CN105517350B - A kind of production method of printed circuit board - Google Patents
A kind of production method of printed circuit board Download PDFInfo
- Publication number
- CN105517350B CN105517350B CN201510849784.XA CN201510849784A CN105517350B CN 105517350 B CN105517350 B CN 105517350B CN 201510849784 A CN201510849784 A CN 201510849784A CN 105517350 B CN105517350 B CN 105517350B
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- printed circuit
- circuit board
- registration holes
- design cell
- jigsaw
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention provides a kind of production method of printed circuit board, including step：S1. registration holes are formed on the non-active area of each design cell on jigsaw printed circuit board；S2. Quality Detection is carried out to design cell, is such as detected as defective products, then blocking corresponding registration holes covering makes opaque, is such as detected as non-defective unit, does not then block corresponding registration holes covering；S3. contraposition exposure is carried out to jigsaw printed circuit board, when detecting the registration holes light transmission aligned with a certain design cell, to the design cell normal exposure, when detecting opaque, to the unobstructed exposure of the design cell；S4. the jigsaw printed circuit board to complete is divided, printed circuit board is made.The design cell of normal exposure can nickel plating it is gold-plated, the design cell of unobstructed exposure is unable to that nickel plating is gold-plated, therefore the production method of the present invention, not only can guarantee the making of non-defective unit design cell, moreover it is possible to reduce the scrap cost of defective products design cell.
Description
Technical field
The present invention relates to electronic circuit technology fields, and in particular to a kind of production method of printed circuit board.
Background technology
Continuous development with printed circuit board technology and ripe, the layout designed capacity continuous improvement of printed circuit board.
In order to improve production efficiency, start jigsaw printed circuit board occur in printed circuit board manufacturing process.Jigsaw printed circuit board
Refer to that multiple mutually independent units are designed in an entire plate, when making, whole plate makes together, to whole after completing
Plate is cut, each unit cut down becomes independent printed circuit panel products.
In the prior art, printed circuit panel products are produced by jigsaw printed circuit board, generally can all included the following steps：
The metal foil and PP plates of continuous laminated multi-layer i.e. on monoblock polypropylene (PP) plate, and each layer of metal foil is etched,
Multiple independent figure circuits (i.e. independent design cell) are formed, until reaching target thickness, and form jigsaw printed circuit
Then plate carries out outer layer welding resistance step to the printed circuit board, i.e., one layer of dielectric ink is plated in outermost metal foil, and right
The dielectric ink is exposed development, keeps the metal foil of setting position exposed, nickel plating, gold in exposed metal foil, last complete
At making.
With popularizing for high-order product, the producting process difficulty of present printed circuit board is increasing, defective products occurs
Probability is also increasing.Since jigsaw printed circuit board is that whole plate makes together, if in the production process, one in whole plate
Or there is defective products in several units, these defective products in outer layer welding resistance step, also can with normal product together by upper nickel, upper gold,
This causes scrap cost higher.
Invention content
Therefore, what the technical problem to be solved in the present invention was to overcome in jigsaw printed circuit board in the prior art bad sets
It is excessively high to count unit scrap cost.
For this purpose, the embodiment of the present invention provides a kind of production method of printed circuit board, include the following steps：S1. positioned at
Registration holes are formed on the non-active area of each design cell on jigsaw printed circuit board；S2. the design cell is carried out
Quality Detection, to being detected as the design cell of defective products, corresponding registration holes covering is blocked make it is opaque, to being detected as
The design cell of non-defective unit does not block corresponding registration holes covering then；S3. the jigsaw printed circuit board is aligned
Exposure, when detecting a certain registration holes light transmission, a pair design cell corresponding with the registration holes carries out normal exposure, is detecting
When a certain registration holes are opaque, a pair design cell corresponding with the registration holes carries out unobstructed exposure；S4. the institute that will be completed
The segmentation of jigsaw printed circuit board is stated, to which printed circuit board be made.
