CN206906514U - A kind of pcb board applied to radium-shine hole skew test point - Google Patents
A kind of pcb board applied to radium-shine hole skew test point Download PDFInfo
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- CN206906514U CN206906514U CN201720137208.7U CN201720137208U CN206906514U CN 206906514 U CN206906514 U CN 206906514U CN 201720137208 U CN201720137208 U CN 201720137208U CN 206906514 U CN206906514 U CN 206906514U
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- test point
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Abstract
The utility model discloses a kind of pcb board applied to radium-shine hole skew test point, including the mainboard and nonfunctional edge strip being connected, the nonfunctional edge strip is provided with 16 the first test points and a second independent test point, the surface of the nonfunctional edge strip is now equipped with Pu Tongqu, first test point is not turned on the Pu Tong areas, and second test point turns on the Pu Tong areas.The utility model adds one group of test-strips at the nonfunctional side of pcb board, as long as directly determining whether that radium-shine processing procedure causes by testing test-strips can：If test-strips turn on, it is judged to radium-shine being displaced to Pu Tongqu；If test-strips are not turned on, it is determined as that other processing procedures cause.Detected by such a method, saved verification time and the manpower of abnormal plate, improved production efficiency.
Description
Technical field
The invention belongs to a kind of detection method, be more particularly to a kind of pcb board applied to radium-shine hole skew test point and
Its method of testing.
Background technology
HDI plates are using a kind of higher circuit board of circuit distribution density of micro- blind buried via hole technology.HDI plates complete production
Afterwards, it is necessary to be detected to it.First by testing machine testing product quality, line conduction is normal, then product normally flow into
Product, the NG plates (short circuit or open circuit) after having tested then send and look for a region, find out the exception in abnormal plate manually by universal meter
Point.But the radium-shine bore dia of HDI plates is generally 100um or so, and aperture is smaller, and as many as wiring point or radium-shine hole number, increase
The work difficulty for looking for a personnel is added.
The blind hole quantity up to 2,000,000 of DHI plates or high-order HDI plates, the abnormal plate (short circuit and open circuit) after finished product test
Caused by various factors, if investigating concrete reason really, it is extremely difficult to find out the point of short circuit or open circuit.
The content of the invention
It is an object of the invention to provide a kind of higher pcb board for being applied to radium-shine hole skew test point of efficiency easy to operate
And its method of testing.
According to an aspect of the invention, there is provided a kind of pcb board applied to radium-shine hole skew test point, including be connected
The mainboard and nonfunctional edge strip connect, the nonfunctional edge strip are provided with 16 the first test points and a second independent test
Point, the surface of the nonfunctional edge strip are equipped with Pu Tongqu, and first test point is not turned on the Pu Tong areas, and described second
Test point turns on the Pu Tong areas.
In some embodiments, 16 first test points and the distance in the Pu Tong areas differ.
In some embodiments, first test point and the distance in the Pu Tong areas are more than or equal to 1.5mil.
In some embodiments, the mainboard is provided with test point in plate.
Its advantage is：The present invention adds one group of test-strips at the nonfunctional side of pcb board, as long as by testing
Bar can directly determines whether that radium-shine processing procedure causes：If test-strips turn on, it is judged to radium-shine being displaced to Pu Tongqu；If survey
Strip is not turned on, then is determined as that other processing procedures cause.Detected by such a method, saved verification time and the people of abnormal plate
Power, improve production efficiency.
Brief description of the drawings
Fig. 1 is a kind of structural representation of pcb board detected partially applied to radium-shine hole of an embodiment of the present invention；
Fig. 2 is the structural representation of the test-strips in Fig. 1.
Embodiment
Fig. 1 schematically shows the pcb board for being applied to radium-shine hole skew test point of one embodiment of the present invention.
As shown in figure 1, should be applied to the pcb board of radium-shine hole skew test point includes the mainboard 1 and nonfunctional edge strip 2 being connected.
Mainboard 1 is connected with nonfunctional bar 2, is connected by the V-groove conveniently to fracture, or fraction disjunctor.Nonfunctional bar 2
It was integral originally with mainboard 1, fraction tie point is formd after shaping is cut.Mainboard 1 is provided with test point 11 in plate.
