CN101716744B - Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board - Google Patents
Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board Download PDFInfo
- Publication number
- CN101716744B CN101716744B CN2009101938827A CN200910193882A CN101716744B CN 101716744 B CN101716744 B CN 101716744B CN 2009101938827 A CN2009101938827 A CN 2009101938827A CN 200910193882 A CN200910193882 A CN 200910193882A CN 101716744 B CN101716744 B CN 101716744B
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- blind hole
- brush roll
- circuit board
- density interconnection
- plate
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Abstract
The invention relates to a board surface leveling method of a loop-free blind hole high-density interconnection printing circuit board, which has the technical key point that the outer layer of a high-density interconnection printing circuit board is performed with whole board plating and is put into a scrubbing machine with the transmission speed of 1.5-2.0m/min; the pressure of a brush roll cooling water nozzle is 1.0-1.5 kg/cm<2>, the temperature of cooling water is 20-30 DEG C, brush roll grinding current is 0.8-1.2A, the horizontal swinging amplitude of the brush roll is 5mm, and the swinging frequency is 350 times/ min; and the board surface of the high-density interconnection printing circuit board is ground and levelled. As the board surface of the printing circuit board is ground to be levelled, blind hole surface and surface copper are on the same horizontal plane; when a dry film is pasted, the blind hole can be tightly stuck with the dry film without adding a welding ring; during acid etching, blind hole integrity is not damaged, thus effectively improving the wiring density of the board surface of the printing circuit board.
Description
Technical field
The present invention relates to the method for a kind of acyclic blind hole high-density interconnection printing road plate plate face leveling.
Background technology
After high density interconnect HDI printed wiring board was accomplished laser drilling blind hole and the plating of whole plate, can there be certain drop in the surface of blind hole and surperficial Copper Foil, and promptly the blind hole place has pit; Thereby make the copper laminar surface present the pit phenomenon; When pasting dry film, because of surperficial blind hole place exists pit to cause between dry film and the blind hole slit is arranged, like this so the circuit at each blind hole place must have a weld-ring than the big 0.2mm of blind hole; So that isolating, blind hole and etching liquid medicine is not etched; When acid etching, etching liquid medicine just can not get into and cause the Copper Foil at blind hole place to be etched in the slit, causes atresia to melt the problem on road like this.Because each blind hole place needs the weld-ring than the big 0.2mm of blind hole, weld-ring has taken bigger wiring space, has therefore limited the wiring density of printed wiring board greatly.
Summary of the invention
The object of the invention just provides the method for a kind of acyclic blind hole high-density interconnection printing road plate plate face leveling.
The method of acyclic blind hole high-density interconnection printing road plate plate face leveling: after the skin of high-density interconnection printing road plate put in order the plate plating; Put into Plate grinder; Plate grinder transmission speed 1.5～2.0m/min, the nozzle exit pressure 1.0～1.5kg/cm of brush roll cooling water
2, 20～30 ℃ of the temperature of cooling water, the grinding electric current 0.8～1.2A of brush roll, the horizontal rocking tendency 5mm of brush roll, 350 times/min of wobble frequency grind leveling to high-density interconnection printing road plate plate face.
Described brush roll is 600 orders or 800 purposes pottery brush roll.
The present invention makes the plate surface reach smooth owing to grind printed wiring board, and promptly the blind hole surface becomes same horizontal plane with table copper, when pasting dry film; Blind hole need not increase weld-ring and just can be adjacent to firmly with dry film, when acid etching, just can not damage the integrality of blind hole yet; So just effectively increased the wiring density of printed wiring board plate face; Wiring quantity can improve more than 20%, thereby adapts to electronic product to light, thin, short, little development with constantly increase the needs of function, can alleviate printed circuit board to higher number of plies Development Trend; And effectively improve reliability of products, practice thrift manufacturing cost.
The specific embodiment
Below in conjunction with embodiment, the present invention is done further description, but it does not represent unique embodiment of the present invention.
Embodiment one
After the high-density interconnection printing road plate of accomplishing operations such as outer laminated, laser drilling blind hole, power auger through hole, de-smear, heavy copper put in order the plate plating; Put into Plate grinder; The transmission speed of Plate grinder is 1.5m/min, the nozzle exit pressure 1.0kg/cm of brush roll cooling water
2, 20 ℃ of the temperature of cooling water, the grinding electric current 0.8A of 600 orders pottery brush roll, the horizontal rocking tendency 5mm of brush roll, the 350 times/min of wobble frequency of brush roll grinds leveling to high-density interconnection printing road plate plate face.
Embodiment two
After the high-density interconnection printing road plate of accomplishing operations such as outer laminated, laser drilling blind hole, power auger through hole, de-smear, heavy copper put in order the plate plating; Put into Plate grinder; The transmission speed of Plate grinder is 2.0m/min, the nozzle exit pressure 1.5kg/cm of brush roll cooling water
2, 30 ℃ of the temperature of cooling water, the grinding electric current 1.2A of 800 orders pottery brush roll, the horizontal rocking tendency 5mm of brush roll, the 350 times/min of wobble frequency of brush roll grinds leveling to high-density interconnection printing road plate plate face.