Preferably, between the step S2 and the step S3, further include：It is laminated on the jigsaw printed circuit board
Other at least one layer of jigsaw printed circuit boards execute step S1 and step S2 to every layer of jigsaw printed circuit board being laminated；Its
The middle contraposition hole site being arranged on different jigsaw printed circuit boards overlaps.
Preferably, the jigsaw printed circuit board includes substrate and the metal foil that is laid on substrate, the design cell
It is arranged in the metal foil with the registration holes, the substrate is transparent material.
Preferably, in the step S1, the registration holes are formed in the metal foil using the method for exposure imaging.
Preferably, in the step S1, the design is formed simultaneously in the metal foil using the method for exposure imaging
The figure circuit of unit and the registration holes.
Preferably, in the step S2, for registration holes corresponding with defective products, using dark oil pen to disposed thereon
The substrate of side and/or lower section carries out smearing covering, makes opaque.
Preferably, in the step S2, Quality Detection is carried out to the design cell using automated optical detection equipment；
And/or in the step S4, contraposition exposure is carried out to the jigsaw printed circuit board using contraposition exposure machine.
Preferably, further include the intensity of light source for reinforcing the contraposition exposure machine, to reinforce the knowledge of its light source in the step S4
The step of other ability.
Preferably, in the step S1, further include being made for monoblock jigsaw printed circuit in the metal foil
The step of whole plate registration holes that plate is aligned.
Preferably, the figure line of the design cell is formed simultaneously in the metal foil using the method for exposure imaging
Road, the registration holes and the whole plate registration holes.
The production method of printed circuit board provided in an embodiment of the present invention, has the following advantages：
1. the production method of the printed circuit board of the embodiment of the present invention, by the setting of the non-active area of design cell with
The corresponding registration holes of design cell, will be with if the design cell is defective products when carrying out Quality Detection to design cell
Its corresponding registration holes is blocked, make it is opaque, if the design cell be non-defective unit, corresponding registration holes are not blocked,
So that its is kept light transmission, in outer layer welding resistance step, before being exposed to each design cell, first pair with each design cell
Corresponding registration holes are detected, if a certain registration holes are opaque, illustrate that corresponding design cell is defective products, this
When unobstructed exposure is carried out to the design cell, make the design cell in subsequent fabrication process, can not nickel plating and gold-plated, in this way
Scrap cost can be reduced when scrapping；If a certain registration holes light transmission is good, illustrate that corresponding design cell is non-defective unit,
Normal exposure is carried out to the design cell at this time, makes the copper of the design cell setting position exposed after development, so as to rear
In continuous manufacturing process, can normal nickel plating and gold-plated, go out printed circuit board finished product so as to final production.
2. the production method of the printed circuit board of the printing of the embodiment of the present invention, jigsaw printed circuit board can be laminated with more
Layer, registration holes are all designed on each layer of jigsaw printed circuit board and carry out Quality Detection, and different jigsaw printed circuits are set
The position of registration holes on plate overlaps, and in this way when wherein any one or more jigsaw printed circuit boards are defective products, all can
Keep registration holes opaque, in post-exposure steps, be detected, and nothing is carried out to the defective products design cell
Block exposure.
3. the production method of the printed circuit board of the embodiment of the present invention is formed on metal foil using the method for exposure imaging
The registration holes, it is easy to operate, it is preferable that with the figure of design cell together exposure imaging, to make simultaneously, in this way
Producing efficiency can be improved, production process is reduced, is transparent material by substrate design, when making registration holes, can not had in base
Registration holes are opened up simultaneously on plate and metal foil, production link can be reduced, reduce cost.
4. the production method of the printed circuit board of the embodiment of the present invention, a diameter of 0.1-0.3mm of registration holes are ensureing thoroughly
While optical property, guarantee aligning accuracy is also helped, and convenient for being left white of changing the time of anti-welding wire mark in outer layer welding resistance step,
Namely expose the registration holes of each design cell in wire mark, it prevents from being covered by solder mask, and will not be by spraying
Ink covers.
