制成。
4.一种室外SMDLED显示器，其包括：
印刷电路板；
多个LED，该多个LED安装在所述电路板的同一表面上，并且与所述电路板一起形成室内LED显示器；以及
真空形成的和/或罩模制的覆盖物，其位于所述印刷电路板的所述表面上的所述LED的上方，并且通过排空所述覆盖物和所述电路板上的所述LED之间的容积而保持在所述印刷电路板上的所述LED的上方，由此形成所述室内LED显示器的保护，以允许其室外操作。
5.如权利要求4所述的室外SMDLED显示器，其中，所述真空形成的和/或罩模制的覆盖物由塑料或硅树脂制成。
6.一种将室内SMDLED配备成室外操作的方法，其包括：
提供室内SMDLED；及
在所述室内SMDLED上真空形成和/或罩模制一覆盖物，由此保护所述室内SMDLED以用于室外操作。
7.如权利要求6所述的将室内SMDLED配备成室外操作的方法，其中，所述罩由塑料或硅树脂制成。
CN201510753207.0A 2014-11-07 2015-11-06 配备成用于室外用途的室内smd led Pending CN105575270A (zh)

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160131328A1 (en) * 2014-11-07 2016-05-12 Lighthouse Technologies Limited Indoor smd led equipped for outdoor usage
JP1541784S (zh) * 2015-01-08 2016-01-18
US20200232623A1 (en) * 2015-09-29 2020-07-23 Osram Sylvania Inc. Formed cellular lighting elements and lighting devices including the same
JP6846877B2 (ja) * 2016-05-16 2021-03-24 三菱電機株式会社 表示ユニット装置及び表示装置
WO2018060332A1 (en) * 2016-09-29 2018-04-05 Koninklijke Philips N.V. Wireless magnetic resonance energy harvesting and coil detuning
EP3388979B1 (en) * 2017-04-14 2020-07-22 Nxp B.V. Rfid integrated circuit
JP6948182B2 (ja) * 2017-08-04 2021-10-13 株式会社アドバンテスト 磁気センサ試験装置
JP7428871B2 (ja) * 2018-11-08 2024-02-07 株式会社デンソーウェーブ 無線タグシステム
US11043729B2 (en) * 2019-02-05 2021-06-22 Best Medical Canada Ltd. Flexible antenna for a wireless radiation dosimeter
US11741329B2 (en) 2019-09-26 2023-08-29 Best Theratronics, Ltd. Low power non-volatile non-charge-based variable supply RFID tag memory
US11604290B2 (en) 2019-09-26 2023-03-14 Best Theratronics, Ltd. Low power dual-sensitivity FG-MOSFET sensor for a wireless radiation dosimeter
JP7447250B2 (ja) * 2019-09-30 2024-03-11 オエティカ エヌワイ インク 無線周波数識別コネクタ
US11669709B2 (en) * 2020-03-02 2023-06-06 Avery Dennison Retail Information Services Llc Controlled energy adsorption by self-limiting heating for curing processes

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101021982A (zh) * 2006-12-20 2007-08-22 株式会社大韩电光 使用芯片型led模块的室外型电光板
CN201274137Y (zh) * 2008-08-27 2009-07-15 深圳市大眼界光电科技有限公司 一种贴片式led户外显示屏
CN201331899Y (zh) * 2008-12-10 2009-10-21 康佳集团股份有限公司 户外smd的led显示屏的改良结构
CN201584129U (zh) * 2010-01-12 2010-09-15 深圳市愿景光电子有限公司 一种防水的led显示模组
CN202102655U (zh) * 2011-06-10 2012-01-04 东莞市远大光电科技有限公司 贴片式led室外屏幕
CN203322878U (zh) * 2013-06-07 2013-12-04 深圳市昌宇科技有限公司 一种led投光灯
CN205122632U (zh) * 2014-11-07 2016-03-30 兆光科技有限公司 室外smd led以及室外smd led显示器

