CN105491806B - A kind of minimizing technology of embedding copper billet edge excessive glue - Google Patents
A kind of minimizing technology of embedding copper billet edge excessive glue Download PDFInfo
- Publication number
- CN105491806B CN105491806B CN201610022329.7A CN201610022329A CN105491806B CN 105491806 B CN105491806 B CN 105491806B CN 201610022329 A CN201610022329 A CN 201610022329A CN 105491806 B CN105491806 B CN 105491806B
- Authority
- CN
- China
- Prior art keywords
- copper billet
- excessive glue
- embedding copper
- standard
- borehole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of minimizing technology of embedding copper billet edge excessive glue, comprises the following steps：S1., the operating parameter of laser drill is set according to the excessive glue thickness of embedding copper billet pcb board and width；S2. calcination is carried out to the excessive glue around the embedding copper billet of the pcb board by the operating parameter using laser drill；S3. to the excessive glue around the embedding copper billet of the pcb board, caused carbonization material and remaining excessive glue carry out nog plate processing after laser drill calcination, the carbonization material and remaining excessive glue is departed from the pcb board；Also include after the step S3：Check whether the embedding copper billet surrounding of pcb board also has the excessive glue not eliminated, repeat step S1 to S3 is until eliminate excessive glue.Embedding copper billet edge excessive glue can efficiently be removed by the above method, while reduce the abrasion of pcb board plate face, making sheet quality is improved, reduce the scrappage of pcb board.
Description
Technical field：
The present invention relates to circuit board technology field, more particularly to a kind of minimizing technology of the embedding copper billet edge excessive glue of pcb board.
Background technology：
With the development of electronics industry, electronic product volume is less and less, and device layout is concentrated, and spacing is smaller, component
Power improves, and especially high-power heater members, these can all claim to the heat-sinking capability of pcb board.And traditional pcb board
Structure can not meet this requirement, thus occur the approach of a variety of heat dissipation problems for solving pcb boards in industry, such as：Using
High thermal conductivity material, Metal Substrate ＆ core plates, thick copper pcb board.
At present, there is the embedding copper pcb board technique of local radiating, this technique makes the embedding copper billet of pcb board directly contact big work(
Rate heater members, pointedly solve the local heat dissipation problem of pcb board, and the embedding copper pcb board locally to radiate is due to radiating surface
Product is small, and consumption copper material amount is few, and processing cost is low, and work flow is simple, widely used by industry.
Because embedding copper billet pcb board is when making, copper billet is opened a window by internal layer PP＆ core plates, is embedded in copper during pressing and is completed.
PP＆ core plates windowing 0.1mm typically big compared with copper billet, therefore resin overflow problem occurs during pressing.For the resin of spilling, typically adopt
With first being handled with abrasive belt grinding, then carry out hand sand will herein resin treatment it is clean.But because copper billet can be with pressing
Plate face forms certain drop, more difficult to clean out excessive glue using current method, and other positions mill leakage base easily occurs
Material phenomenon.
The content of the invention：
The present invention makes improvements for the above-mentioned problems of the prior art, i.e., the technical problem to be solved in the present invention is to carry
For a kind of method for expeditiously removing embedding copper billet pcb board excessive glue.
A kind of method for removing the embedding copper billet excessive glue of pcb board, comprises the following steps：
S1., the operating parameter of laser drill is set according to the excessive glue thickness of embedding copper billet pcb board and width；
S2. calcination is carried out to the excessive glue around the embedding copper billet of the pcb board by the operating parameter using laser drill；
S3. to the excessive glue around the embedding copper billet of the pcb board, caused carbonization material and residue are overflow after laser drill calcination
Glue carries out nog plate processing, the carbonization material and remaining excessive glue is departed from the pcb board.
Further, the laser drill operating parameter includes pulsewidth, energy, hair number and standard borehole aperture, its middle arteries
A width of 4-10ms, energy 4-6mj, hair number are sent out for 1-3, and standard borehole aperture is 0.1-0.175um.