5. the production method of the printed circuit board of the embodiment of the present invention, in step s 2, when detecting a certain design cell
For defective products when, corresponding registration holes are found, using dark oil pen to the PP positioned at the registration holes above and or below
Substrate carries out smearing covering, keeps the registration holes opaque, and this mode of operation is simple and practicable, and efficient and occlusion effect is good.
6. the production method of the printed circuit board of the embodiment of the present invention, right when the number of plies of jigsaw printed circuit board is more
The transmittancy in position hole is deteriorated, and the intensity of light source of the exposure machine of enhancing contraposition at this time reinforces its light source recognition capability, can avoid missing
Inspection.
7. the production method of the printed circuit board of the embodiment of the present invention further includes in step sl making on metal foil
The step of whole plate registration holes, whole plate registration holes for being positioned to the stratification position of substrate and metal foil, and make registration holes at
It for special index aperture, is positioned without the stratification position again for substrate and metal foil, so even only there are one contrapositions
When the light transmission of hole, substrate and metal foil also normally can be aligned and are laminated, and it is single that contraposition exposure machine can be utilized to design the non-defective unit
Member carries out normal exposure, and finally produces finished product, utmostly non-defective unit is avoided to scrap.
8. the production method of the printed circuit board of the embodiment of the present invention, using exposure imaging method on metal foil simultaneously
Figure circuit, registration holes and the whole plate registration holes for forming design cell, can improve production efficiency.
Description of the drawings
In order to illustrate more clearly of the technical solution in the prior art or the specific embodiment of the invention, below to existing skill
Attached drawing used in art or specific implementation mode description is briefly described, it should be apparent that, for ordinary skill people
For member, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the principle schematic diagram of jigsaw printed circuit board in embodiment 1.
Fig. 2 is the sectional view of the A-A along Fig. 1.
In figure：1- substrates, 2- metal foils, 3- design cells, 4- registration holes, 5- whole plate registration holes.
Specific implementation mode
Technical scheme of the present invention is described with reference to the accompanying drawings of the specification, it is clear that following embodiments is not this
Invent whole embodiments.Based on embodiment described in the invention, those of ordinary skill in the art are not making other wounds
The every other embodiment obtained under the premise of the property made labour, belongs to protection scope of the present invention.
It should be noted that as long as technical characteristic involved in invention described below different embodiments is each other
Between do not constitute conflict and can be combined with each other.
Embodiment 1
The present embodiment provides a kind of production methods of printed circuit board to include the following steps referring to fig. 1 and fig. 2：
S1. registration holes 4 are formed on the non-active area of each design cell 3 on jigsaw printed circuit board；
S2. carrying out Quality Detection to the design cell 3 will be corresponding to being detected as the design cell 3 of defective products
The covering of registration holes 4, which is blocked, to be made opaque, to being detected as the design cell 3 of non-defective unit, is not then covered corresponding registration holes 4 and is hidden
Gear；
S3. contraposition exposure is carried out to the jigsaw printed circuit board, when detecting a certain 4 light transmission of registration holes, pair with should
4 corresponding design cell 3 of registration holes carry out normal exposure, when detecting that a certain registration holes 4 are opaque, pair with the registration holes 4
Corresponding design cell 3 carries out unobstructed exposure；
S4. the jigsaw printed circuit board to complete is divided, to which printed circuit board be made.
The production method of the printed circuit board of the present embodiment can utilize registration holes 4 by non-defective unit design cell and defective products
Design cell is marked respectively, and in this way in the outer layer welding resistance step in later stage, contraposition exposure machine can identify respectively, to right
Non-defective unit design cell carries out normal exposure, and unobstructed exposure is carried out to poor design unit, the design cell warp after normal exposure
After development, can nickel plating and gold-plated, and after the design cell of unobstructed exposure is developed, can not nickel plating and gold-plated, to both
The normal production process that ensure that non-defective unit design cell, also reduces the scrap cost of defective products design cell.
