CN105567143A - 一种集成电路封口胶剂 - Google Patents

一种集成电路封口胶剂 Download PDF

Info

Publication number
CN105567143A
CN105567143A CN201610039675.6A CN201610039675A CN105567143A CN 105567143 A CN105567143 A CN 105567143A CN 201610039675 A CN201610039675 A CN 201610039675A CN 105567143 A CN105567143 A CN 105567143A
Authority
CN
China
Prior art keywords
parts
integrated circuit
unicircuit
epoxy resin
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610039675.6A
Other languages
English (en)
Inventor
杨梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangxi University
Original Assignee
Guangxi University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangxi University filed Critical Guangxi University
Priority to CN201610039675.6A priority Critical patent/CN105567143A/zh
Publication of CN105567143A publication Critical patent/CN105567143A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)

Abstract

一种集成电路封口胶剂，包括环氧树脂100～120份、聚酯30～50份、改性剂25～40份、固化剂20～35份、填料15～25份、邻苯二甲酸二丁酯10～15份、硅烷偶联剂6～12份、环氧促进剂6～12份。本发明具有良好的粘性，材料污染小，加入的改性剂、填料能使得环氧树脂胶剂具有更好的耐热、耐腐蚀、稳定性、电绝缘性能，在集成电路中，能够抵抗高温情况，也能在温度变化中保持稳定，提高了集成电路的使用寿命。

Description

一种集成电路封口胶剂
技术领域
本发明涉及封口胶制品，特别涉及一种集成电路封口胶剂。
背景技术
集成电路是一种微型电子器件或部件。采用一定的工艺，把一个电路中所需的晶体管、电阻、电容和电感等元件及布线互连一起，制作在一小块或几小块半导体晶片或介质基片上，然后封装在一个管壳内，成为具有所需电路功能的微型结构，当今半导体工业大多数应用的是基于硅的集成电路。集成电路具有体积小，重量轻，引出线和焊接点少，寿命长，可靠性高，性能好等优点，同时成本低，便于大规模生产。用集成电路来装配电子设备，其装配密度比晶体管可提高几十倍至几千倍，设备的稳定工作时间也可大大提高。
集成电路的粘合对集成电路的性能、寿命起着重要影响，封口胶的作用是能够稳固的固定和填充各部件之间缝隙，要求具有一定的粘附性、耐温性、稳定性、韧性和一定的电绝缘性能。现有的集成电路封口胶剂使用寿命不长，耐温性、稳定性和电绝缘性难以同时达到要求，难以在温度变化中保存稳定。
发明内容
一种集成电路封口胶剂，包括环氧树脂100～120份、聚酯30～50份、改性剂25～40份、固化剂20～35份、填料15～25份、邻苯二甲酸二丁酯10～15份、硅烷偶联剂6～12份、环氧促进剂6～12份。
进一步，所述的改性剂为酚醛树脂、有机硅环氧树脂、有机硅聚酯改性树脂、环氧改性有机硅树脂的一种或几种。
酚醛树脂也叫电木，又称电木粉。耐弱酸和弱碱，不溶于水，溶于丙酮、酒精等有机溶剂中，酚醛树脂最重要的特征就是耐高温性，即使在非常高的温度下，也能保持其结构的整体性和尺寸的稳定性，可改善环氧树脂胶剂的耐温及耐腐蚀性能。
有机硅环氧树脂，既具有有机硅聚合物的耐热性和耐水性，又保持了环氧树脂高的粘接强度。
有机硅环氧树脂、有机硅聚酯改性树脂、环氧改性有机硅树脂可改善环氧树脂胶剂的耐热性能。
进一步，所述的固化剂为乙二胺、二乙基三胺、三乙烯四胺、二丙烯三胺、二甲氨基环己烷的一种或几种。
进一步，所述的填料为钛白粉、滑石粉、二氧化硅、氧化铝的一种或几种。所述钛白粉为金红石钛白粉，氧化钛的三种同分异构体中只有金红石型最稳定，天然板钛矿在650℃以上即转换为金红石型，锐钛矿在915℃左右也能转变呈金红石型，金红石型二氧化钛的熔点为1850℃，属于热稳定性好的物质。
所述二氧化硅为纳米二氧化硅，可提高环氧树脂胶剂的硬度、降低收缩率防止变形、提高耐磨性能、增加绝缘性。
滑石粉具有润滑性、耐火性、抗酸性、绝缘性、熔点高、化学性不活泼、遮盖力良好、光泽好、吸附力强等优良的物理、化学特性。
本发明具有的有益效果为：
本发明的一种集成电路封口胶剂，具有良好的粘性，材料污染小，加入的改性剂、填料能使得环氧树脂胶剂具有更好的耐热、耐腐蚀、稳定性、电绝缘性能，在集成电路中，能够抵抗高温情况，也能在温度变化中保持稳定，提高了集成电路的使用寿命。
具体实施方式
实施例1
一种集成电路封口胶剂，包括环氧树脂110份、聚酯40份、酚醛树脂15份、有机硅环氧树脂10份、有机硅聚酯改性树脂10份、二甲氨基环己烷15份、二乙基三胺10份、钛白粉5份、滑石粉10份、二氧化硅5份、邻苯二甲酸二丁酯10份、硅烷偶联剂8份、环氧促进剂9份。
实施例2
一种集成电路封口胶剂，包括环氧树脂108份、聚酯47份、酚醛树脂8份、有机硅环氧树脂13份、有机硅聚酯改性树脂13份、乙二胺17份、二乙基三胺12份、钛白粉9份、滑石粉4份、二氧化硅12份、邻苯二甲酸二丁酯14份、硅烷偶联剂9份、环氧促进剂11份。
实施例3
一种集成电路封口胶剂，包括环氧树脂107份、聚酯32份、有机硅聚酯改性树脂16份、环氧改性有机硅树脂12份、二乙基三胺11份、二丙烯三胺14份、氧化铝19份、邻苯二甲酸二丁酯14份、硅烷偶联剂7份、环氧促进剂7份。

