CN105541914A - 鏻化合物、制备其的方法、包括其的环氧树脂组合物以及由其制备的半导体装置 - Google Patents

鏻化合物、制备其的方法、包括其的环氧树脂组合物以及由其制备的半导体装置 Download PDF

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Publication number
CN105541914A
CN105541914A CN201510695432.3A CN201510695432A CN105541914A CN 105541914 A CN105541914 A CN 105541914A CN 201510695432 A CN201510695432 A CN 201510695432A CN 105541914 A CN105541914 A CN 105541914A
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epoxy resin
formula
substituted
unsubstituted
compound
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CN201510695432.3A
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Chinese (zh)
Inventor
金民兼
劝冀爀
李东桓
郑主泳
千晋敏
崔振佑
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Samsung SDI Co Ltd
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Samsung SDI Co Ltd
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Priority claimed from KR1020140143638A external-priority patent/KR101768281B1/ko
Priority claimed from KR1020150058072A external-priority patent/KR101802577B1/ko
Application filed by Samsung SDI Co Ltd filed Critical Samsung SDI Co Ltd
Publication of CN105541914A publication Critical patent/CN105541914A/zh
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    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
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    • C07C233/00—Carboxylic acid amides
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    • C07C233/65—Carboxylic acid amides having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
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    • C07C235/42—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings and singly-bound oxygen atoms bound to the same carbon skeleton
    • C07C235/44—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings and singly-bound oxygen atoms bound to the same carbon skeleton with carbon atoms of carboxamide groups and singly-bound oxygen atoms bound to carbon atoms of the same non-condensed six-membered aromatic ring
    • C07C235/58—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings and singly-bound oxygen atoms bound to the same carbon skeleton with carbon atoms of carboxamide groups and singly-bound oxygen atoms bound to carbon atoms of the same non-condensed six-membered aromatic ring with carbon atoms of carboxamide groups and singly-bound oxygen atoms, bound in ortho-position to carbon atoms of the same non-condensed six-membered aromatic ring
    • C07C235/64—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings and singly-bound oxygen atoms bound to the same carbon skeleton with carbon atoms of carboxamide groups and singly-bound oxygen atoms bound to carbon atoms of the same non-condensed six-membered aromatic ring with carbon atoms of carboxamide groups and singly-bound oxygen atoms, bound in ortho-position to carbon atoms of the same non-condensed six-membered aromatic ring having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a six-membered aromatic ring
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    • C07C235/66—Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings and singly-bound oxygen atoms bound to the same carbon skeleton with carbon atoms of carboxamide groups bound to carbon atoms of six-membered aromatic rings being part of condensed ring systems and singly-bound oxygen atoms, bound to the same carbon skeleton
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    • C07C259/10—Compounds containing carboxyl groups, an oxygen atom of a carboxyl group being replaced by a nitrogen atom, this nitrogen atom being further bound to an oxygen atom and not being part of nitro or nitroso groups without replacement of the other oxygen atom of the carboxyl group, e.g. hydroxamic acids having carbon atoms of hydroxamic groups bound to carbon atoms of six-membered aromatic rings
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    • C07C323/20—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton with singly-bound oxygen atoms bound to carbon atoms of the same non-condensed six-membered aromatic ring
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    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/02—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring monocyclic with no unsaturation outside the aromatic ring
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    • C07C39/17—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings, e.g. cyclohexylphenol
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  • Chemical & Material Sciences (AREA)
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  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201510695432.3A 2014-10-22 2015-10-22 鏻化合物、制备其的方法、包括其的环氧树脂组合物以及由其制备的半导体装置 Pending CN105541914A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020140143638A KR101768281B1 (ko) 2014-10-22 2014-10-22 포스포늄계 화합물, 이를 포함하는 에폭시수지 조성물, 및 이를 사용하여 제조된 반도체 장치
KR10-2014-0143638 2014-10-22
KR10-2015-0058072 2015-04-24
KR1020150058072A KR101802577B1 (ko) 2015-04-24 2015-04-24 포스포늄계 화합물, 이를 포함하는 에폭시수지 조성물, 및 이를 사용하여 제조된 반도체 장치

