CN105979702A - Circuit board spliced board - Google Patents
Circuit board spliced board Download PDFInfo
- Publication number
- CN105979702A CN105979702A CN201610382731.6A CN201610382731A CN105979702A CN 105979702 A CN105979702 A CN 105979702A CN 201610382731 A CN201610382731 A CN 201610382731A CN 105979702 A CN105979702 A CN 105979702A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed
- panel
- dowel
- technique edges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pinball Game Machines (AREA)
Abstract
The invention provides a circuit board spliced board comprising technological edges and a plurality of circuit board daughter boards. The plurality of circuit board daughter boards are connected together by first connecting ribs, and the technological edges are disposed on the outer sides of the plurality of circuit board daughter boards. The plurality of circuit board daughter boards, which are adjacent to the technological edges, are connected with the technological edges by second connecting ribs, and the technological edges are provided with positioning holes, which are disposed between the two second connecting ribs. During a dismounting process and a conveying process, the positioning holes are disposed in the inner sides of the second connecting ribs, and therefore the damages on the positioning holes caused by the collision during the conveying process are prevented, and in addition, the positioning holes are disposed in the inner sides of the second connecting ribs in order to prevent the tearing of the positioning holes caused by the stress concentration during the dismounting process.
Description
Technical field
The present invention relates to circuit board making technical field, particularly relate to a kind of multiple-printed-panel for circuit board.
Background technology
In circuit board manufacturing area, due to each circuit board finished product cause not of uniform size, during making, typically require spelling
The size becoming certain makes and could meet machinery equipment requirement, referred to as multiple-printed-panel for circuit board.The side of multiple-printed-panel for circuit board
Formula has a lot of advantages, the highest for SMT whole efficiency, cost control.The production of dual platen only needs
Want one-time process to complete, greatly improve the utilization rate of chip mounter.For manufacturing on-the-spot management power
Degree does not results in too much waste yet, is very suitable for production in enormous quantities pattern.
But foregoing circuit plate jigsaw is producing and in transportation, often due to the structure design in hole, location
Unreasonable, cause multiple-printed-panel for circuit board to occur tear etc. bad, sternly during tearing plate and transport open at via
Heavily have impact on the fine ratio of product of multiple-printed-panel for circuit board, therefore need badly and existing jigsaw structure is optimized design.
Summary of the invention
It is an object of the invention to provide a kind of multiple-printed-panel for circuit board, this multiple-printed-panel for circuit board can reduce tears plate and fortune open
The probability of tear during defeated, promotes fine ratio of product.
To achieve these goals, the following technical scheme of embodiment of the present invention offer:
The present invention provides a kind of multiple-printed-panel for circuit board, including technique edges and multiple circuit board daughter board, the plurality of electricity
Being connected by the first dowel between the plank plate of road, described technique edges is arranged on outside the plurality of circuit board daughter board
Side, the multiple described circuit board daughter board adjacent with described technique edges is by the second dowel with described technique edges even
Connecing, described technique edges is provided with hole, location, hole, described location is between two described second dowels.
Wherein, the monolateral distance at hole, described location and described technique edges edge is between 0.8mm～1.5mm.
Wherein, the width of described technique edges is between 3mm～6mm.
Wherein, the width of described second dowel is between 2mm～5mm.
Wherein, described circuit board daughter board is connected with described technique edges by two described second dowels.
Wherein, the width of described first dowel is identical with the width of described second dowel.
Wherein, the junction of described first dowel and described circuit board daughter board and described second dowel and institute
The junction stating circuit board daughter board is equipped with stamp hole.
Wherein, the quantity of described technique edges is two, and described two technique edges are set in parallel in the plurality of electricity
Outside the plank plate of road.
Wherein, the shape and size of the plurality of circuit board daughter board are the most identical.
Wherein, described multiple-printed-panel for circuit board is one side, two-sided or multilamellar.
The embodiment of the present invention has the advantage that or beneficial effect:
In the present invention, by the hole, location on technique edges is arranged on the method between two the second dowels,
Make during tearing plate and transport open, hole, location all in the second dowel inside, it is to avoid transporting
Collision in journey causes at hole, location damaged；In addition hole, location is arranged on inside the second dowel and can also keep away
Exempt from during tearing plate open owing to stress concentration causes the tear in hole, location.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement
In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is jointing-board structure of circuit board schematic diagram of the present invention；
Fig. 2 is the enlarged diagram of I part in Fig. 1；
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the present invention, and not
It it is whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making wound
The all other embodiments obtained on the premise of the property made work, broadly fall into the scope of protection of the invention.
