CN201100621Y

CN201100621Y - LCD LED backlight source heat radiator

Info

Publication number: CN201100621Y
Application number: CNU2007200759879U
Authority: CN
Inventors: 张克然; 严华锋; 李松
Original assignee: SVA Group Co Ltd
Current assignee: SVA Group Co Ltd
Priority date: 2007-11-26
Filing date: 2007-11-26
Publication date: 2008-08-13
Anticipated expiration: 2017-11-26

Abstract

The utility model discloses an LED backlight heat radiation device of an LCD, which comprises a heat radiating base plate and a plurality of heat radiating fins installed on the heat radiating base plate. A plurality of pyramid trapezoid shaped grooves are opened on the heat radiating base plate, and the heat radiating fin is provided with a trapezoid shaped bottom portion which is engaged with the heat radiating base plate, then the trapezoid shaped bottom portion of the heat radiating fin is located in the trapezoid shaped groove of the heat radiating base plate, further the heat radiating fin is capable of being slid in the trapezoid shaped groove on the heat radiating base plate, and each trapezoid shaped groove is provided with one or a plurality of heat radiating fins. The LED backlight heat radiation device of the LCD has the advantages of simple structure and convenient installation, further the evenness of the backlight temperature is tremendously improved, and the evenness of the high-luminance color of the front picture is also improved.

Description

LCD LED-backlit source heat-dissipating device

Technical field

The utility model relates to a kind of LCD LED (Light Emitting Diode, light emitting diode) backlight, particularly a kind of LCD LED-backlit source heat-dissipating device.

Background technology

LCD use LED-backlit source is a focus in recent years.The LED-backlit source has environmental protection, volume is little, the life-span is long, drives easily, few or the like the characteristics of power consumption.In recent years, adopt the direct-light-type backlight of high-luminous-efficiency LED to be used for the large scale liquid crystal TV more, the large scale liquid crystal TV is had higher requirement for the YC stability of backlight, and according to TCO ' 05 standard, general backlight colo(u)r bias requires Δ u ' v '＜0.01.

Usually, temperature can produce directly influence to the emission wavelength of LED, and the temperature difference can make the emission wavelength of identical LED different different with decay property, thereby it is different with decay property that chroma offset takes place, and forms colo(u)r bias.In recent years, increasing LED packaged chip is used in large scale LED-backlit source, the junction temperature characteristic of the LED packaged chip of different stage is all different with light characteristic, and therefore in the course of the work, the temperature homogeneity of backlight source module has directly determined its YC uniformity.Generally speaking, surpassing under 40 ℃ the situation in backlight source module, aberration will surpass 0.01, meanwhile, As time goes on, in the process of backlight work, owing to the different aberration that produce of led chip decay separately, the work above 2 hours will produce and surpass 0.01 aberration.

Therefore temperature is very crucial for the display quality in LED-backlit source, and in recent years, along with the LCD TV size increases, the corresponding backlight Source size increases, and direct LED backlight temperature inhomogeneity problem is also more and more outstanding.Large scale LED-backlit source is because its large scale structure, therefore heat-radiating substrate top and the bottom uneven temperature problem also highlights, in general because factors such as heat radiation cross-ventilations, the temperature on substrate top always is greater than the temperature of bottom, as on the thick substrate of 2mm, the temperature on substrate top is than nearly 10 ℃ of the temperature contrasts of bottom.

Usually, in the back in LED-backlit source the temperature that heat abstractor reduces the LED-backlit source is set, as shown in Figure 1, Fig. 1 is existing LCD LED-backlit source heat-dissipating device schematic diagram, the heat abstractor in LED-backlit source 1 is that certain thickness aluminium base heat-radiating substrate 2 and radiating fin 3 constitute, radiating fin 3 is evenly distributed on the heat-radiating substrate 2, thus the material of radiating fin 3 and structures shape its radiating effect.Usually heat-radiating substrate 2 is thick more, its radiating effect is good more, usually the thick heat-radiating substrate of 10mm can guarantee that heat-radiating substrate top and the bottom temperature contrast is no more than 2 ℃, but the lightening requirement of LCD does not allow to adopt so thick heat-radiating substrate, because such heat abstractor can increase the weight of product weight greatly.Usually adopt at present the heat-radiating substrate of 2mm thickness in the industry, but can cause the temperature deviation that substrate is about up and down 10 ℃ like this, this YC uniformity for the LED-backlit source is very disadvantageous.

Summary of the invention

For addressing the above problem, the utility model provides a kind of LCD LED-backlit source heat-dissipating device, improve LED-backlit source bulk temperature difference by the uneven distribution of radiating fin, guarantee that monoblock module temperature backlight keeps evenly, thereby guarantee the YC uniformity in LED-backlit source.

For achieving the above object, LCD LED-backlit source heat-dissipating device of the present utility model, comprise a heat-radiating substrate and a plurality of radiating fins that are installed on the heat-radiating substrate, offer a plurality of up-narrow and down-wide trapezoidal grooves on the described heat-radiating substrate, described radiating fin have with heat-radiating substrate on the trapezoidal bottom that is complementary of trapezoidal groove, the trapezoidal bottom portion of radiating fin is arranged in the trapezoidal groove on the heat-radiating substrate, radiating fin can slide in the trapezoidal groove on heat-radiating substrate, in described each trapezoidal groove one or more radiating fins can be set.

Described radiating fin is fixed in the trapezoidal groove on the heat-radiating substrate by heat-conducting glue.