Further, the hair number parameter of the laser drill is arranged to：Set apart from embedding copper billet edge 0.05-1.0mm positions
It is 3 hairs to put hair number, and it is 2 hairs to set hair number apart from embedding copper billet edge 1.0-2.0mm positions, apart from embedding copper billet edge 2.0-3.0mm
It is 1 hair to set hair number.
Further, the laser drill operating parameter also includes standard borehole arranging rule, the standard borehole arrangement
Rule is：Multi-turn is formed around the burn area of embedding copper billet, wherein, the overlapping 20%-30% in adjacent two circle burn areas；It is each
Circle burn area is formed by multiple size identicals drilling cluster overlapping arrangement, and phase is spaced between multiple drilling clusters in same circle
Together, overlap proportion 25-35%；Each drilling cluster includes inner ring standard borehole and outer ring standard borehole, and the inner ring standard is bored
Hole is formed by the rounded arrangement of 3-6 standard borehole, and inner ring standard borehole all intersects at point O, in being in as symmetrical centre using point O
The heart is symmetrical, and adjacent inner coil standard borehole overlap proportion is 20-50%；The outer ring standard borehole includes 6-12, all outer
Circle standard borehole is centrosymmetric using point O as symmetrical centre, and the center of circle of all outer ring standard boreholes is bored to point O distance for standard
2-2.5 times of pore radius.
Further, the drilling cluster arranging rule is：Each drilling cluster includes inner ring standard borehole and outer ring standard is bored
Hole, the inner ring standard borehole are formed by the rounded arrangement of 6 standard boreholes, and inner ring standard borehole all intersects at point O, with point
O is centrosymmetric for symmetrical centre, and adjacent inner coil standard borehole overlap proportion is 50%；The outer ring standard borehole is by 12 marks
The rounded arrangement of quasi- drilling is formed, and all outer ring standard boreholes are centrosymmetric using point O as symmetrical centre, and all outer ring standards are bored
The center of circle in hole to point O distance be 2 times of standard borehole radius.
Further, the drilling cluster arranging rule is：The inner ring standard borehole is by 3 rounded arrangements of standard borehole
Form, inner ring standard borehole all intersects at point O, is centrosymmetric using point O as symmetrical centre, the adjacent modular drilling center of circle and O
The angle that the line of point is formed is 120 °；The outer ring standard borehole is formed by the rounded arrangement of 6 standard boreholes, all outer rings
Standard borehole is centrosymmetric using point O as symmetrical centre, and adjacent outer ring standard borehole is tangent, the center of circle of all outer ring standard boreholes
Distance to point O is 2 times of standard borehole radius.
Further, the burn area is to 3.0mm closed area certainly at embedding copper billet edge 0.05mm.
Further, in the step S3, nog plate processing, the grinding electric current that the Plate grinder is set are carried out using Plate grinder
For 1.5-3.0A, transmission speed 3.0-4.0m/min.
Further, the mode of the Plate grinder progress nog plate processing includes abrasive belt grinding, adhesive-bonded fabric nog plate or ceramic grinding
Plate.
Further, also include after the step S3：Check whether the embedding copper billet surrounding of pcb board also overflows in the presence of what is do not eliminated
Glue；If in the presence of the excessive glue not eliminated, repeat step S1 to S3 is until eliminate excessive glue.
The minimizing technology of above-mentioned embedding copper billet edge excessive glue carries out calcination using laser drill to the excessive glue around embedding copper billet, then
To excessive glue calcination gestalt around the embedding copper billet of pcb board into carbonization material and a small amount of excessive glue not burnt carry out nog plate processing, therefore,
When nog plate is handled, nog plate intensity decreases, the effect of plate face will not be worn, is avoided in conventional nog plate operation because excessive nog plate is led
The phenomenon of mill leakage pcb board base material is caused, improves making sheet quality, reduces the scrappage of pcb board.
