CN105789238B - Compound eutectic flip LED organic substrate display module and its manufacturing method - Google Patents
Compound eutectic flip LED organic substrate display module and its manufacturing method Download PDFInfo
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- CN105789238B CN105789238B CN201410810770.2A CN201410810770A CN105789238B CN 105789238 B CN105789238 B CN 105789238B CN 201410810770 A CN201410810770 A CN 201410810770A CN 105789238 B CN105789238 B CN 105789238B
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Abstract
The present invention relates to a kind of compound eutectic flip LED organic substrate display module and its manufacturing methods, this method comprises: preparing electrode on compound eutectic flip LED organic substrate；The compound eutectic flip LED organic substrate includes the flip LED chip of organic substrate, the multiple upside-down mountings being packed into the multiple isolation channels in organic substrate side；Prepare organic laminated circuit board；The first surface of organic laminated circuit board has LED eutectic pad, for welding the LED wafer；The second surface of organic laminated circuit board has multiple ball-like pins grid array BGA soldered balls, for welding integrated circuit discrete device；Compound eutectic flip LED organic substrate, organic laminated circuit board and integrated circuit discrete device are sequentially placed into eutectic mold and fixed, after positioning, the eutectic mold is put into progress eutectic welding in reflow machine, to form the display module.
Description
Technical field
The present invention relates to semiconductor field more particularly to a kind of compound eutectic flip LED organic substrate display module and its
Manufacturing method.
Background technique
Semiconductor display product develops to today, it is matched or intersect industry resource greatly enriched with it is complete
It is kind.
But traditional LED display technique has already appeared bottleneck in high density field.Because being limited by the tradition of LED light source
Structure, while material structure involved in the mould group of processing is integrated after being limited by, for example the driving of traditional constant-current source encapsulation is held
Amount and structure, the loose material bring of traditional FR4PCB plate integrate the thermal instability problem and flatness intensity of finished product
Problem, and be spliced into required for large screen for installation and be molded mask and plastic housing etc., it all seriously limits LED display technique and exists
The breakthrough and application in high density field.
Summary of the invention
In view of this, the present invention provides a kind of compound eutectic flip LED organic substrate display module and its manufacturing method,
The method simple process, be suitable for large-scale production and application, the organic substrate display module being prepared, display effect with it is consistent
Property is good, can satisfy the needs that LED display technique is applied in high density field.
In a first aspect, the present invention provides a kind of manufacturing method of compound eutectic flip LED organic substrate display module, packet
It includes:
Electrode is prepared on compound eutectic flip LED organic substrate；The compound eutectic flip LED organic substrate includes
Machine substrate, the multiple upside-down mountings being packed into the multiple isolation channels in organic substrate side flip LED chip；
Prepare organic laminated circuit board；The first surface of organic laminated circuit board has LED eutectic pad, for welding
Connect the LED wafer；The second surface of organic laminated circuit board has multiple ball-like pins grid array BGA soldered balls, uses
In welding integrated circuit discrete device；
Compound eutectic flip LED organic substrate, organic laminated circuit board and integrated circuit discrete device are sequentially placed into altogether
It is fixed in brilliant mold, after positioning, the eutectic mold is put into progress eutectic welding in reflow machine, to form the display
Mould group.
Preferably, the spacing of the LED wafer and the corresponding BGA for LED eutectic on organic integrated circuit substrate
Pad spacing is consistent.
Preferably, the arrangement and the welding of the integrated circuit discrete device of the BGA soldered ball of organic laminated circuit board
Pin is consistent.
Preferably, the integrated circuit discrete device specifically includes:
Application-specific integrated circuit ASIC or on-site programmable gate array FPGA.
Preferably, the eutectic mold is being put into reflow machine after progress eutectic welding, the method also includes,
Aluminum or ceramic heat-dissipating bracket are mounted in the discrete device side.
Preferably, after the formation display module, the method also includes:
Electrical testing is carried out to the display module.
Preferably, after the formation display module, the method also includes:
Optic test is carried out to the display module.
Second aspect, the embodiment of the invention provides a kind of LED using the preparation of method described in above-mentioned first aspect to have
Machine substrate display module.
The manufacturing method of compound eutectic flip LED organic substrate display module provided by the invention, simple process are suitable for big
Large-scale production application, the multi-colored led display module being prepared, display effect and consistency are good, can satisfy LED display technique
In the needs of high density field application.
