CN105551376B - A kind of manufacture method of composite LED glass base plane - Google Patents
A kind of manufacture method of composite LED glass base plane Download PDFInfo
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- CN105551376B CN105551376B CN201410597038.1A CN201410597038A CN105551376B CN 105551376 B CN105551376 B CN 105551376B CN 201410597038 A CN201410597038 A CN 201410597038A CN 105551376 B CN105551376 B CN 105551376B
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Abstract
The present invention relates to a kind of manufacture method of composite LED glass base plane, including：Prepare glass substrate；There are multiple matrix grooves at equal intervals on glass substrate；The exiting surface of a variety of monochromatic LED chips is affixed on the first lining paper respectively and is classified respectively；Reverse mould is carried out respectively to a variety of monochromatic LED chips after classification, the electrode side of a variety of monochromatic LED chips is affixed on respectively on multiple second lining papers；Then reverse mould is distinguished again to the 3rd lining paper；Spread sheet operation is carried out to the 3rd lining paper, it is equal with the spacing dimension of the matrix groove to the spacing between a variety of monochromatic LED chips for carrying；A variety of monochromatic LED chips on 3rd lining paper are loaded into matrix groove；Positioning hot pressing is carried out to glass substrate and a variety of monochromatic LED chips, glass substrate is in molten state, after the cooling period, a variety of monochromatic LED chips to be flush-mounted in the matrix groove of glass substrate；Polishing is ground to first surface；Composite LED glass base plane is made after annealing.
Description
Technical field
The present invention relates to semiconductor applications, more particularly to a kind of manufacture method of composite LED glass base plane.
Background technology
Has there is bottleneck in high density field in traditional LED display technique, because being limited by the conventional junction of LED light source
Structure, while the driving capacity of the material structure, for example encapsulation of traditional constant-current source involved by the module of processing is integrated after being limited by
And structure, the thermally labile sex chromosome mosaicism and flatness intensity of the integrated finished product that the loose material of traditional FR4 circuit boards is brought
Problem, and the injection mask required for giant-screen and the integrity problem of plastic housing etc. are spliced into for installation, all seriously limit
Breakthrough of the LED display technique in high density field.
Therefore, how to realize in a kind of high density field show suitable for LED can low cost, meet large scale splicing
The LED display panel needed, it is urgent problem to be solved.
The content of the invention
In view of this, the invention provides a kind of manufacture method of composite LED glass base plane, the letter of methods described technique
Single, cost is low, the needs of large scale splicing is disclosure satisfy that, suitable for large-scale production and application.
In a first aspect, the invention provides a kind of manufacture method of composite LED glass base plane, including：
Prepare glass substrate；There is multiple matrix grooves at equal intervals, the matrix on the first surface of the glass substrate
Length and width, depth, the spacing dimension of groove are all equal respectively；
The exiting surface of a variety of monochromatic LED chips is affixed on multiple first lining papers respectively；
A variety of monochromatic LED chips are classified respectively；
Reverse mould is carried out respectively to a variety of monochromatic LED chips after classification；After the reverse mould, a variety of monochromatic LEDs are brilliant
The electrode side of piece is affixed on multiple second lining papers respectively；
The a variety of monochromatic LED chips carried respectively on multiple second lining papers are distinguished to reverse mould again to same 3rd lining paper；
Spread sheet operation is carried out to the 3rd lining paper, between a variety of monochromatic LED chips for being carried on the 3rd lining paper
Spacing is equal with the spacing dimension of the matrix groove；
A variety of monochromatic LED chips on 3rd lining paper are loaded into the matrix groove；
Positioning hot pressing is carried out to the glass substrate and a variety of monochromatic LED chips, the glass substrate is in molten
Melt state, after the cooling period, a variety of monochromatic LED chips to be flush-mounted in the matrix groove of the glass substrate；
After cooling, polishing is ground to the first surface；
After annealing, the composite LED glass base plane is made.
Preferably, the monochromatic LED chip is trapezoidal chip.
Preferably, after the annealing, methods described also includes：
The composite LED glass base plane is cleaned and dried and tested.
Preferably, a variety of monochromatic LED chips include：Red LED chip, green LED chip and blue led chip.
A kind of manufacture method of composite LED glass base plane of the present invention, technique is simple, and cost is low, disclosure satisfy that big chi
The needs of very little splicing, suitable for large-scale production and application.
Brief description of the drawings
Fig. 1 is a kind of manufacture method flow chart of composite LED glass base plane provided in an embodiment of the present invention；
Fig. 2 is one of preparation process schematic diagram of composite LED glass base plane provided in an embodiment of the present invention；
Fig. 3 is the two of the preparation process schematic diagram of composite LED glass base plane provided in an embodiment of the present invention；
Fig. 4 is the three of the preparation process schematic diagram of composite LED glass base plane provided in an embodiment of the present invention；
Fig. 5 is the four of the preparation process schematic diagram of composite LED glass base plane provided in an embodiment of the present invention；
Fig. 6 is the five of the preparation process schematic diagram of composite LED glass base plane provided in an embodiment of the present invention；
Fig. 7 is the six of the preparation process schematic diagram of composite LED glass base plane provided in an embodiment of the present invention；
Fig. 8 is the seven of the preparation process schematic diagram of composite LED glass base plane provided in an embodiment of the present invention.