Brief description of the drawings：
Fig. 1 is the schematic diagram of the embedding copper billet edge excessive glue method of removal of better embodiment；
Fig. 2 is the schematic diagram that embedding copper billet presses back edge excessive glue；
Fig. 3 is the hole position layout viewing of the drilling cluster of embodiment one；
Fig. 4 is the hole position layout viewing of the drilling cluster of embodiment two；
Identifier declaration in figure：
Excessive glue scope around 20 embedding copper billet of 10PCB plates
30 embedding copper billet 41O points
42 standard borehole diameters 43 drilling cluster width
Embodiment：
To illustrate the thought and purpose of the present invention, invention is done further below in conjunction with the drawings and specific embodiments
It is bright.
Fig. 1 and Fig. 2 are refer to, it is a kind of method of the embedding copper billet excessive glues of efficient removal PCB of better embodiment, described
The method for efficiently removing the embedding copper billet excessive glues of PCB comprises the following steps：
S1：The operating parameter of laser drill is set according to the excessive glue thickness of embedding copper billet pcb board and width.Wherein, pcb board
Excessive glue thickness is 20-70mm, and width is from the outside 0-3mm in copper billet edge, it is preferable that laser drill is CO2 laser drills.Swash
Drill finish machine operating parameter includes pulsewidth, energy, hair number and standard borehole aperture, and wherein pulsewidth is 4-10ms, energy 4-6mj,
Send out number to send out for 1-3, standard borehole aperture is 0.1-0.175um.Preferably, pulsewidth 5ms, energy 5mj, hair number are sent out for 1-3,
The aperture of drilling is 0.15um.In addition, laser gas and concentration accounting (mol/mol) are：H20.15%；CO 5%；CO214%；
N218%；Remaining as He.
Specifically, due to more remote apart from embedding copper billet edge, excessive glue thickness is thinner, therefore the hair number parameter setting of laser drill
For：It is 3 hairs to set hair number apart from embedding copper billet edge 0.05-1.0mm positions, is set apart from embedding copper billet edge 1.0-2.0mm positions
It is 2 hairs to send out number, and it is 1 hair to set hair number apart from embedding copper billet edge 2.0-3.0mm.Both thicker part around divisible copper billet is so set
Excessive glue, and can reduce the damage to excessive glue thin location pcb board, improve removing glue efficiency.
The laser drill operating parameter also includes standard borehole arranging rule, and the standard borehole arranging rule is：Shape
Into multi-turn around the burn area of embedding copper billet, wherein, the overlapping 20%-30% in adjacent two circle burn areas；Each circle calcination area
Domain is formed by multiple size identicals drilling cluster overlapping arrangement, and identical, overlap ratio is spaced between multiple drilling clusters in same circle
Example is 25-35%；Each drilling cluster includes inner ring standard borehole and outer ring standard borehole, and the inner ring standard borehole is by 3-6
The rounded arrangement of standard borehole forms, and inner ring standard borehole all intersects at point O, is centrosymmetric using point O as symmetrical centre, phase
Adjacent inner ring standard borehole overlap proportion is 20-50%；The outer ring standard borehole includes 6-12, all outer ring standard boreholes
It is centrosymmetric using point O as symmetrical centre, the distance in the center of circle of all outer ring standard boreholes to point O is the 2- of standard borehole radius
2.5 again.
Specifically, resin overflow problem occurs because PP＆ core plates open a window 0.1mm typically big compared with copper billet, during pressing, overflows
Part is probably in 2.5mm or so, thus the burn area of laser drill is set to embedding copper billet periphery, from apart from embedding copper billet edge
To 3.0mm closed area at 0.05mm, preferably from copper billet edge 0.13mm to 2.5mm closed area.By laser
The burn area of drilling carries out above-mentioned setting, can efficiently remove copper billet edge excessive glue.