Detailed description of the invention
Fig. 1 is the manufacturing method process of compound eutectic flip LED organic substrate display module provided in an embodiment of the present invention
Figure；
Fig. 2 is that the preparation process of compound eutectic flip LED organic substrate display module provided in an embodiment of the present invention is illustrated
One of figure；
Fig. 3 is that the preparation process of compound eutectic flip LED organic substrate display module provided in an embodiment of the present invention is illustrated
The two of figure；
Fig. 4 is the schematic diagram of compound eutectic flip LED organic substrate display module provided in an embodiment of the present invention.
Below by drawings and examples, technical scheme of the present invention will be described in further detail.
Specific embodiment
Compound eutectic flip LED organic substrate display module of the invention and its manufacturing method, are mainly used for LED and show
Screen, extra small space distance LED display screen, ultra high density LED display, the just luminous TV of LED, the just luminous monitor of LED, LED video
Wall, LED indication, the display panel manufacture in the fields such as LED special lighting.
Fig. 1 is the manufacturing method process of compound eutectic flip LED organic substrate display module provided in an embodiment of the present invention
Figure.Fig. 2-Fig. 3 is the preparation process schematic diagram of the compound eutectic flip LED organic substrate display module of the embodiment of the present invention, under
Face is illustrated the manufacturing method of the present invention with Fig. 1 and in conjunction with Fig. 2-Fig. 3.
The manufacturing method of compound eutectic flip LED organic substrate display module provided in an embodiment of the present invention includes following step
It is rapid:
Step 110, electrode is prepared on compound eutectic flip LED organic substrate；
Specifically, as shown in Fig. 2, compound eutectic flip LED organic substrate used by the present embodiment include organic substrate,
It is packed into the LED wafer of multiple upside-down mountings in the multiple isolation channels in organic substrate side；
Wherein, LED wafer can be specially monochromatic or polychrome eutectic flip LED chip, they are solid to melt embedding mode
It is scheduled in the isolation channel of organic substrate.
Multi-colored led chip can be the redgreenblue LED in typical case, and it is multi-colored led to be also possible to other.Each
LED wafer all includes positive electrode and negative electrode, receives LED drive signal by electrode.
Step 120, organic laminated circuit board is prepared；
Specifically, organic laminated substrate refers to the circuit using physical vapor deposition (PVD) and electroplating technology deposit manufacture
Plate, as shown in figure 3, including conducting wire lamination layer and organic lamination insulating layer.Wherein conducting wire lamination layer is for driving letter
Number transmission, and organic lamination insulating layer is for the isolation between unlike signal transport layer.
In addition, the first surface of organic laminated circuit board has the eutectic pad of LED, for welding LED wafer；Wherein,
The corresponding BGA pad spacing for LED eutectic is consistent on organic integrated circuit substrate for the spacing of LED wafer.
The second surface of organic laminated circuit board has multiple ball-like pins grid arrays (Ball Grid Array, BGA)
Soldered ball, for welding integrated circuit discrete device；Wherein, the arrangement of the BGA soldered ball of organic laminated circuit board and the integrated electricity
The welding pin of road discrete device is consistent.
Step 130, by compound eutectic flip LED organic substrate, organic laminated circuit board and integrated circuit discrete device according to
Secondary be put into eutectic mold is fixed, and after positioning, the eutectic mold is put into progress eutectic welding in reflow machine, to be formed
The display module.
Specifically, integrated circuit discrete device controls LED wafer for providing control signal, by organic laminated circuit board
Work.Integrated circuit discrete device can be specially specific integrated circuit (ASIC) or field programmable gate array (FPGA)
Etc. control devices.
Preferably, the eutectic mold is being put into reflow machine after progress eutectic welding, the method also includes,
Aluminum or ceramic heat-dissipating bracket are mounted in the discrete device side, for compound eutectic flip LED organic group
Plate, organic laminated circuit board and integrated circuit discrete device radiate.The specific structure of radiator structure, can be according to practical need
It wants and designs.
Step 140, electrical testing is carried out to compound eutectic flip LED organic substrate display module；
Specifically, being carried out to the display module clear after obtaining compound eutectic flip LED organic substrate display module
It is clean, dry, then carry out electrical testing, to guarantee its electric property, and with the electric property after ASIC or FPGA assembling.
Step 150, optic test is carried out to the compound eutectic flip LED organic substrate display module, to detect it
Optical property.
