CN105542990A - 一种水基led芯片清洗剂 - Google Patents
一种水基led芯片清洗剂 Download PDFInfo
- Publication number
- CN105542990A CN105542990A CN201610064717.1A CN201610064717A CN105542990A CN 105542990 A CN105542990 A CN 105542990A CN 201610064717 A CN201610064717 A CN 201610064717A CN 105542990 A CN105542990 A CN 105542990A
- Authority
- CN
- China
- Prior art keywords
- out system
- led chip
- water base
- base led
- clean
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 239000012459 cleaning agent Substances 0.000 title abstract 4
- -1 fatty acid ester Chemical class 0.000 claims abstract description 13
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 10
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 10
- 239000000194 fatty acid Substances 0.000 claims abstract description 10
- 229930195729 fatty acid Natural products 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 6
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 4
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000007127 saponification reaction Methods 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000001509 sodium citrate Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 150000001408 amides Chemical class 0.000 claims description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 4
- 150000002632 lipids Chemical class 0.000 claims description 4
- KWIPUXXIFQQMKN-UHFFFAOYSA-N 2-azaniumyl-3-(4-cyanophenyl)propanoate Chemical compound OC(=O)C(N)CC1=CC=C(C#N)C=C1 KWIPUXXIFQQMKN-UHFFFAOYSA-N 0.000 claims description 3
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical group CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 claims description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 3
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 3
- KGWDUNBJIMUFAP-KVVVOXFISA-N Ethanolamine Oleate Chemical compound NCCO.CCCCCCCC\C=C/CCCCCCCC(O)=O KGWDUNBJIMUFAP-KVVVOXFISA-N 0.000 claims description 3
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 3
- 229940090948 ammonium benzoate Drugs 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 3
- 238000007046 ethoxylation reaction Methods 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims description 3
- 235000010234 sodium benzoate Nutrition 0.000 claims description 3
- 239000004299 sodium benzoate Substances 0.000 claims description 3