Below by drawings and examples, technical scheme is described in further detail.
Embodiment
The preparation method of the composite LED glass base plane of the present invention, is mainly used in LED display, extra small spacing LED is shown
Screen, VHD LED display, the just luminous TVs of LED, the just luminous monitors of LED, LED video walls, LED instructions, LED are special
The display panel manufacture in the fields such as illumination.
Fig. 1 is the preparation method flow chart of composite LED glass base plane provided in an embodiment of the present invention.Fig. 2-Fig. 8 is this
The preparation process schematic diagram of the composite LED glass base plane of inventive embodiments, below with Fig. 1 and with reference to Fig. 2-Fig. 8 to the present invention
Preparation method illustrate.
As shown in figure 1, the preparation method of composite LED glass base plane provided in an embodiment of the present invention comprises the following steps：
Step 110, glass substrate is prepared；
Specifically, being machined to the glass substrate with optical clarity, square is carried out according to the size set
Battle array groove makes.Multiple matrix grooves are formed by being machined in the one side of glass template, sectional view is as shown in Fig. 2 each square
Spacing between battle array groove is all equal, and the groove depth and length, width dimensions of each matrix groove are also equal respectively.
Step 120, the exiting surface of a variety of monochromatic LED chips is affixed on multiple first lining papers respectively；
Specifically, a variety of monochromatic LED chips prepared are attached to chip (wafer) lining respectively according to different colours
On paper, wherein wafer lining papers are sticked on the exiting surface of LED wafer, as shown in Figure 3.The monochromatic LED chip is preferably trapezoidal
Chip, the color of LED wafer can select any color, in this example as depicted, a variety of monochromatic LED chips as needed
Including：Red LED chip, green LED chip and blue led chip.
Step 130, a variety of monochromatic LED chips are classified respectively；
Specifically, the electrical measurement mode surveyed using pin, to parameters such as the forward voltage of LED wafer, light intensity, optical wavelength, electric leakages
Classified, inhomogeneity sorts out, and is attached to respectively on different wafer lining papers.The LED of different stage for sorting out is brilliant
Piece, it can subsequently carry out cross arrangement so that display effect is more preferably uniform, or according to demand, for a display panel
The LED wafer of same rank is only selected, to obtain more preferable display effect.
Step 140, reverse mould is carried out respectively to a variety of monochromatic LED chips after classification；After reverse mould, a variety of monochromatic LEDs
The electrode side of chip is affixed on multiple second lining papers respectively；
Specifically, as shown in figure 4, paste the LED wafer on wafer lining papers for exiting surface carries out a reverse mould again,
Make exiting surface upward, electrode side is pasted on another wafer lining paper.This step is carried out respectively for the LED wafer of multiple color
Rapid operation.
Step 150, a variety of monochromatic LED chips carried respectively on multiple second lining papers are distinguished to reverse mould again to the same 3rd
On lining paper；
Specifically, above-mentioned a variety of monochromatic LED chips are used into special-purpose multifunctional reverse mould technique, reverse mould can to same respectively
On the lining paper of spread sheet, red+green+blueness (R+G+B) cell array is formed, as shown in Figure 5.Spread sheet lining paper can be in each side
Stretched, after being mounted on spread sheet lining paper, original lining paper is removed upwards.
Step 160, spread sheet operation is carried out to the 3rd lining paper, to a variety of monochromatic LEDs crystalline substance carried on the 3rd lining paper
Spacing between piece is equal with the spacing dimension of the matrix groove；
Specifically, stretching spread sheet lining paper, carry out precisely expanding crystalline substance so that multiple LED wafers of R+G+B cell arrays
Between line space and column pitch all increase, until spacing between each matrix groove matches, as indicated with 6.
Step 170, a variety of monochromatic LED chips on the 3rd lining paper are loaded into the matrix groove；
Specifically, the LED wafer being inverted on spread sheet lining paper can be fitted into matrix groove using stylus printing mode.Or
Person, can also use conventional bonder mode etc., and LED wafer is moved into matrix groove.As shown in Figure 7.
Step 180, positioning hot pressing is carried out to the glass substrate and a variety of monochromatic LED chips, makes the glass base
Plate is in molten state, after the cooling period, a variety of monochromatic LED chips to be flush-mounted in the matrix groove of the glass substrate；
Specifically, carry out positioning hot pressing to the glass substrate for loading LED wafer, temperature control is in molten state making glass
Temperature.In high temperature hot pressing process, glass is set to be in molten state, so as to be engaged with LED wafer.Meanwhile in heat
During pressure, each LED wafer is also at precompressed positioning states.As shown in Figure 8.
Step 190, after cooling, polishing is ground to the first surface, after annealing, the composite LED glass is made
Base plane.