Additionally, the explanation of following embodiment is with reference to additional diagram, may be used to reality in order to illustrate the present invention
The specific embodiment executed.The direction term being previously mentioned in the present invention, such as, " on ", D score, "front", "rear",
"left", "right", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings, therefore, use
Direction term in order to more preferably, be illustrated more clearly that and understand the present invention rather than instruction or infer indication
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that
Limitation of the present invention.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", should be interpreted broadly " being connected ", " connection ", for example, it may be fix connection, it is also possible to be detachable
Ground connects, or is integrally connected；Can be to be mechanically connected；Can be to be joined directly together, it is also possible in by
Between medium be indirectly connected to, can be the connection of two element internals.For those of ordinary skill in the art
Speech, can understand above-mentioned term concrete meaning in the present invention with concrete condition.
Additionally, in describing the invention, except as otherwise noted, " multiple " are meant that two or more.
If occurring the term of " operation " in this specification, it refers not only to independent operation, cannot be bright with other operation
When really distinguishing, as long as the effect desired by this operation that can realize then is also included within this term.It addition, this theory
In bright book with "～" numerical range that represents refer to using "～" before and after the numerical value recorded as minima and maximum
The scope that value is included.In the accompanying drawings, similar or identical being indicated by the same numeral of structure.
Referring to Fig. 1, the multiple-printed-panel for circuit board 100 of the present invention includes: technique edges 10 and multiple circuit board daughter board
20, the plurality of circuit board daughter board 20 is arranged in array, by the first dowel between multiple circuit board daughter boards
30 connect.It is positioned at the described circuit board daughter board 20 in outside by the second dowel 40 with described technique edges 10 even
Connect.Being additionally provided with hole 50, location on described technique edges 10, hole, described location 50 is for spelling described circuit board
Plate 100 positions, and hole, described location 50 is between two described second dowels 40.In other words,
More outermost described second dowel 40 in hole, described location 50 is near the middle part of whole multiple-printed-panel for circuit board.
In the present invention, by the hole, location on technique edges is arranged on the method between two the second dowels,
Make during tearing plate and transport open, hole, location all in the second dowel inside, it is to avoid transporting
Collision in journey causes at hole, location damaged；In addition hole, location is arranged on inside the second dowel and can also keep away
Exempt from during tearing plate open owing to stress concentration causes the tear in hole, location.
Incorporated by reference to refering to Fig. 2, in one preferred embodiment of the invention, hole, described location 50 is with described
Monolateral distance d at technique edges 10 edge is between 0.8mm～1.5mm.For technique edges 10,
Thin place is exactly the place nearest with the center of circle, hole 50, location, and stress herein is maximum, is easiest to fracture.Cause
This, in order to ensure the structural strength at this, it shall be guaranteed that 0.8mm≤d≤1.5mm.
It is further preferred that the width m of described technique edges is between 3mm～6mm.Usual described location
The diameter in hole is at about 2mm.Therefore, the width of technique edges is between 3mm～6mm just to can guarantee that enough
Structural strength.
In one preferred embodiment of the invention, the width h of described second dowel 40 between
Between 2mm～5mm.Described second dowel 40 in this range can ensure that circuit board daughter board 20 and institute
State technique edges 10 firmly to connect.It is understood that for ensureing consolidating between two circuit board daughter boards 20
Connecting, the width of described first dowel 30 is also in the range of this.It is further preferred that be positioned at outside
Described circuit board daughter board 20 is connected with described technique edges 10 by two described second dowels 40.
In one specific embodiment of the present invention, the width of described technique edges 10 is 4mm, hole, described location
50 a diameter of 2mm, then hole 50, location is 1mm with the monolateral distance of described technique edges.
It is further preferred that the junction of described first dowel 30 and described circuit board daughter board 10 is provided with postal
Ticket hole 60；Described second dowel 40 is provided with stamp hole 60 with the junction of described circuit board daughter board 10.Institute
The effect stating stamp hole 60 is, when multiple-printed-panel for circuit board 100 needs to split, and the plurality of circuit board
Daughter board 20 can be disassembled easily as each single daughter board.