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278890A (ja) * 1985-10-01 1987-04-11 Ricoh Co Ltd ドツトアレイデバイス
US5050604A (en) 1989-10-16 1991-09-24 Israel Reshef Apparatus and method for monitoring the health condition of a subject
DE4002801C1 (zh) 1990-01-31 1991-04-11 Texas Instruments Deutschland Gmbh, 8050 Freising, De
JPH0511714A (ja) * 1991-06-28 1993-01-22 Takiron Co Ltd ドツトマトリクス発光表示体及びその製造方法
US6087930A (en) 1994-02-22 2000-07-11 Computer Methods Corporation Active integrated circuit transponder and sensor apparatus for transmitting vehicle tire parameter data
GB2308947A (en) 1996-01-04 1997-07-09 I D Systems Ltd Identification tag with environmental sensing facility
US6437692B1 (en) 1998-06-22 2002-08-20 Statsignal Systems, Inc. System and method for monitoring and controlling remote devices
US6617963B1 (en) * 1999-02-26 2003-09-09 Sri International Event-recording devices with identification codes
TW425672B (en) * 1999-05-06 2001-03-11 United Microelectronics Corp Forming HV-CMOS with grading doping electrode
DE10220171A1 (de) 2002-05-06 2003-11-27 K-Jump Health Co Elektronisches Patch Thermometer
US6847912B2 (en) * 2002-05-07 2005-01-25 Marconi Intellectual Property (Us) Inc. RFID temperature device and method
CA2387106A1 (en) 2002-05-21 2003-11-21 Information Mediary Corporation Method for measuring temperature using a remote, passive, calibrated rf/rfid tag including a method for calibration
US7256695B2 (en) 2002-09-23 2007-08-14 Microstrain, Inc. Remotely powered and remotely interrogated wireless digital sensor telemetry system
DE10258670A1 (de) 2002-12-13 2004-06-24 Giesecke & Devrient Gmbh Transponder zur berührungslosen Übertragung von Daten
FR2849764B1 (fr) 2003-01-14 2012-12-14 Oreal Dispositif et procede visant notamment a evaluer l'hydratation de la peau ou des muqueuses
US7148803B2 (en) 2003-10-24 2006-12-12 Symbol Technologies, Inc. Radio frequency identification (RFID) based sensor networks
US7463142B2 (en) 2003-12-30 2008-12-09 Kimberly-Clark Worldwide, Inc. RFID system and method for tracking environmental data
KR100814545B1 (ko) 2004-01-27 2008-03-17 알티베라, 엘엘씨 진단 라디오 주파수 식별 센서 및 그 애플리케이션
JP2006085411A (ja) * 2004-09-16 2006-03-30 Hitachi Ltd トランスポンダ及びそのトランスポンダを用いたセンサ測定システム
WO2006081693A1 (de) 2005-02-02 2006-08-10 Plantcare Ag Vorrichtung zur messung thermischer eigenschaften in einem medium und verfahren zur bestimmung von feuchtigkeit im medium
US7383072B2 (en) 2005-05-09 2008-06-03 P. J. Edmonson Ltd Sweat sensor system and method of characterizing the compositional analysis of sweat fluid
KR20080017460A (ko) 2005-06-08 2008-02-26 파워캐스트 코포레이션 Ｒｆ 에너지 하베스팅을 이용하여 디바이스에 전력을공급하는 장치 및 방법
US9564070B2 (en) * 2006-10-05 2017-02-07 GE Lighting Solutions, LLC LED backlighting system for cabinet sign
US7629184B2 (en) * 2007-03-20 2009-12-08 Tokyo Electron Limited RFID temperature sensing wafer, system and method
JP4910967B2 (ja) 2007-10-03 2012-04-04 ソニー株式会社 非接触通信装置用アンテナ基板および非接触通信装置
US20100212198A1 (en) * 2007-10-22 2010-08-26 Hideto Matsunaga Surface emitter and internally illuminated sign incorporating the same
US8406865B2 (en) 2008-09-30 2013-03-26 Covidien Lp Bioimpedance system and sensor and technique for using the same
JP2010286600A (ja) * 2009-06-10 2010-12-24 Amcrew Co Ltd 両面発光体並びにこれを組み込んで成る両面広告型内照式看板
JP5358332B2 (ja) 2009-07-23 2013-12-04 テルモ株式会社 体温測定システム及びデータ読み取り装置ならびにその駆動制御方法
TWI408372B (zh) 2009-08-14 2013-09-11 Univ Chung Hua 應用無線射頻識別標籤技術之熱氣泡式加速儀及其製備方法