Specifically, after cooling, each LED wafer is just fixed on the square of glass substrate by the glass solidified again from molten state
Battle array groove suffers.
After annealing, it is also necessary to which composite LED glass base plane is cleaned and dried and tested.
The manufacture method of composite LED glass base plane provided in an embodiment of the present invention, by the reverse mould on lining paper twice,
By on the LED wafer reverse mould of multiple color to same spread sheet lining paper, cell array is formed, is reloaded into the matrix groove of glass substrate
In, by applying high temperature hot pressing to glass substrate, in the glass substrate for making chip insertion molten state, then cool down, that is, obtain compound
LED glass base planes.The manufacture method of the composite LED glass base plane of the present invention, technique is simple, and cost is low, disclosure satisfy that big
The needs of size splicing, suitable for large-scale production and application.
Above-described embodiment, the purpose of the present invention, technical scheme and beneficial effect are carried out further
Describe in detail, should be understood that the embodiment that the foregoing is only the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution and improvements done etc., all should include
Within protection scope of the present invention.
Claims (4)
1. a kind of manufacture method of composite LED glass base plane, it is characterised in that methods described includes：
Prepare glass substrate；There are multiple matrix grooves at equal intervals on the first surface of the glass substrate, the matrix groove
Length and width, depth, spacing dimension are all equal respectively；
The exiting surface of every kind of monochromatic LED chip is affixed on first lining paper respectively；
A variety of monochromatic LED chips are classified respectively；
Reverse mould is carried out respectively to a variety of monochromatic LED chips after classification；After reverse mould, the electrode side of a variety of monochromatic LED chips
It is affixed on respectively on multiple second lining papers；
The a variety of monochromatic LED chips carried respectively on multiple second lining papers are distinguished to reverse mould again to same 3rd lining paper；
Spread sheet operation is carried out to the 3rd lining paper so that the spacing between a variety of monochromatic LED chips carried on the 3rd lining paper
It is equal with the spacing of the matrix groove；
A variety of monochromatic LED chips on 3rd lining paper are loaded into the matrix groove；
Positioning hot pressing is carried out to the glass substrate and a variety of monochromatic LED chips, the glass substrate is in molten state,
After the cooling period, a variety of monochromatic LED chips to be flush-mounted in the matrix groove of the glass substrate；
After cooling, polishing is ground to the first surface；
After annealing, the composite LED glass base plane is made.
2. manufacture method according to claim 1, it is characterised in that the monochromatic LED chip is trapezoidal chip.
3. manufacture method according to claim 1, it is characterised in that after the annealing, methods described also includes：
The composite LED glass base plane is cleaned and dried and tested.
4. manufacture method according to claim 1, it is characterised in that a variety of monochromatic LED chips include：Red LED
Chip, green LED chip and blue led chip.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410597038.1A CN105551376B (en) | 2014-10-30 | 2014-10-30 | A kind of manufacture method of composite LED glass base plane |
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| CN201410597038.1A CN105551376B (en) | 2014-10-30 | 2014-10-30 | A kind of manufacture method of composite LED glass base plane |
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| CN105551376A CN105551376A (en) | 2016-05-04 |
| CN105551376B true CN105551376B (en) | 2018-02-23 |
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| CN106097912B (en) * | 2016-08-05 | 2019-01-25 | 环视先进数字显示无锡有限公司 | The manufacturing method and display module of a kind of micron of LED glass substrate display module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931320A (en) * | 2012-11-13 | 2013-02-13 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | White light light-emitting diode (LED) approximate shape-preserving packaging structure and preparation method thereof |
| CN102983127A (en) * | 2012-12-06 | 2013-03-20 | 鹤山丽得电子实业有限公司 | LED composite chip, processing method and display screen using composite chip |
| CN103544895A (en) * | 2013-11-01 | 2014-01-29 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display module and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3517700B2 (en) * | 1996-10-30 | 2004-04-12 | 日本航空電子工業株式会社 | Surface type optical element and method of manufacturing the same |
| US8933433B2 (en) * | 2012-07-30 | 2015-01-13 | LuxVue Technology Corporation | Method and structure for receiving a micro device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931320A (en) * | 2012-11-13 | 2013-02-13 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | White light light-emitting diode (LED) approximate shape-preserving packaging structure and preparation method thereof |
| CN102983127A (en) * | 2012-12-06 | 2013-03-20 | 鹤山丽得电子实业有限公司 | LED composite chip, processing method and display screen using composite chip |
| CN103544895A (en) * | 2013-11-01 | 2014-01-29 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display module and manufacturing method thereof |
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Effective date of registration: 20160804 Address after: 214100, Jiangsu, Wuxi Province, high road, Binhu District No. 999 (software R & D building) Applicant after: Look around the advanced digital display Wuxi Co. Ltd. Address before: 100097 room B1F, unit four, building No. three, Far East Road, Haidian District, Beijing Applicant before: Cheng Jun Applicant before: Yan Min Applicant before: Zhou Mingbo |
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