S2. calcination is carried out to the excessive glue around the embedding copper billet of the pcb board by the operating parameter using laser drill.
Due to the calcination of the laser beam of high temperature, the excessive glue of the embedding copper billet surrounding of pcb board is expanded, melts, evaporates, shunk
And carbonization, excessive glue calcination gestalt there may exist that a small amount of periphery is uncovered to be arrived into one layer of thin carbonization material of rear formation
Excessive glue not by calcination.The very thin carbonization material of this layer and not by the remaining excessive glue that calcination is arrived due to thickness of thin, with the knot of pcb board
It is weak with joint efforts, easily thoroughly removed by the processing of follow-up nog plate.
S3. to the excessive glue around the embedding copper billet of the pcb board, caused carbonization material and residue are overflow after laser drill calcination
Glue carries out nog plate processing, the carbonization material and remaining excessive glue is departed from the pcb board.
Due to pcb board after step A processing caused carbonization material and the remaining excessive glue thickness of thin not arrived by calcination,
It is weak with the adhesion of pcb board, thus the nog plate processing to pcb board reduces severity of grind and time herein.Carried out using Plate grinder
Nog plate processing, the mode that Plate grinder carries out nog plate processing is abrasive belt grinding, adhesive-bonded fabric nog plate or ceramic nog plate.The Plate grinder is set
The grinding electric current put is 1.5-3.0A, transmission speed 3.0-4.0m/min.
Preferably, 2A, transfer rate 3.5m/min are arranged to using adhesive-bonded fabric Plate grinder, the grinding electric current of Plate grinder,
Polish-brush wheel is 2 pairs, before a pair of mesh numbers be 320#, one rear pair polish-brush wheel is 500#, and the polish-brush wheel amplitude of oscillation is +/- 3.5mm, the amplitude of oscillation
Frequency is 200 times/min.Parameter setting as being carried out to Plate grinder, it not only can reach quick remove around the embedding copper billet of pcb board
Excessive glue after laser drill calcination the effect of caused carbonization material and remaining excessive glue, while plate face will not be worn, improve PCB
Quality.
Also include after the step S3：Check whether the embedding copper billet surrounding of pcb board also has the excessive glue not eliminated, if in the presence of
The excessive glue not eliminated, repeat step S1 to S3 is until eliminate excessive glue.
Embodiment one
Refer to Fig. 3, in the present embodiment, the aperture of drilling is 0.15mm, and the arranging rule for the cluster that drills is specially：Each brill
Hole cluster includes inner ring standard borehole and outer ring standard borehole, the inner ring standard borehole by the rounded arrangement of 6 standard boreholes and
Into inner ring standard borehole all intersects at point O, is centrosymmetric using point O as symmetrical centre, adjacent inner coil standard borehole overlap ratio
Example is 50%；The outer ring standard borehole by 12 standard boreholes it is rounded arrangement form, all outer ring standard boreholes using point O as
Symmetrical centre is centrosymmetric, and the distance in the center of circle of all outer ring standard boreholes to point O is 2 times of standard borehole radius.42 are
Standard borehole diameter, 43 be drilling cluster width.
Laser burns are carried out to excessive glue around the embedding copper billet of pcb board using the queueing discipline of above-mentioned drilling cluster, calcination dynamics is strong,
On the premise of ensureing the excessive glue around embedding copper billet by laser burns, and the excessive glue at the calcination position covered can be burnt
It is complete, the embedding copper billet pcb board that excessive glue thickness is 30-70mm is more suitable for, ensures the high efficiency of removing glue.
Embodiment two
Refer to Fig. 4, in the present embodiment, the aperture of drilling is 0.175mm, and the arranging rule for the cluster that drills is specially：It is each
Drilling cluster includes inner ring standard borehole and outer ring standard borehole, and inner ring standard borehole is formed by the rounded arrangement of 3 standard boreholes,
Inner ring standard borehole all intersects at point O, is centrosymmetric using point O as symmetrical centre, the adjacent modular drilling center of circle and the company of O points
The angle that line is formed is 120 °；The outer ring standard borehole is formed by the rounded arrangement of 6 standard boreholes, and all outer ring standards are bored
Kong Yidian O are centrosymmetric for symmetrical centre, and adjacent outer ring standard borehole is tangent, the center of circle of all outer ring standard boreholes to point O
Distance be 2 times of standard borehole radius.
Laser burns, standard borehole hole are carried out to excessive glue around the embedding copper billet of pcb board using the queueing discipline of above-mentioned drilling cluster
Position overlap proportion is less, on the premise of ensureing the excessive glue around copper billet by laser burns, can reduce laser drill quantity,
The energy expenditure of laser drill is saved, suitable for the embedding copper billet pcb board that excessive glue thickness is 20-30mm, ensures the high efficiency of removing glue.
The present invention removes minimizing technology of the method applied to pcb board face excessive glue of embedding copper billet edge excessive glue, and the present invention utilizes
Laser drill to around embedding copper billet excessive glue carry out calcination, then again to excessive glue calcination gestalt around the embedding copper billet of pcb board into carbon
Compound matter and a small amount of excessive glue not burnt carry out nog plate processing, therefore, when nog plate is handled, nog plate intensity decreases, without grinding
The effect of plate face is damaged, avoids in conventional nog plate operation because excessive nog plate causes the phenomenon of mill leakage pcb board base material, improves making sheet matter
Amount, reduce the scrappage of pcb board.
Above is the method for removal embedding copper billet edge excessive glue provided by the present invention is described in detail, herein
Apply specific case to be set forth the structural principle and embodiment of invention, above example is only intended to help and understood
The method and its core concept of invention；Meanwhile for those of ordinary skill in the art, according to the thought of invention, specific real
There will be changes in mode and application are applied, in summary, this specification content should not be construed as the limitation to invention.
Claims (8)
1. a kind of minimizing technology of embedding copper billet edge excessive glue, comprises the following steps：
S1., the operating parameter of laser drill is set according to the excessive glue thickness of embedding copper billet pcb board and width；The laser drill operation
Parameter includes pulsewidth, energy, hair number and standard borehole aperture, the hair number parameter of the laser drill and is arranged to：Apart from embedding copper billet
It is 3 hairs that edge 0.05-1.0mm positions, which set and send out number, and hair number is set as 2 hairs, distance apart from embedding copper billet edge 1.0-2.0mm positions
It is 1 hair that embedding copper billet edge 2.0-3.0mm, which sets hair number,；
The laser drill operating parameter also includes standard borehole arranging rule, and the standard borehole arranging rule is：Formed more
Ring around the burn area of embedding copper billet, wherein, the adjacent two circle overlapping 20%-30% in burn areas；It is each circle burn area by
Multiple size identicals drilling cluster overlapping arrangements form, and are spaced identical between multiple drilling clusters in same circle, and overlap proportion is
25-35%；Each drilling cluster includes inner ring standard borehole and outer ring standard borehole, and the inner ring standard borehole is by 3-6 standard
The rounded arrangement that drills forms, and inner ring standard borehole all intersects at point O, is centrosymmetric using point O as symmetrical centre, adjacent interior
It is 20-50% to enclose standard borehole overlap proportion；The outer ring standard borehole includes 6-12, and all outer ring standard boreholes are with point
O is centrosymmetric for symmetrical centre, and the distance in the center of circle of all outer ring standard boreholes to point O is the 2-2.5 of standard borehole radius
Times；
S2. calcination is carried out to the excessive glue around the embedding copper billet of the pcb board by the operating parameter using laser drill；
S3. to the excessive glue around the embedding copper billet of the pcb board, caused carbonization material and remaining excessive glue are entered after laser drill calcination
The processing of row nog plate, the carbonization material and remaining excessive glue is set to depart from the pcb board.
2. the minimizing technology of embedding copper billet edge excessive glue according to claim 1, it is characterised in that：It is described to swash in step S1
The pulsewidth of drill finish machine operating parameter is 4-10ms, and energy 4-6mj, standard borehole aperture is 0.1-0.175um.
3. the minimizing technology of embedding copper billet edge excessive glue according to claim 1, it is characterised in that：The drilling cluster arrangement rule
It is then：Each drilling cluster includes inner ring standard borehole and outer ring standard borehole, and the inner ring standard borehole is in by 6 standard boreholes
Circular arrangement forms, and inner ring standard borehole all intersects at point O, is centrosymmetric using point O as symmetrical centre, adjacent inner coil standard
The overlap proportion that drills is 50%；The outer ring standard borehole is formed by the rounded arrangement of 12 standard boreholes, all outer ring standards
Drilling is centrosymmetric using point O as symmetrical centre, and the center of circle of all outer ring standard boreholes to point O distance is standard borehole radius
2 times.
4. the minimizing technology of embedding copper billet edge excessive glue according to claim 1, it is characterised in that：The drilling cluster arrangement rule
It is then：Each drilling cluster includes inner ring standard borehole and outer ring standard borehole, and the inner ring standard borehole is in by 3 standard boreholes
Circular arrangement forms, and inner ring standard borehole all intersects at point O, is centrosymmetric using point O as symmetrical centre, adjacent modular drilling
The angle that the line of the center of circle and O points is formed is 120 °；The outer ring standard borehole is formed by the rounded arrangement of 6 standard boreholes,
All outer ring standard boreholes are centrosymmetric using point O as symmetrical centre, and adjacent outer ring standard turn hole is tangent, and all outer ring standards are bored
The center of circle in hole to point O distance be 2 times of standard borehole radius.
5. the minimizing technology of embedding copper billet edge excessive glue according to claim 1, it is characterised in that：The burn area is certainly
To 3.0mm closed area at embedding copper billet edge 0.05mm.
6. the minimizing technology of embedding copper billet edge excessive glue according to claim 1, it is characterised in that：In the step S3, adopt
Nog plate processing is carried out with Plate grinder, the grinding electric current that the Plate grinder is set is 1.5-3.0A, transmission speed 3.0-4.0m/
min。
7. the minimizing technology of embedding copper billet edge excessive glue according to claim 6, it is characterised in that：The Plate grinder is ground
The mode of plate processing includes abrasive belt grinding, adhesive-bonded fabric nog plate or ceramic nog plate.
8. the minimizing technology of embedding copper billet edge excessive glue according to claim 1, it is characterised in that：After the step S3 also
Including：Check whether the embedding copper billet surrounding of pcb board also has the excessive glue not eliminated；If in the presence of the excessive glue not eliminated, repeat step S1
To S3 until eliminating excessive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610022329.7A CN105491806B (en) | 2016-01-13 | 2016-01-13 | A kind of minimizing technology of embedding copper billet edge excessive glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610022329.7A CN105491806B (en) | 2016-01-13 | 2016-01-13 | A kind of minimizing technology of embedding copper billet edge excessive glue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105491806A CN105491806A (en) | 2016-04-13 |
| CN105491806B true CN105491806B (en) | 2018-04-03 |
Family
ID=55678406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610022329.7A Expired - Fee Related CN105491806B (en) | 2016-01-13 | 2016-01-13 | A kind of minimizing technology of embedding copper billet edge excessive glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105491806B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328832A (en) * | 2016-10-27 | 2017-01-11 | 武汉华星光电技术有限公司 | Removal method of anisotropic conductive adhesive film |
| CN106654062B (en) * | 2016-12-26 | 2018-11-09 | 武汉华星光电技术有限公司 | The method for detaching polaroid and flexible OLED display panel |
| CN109786151A (en) * | 2019-01-30 | 2019-05-21 | 成都宏明双新科技股份有限公司 | A kind of hot pressing aftertreatment technology of mobile phone volume key |
| CN114101224A (en) * | 2020-08-28 | 2022-03-01 | 碁鼎科技秦皇岛有限公司 | Excessive glue removing method and device for circuit board |
| CN112235956A (en) * | 2020-11-06 | 2021-01-15 | 惠州市盈帆实业有限公司 | Production and manufacturing process of copper-embedded circuit board based on PVC material |
| CN115301636A (en) * | 2022-08-12 | 2022-11-08 | 阳程科技股份有限公司 | Laser degumming method and degumming equipment adopting same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2527956A1 (en) * | 1982-06-08 | 1983-12-09 | Limours Const Meca Elect Elect | Laminated printed circuit board drilling guide plate - has mineral-loaded thermo-setting layer and aluminium layer to dissipate frictional heat |
| CN103347365A (en) * | 2013-06-07 | 2013-10-09 | 东莞生益电子有限公司 | Method for removing laminated flowing glue on PCB surface |
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
-
2016
- 2016-01-13 CN CN201610022329.7A patent/CN105491806B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2527956A1 (en) * | 1982-06-08 | 1983-12-09 | Limours Const Meca Elect Elect | Laminated printed circuit board drilling guide plate - has mineral-loaded thermo-setting layer and aluminium layer to dissipate frictional heat |
| CN103347365A (en) * | 2013-06-07 | 2013-10-09 | 东莞生益电子有限公司 | Method for removing laminated flowing glue on PCB surface |
| CN103997860A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Selective surface treatment process method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105491806A (en) | 2016-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105491806B (en) | A kind of minimizing technology of embedding copper billet edge excessive glue | |
| CN108718480B (en) | Inner and outer 6OZ ultra-thick copper PCB and manufacturing method thereof | |
| CN102883558B (en) | Manufacturing method of single plating hole copper | |
| TW200707643A (en) | Semiconductor device having through electrode and method of manufacturing the same | |
| CN108447643B (en) | Magnetic shielding sheet | |
| RU2013128449A (en) | METHOD FOR MANUFACTURING A PANEL INCLUDING A WEAR-RESISTANT LAYER AND A PANEL | |
| CN103347365B (en) | Remove the method for pcb board surface layer baric flow glue | |
| CN103249253A (en) | High precision aluminium base material circuit board manufacturing process and system | |
| CN105934097A (en) | Method for processing semi-hole plate | |
| CN101716744B (en) | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board | |
| CN102781158A (en) | PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect | |
| CN103338592B (en) | A kind of buried resistor and processing technology thereof | |
| CN104093283A (en) | Vacuum hole plugging method applied to PCB (Printed Circuit Board) | |
| WO2010109430A3 (en) | Apparatus and method for manufacturing an integrated circuit | |
| CN204090281U (en) | A kind of PCB | |
| CN106028682A (en) | PCB hole plating method | |
| CN106413291A (en) | Deep-groove PCB board and processing method thereof | |
| WO2009013889A1 (en) | Electrode plate for battery, polar plate group for battery, lithium secondary battery, method for manufacturing electrode plate for battery, and apparatus for manufacturing electrode plate for battery | |
| CN203120303U (en) | Apparatus used for manufacturing heat dissipation structure of printed circuit board | |
| CN104113985B (en) | The processing method in hole on edging cleaning method and system, printed circuit board (PCB) | |
| CN103025066B (en) | A kind of preparation method of metal base single-sided doubling plate | |
| CN108425081A (en) | A kind of copper aluminium rolling casting bonding strip online annealing method | |
| CN101699936B (en) | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating | |
| CN107249258A (en) | A kind of repair method of PCB pads | |
| CN204565884U (en) | A kind of single side polishing machine bonding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 Termination date: 20210113 |