RU2403561C1 (ru) 2009-10-21 2010-11-10 Шлюмберже Текнолоджи Б.В. Способ определения тепловых свойств твердых тел и устройство для его реализации
TW201123125A (en) * 2009-12-21 2011-07-01 Aussmak Optoelectronic Corp Light transmissible display apparatus
US8930147B2 (en) 2010-02-05 2015-01-06 Prima-Temp, Inc. Multi-sensor patch and system
JP5697233B2 (ja) 2010-09-16 2015-04-08 東日本旅客鉄道株式会社 環境情報計測装置、環境情報計測システム、及び環境情報計測方法
JP2013541220A (ja) * 2010-10-27 2013-11-07 コーニンクレッカ フィリップス エヌ ヴェ 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法
US20120153311A1 (en) * 2010-12-17 2012-06-21 Intematix Corporation Low-cost solid-state based light emitting devices with photoluminescent wavelength conversion and their method of manufacture
AU2011357590B2 (en) 2011-01-28 2015-09-24 Bluechiip Pty Ltd Temperature sensing and heating device
JP2012164742A (ja) * 2011-02-04 2012-08-30 Showa Denko Kk 照明装置および照明装置の製造方法
CN102170295A (zh) 2011-04-21 2011-08-31 惠州Tcl移动通信有限公司 Nfc功能与fm-tm发送功能共用天线的移动终端
WO2013051121A1 (ja) 2011-10-05 2013-04-11 富士通株式会社 Ｒｆｉｄタグ、及び、ヒューズ
US9151741B2 (en) 2011-11-02 2015-10-06 Avery Dennison Corporation RFID-based devices and methods for initializing a sensor
US20160042213A1 (en) 2012-02-15 2016-02-11 Gema Touch, Inc. RFID User Input Device with One or More Integrated Circuits for Use with an RFID System
EP2645091B1 (en) 2012-03-30 2018-10-17 ams international AG Integrated circuit comprising a gas sensor
US20130265775A1 (en) * 2012-04-06 2013-10-10 Glenn Freeman Supporter for Use During the Overmolding of a Light Engine
JP5798974B2 (ja) 2012-04-13 2015-10-21 株式会社ユニバーサルエンターテインメント 識別情報アクセス装置
CN102682675A (zh) * 2012-06-04 2012-09-19 蒋晓东 Led 显示板新型防水结构
US9220416B2 (en) 2012-06-22 2015-12-29 Microsoft Technology Licensing, Llc Heat flux balanced thermometer for measuring human core temperature
CN104937656B (zh) * 2012-12-10 2018-10-12 达科电子股份有限公司 显示模块上的发光元件的封装
CN103022325B (zh) * 2012-12-24 2016-01-20 佛山市香港科技大学Led-Fpd工程技术研究开发中心 应用远距式荧光粉层的led封装结构及其制成方法
TW201433214A (zh) 2013-02-01 2014-08-16 Primax Electronics Ltd 無線發熱裝置以及無線發熱系統
CN103426379B (zh) * 2013-09-05 2016-04-06 张金枝 一种高像素密度led显示屏面板及其制作方法
WO2015152568A1 (ko) * 2014-04-04 2015-10-08 송창환 연성 led 광원 패널 및 이를 이용한 영상 촬영용 연성 ｌｅｄ 조명 장치
JP6418812B2 (ja) * 2014-06-30 2018-11-07 三菱電機株式会社 表示装置
CN106575369B (zh) 2014-07-31 2019-09-13 3M创新有限公司 柔性基底上的rfid标签
WO2016018585A1 (en) 2014-07-31 2016-02-04 3M Innovative Properties Company Rfid tag on stretchable substrate
WO2016073408A1 (en) 2014-11-07 2016-05-12 3M Innovative Properties Company Wireless sensing system using sensing device with excitation element
CN107077632B (zh) 2014-11-07 2018-12-14 3M创新有限公司 具有多个天线、ic和/或感测元件的标签组件
WO2016073344A1 (en) 2014-11-07 2016-05-12 3M Innovative Properties Company Wireless sensing devices and method for detecting hydration
EP3215985B1 (en) 2014-11-07 2019-07-03 3M Innovative Properties Company Wireless sensor for thermal property with thermal source

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101021982A (zh) * 2006-12-20 2007-08-22 株式会社大韩电光 使用芯片型led模块的室外型电光板
CN201274137Y (zh) * 2008-08-27 2009-07-15 深圳市大眼界光电科技有限公司 一种贴片式led户外显示屏
CN201331899Y (zh) * 2008-12-10 2009-10-21 康佳集团股份有限公司 户外smd的led显示屏的改良结构
CN201584129U (zh) * 2010-01-12 2010-09-15 深圳市愿景光电子有限公司 一种防水的led显示模组
CN202102655U (zh) * 2011-06-10 2012-01-04 东莞市远大光电科技有限公司 贴片式led室外屏幕
CN203322878U (zh) * 2013-06-07 2013-12-04 深圳市昌宇科技有限公司 一种led投光灯
CN205122632U (zh) * 2014-11-07 2016-03-30 兆光科技有限公司 室外smd led以及室外smd led显示器

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