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 3
- 229940038773 trisodium citrate Drugs 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000003912 environmental pollution Methods 0.000 abstract description 3
- RHQDFWAXVIIEBN-UHFFFAOYSA-N Trifluoroethanol Chemical compound OCC(F)(F)F RHQDFWAXVIIEBN-UHFFFAOYSA-N 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 abstract 1
- 229920001214 Polysorbate 60 Polymers 0.000 abstract 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 abstract 1
- XWXMGTIHBYFTIE-UHFFFAOYSA-N chembl203360 Chemical compound OC1=CC=CC=C1C1=NC2=CC=CC=C2N1 XWXMGTIHBYFTIE-UHFFFAOYSA-N 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 238000011086 high cleaning Methods 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 229940079842 sodium cumenesulfonate Drugs 0.000 abstract 1
- QEKATQBVVAZOAY-UHFFFAOYSA-M sodium;4-propan-2-ylbenzenesulfonate Chemical compound [Na+].CC(C)C1=CC=C(S([O-])(=O)=O)C=C1 QEKATQBVVAZOAY-UHFFFAOYSA-M 0.000 abstract 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- MEIRRNXMZYDVDW-MQQKCMAXSA-N (2E,4E)-2,4-hexadien-1-ol Chemical compound C\C=C\C=C\CO MEIRRNXMZYDVDW-MQQKCMAXSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000002153 concerted effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/825—Mixtures of compounds all of which are non-ionic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2079—Monocarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2096—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/24—Organic compounds containing halogen
- C11D3/245—Organic compounds containing halogen containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3418—Toluene -, xylene -, cumene -, benzene - or naphthalene sulfonates or sulfates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
- C11D1/721—End blocked ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/74—Carboxylates or sulfonates esters of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
Abstract
本发明公开了一种水基LED芯片清洗剂，包括如下组分：烷基醇酰胺聚氧乙烯醚、失水山梨醇脂肪酸酯聚氧乙烯醚、乳化剂、有机溶剂、四氢糠醇、三氟乙醇、三丙二醇甲醚、2-(2′-羟基苯基)苯并咪唑、异丙苯磺酸钠、分散剂、缓蚀剂以及去离子水。本发明提供的清洗剂清洗效率高，去污能力强；安全性能好，不污染环境；节约能源，洗涤成本低；洗涤过程对LED无损清洗剂能够在芯片表面形成保护膜，隔绝空气，防止大气中水及其他分子腐蚀芯片，抗氧化，方便下一步制作工艺进行。
Description
技术领域
本发明涉及一种清洗剂，具体地说，本发明涉及一种水基LED芯片清洗剂。
背景技术
在电子工业制造的电子元件的生产过程中，采用清洁剂对部件进行清洗是必不可少的工艺过程，而采用的清洗剂大部分包括氟利昂在内的清洗剂，而氟利昂是破坏大气臭氧层的物质，根据国际上签订的蒙特利尔协议书，各签订国应该逐步淘汰氟利昂等氯氟烃类物质。这是向电子工业发出的任务与挑战，因此需要选择合适的替代清洁剂和采用相应的生产工艺。
地球是人类赖以生存的家园，保护好环境就是保护人类自身。因大工业生产而造成的臭氧层空洞已经引起世界各国政府的注意，同时很多国家都已采取行动，中国是最大的发展中国家，中国的电子工业正在迅猛崛起，因此我们有义务去通过不断的发展，逐步淘汰氯氟烃类物质的使用，其中一个重要任务就是寻找非氯氟烃的清洗剂和合适的工艺。
在电子工业制造中，电子元件的生产和组装有多个阶段组成，并且每个阶段都有清洗的工艺过程，以保证产品的高可靠性和高成品率。由于污染颗粒的沾污和不恰当的清洗所导致的电子元件问题包括高漏电、短路开路、腐蚀锈蚀、检测失效、不良焊接、密封不牢和金属迁移等而造成大量降级产品和次品。因此需要进一步开发一种既环保又高效的清洗剂。
发明内容
本发明的目的是提供一种水基LED芯片清洗剂，该清洗剂能够在芯片表面形成保护膜，隔绝空气，防止大气中水及其他分子腐蚀芯片，抗氧化，方便下一步制作工艺进行。
本发明采用的技术方案为一种水基LED芯片清洗剂，包括如下重量份的组分：
优选的是，所述缓蚀剂为苯并三氮唑、苯甲酸钠、苯甲酸胺中的一种或两种。
优选的是，所述烷基醇酰胺聚氧乙烯醚为碳原子数为8～18的脂肪酸先经过乙醇胺缩合，再经过乙氧基化得到的产物，其乙氧基数为3～6。
优选的是，所述失水山梨醇脂肪酸酯聚氧乙烯醚的皂化值为80～120，其中皂化值为85～110的失水山梨醇脂肪酸酯聚氧乙烯醚的比例为80wt％以上。
优选的是，所述分散剂为乙二胺四乙酸二钠、羟基乙叉二膦酸四钠、二乙烯三胺五乙酸五钠及柠檬酸钠中的两种或三种的混合物。
优选的是，所述乳化剂为两种HLB值不同的脂肪醇聚氧乙烯醚和仲辛基酚聚氧乙烯醚复配而成，其HLB值在5～20之间。
优选的是，所述有机溶剂为异丙醇和丙酮的混合物，其中异丙醇的质量分数为50～70％，丙酮的质量分数为30～50％。
本发明至少包括以下有益效果：
(1)本发明水基LED芯片清洗剂采用安全且易于漂洗的分散剂和表面活化剂配合使用，清洗速度快且没有毒挥发性物质产生，减少对操作者皮肤的伤害及对环境的污染，同时由于清洗的效率高、速度快，成本也更低；
(2)本发明清洗剂含三氟乙醇，因而不易燃、挥发速率快，清洗剂中选用的化学试剂，不污染环境，不易燃烧，对人体无害，属于非破坏臭氧层物质，满足环保要求，可以替代目前仍在使用的氟利昂清洗剂和卤代烃溶剂；对LED表面残留物、助焊剂、松香、树脂、油污、指印、灰尘有优良的清洗效果；
(3)本发明清洗剂清洗效率高，去污能力强；安全性能好，不污染环境；节约能源，洗涤成本低；洗涤过程对LED无损伤，加入乳化剂增加了烷基醇酰胺聚氧乙烯醚的渗透效率，二者协同作用，增强去污效果，加入2-(2′-羟基苯基)苯并咪唑可以保持化学平衡，降低表面张力,防止光、热分解或氧化分解。
具体实施方式
以下将结合具体实施例来详细说明本发明的实施方式，借此对本发明如何应用技术手段来解决技术问题，并达到技术效果的实现过程能充分理解并据以实施。
若未特别指明，实施例中所采用的技术手段为本领域技术人员所熟知的常规手段，所采用的原料也均为可商业获得的。未详细描述的各种过程和方法是本领域中公知的常规方法。
一种水基LED芯片清洗剂，包括如下重量份的组分：
作为本发明进一步改进，所述缓蚀剂为苯并三氮唑、苯甲酸钠、苯甲酸胺中的一种或两种。
作为本发明进一步改进，所述烷基醇酰胺聚氧乙烯醚为碳原子数为8～18的脂肪酸先经过乙醇胺缩合，再经过乙氧基化得到的产物，其乙氧基数为3～6。
作为本发明进一步改进，所述失水山梨醇脂肪酸酯聚氧乙烯醚的皂化值为80～120，其中皂化值为85～110的失水山梨醇脂肪酸酯聚氧乙烯醚的比例为80wt％以上。本发明采用非离子表面活性剂失水山梨醇脂肪酸酯聚氧乙烯醚通过三步法反应制得。首先，山梨醇脱水形成去水山梨糖；去水山梨糖同脂肪酸如油酸、硬脂酸，棕榈酸生成己糖酯；最后在催化剂作用下和环氧乙烷反应生成失水山梨醇脂肪酸酯聚氧乙烯醚。合适皂化值的失水山梨醇脂肪酸酯聚氧乙烯醚其乳化力、洗涤力、分散力好，与分散剂配合使用，可以显著提高清洗剂的去污能力。
作为本发明进一步改进，所述分散剂为乙二胺四乙酸二钠、羟基乙叉二膦酸四钠、二乙烯三胺五乙酸五钠及柠檬酸钠中的两种或三种的混合物。
作为本发明进一步改进，所述乳化剂为两种HLB值不同的脂肪醇聚氧乙烯醚和仲辛基酚聚氧乙烯醚复配而成，其HLB值在5～20之间。本发明采用的乳化剂HLB范围在5～20之间，这主要是从乳化剂的增效和协同反应出发，两种乳化剂混合体系协同效应的存在不仅取决于它们之间相互作用的强度，而且也取决于混合体系中各组分乳化剂的相关性质。为使两种乳化剂产生协同效应，它们必须有相互吸引作用，且它们的相关性质差异不能太大。
作为本发明进一步改进，所述有机溶剂为异丙醇和丙酮的混合物，其中异丙醇的质量分数为50～70％，丙酮的质量分数为30～50％。有机溶剂在该清洗剂的的作用是溶解其他组分，同时清洗剂需要易挥发有机体系、且快速、高效、因此选用异丙醇与丙酮二者的混合物作为有机溶剂，不仅可以满足溶解其他组分的性能，提高清洗剂的清洗性能，还使得整个清洗剂具有易挥发有机体系，可以有效降低清洗剂的清洗残留物。
表1列出不同实施例和对比例的具体组分及其含量。
表1实施例1～3和对比例1～4具体的组分
注：3EO是指乙氧基数为3，其他类似的表示也指该含义。
表2列出了实施例1～3和对比例1～4的测试结果。
表2实施例1～3和对比例1～4的测试结果
尽管本发明的实施方案已公开如上，但其并不仅仅限于说明书和实施方式中所列运用，它完全可以被适用于各种适合本发明的领域，对于熟悉本领域的人员而言，可容易地实现另外的修改，因此在不背离权利要求及等同范围所限定的一般概念下，本发明并不限于特定的细节。
Claims (7)
1.一种水基LED芯片清洗剂，其特征在于，包括如下重量份的组分：
2.如权利要求1所述的水基LED芯片清洗剂，其特征在于，所述缓蚀剂为苯并三氮唑、苯甲酸钠、苯甲酸胺中的一种或两种。
3.如权利要求1所述的水基LED芯片清洗剂，其特征在于，所述烷基醇酰胺聚氧乙烯醚为碳原子数为8～18的脂肪酸先经过乙醇胺缩合，再经过乙氧基化得到的产物，其乙氧基数为3～6。
4.如权利要求1所述的水基LED芯片清洗剂，其特征在于，所述失水山梨醇脂肪酸酯聚氧乙烯醚的皂化值为80～120，其中皂化值为85～110的失水山梨醇脂肪酸酯聚氧乙烯醚的比例为80wt％以上。
5.如权利要求1所述的水基LED芯片清洗剂，其特征在于，所述分散剂为乙二胺四乙酸二钠、羟基乙叉二膦酸四钠、二乙烯三胺五乙酸五钠及柠檬酸钠中的两种或三种的混合物。
6.如权利要求1所述的水基LED芯片清洗剂，其特征在于，所述乳化剂为两种HLB值不同的脂肪醇聚氧乙烯醚和仲辛基酚聚氧乙烯醚复配而成，其HLB值在5～20之间。
7.如权利要求1所述的水基LED芯片清洗剂，其特征在于，所述有机溶剂为异丙醇和丙酮的混合物，其中异丙醇的质量分数为50～70％，丙酮的质量分数为30～50％。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610064717.1A CN105542990A (zh) | 2016-01-29 | 2016-01-29 | 一种水基led芯片清洗剂 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610064717.1A CN105542990A (zh) | 2016-01-29 | 2016-01-29 | 一种水基led芯片清洗剂 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105542990A true CN105542990A (zh) | 2016-05-04 |
Family
ID=55822556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610064717.1A Pending CN105542990A (zh) | 2016-01-29 | 2016-01-29 | 一种水基led芯片清洗剂 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105542990A (zh) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085622A (zh) * | 2016-05-31 | 2016-11-09 | 安徽福恩光电科技有限公司 | 一种led芯片清洗液 |
| CN106148029A (zh) * | 2016-06-28 | 2016-11-23 | 华蓥市高科德电子科技有限公司 | 一种发光二级管清洗材料 |
| CN107904031A (zh) * | 2017-12-07 | 2018-04-13 | 安徽新欧电子科技有限公司 | 一种led面板清洗液 |
| CN111057620A (zh) * | 2020-01-17 | 2020-04-24 | 重庆理工大学 | 一种适用于自动化清洗用低成本水基清洗剂及其清洗方法 |
| CN114653667A (zh) * | 2022-03-31 | 2022-06-24 | 乌海市晶易硅材料有限公司 | 一种去除硅料表面氧化层的清洗方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335382A (zh) * | 2001-07-23 | 2002-02-13 | 山东大学 | 一种用于超大规模集成电路芯片的清洗剂组合物及其制备方法 |
| CN102660393A (zh) * | 2012-05-02 | 2012-09-12 | 常熟奥首光电材料有限公司 | Led芯片清洗液 |
| CN103540434A (zh) * | 2013-10-30 | 2014-01-29 | 合肥市华美光电科技有限公司 | 一种水溶性印刷电路板清洗剂及其制备方法 |
| CN103809393A (zh) * | 2012-11-12 | 2014-05-21 | 安集微电子科技(上海)有限公司 | 一种去除光阻残留物的清洗液 |
| CN104450308A (zh) * | 2014-12-11 | 2015-03-25 | 江门市江海区奥琪化工科技有限公司 | 一种led防火型清洗剂及其制备方法 |
| CN104662202A (zh) * | 2012-07-24 | 2015-05-27 | Ltc有限公司 | 用于去除和防止金属线表面形成氧化物的组合物 |
-