In one specific embodiment of the present invention, the shape and size of the plurality of circuit board daughter board 20 are homogeneous
With.
It is understood that the number of described circuit board daughter board 20 can be any number in theory, but actual
Upper generally 2,4,6 or 8.Determine the even number that number is less than 8 former of such jigsaw 2
Because being, when circuit board daughter board 20 sum is more than 8, the circuit board daughter board 20 being positioned at centre is making
During easily cause bending even phenomenon of rupture because of surrounding unbalance stress；When circuit board daughter board 20 sum is strange
Number, it is also possible to cause one of them circuit board daughter board 20 to be in the isolated state not having symmetrical structure, also can lead
Cause about discontinuity and bend and even rupture.
In one specific embodiment of the present invention, described technique edges 10 is in strip, and two technique edges 10 are parallel
It is arranged on outside the plurality of circuit board daughter board 20.
In one specific embodiment of the present invention, every technique edges 10 is each provided with hole 50, two location.
In one specific embodiment of the present invention, described multiple-printed-panel for circuit board 100 can be one side, two-sided or
Multilamellar.It is understood that the plurality of circuit board daughter board 20 can be one side, two-sided or many most accordingly
Layer.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " tool
Body example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure,
Material or feature are contained at least one embodiment or the example of the present invention.In this manual, to upper
The schematic representation stating term is not necessarily referring to identical embodiment or example.And, the concrete spy of description
Levy, structure, material or feature can in any one or more embodiments or example in an appropriate manner
In conjunction with.
Embodiments described above, is not intended that the restriction to this technical scheme protection domain.Any upper
Amendment, equivalent and the improvement etc. made within stating the spirit of embodiment and principle, should be included in this
Within the protection domain of technical scheme.
Claims (10)
1. a multiple-printed-panel for circuit board, it is characterised in that include technique edges and multiple circuit board daughter board, the plurality of
Being connected by the first dowel between circuit board daughter board, described technique edges is arranged on the plurality of circuit board daughter board
Outside, the multiple described circuit board daughter board adjacent with described technique edges is by the second dowel and described technique edges
Connecting, described technique edges is provided with hole, location, hole, described location is between two described second dowels.
2. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that hole, described location and described technique edges
The monolateral distance at edge is between 0.8mm～1.5mm.
3. multiple-printed-panel for circuit board as claimed in claim 2, it is characterised in that the width of described technique edges between
Between 3mm～6mm.
4. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that the width of described second dowel is situated between
Between 2mm～5mm.
5. multiple-printed-panel for circuit board as claimed in claim 4, it is characterised in that described circuit board daughter board passes through two
Described second dowel is connected with described technique edges.
6. multiple-printed-panel for circuit board as claimed in claim 4, it is characterised in that the width of described first dowel with
The width of described second dowel is identical.
7. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that described first dowel and described electricity
The junction of the junction of road plank plate and described second dowel and described circuit board daughter board is equipped with stamp
Hole.
8. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that the quantity of described technique edges is two,
Described two technique edges are set in parallel in outside the plurality of circuit board daughter board.
9. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that the shape of the plurality of circuit board daughter board
Shape is the most identical with size.