The manufacturing method of compound eutectic flip LED organic substrate display module provided in an embodiment of the present invention, simple process,
Suitable for large-scale production and application, the display module being prepared, display effect and consistency are good, can satisfy LED display technique
In the needs of high density field application.
Correspondingly, having the embodiment of the invention also provides a kind of using compound eutectic flip LED prepared by the above method
Machine substrate display module.As shown in figure 4, the display module includes: compound eutectic flip LED organic substrate 410, organic lamination
Circuit board 420, aluminum or ceramic heat-dissipating bracket 430, discrete device 440 and IO cascade terminal 450.
Wherein, pass through the BGA soldered ball of organic laminated circuit board 420 between organic laminated circuit board 420 and discrete device 440
421 are connected.
In the present embodiment display module, compound eutectic flip LED organic substrate 410 has direction discernment mark, is convenient for
Screen is shown with this display module splicing large scale.It in addition, can be by the picture of display breadth ratio (4K high definition 16:9) in splicing
Plain spacing makes one piece of organic transparent panel or glass plate completely thickeied, is used as protection purposes and bracket purposes, so that
Display module of the invention can do the viscous spelling of seamless Mi Pu thereon.
Compound eutectic flip LED organic substrate display module of the invention, manufacturing process is simple, at low cost, is able to carry out
Full-color display has good display effect.
Above-described specific embodiment has carried out further the purpose of the present invention, technical scheme and beneficial effects
It is described in detail, it should be understood that being not intended to limit the present invention the foregoing is merely a specific embodiment of the invention
Protection scope, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should all include
Within protection scope of the present invention.
Claims (5)
1. a kind of manufacturing method of compound eutectic flip LED organic substrate epitaxy display module, which is characterized in that the method packet
It includes:
Electrode is prepared on compound eutectic flip LED organic substrate；The compound eutectic flip LED organic substrate includes organic group
Plate, the multiple upside-down mountings being packed into the multiple isolation channels in organic substrate side LED wafer；
Prepare organic laminated circuit board；The first surface of organic laminated circuit board has LED eutectic pad, for welding
State LED wafer；The second surface of organic laminated circuit board has multiple ball-like pins grid array BGA soldered balls, for welding
Connect integrated circuit discrete device；
Compound eutectic flip LED organic substrate, organic laminated circuit board and integrated circuit discrete device are sequentially placed into eutectic mould
It is fixed in tool, after positioning, the eutectic mold is put into progress eutectic welding in reflow machine, to form the display mould
Group；
The spacing of the LED wafer BGA pad spacing one for LED eutectic corresponding on organic integrated circuit substrate
It causes；
The arrangement of the BGA soldered ball of organic laminated circuit board is consistent with the welding pin of the integrated circuit discrete device；
The integrated circuit discrete device specifically includes:
Application-specific integrated circuit ASIC or on-site programmable gate array FPGA.
2. the method according to claim 1, wherein being total to the eutectic mold to be put into reflow machine
After crystalline substance welding, the method also includes,
Aluminum or ceramic heat-dissipating bracket are mounted in the discrete device side.
3. the method according to claim 1, wherein it is described form the display module after, the method
Further include:
Electrical testing is carried out to the display module.
4. the method according to claim 1, wherein it is described form the display module after, the method
Further include:
Optic test is carried out to the display module.
5. a kind of LED organic substrate display module using any method preparation of the claims 1-4.
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| CN201410810770.2A CN105789238B (en) | 2014-12-23 | 2014-12-23 | Compound eutectic flip LED organic substrate display module and its manufacturing method |
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|---|---|---|---|
| CN201410810770.2A CN105789238B (en) | 2014-12-23 | 2014-12-23 | Compound eutectic flip LED organic substrate display module and its manufacturing method |
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| CN105789238A CN105789238A (en) | 2016-07-20 |
| CN105789238B true CN105789238B (en) | 2019-01-25 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103366647A (en) * | 2013-07-09 | 2013-10-23 | 严敏 | LED display unit module |
| CN203433761U (en) * | 2013-09-06 | 2014-02-12 | 严敏 | Light-emitting diode (LED) light-emitting display board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI297223B (en) * | 2006-04-25 | 2008-05-21 | Gigno Technology Co Ltd | Package module of light emitting diode |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103366647A (en) * | 2013-07-09 | 2013-10-23 | 严敏 | LED display unit module |
| CN203433761U (en) * | 2013-09-06 | 2014-02-12 | 严敏 | Light-emitting diode (LED) light-emitting display board |
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