Claims (4)

1.一种集成电路封口胶剂，其特征在于，包括环氧树脂100～120份、聚酯30～50份、改性剂25～40份、固化剂20～35份、填料15～25份、邻苯二甲酸二丁酯10～15份、硅烷偶联剂6～12份、环氧促进剂6～12份。
2.根据权利要求1的一种集成电路封口胶剂，其特征在于，所述的改性剂为酚醛树脂、有机硅环氧树脂、有机硅聚酯改性树脂、环氧改性有机硅树脂的一种或几种。
3.根据权利要求1的一种集成电路封口胶剂，其特征在于，所述的固化剂为乙二胺、二乙基三胺、三乙烯四胺、二丙烯三胺、二甲氨基环己烷的一种或几种。
4.根据权利要求1的一种集成电路封口胶剂，其特征在于，所述的填料为钛白粉、滑石粉、二氧化硅、氧化铝的一种或几种。
CN201610039675.6A 2016-01-21 2016-01-21 一种集成电路封口胶剂 Pending CN105567143A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610039675.6A CN105567143A (zh) 2016-01-21 2016-01-21 一种集成电路封口胶剂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610039675.6A CN105567143A (zh) 2016-01-21 2016-01-21 一种集成电路封口胶剂

Publications (1)

Publication Number Publication Date
CN105567143A true CN105567143A (zh) 2016-05-11

Family

ID=55877800

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610039675.6A Pending CN105567143A (zh) 2016-01-21 2016-01-21 一种集成电路封口胶剂

Country Status (1)

Country Link
CN (1) CN105567143A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106280260A (zh) * 2016-08-24 2017-01-04 深圳芯启航科技有限公司 一种平整封装传感器的工艺
CN109571289A (zh) * 2018-12-29 2019-04-05 江苏华东砂轮有限公司 一种改性酚醛树脂结合剂的制备工艺及应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103642443A (zh) * 2013-12-05 2014-03-19 陈顺美 厚膜电路封口用胶粘剂

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103642443A (zh) * 2013-12-05 2014-03-19 陈顺美 厚膜电路封口用胶粘剂

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106280260A (zh) * 2016-08-24 2017-01-04 深圳芯启航科技有限公司 一种平整封装传感器的工艺
CN106280260B (zh) * 2016-08-24 2019-05-14 深圳芯启航科技有限公司 一种平整封装传感器的工艺
CN109571289A (zh) * 2018-12-29 2019-04-05 江苏华东砂轮有限公司 一种改性酚醛树脂结合剂的制备工艺及应用

Similar Documents

Publication Publication Date Title
KR101831573B1 (ko) 봉지용 수지 조성물, 차재용 전자 제어 유닛의 제조 방법, 및 차재용 전자 제어 유닛
JP6794626B2 (ja) 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
WO2015037349A1 (ja) 半導体装置
JP5393207B2 (ja) 半導体装置
WO2012070529A1 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
TW201810452A (zh) 半導體密封用環氧樹脂組成物及半導體裝置
WO2006075599A1 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5391530B2 (ja) 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
CN105567143A (zh) 一种集成电路封口胶剂
JP7126186B2 (ja) 封止用樹脂組成物、その硬化物、及び半導体装置
JP7301492B2 (ja) 樹脂組成物の製造方法
JP2022003130A (ja) 封止用樹脂組成物、半導体装置、及び半導体装置の製造方法
JP2011100757A (ja) 電子部品及びその製造方法
JP2011096940A (ja) 繊維強化型樹脂ケース、その製造方法及び電子部品収納用中空樹脂パッケージ装置
TWI611532B (zh) 半導體裝置
KR102184233B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
JP2006206827A (ja) 液状封止用エポキシ樹脂組成物及び半導体装置
JP6885068B2 (ja) 封止用樹脂組成物および半導体装置
JP4802619B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2022098698A (ja) 樹脂組成物およびパワーモジュール
US20230411229A1 (en) Semiconductor device
US11462450B2 (en) Semiconductor device
US20220310548A1 (en) Semiconductor element bonding portion and semiconductor device
JP5056620B2 (ja) 配線板
CN113242884B (zh) 导热封装组合物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160511