There is blind hole in test-strips 22, the outer layer of blind hole is test point, and test point opens short circuit, then blind hole opens short circuit, and blind hole and Pu Tong areas are set
Two networks are counted, Pu Tongqu is displaced to Ru radium-shine, then universal meter test short circuit.What test point connected in plate is a blind hole, such as
When blind hole distance Pu Tong area 3mil, that short circuit are looked for, test point can be looked for since 3mil, such as blind hole distance Pu Tong area 2mil, that
When short circuit is looked for, test point can be looked for since 2mil, the surface of nonfunctional edge strip 2 is equipped with Pu Tong areas 21.On nonfunctional edge strip 2
Provided with test-strips 22, test-strips include 16 the first test points 221 and a second independent test point 222.First test
Point 221 is not turned on Pu Tongqu.Specifically, the first test point 221 is circle, and Pu Tong areas 21 are in 221 peripheral shape of the first test point
Do not contacted with the first test point 221 into the Shi Putong areas 21 of circular hole 211, and the center of circle of circular hole 211 and the center of circle of the first test point 221
It is overlapping, you can to ensure that distance of the inward flange of the circular hole in Pu Tong areas 21 to the center of circle of each first test point 221 is equal and spreads copper
Area 21 is not turned on test point 221.The distance in 16 the first test point 221 and Pu Tong areas 21 differs, the first test point
221 are more than or equal to 1.5mil with the distance in Pu Tong areas 21.In this embodiment, 16 the first test points 221 and Pu Tongqu
21 distance be respectively 1.5mil, 2.0mil, 2.5mil, 3.0mil, 3.5mil, 4.0mil, 4.5mil, 5.0mil, 5.5mil,
6.0mil, 6.5mil, 7.0mil, 7.5mil, 8.0mil, 8.5mil and 9.0mil.Second test point 222 turns on Pu Tong areas.
Specifically, the outward flange of the second test point 222 is connected with Pu Tong areas 21.
A kind of method applied to radium-shine hole skew test point, comprise the following steps：Prepare pcb board, pcb board includes nothing
Function edge strip 2；Pu Tong areas 21 and one group of test-strips 22, test-strips 22 are set to include 16 Ge Yuputong areas in nonfunctional edge strip 2
21 the first test points 221 being not turned on and the second test point 222 of a Ge Yuputong areas 21 conducting；Tested by universal meter idle
Test-strips 22 on energy edge strip 2：If test-strips 22 turn on, the radium-shine Kong Xiangputong areas 21 on pcb board are offset；If test-strips 22
It is not turned on, then is determined as that radium-shine hole is not offset.The universal meter used in this embodiment is can to survey open circuit and short circuit, own
PCB is manufacturing to look for the universal meter a little all used.
The present invention 2 one group of test-strips 22 of addition at the nonfunctional side of pcb board, as long as by testing the can of test-strips 22
Directly determine whether that radium-shine processing procedure causes：If test-strips 22 turn on, it is judged to radium-shine being displaced to Pu Tongqu；If test-strips 22
It is not turned on, then is determined as that other processing procedures cause.Detected by such a method, saved verification time and the manpower of abnormal plate, carried
Production efficiency is risen.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, do not taking off
On the premise of conceiving from the invention, various modifications and improvements can be made, these belong to protection scope of the present invention.
Claims (4)
1. a kind of pcb board applied to radium-shine hole skew test point, it is characterised in that including the mainboard being connected and nonfunctional side
Bar, the nonfunctional edge strip are provided with 16 the first test points and a second independent test point, the nonfunctional edge strip
Surface be equipped with Pu Tongqu, first test point is not turned on the Pu Tong areas, second test point and the paving copper
Area turns on.
2. the pcb board according to claim 1 applied to radium-shine hole skew test point, it is characterised in that described in 16
First test point and the distance in the Pu Tong areas differ.
3. the pcb board according to claim 2 applied to radium-shine hole skew test point, it is characterised in that described first surveys
Pilot and the distance in the Pu Tong areas are more than or equal to 1.5mi l.
4. the pcb board according to claim 1 applied to radium-shine hole skew test point, it is characterised in that on the mainboard
Provided with test point in plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720137208.7U CN206906514U (en) | 2017-02-15 | 2017-02-15 | A kind of pcb board applied to radium-shine hole skew test point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720137208.7U CN206906514U (en) | 2017-02-15 | 2017-02-15 | A kind of pcb board applied to radium-shine hole skew test point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206906514U true CN206906514U (en) | 2018-01-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720137208.7U Active CN206906514U (en) | 2017-02-15 | 2017-02-15 | A kind of pcb board applied to radium-shine hole skew test point |
Country Status (1)
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|---|---|
| CN (1) | CN206906514U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771824A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of pcb board and its method for being applied to radium-shine hole skew test point |
-
2017
- 2017-02-15 CN CN201720137208.7U patent/CN206906514U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771824A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of pcb board and its method for being applied to radium-shine hole skew test point |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Patentee after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Electronic Information Industry Park, Yancheng City, Jiangsu. Patentee before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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| CP02 | Change in the address of a patent holder |