In the present embodiment step S1,4 design cells 3 are provided on jigsaw printed circuit board, and correspond to each
Design cell 3 is all provided with a registration holes 4, it should be noted that the number of design cell 3 is not limited to 4, more
Or less design cell 3 is also feasible, and a registration holes 4, more registration holes are also not limited on each design cell 3
4 be also feasible.
Jigsaw printed circuit board in the present embodiment includes including substrate 1 and being laid with metal foil 2 on substrate 1, described
Design cell 3 and the registration holes 4 are arranged by way of exposure imaging in the metal foil 2, and the substrate 1 is transparent
Material, in the present embodiment, substrate 1 uses PP plates, metal foil 2 to use copper foil.
In the present embodiment, the registration holes 4 of a diameter of 0.2mm of registration holes 4, this kind of size can ensure light transmission
Meanwhile ensureing aligning accuracy, and convenient for being left white of changing the time of anti-welding wire mark in outer layer welding resistance step.Those skilled in the art
Can also be as needed 0.1-0.3mm by the diameter design of registration holes 4, such as 0.15,0.25, can it reach essentially identical
Technique effect.
In the present embodiment step S2, quality inspection is carried out to the design cell 3 using automated optical detection equipment (AOI)
It surveys.When being detected to a certain design cell 3, if being detected as defective products, corresponding registration holes 4 are just found, and make
Smearing covering is carried out on the substrate 1 overlapped with the registration holes 4 with dark oil pen, makes the no longer light transmission of registration holes 4, if detection
For non-defective unit, does not then have to smear covering, the registration holes 4 is made to keep light transmission.
In the present embodiment step S3, contraposition exposure is carried out to the jigsaw printed circuit board using contraposition exposure machine.
Embodiment 2
The present embodiment provides a kind of production methods of printed circuit board to include the following steps referring to fig. 1 and fig. 2：
S1. registration holes 4 are formed on the non-active area of each design cell 3 on jigsaw printed circuit board；
S2. carrying out Quality Detection to the design cell 3 will be corresponding to being detected as the design cell 3 of defective products
The covering of registration holes 4, which is blocked, to be made opaque, to being detected as the design cell 3 of non-defective unit, is not then covered corresponding registration holes 4 and is hidden
Gear；
S3. continue that jigsaw printed circuit board is laminated on jigsaw printed circuit board, to each layer of jigsaw printed circuit board
Step S1 and step S2 is repeated, and registration holes (4) position being arranged on different jigsaw printed circuit boards is made to overlap, until reaching
The target number of plies；
S4. contraposition exposure is carried out to the jigsaw printed circuit board, when detecting a certain 4 light transmission of registration holes, pair with should
4 corresponding design cell 3 of registration holes carry out normal exposure, when detecting that a certain registration holes 4 are opaque, pair with the registration holes 4
Corresponding design cell 3 carries out unobstructed exposure；
S5. the jigsaw printed circuit board to complete is divided, to which printed circuit board be made.
Compared with the production method in embodiment 1, the production method of the printed circuit board of the present embodiment, jigsaw printed circuit
Plate can be laminated with multilayer, and registration holes 4 are all designed on each layer of jigsaw printed circuit board and carry out Quality Detection, and are arranged not
Position with the registration holes 4 on jigsaw printed circuit board overlaps, in this way when wherein any one or more jigsaw printed circuit boards
On a certain design cell when being defective products, can all make corresponding registration holes 4 opaque, in post-exposure steps
In, it can be detected, and unobstructed exposure is carried out to the circuit board comprising the defective products design cell, after unobstructed exposure
Circuit board, nickel and gold can not be coated with again in later stage welding resistance step, it is thus possible to scrap cost is reduced when scrapping.