Embodiment three
After the high-density interconnection printing road plate of accomplishing operations such as outer laminated, laser drilling blind hole, power auger through hole, de-smear, heavy copper put in order the plate plating; Put into Plate grinder; The transmission speed of Plate grinder is 1.8m/min, the nozzle exit pressure 1.2kg/cm of brush roll cooling water
2, 25 ℃ of the temperature of cooling water, the grinding electric current 1.0A of 600 orders pottery brush roll, the horizontal rocking tendency 5mm of brush roll, the 350 times/min of wobble frequency of brush roll grinds leveling to high-density interconnection printing road plate plate face.
After high-density interconnection printing road plate plate face grinding leveling, get into the washing section of Plate grinder, pressure washing pressure 2.0～3.0kg/cm
2, high-pressure washing pressure 10～15kg/cm
2, supply washing 12～15L/min cleans the circuit board that is ground after flattening; Washing gets into the cold wind section of drying up, again behind 75～90 ℃ of hot blast dryings after section blots after sponge sucks in water; The two-sided dry film that sticks simultaneously at the printed wiring board that dries up leaves standstill>=15 minutes; The circuit film with designing carries out contraposition, because PCB surface is ground leveling, so the circuit that is connected with blind hole in the circuit film has been designed to not have ring-type; To put into exposure machine to the wiring board of good position and make public, exposure intensity is 6～9 lattice epiphragmas; The wiring board that exposure is finished leaves standstill>=and 15 minutes, to put into developing machine and develop, downforce is 1.8～2.3kg/cm on the developing nozzle
2, developing powder is 3～4m/min; Wiring board after developing is got into acid etching machine carry out etching, downforce is 2～3kg/cm on the etching nozzle
2, etching speed is 4～6m/min; After the wiring board after the etching takes off film, cleaning, oven dry, promptly accomplished the making of acyclic blind hole.
Claims (2)
1. the method for an acyclic blind hole high-density interconnection printing road plate plate face leveling; After it is characterized in that the skin of high-density interconnection printing road plate put in order plate and electroplate; Put into Plate grinder, Plate grinder transmission speed 1.5～2.0m/min, the nozzle exit pressure 1.0～1.5kg/cm of brush roll cooling water
2, 20～30 ℃ of the temperature of cooling water, the grinding electric current 0.8～1.2A of brush roll, the horizontal rocking tendency 5mm of brush roll, 350 times/min of wobble frequency grind leveling to high-density interconnection printing road plate plate face.
2. the method for acyclic blind hole high-density interconnection printing according to claim 1 road plate plate face leveling is characterized in that brush roll is 600 orders or 800 purposes pottery brush roll.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101938827A CN101716744B (en) | 2009-11-12 | 2009-11-12 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101938827A CN101716744B (en) | 2009-11-12 | 2009-11-12 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101716744A CN101716744A (en) | 2010-06-02 |
| CN101716744B true CN101716744B (en) | 2012-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101938827A Expired - Fee Related CN101716744B (en) | 2009-11-12 | 2009-11-12 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN101716744B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548222A (en) * | 2010-12-30 | 2012-07-04 | 北大方正集团有限公司 | Method and device for manufacturing circuit board and circuit board |
| CN106028655B (en) * | 2016-06-23 | 2018-09-07 | 江西景旺精密电路有限公司 | A kind of quick nog plate method for adhering film of outer-layer circuit plate |
| CN106132090B (en) * | 2016-06-30 | 2019-03-22 | 广德宝达精密电路有限公司 | A kind of method of conductive pattern leveling in PCB |
| CN108133886A (en) * | 2017-12-11 | 2018-06-08 | 上海申和热磁电子有限公司 | A kind of method of DBC substrate backs grinding |
| CN110545620A (en) * | 2019-08-06 | 2019-12-06 | 宁波华远电子科技有限公司 | Hole filling process for through hole of circuit board |
| CN114423173B (en) * | 2021-12-13 | 2023-04-07 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic substrate with high bonding strength and preparation process thereof |
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| WO2003019653A2 (en) * | 2001-08-24 | 2003-03-06 | Schott Glas | Method for producing contacts and printed circuit packages |
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN101365299A (en) * | 2008-09-19 | 2009-02-11 | 深圳市和美精艺科技有限公司 | Manufacturing method for memory card series circuit board having thickened golden finger and memory card |
| CN101460011A (en) * | 2007-12-12 | 2009-06-17 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing method and circuit board |
| CN100505195C (en) * | 2003-06-30 | 2009-06-24 | 美龙翔微电子科技（深圳）有限公司 | Method for forming solid conductive via hole of integrated circuit packaging base plate |
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2009
- 2009-11-12 CN CN2009101938827A patent/CN101716744B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003019653A2 (en) * | 2001-08-24 | 2003-03-06 | Schott Glas | Method for producing contacts and printed circuit packages |
| CN100505195C (en) * | 2003-06-30 | 2009-06-24 | 美龙翔微电子科技（深圳）有限公司 | Method for forming solid conductive via hole of integrated circuit packaging base plate |
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN101460011A (en) * | 2007-12-12 | 2009-06-17 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing method and circuit board |
| CN101365299A (en) * | 2008-09-19 | 2009-02-11 | 深圳市和美精艺科技有限公司 | Manufacturing method for memory card series circuit board having thickened golden finger and memory card |
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| CN101716744A (en) | 2010-06-02 |
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Granted publication date: 20120118 Termination date: 20201112 |