The distribution density of radiating fin is greater than the distribution density of radiating fin in low regional of temperature on the described heat-radiating substrate in the zone that temperature is high on described heat-radiating substrate.

The material of described heat-radiating substrate is any one in copper material, aluminium material, alloy material, the ceramic material.

LCD LED-backlit source heat-dissipating device of the present utility model, simple in structure, easy for installation, the backlight temperature homogeneity is improved greatly, can promote the light tone uniformity of front end picture, reach the standard of TCO ' 05.

Description of drawings

Fig. 1 is existing LCD LED-backlit source heat-dissipating device schematic diagram;

Fig. 2 is a LCD LED-backlit source heat-dissipating device schematic perspective view of the present utility model;

Fig. 3 is that the A of LCD LED-backlit source heat-dissipating device among Fig. 2 is to schematic diagram;

Fig. 4 is the exploded sketch of LCD LED-backlit source heat-dissipating device among Fig. 3;

Fig. 5 is the schematic perspective view of radiating fin.

The specific embodiment

Below in conjunction with accompanying drawing the utility model is further described:

Fig. 2 is a LCD LED-backlit source heat-dissipating device schematic perspective view of the present utility model, at the radiator structure that adopts the single uniformity with respect to small size LED-backlit source, front, in the use of large-sized LED-backlit source, limitation is arranged, the utility model is on thin heat-radiating substrate 20, increase some little radiating fins 30, radiating fin 30 can be up and down, radiating fin 30 is intensive in the temperature eminence, promptly encrypt radiating fin 30 than higher place at middle part, heat-radiating substrate 20 tops equitemperature, make the bigger radiating effect of performance, and at the sparse radiating fin 30 of the lower lower area of temperature.

Fig. 3 is that the A of LCD LED-backlit source heat-dissipating device among Fig. 2 is to schematic diagram, Fig. 4 is the exploded sketch of LCD LED-backlit source heat-dissipating device among Fig. 3, as shown in the figure, LCD LED-backlit source heat-dissipating device of the present utility model comprises a heat-radiating substrate 20 and a plurality of radiating fin 30, on heat-radiating substrate 20, offer a plurality of up-narrow and down-wide trapezoidal grooves 21, radiating fin 30 have with heat-radiating substrate 20 on the trapezoidal bottom 31 that is complementary of trapezoidal groove 21, the schematic perspective view of radiating fin 30 is as shown in Figure 5.The trapezoidal bottom 31 of radiating fin 30 is arranged in the trapezoidal groove 21 on the heat-radiating substrate 20, and radiating fin 30 can slide in the trapezoidal groove on the heat-radiating substrate 20 21.In each trapezoidal groove 21 one or more radiating fins 30 can be set.

Radiating fin 30 is fixed in the trapezoidal groove 21 on the heat-radiating substrate 20 by heat-conducting glue, and heat-conducting glue is heated and promptly can expands, and can make radiating fin 30 be stable in the trapezoidal groove 21 on the heat-radiating substrate 20 when being heated.

LCD LED-backlit source heat-dissipating device of the present utility model, passing through Icepak of calorifics simulation software and Qfin, simulate Temperature Distribution on the heat-radiating substrate 20 roughly, because radiating fin 30 can slide in the trapezoidal groove on the heat-radiating substrate 20 21, therefore can regulate the position of radiating fin 30 according to Temperature Distribution easily,, radiating fin is set more in the higher middle and upper part of temperature, and, fewly be provided with or be not provided with radiating fin at the lower area of heat-radiating substrate 20.Substantially do not place radiating fin, institute's spacing can be used for placing the printed circuit board (PCB) of control system.The structure of a kind of inhomogeneous radiating fin of arranging like this, can regulate distribution according to the different LED packaged chip that different batches uses, the radiating effect that performance is maximum, thus guarantee that monoblock backlight source module temperature is even, and the backlight temperature contrast can be contracted in 2 ℃.

The material of heat-radiating substrate 20 is relevant materials with high heat-conducting effect such as copper material, aluminium material, alloy material, ceramic material.The heat-radiating substrate treatment process of this embodiment is simple, easy to assembly, can promote the light tone uniformity of front end picture, reaches the standard of TCO ' 05.

Claims

1, a kind of LCD LED-backlit source heat-dissipating device, comprise a heat-radiating substrate and a plurality of radiating fins that are installed on the heat-radiating substrate, it is characterized in that, offer a plurality of up-narrow and down-wide trapezoidal grooves on the described heat-radiating substrate, described radiating fin have with heat-radiating substrate on the trapezoidal bottom that is complementary of trapezoidal groove, the trapezoidal bottom portion of radiating fin is arranged in the trapezoidal groove on the heat-radiating substrate, radiating fin can slide in the trapezoidal groove on heat-radiating substrate, in described each trapezoidal groove one or more radiating fins can be set.

2, LCD LED-backlit source heat-dissipating device as claimed in claim 1 is characterized in that, described radiating fin is fixed in the trapezoidal groove on the heat-radiating substrate by heat-conducting glue.

3, LCD LED-backlit source heat-dissipating device as claimed in claim 1 is characterized in that, the distribution density of radiating fin is greater than the distribution density of radiating fin in low regional of temperature on the described heat-radiating substrate in the zone that temperature is high on described heat-radiating substrate.

4, LCD LED-backlit source heat-dissipating device as claimed in claim 1 is characterized in that, the material of described heat-radiating substrate is any one in copper material, aluminium material, alloy material, the ceramic material.