In the present embodiment step S1,4 design cells 3 are provided on jigsaw printed circuit board, and correspond to each
Design cell 3 is all provided with a registration holes 4, it should be noted that the number of design cell 3 is not limited to 4, more
Or less design cell 3 is also feasible, and a registration holes 4, more registration holes are also not limited on each design cell 3
4 be also feasible.
Jigsaw printed circuit board in the present embodiment includes including substrate 1 and being laid with metal foil 2 on substrate 1, described
Design cell 3 and the registration holes 4 are arranged by way of exposure imaging in the metal foil 2, and the substrate 1 is transparent
Material, in the present embodiment, substrate 1 uses PP plates, metal foil 2 to use copper foil.
In the present embodiment, the registration holes 4 of a diameter of 0.2mm of registration holes 4, this kind of size can ensure light transmission
Meanwhile ensureing aligning accuracy, and convenient for being left white of changing the time of anti-welding wire mark in outer layer welding resistance step.Those skilled in the art
Can also be as needed 0.1-0.3mm by the diameter design of registration holes 4, such as 0.15,0.25, can it reach essentially identical
Technique effect.
Scheme as a further improvement further includes being made in metal foil 2 for being printed to monoblock jigsaw in step S1
The step of whole plate registration holes 5 that circuit board is aligned.Whole plate registration holes 5 be used for the stratification position of substrate 1 and metal foil 2 into
Row positioning, and registration holes 4 is made to become special index aperture, it is positioned without the stratification position again for substrate 1 and metal foil 2,
So even only there are one when 4 light transmission of registration holes, substrate 1 and metal foil 2 also normally can be aligned and are laminated, and can be utilized
It aligns exposure machine and normal exposure is carried out to the non-defective unit design cell, and finally produce finished product, utmostly non-defective unit is avoided to scrap.
The figure circuit of the design cell 3, the contraposition are formed simultaneously in metal foil 2 using the method for exposure imaging
Hole 4 and the whole plate registration holes 5；The figure line of design cell 3 is formed simultaneously in metal foil 2 using the method for exposure imaging
Road, registration holes 4 and whole plate registration holes 5, can improve production efficiency.
In the present embodiment step S2, quality inspection is carried out to the design cell 3 using automated optical detection equipment (AOI)
It surveys.When being detected to a certain design cell 3, if being detected as defective products, corresponding registration holes 4 are just found, and make
Smearing covering is carried out on the substrate 1 overlapped with the registration holes 4 with dark oil pen, makes the no longer light transmission of registration holes 4, if detection
For non-defective unit, does not then have to smear covering, the registration holes 4 is made to keep light transmission.
In the present embodiment step S3, refering to what is shown in Fig. 2, jigsaw printed circuit board has been laminated 2 layers, it should be noted that this
The technical staff in field can laminated multi-layer as needed, such as 3-10 layers.
In the present embodiment step S4, contraposition exposure is carried out to the jigsaw printed circuit board using contraposition exposure machine.
As an improvement scheme, in step S4, using contraposition exposure machine identification registration holes 4 whether light transmission when, also wrap
The intensity of light source for reinforcing the contraposition exposure machine is included, the step of to reinforce its light source recognition capability.When jigsaw printed circuit board
When the number of plies is more, the transmittancy of registration holes 4 is deteriorated, and the intensity of light source of the exposure machine of enhancing contraposition at this time reinforces the identification of its light source
Ability can avoid flase drop.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. a kind of production method of printed circuit board, it is characterised in that：Include the following steps：
S1. registration holes (4) are formed on the non-active area of each design cell (3) on jigsaw printed circuit board；
S2. carrying out Quality Detection to the design cell (3) will be corresponding to being detected as the design cell (3) of defective products
Registration holes (4) covering block make it is opaque, to being detected as the design cell (3) of non-defective unit, then not by corresponding registration holes (4)
Covering is blocked；
S3. contraposition exposure is carried out to the jigsaw printed circuit board, it is pair right with this when detecting a certain registration holes (4) light transmission
Position hole (4) corresponding design cell (3) carries out normal exposure, when detecting that a certain registration holes (4) are opaque, pair with the contraposition
The corresponding design cell (3) in hole (4) carries out unobstructed exposure；
S4. the jigsaw printed circuit board to complete is divided, to which printed circuit board be made.