2016
- 2016-01-29 CN CN201610064717.1A patent/CN105542990A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335382A (zh) * | 2001-07-23 | 2002-02-13 | 山东大学 | 一种用于超大规模集成电路芯片的清洗剂组合物及其制备方法 |
| CN102660393A (zh) * | 2012-05-02 | 2012-09-12 | 常熟奥首光电材料有限公司 | Led芯片清洗液 |
| CN104662202A (zh) * | 2012-07-24 | 2015-05-27 | Ltc有限公司 | 用于去除和防止金属线表面形成氧化物的组合物 |
| CN103809393A (zh) * | 2012-11-12 | 2014-05-21 | 安集微电子科技(上海)有限公司 | 一种去除光阻残留物的清洗液 |
| CN103540434A (zh) * | 2013-10-30 | 2014-01-29 | 合肥市华美光电科技有限公司 | 一种水溶性印刷电路板清洗剂及其制备方法 |
| CN104450308A (zh) * | 2014-12-11 | 2015-03-25 | 江门市江海区奥琪化工科技有限公司 | 一种led防火型清洗剂及其制备方法 |
Non-Patent Citations (2)
| Title |
|---|
| 侯海云: "《表面活性剂物理化学基础》", 31 August 2014 * |
| 程能林: "《溶剂手册》", 31 March 2008 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085622A (zh) * | 2016-05-31 | 2016-11-09 | 安徽福恩光电科技有限公司 | 一种led芯片清洗液 |
| CN106148029A (zh) * | 2016-06-28 | 2016-11-23 | 华蓥市高科德电子科技有限公司 | 一种发光二级管清洗材料 |
| CN107904031A (zh) * | 2017-12-07 | 2018-04-13 | 安徽新欧电子科技有限公司 | 一种led面板清洗液 |
| CN111057620A (zh) * | 2020-01-17 | 2020-04-24 | 重庆理工大学 | 一种适用于自动化清洗用低成本水基清洗剂及其清洗方法 |
| CN114653667A (zh) * | 2022-03-31 | 2022-06-24 | 乌海市晶易硅材料有限公司 | 一种去除硅料表面氧化层的清洗方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105542990A (zh) | 一种水基led芯片清洗剂 | |
| CN101748003A (zh) | 一种无卤环保清洗剂 | |
| CN108286052B (zh) | 一种生物降解水基型金属清洗剂及其制备方法与应用 | |
| CN103834484A (zh) | 一种环保水性线路板专用清洗剂及其制备方法 | |
| CN103074174A (zh) | 一种重油污垢清洗剂 | |
| CN102161941B (zh) | 一种碳氢清洗剂 | |
| CN106118811A (zh) | 高渗透、高油水分离性环保型工序防锈油 | |
| US9725677B2 (en) | Cleaner composition | |
| CN103045391A (zh) | 玻璃基板水基清洗液及使用该清洗液清洗玻璃基板的方法 | |
| CN104804514B (zh) | 高性能环保型水基凹版洗版液及其制备方法 | |
| CN109837145A (zh) | 一种水性电子工业助焊剂清洗剂及其制备方法 | |
| CN105040005A (zh) | 一种汽车零件用水基清洗剂及其制备方法 | |
| CN112266832B (zh) | 一种半导体芯片清洗剂及制备方法与应用 | |
| CN105297042A (zh) | 一种金属材料清洗剂及其使用方法 | |
| CN102408959A (zh) | 一种电子线路板专用清洗剂及其制备方法 | |
| CN101531955A (zh) | 太阳能电池丝网印刷工艺用清洗液 | |
| CN105623895A (zh) | 一种led衬底基片去蜡清洗剂 | |
| CN103881843A (zh) | 一种玻璃基板清洗剂 | |
| CN101463295B (zh) | 半导体工业用清洗剂 | |
| CN109183052A (zh) | 一种除油粉及其制备方法 | |
| CN113214916A (zh) | 一种机电设备带电清洗剂 | |
| CN103113972A (zh) | 一种芯片铜互连封装用高效划片液 | |
| CN104946417A (zh) | 一种洗涤剂 | |
| CN104893833A (zh) | 一种工业用重油污清洗剂 | |
| CN107574051A (zh) | 无卤环保清洗剂 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160504 |