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CN105541914A true CN105541914A (zh) 2016-05-04

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US (1) US9868751B2 (https=)
JP (1) JP6803138B2 (https=)
CN (1) CN105541914A (https=)
TW (1) TWI580687B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108291052A (zh) * 2015-11-26 2018-07-17 三星Sdi株式会社 用于密封半导体器件的环氧树脂组合物以及使用其密封的半导体器件

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101802583B1 (ko) * 2015-06-23 2017-12-29 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자
CN109890894B (zh) 2016-11-02 2020-04-21 住友电木株式会社 环氧树脂组合物和结构体
JP7087797B2 (ja) * 2018-08-01 2022-06-21 Dic株式会社 インク組成物、光変換層及びカラーフィルタ
EP4400525A1 (en) * 2023-01-12 2024-07-17 Henkel AG & Co. KGaA One component liquid epoxy resin composition

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002105171A (ja) * 2000-09-29 2002-04-10 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物、並びにこれを用いたプリプレグおよび積層板
JP2006307131A (ja) * 2005-03-28 2006-11-09 Sumitomo Bakelite Co Ltd 潜伏性触媒の製造方法およびエポキシ樹脂組成物
CN101107285A (zh) * 2005-01-20 2008-01-16 住友电木株式会社 环氧树脂组合物及该组合物潜伏化的方法和半导体装置
US20100148379A1 (en) * 2007-05-17 2010-06-17 Nitto Denko Corporation Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same
US20120046244A1 (en) * 2008-12-29 2012-02-23 The Board Of Trustees Of The University Of Alabama Dual functioning ionic liquids and salts thereof
CN103896983A (zh) * 2012-12-24 2014-07-02 第一毛织株式会社 季鏻盐、包含季鏻盐用于封装半导体器件的环氧树脂组合物和用该组合物封装的半导体器件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5055679B2 (ja) * 2000-09-29 2012-10-24 住友ベークライト株式会社 熱硬化性樹脂組成物およびそれを用いたエポキシ樹脂成形材料ならびに半導体装置
JP2003292584A (ja) * 2002-04-02 2003-10-15 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物およびそれを用いたエポキシ樹脂成形材料ならびに半導体装置
JP4569076B2 (ja) * 2002-06-05 2010-10-27 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
TW200611896A (en) * 2004-05-21 2006-04-16 Aventis Pharma Gmbh Process for preparing 1, 4-diphenylazetidinone derivatives
JP5782434B2 (ja) * 2010-05-28 2015-09-24 住友ベークライト株式会社 エステル化物の製造方法
KR101813758B1 (ko) * 2015-06-22 2018-01-31 삼성에스디아이 주식회사 포스포늄계 화합물, 이를 포함하는 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자
KR101802583B1 (ko) * 2015-06-23 2017-12-29 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자
KR101835937B1 (ko) * 2015-07-03 2018-04-20 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002105171A (ja) * 2000-09-29 2002-04-10 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物、並びにこれを用いたプリプレグおよび積層板
CN101107285A (zh) * 2005-01-20 2008-01-16 住友电木株式会社 环氧树脂组合物及该组合物潜伏化的方法和半导体装置
JP2006307131A (ja) * 2005-03-28 2006-11-09 Sumitomo Bakelite Co Ltd 潜伏性触媒の製造方法およびエポキシ樹脂組成物
US20100148379A1 (en) * 2007-05-17 2010-06-17 Nitto Denko Corporation Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same
US20120046244A1 (en) * 2008-12-29 2012-02-23 The Board Of Trustees Of The University Of Alabama Dual functioning ionic liquids and salts thereof
CN103896983A (zh) * 2012-12-24 2014-07-02 第一毛织株式会社 季鏻盐、包含季鏻盐用于封装半导体器件的环氧树脂组合物和用该组合物封装的半导体器件

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108291052A (zh) * 2015-11-26 2018-07-17 三星Sdi株式会社 用于密封半导体器件的环氧树脂组合物以及使用其密封的半导体器件
CN108291052B (zh) * 2015-11-26 2020-07-03 三星Sdi株式会社 用于密封半导体器件的环氧树脂组合物以及使用其密封的半导体器件

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