10. multiple-printed-panel for circuit board as claimed in claim 1, it is characterised in that described multiple-printed-panel for circuit board be one side,
Two-sided or multilamellar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610382731.6A CN105979702A (en) | 2016-05-31 | 2016-05-31 | Circuit board spliced board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610382731.6A CN105979702A (en) | 2016-05-31 | 2016-05-31 | Circuit board spliced board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105979702A true CN105979702A (en) | 2016-09-28 |
Family
ID=57010210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610382731.6A Pending CN105979702A (en) | 2016-05-31 | 2016-05-31 | Circuit board spliced board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105979702A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973497A (en) * | 2017-04-07 | 2017-07-21 | 深圳怡化电脑股份有限公司 | Printed circuit board and cash handling device |
| CN108362831A (en) * | 2018-01-18 | 2018-08-03 | 深圳市可飞科技有限公司 | Atmospheric components detection device |
| CN108617085A (en) * | 2018-07-13 | 2018-10-02 | 安徽芯瑞达科技股份有限公司 | A kind of single stamp hole circuit board of down straight aphototropism mode set |
| CN109095434A (en) * | 2018-07-09 | 2018-12-28 | 武汉耐普登科技有限公司 | Structural member of sensor and its manufacturing method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201063967Y (en) * | 2007-04-20 | 2008-05-21 | 欣兴电子股份有限公司 | Transplant structure of printed circuit board |
| CN101784166A (en) * | 2010-03-05 | 2010-07-21 | 苏州工业园区时代华龙科技有限公司 | PCB (Printed Circuit Board) art border structure |
| CN202617498U (en) * | 2012-04-17 | 2012-12-19 | 深圳市奔创电子有限公司 | Precise PCB circuit board with positioning holes |
| CN103068160A (en) * | 2012-12-25 | 2013-04-24 | 广东欧珀移动通信有限公司 | Split type circuit board |
| CN103327739A (en) * | 2012-03-20 | 2013-09-25 | 上海嘉捷通信息科技有限公司 | PCS plate suitable for shape processing needless of inner positioning |
| CN204090299U (en) * | 2014-10-22 | 2015-01-07 | 苏州市三生电子有限公司 | A kind of miaow head wiring board |
| CN205160914U (en) * | 2015-11-16 | 2016-04-13 | 磊鑫达电子(深圳)有限公司 | PCB makeup structure |
| CN105517350A (en) * | 2015-11-27 | 2016-04-20 | 北大方正集团有限公司 | Manufacturing method for printed circuit board |
-
2016
- 2016-05-31 CN CN201610382731.6A patent/CN105979702A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201063967Y (en) * | 2007-04-20 | 2008-05-21 | 欣兴电子股份有限公司 | Transplant structure of printed circuit board |
| CN101784166A (en) * | 2010-03-05 | 2010-07-21 | 苏州工业园区时代华龙科技有限公司 | PCB (Printed Circuit Board) art border structure |
| CN103327739A (en) * | 2012-03-20 | 2013-09-25 | 上海嘉捷通信息科技有限公司 | PCS plate suitable for shape processing needless of inner positioning |
| CN202617498U (en) * | 2012-04-17 | 2012-12-19 | 深圳市奔创电子有限公司 | Precise PCB circuit board with positioning holes |
| CN103068160A (en) * | 2012-12-25 | 2013-04-24 | 广东欧珀移动通信有限公司 | Split type circuit board |
| CN204090299U (en) * | 2014-10-22 | 2015-01-07 | 苏州市三生电子有限公司 | A kind of miaow head wiring board |
| CN205160914U (en) * | 2015-11-16 | 2016-04-13 | 磊鑫达电子(深圳)有限公司 | PCB makeup structure |
| CN105517350A (en) * | 2015-11-27 | 2016-04-20 | 北大方正集团有限公司 | Manufacturing method for printed circuit board |
Non-Patent Citations (3)
| Title |
|---|
| 《电子工业生产技术手册》编委会: "《电子工业生产技术手册（12）通用工艺卷》", 31 March 1989, 国防工业出版社 * |
| 姚维煊等: "《摄像模组概论》", 30 September 2014, 东北大学出版社 * |
| 蔡建军: "《电子产品工艺与标准化》", 30 June 2008, 北京理工大学出版社 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973497A (en) * | 2017-04-07 | 2017-07-21 | 深圳怡化电脑股份有限公司 | Printed circuit board and cash handling device |
| CN108362831A (en) * | 2018-01-18 | 2018-08-03 | 深圳市可飞科技有限公司 | Atmospheric components detection device |
| CN109095434A (en) * | 2018-07-09 | 2018-12-28 | 武汉耐普登科技有限公司 | Structural member of sensor and its manufacturing method |
| CN108617085A (en) * | 2018-07-13 | 2018-10-02 | 安徽芯瑞达科技股份有限公司 | A kind of single stamp hole circuit board of down straight aphototropism mode set |
| CN108617085B (en) * | 2018-07-13 | 2023-10-31 | 安徽芯瑞达科技股份有限公司 | Single stamp hole circuit board for direct type backlight module |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160928 |
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| RJ01 | Rejection of invention patent application after publication |