2. the production method of printed circuit board according to claim 1, it is characterised in that：In the step S2 and the step
Between rapid S3, further include：Few one layer of other jigsaw printed circuit board is laminated on the jigsaw printed circuit board, to being laminated
Every layer of jigsaw printed circuit board execute step S1 and step S2；The registration holes being provided on different jigsaw printed circuit boards
(4) position overlaps.
3. the production method of printed circuit board according to claim 1 or 2, it is characterised in that：The jigsaw printed circuit
Plate includes substrate (1) and the metal foil (2) being laid on substrate (1), and the design cell (3) and the registration holes (4) are all provided with
It sets in the metal foil (2), the substrate (1) is transparent material.
4. the production method of printed circuit board according to claim 3, it is characterised in that：In the step S1, exposure is used
The method of photodevelopment forms the registration holes (4) in the metal foil (2).
5. the production method of printed circuit board according to claim 4, it is characterised in that：In the step S1, exposure is used
The method of photodevelopment is formed simultaneously the figure circuit of the design cell (3) and the registration holes in the metal foil (2)
(4)。
6. the production method of printed circuit board according to claim 3, it is characterised in that：In the step S2, for
The corresponding registration holes of defective products (4), using dark oil pen to be positioned above and/or the substrate of lower section (1) carry out smear cover
Lid, makes opaque.
7. the production method of printed circuit board according to claim 1, it is characterised in that：In the step S2, using certainly
Dynamic optical detection apparatus carries out Quality Detection to the design cell (3)；And/or
In the step S4, contraposition exposure is carried out to the jigsaw printed circuit board using contraposition exposure machine.
8. the production method of printed circuit board according to claim 7, it is characterised in that：In the step S4, further include
The intensity of light source for reinforcing the contraposition exposure machine, the step of to reinforce its light source recognition capability.
9. the production method of printed circuit board according to claim 3, it is characterised in that：In the step S1, it also wraps
It includes the step of making whole plate registration holes (5) for being aligned to monoblock jigsaw printed circuit board in the metal foil (2).
10. the production method of printed circuit board according to claim 9, it is characterised in that：Use the method for exposure imaging
Figure circuit, the registration holes (4) and the whole plate pair of the design cell (3) are formed simultaneously in the metal foil (2)
Position hole (5).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510849784.XA CN105517350B (en) | 2015-11-27 | 2015-11-27 | A kind of production method of printed circuit board |
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| CN201510849784.XA CN105517350B (en) | 2015-11-27 | 2015-11-27 | A kind of production method of printed circuit board |
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| CN105517350B true CN105517350B (en) | 2018-09-04 |
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| CN105979702A (en) * | 2016-05-31 | 2016-09-28 | 广东欧珀移动通信有限公司 | Circuit board spliced board |
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| CN109496059A (en) * | 2018-11-21 | 2019-03-19 | 梅州市志浩电子科技有限公司 | Production method without location structure PCB |
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| CN113923870B (en) * | 2021-09-18 | 2023-06-09 | 宏华胜精密电子(烟台)有限公司 | Circuit board preparation method |
| CN113993287A (en) * | 2021-11-23 | 2022-01-28 | 浙江罗奇泰克科技股份有限公司 | Manufacturing process of large-size LED backlight circuit board and circuit board |
| CN116419491A (en) * | 2023-04-17 | 2023-07-11 | 柏承(南通)微电子科技有限公司 | Anti-soldering area exposure cost-saving processing method for PCB semi-finished product |
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| CN105517350A (en) | 2016-04-20 |
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Effective date of registration: 20220623 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |