CN100505195C - Method for forming solid conductive via hole of integrated circuit packaging base plate - Google Patents
Method for forming solid conductive via hole of integrated circuit packaging base plate Download PDFInfo
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- CN100505195C CN100505195C CNB031396755A CN03139675A CN100505195C CN 100505195 C CN100505195 C CN 100505195C CN B031396755 A CNB031396755 A CN B031396755A CN 03139675 A CN03139675 A CN 03139675A CN 100505195 C CN100505195 C CN 100505195C
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Abstract
The invention is a method of forming solid electric conduction vias in an IC packing substrate, including: a. pasting a film on one of the two line surfaces in need of connection and forming the needed hole shape of electric conduction hole in the corresponding position on the film to solid copper electric conduction via; b. by plating process, forming a solid copper column in the hole shape and eliminating the film; c. coating an insulating medium and by grind plate or pattern transfer process, exposing the end surface of the solid copper column; d. depositing a metallic thin layer on the end surface of the copper column and the insulating medium surface, respectively, and by patter plating process, forming the needed line surfaces on the surface of the metallic thin film layer; e. on the new formed line surfaces, repeating the operations of the above steps a-d, and completing the connection of solid electric conduction vias between adjacent line-layer patterns on many insulating layers. It realizes the solid electric conduction vias by simple and convenient processes, further realizes the connection between electric signals on different line layers of the substrate, assures the integrity of signal transmission and meets the requirement on high reliability.
Description
Technical field
The present invention relates to the integrated circuit (IC) substrate package manufacturing technology, specifically is the insulating barrier interconnected required solid conductive via manufacturing process of two conductor layers up and down in a kind of integrated circuit (IC) substrate package.
Background technology
Along with the miniaturization of integrated circuit development, the requirement of integrated circuit encapsulation is also improved thereupon, wherein to the requirement of base plate for packaging more towards gently, thin, short, little direction develops, and guarantees good electrical properties and hot property.For reaching above requirement, the high reliability conductive via that size is littler has very big influence to the density of wiring and electricity, the hot property after the encapsulation.
As everyone knows, must there be some conductive vias to be used for connecting the circuit of the neighbouring lead aspect of insulating barrier on the Ic base plate for packaging.And one of manufacture method of traditional conductive via is a mechanical hole building, as punch press or drilling machine, on substrate, go out or get out needed through hole, then by heavy copper, electroplating technology forms hollow conductive via, with reference to Fig. 1, each several part is a substrate 1 among the figure, lower floor's conductor side 2, insulating barrier 3, hollow conductive via 4, topping wire face 5, this hollow conductive via has very big negative effect to follow-up technological process, the line pattern transfer process after hollow conductive via is shaped for example, because it is bad that the rough and uneven in surface meeting of the substrate surface that hollow bore causes causes the photosensitive resist film to attach, and easily causes line defct.This in addition through hole has very big influence to wires design, makes that the cloth hole is restricted on the racket, and special wire structures such as folded hole can not be realized, thereby has restricted the raising of wiring density.
The manufacture method two of conductive via is to utilize the optical imagery dielectric at present or utilize the blind conductive via of laser punching fabrication techniques and bury conductive via.Manufacture method blind, that bury conductive via is to form the nick hole of exposing copper layer below the dielectric layer by the figure transfer technology on sensitization dielectric material, or directly on insulating medium layer, form the nick hole expose copper layer below the dielectric layer by laser ablation technology, form blind, buried conductive via by heavy copper, electroplating technology then, as shown in Figure 2 (among the figure, the 1-substrate; 2-lower floor conductor side; The 3-insulating barrier; 5-topping wire face; The blind conductive via of 6-; 7-buries conductive via), blind, bury conductive via because its technology, hole shape control difficulty becomes big (upside down funnel shape) at the bottom of often causing the hole, causes follow-up hole metallization difficulty in process, the reliability instability of conductive via.Blind in addition, bury conductive via can nature after shaping depression, if need to continue to make wire pattern on the hole, consent or electroplating technology that must application specific be filled and led up depression, could realize folding on hole, the racket special wire structures such as cloth hole.
For the through-hole type conductive via or blind, bury conductive via, also have at present by special process such as reverse impulse plating hollow or the plating of depression conductive via are solid conductive via, but existing, it needs to use particular electrical coating apparatus, the problem that cost height and efficient are lower.
Summary of the invention
In view of existing hollow bore formula conductive via or depression blind buries the problems referred to above that conductive via causes integrated circuit (IC) substrate package to occur, the invention provides a kind of solid conductive via manufacturing process of integrated circuit (IC) substrate package, realize solid conductive via by technology simply and easily, thereby realize the conducting of the signal of telecommunication between the different conductor layer of integrated circuit (IC) substrate package, guarantee the integrality of signal transmission, and satisfy high reliability request.
The solid conductive via manufacturing process of integrated circuit (IC) substrate package of the present invention comprises the steps:
A needs insulating medium layer that conducting connects up and down on one of two-layer conductor wire road surface in integrated circuit (IC) substrate package, adhered film, and corresponding solid copper conductive via position forms the hole shape of the conductive via that requires on film;
B, in the hole shape of the conductive via of film, form solid copper pin, remove film by electroplating technology;
Apply dielectric on c, the conductor wire road surface after forming the copper post, and described solid copper pin end face is exposed;
D, on solid copper pin end face that exposes and dielectric face the plated metal thin layer, and electroplate by graphic plating technology or whole plate and to add the figure etch process and on thin metal layer, form required circuit surface;
E, on the new circuit surface that is shaped, repeat the operation of above-mentioned steps a-d, finish that the solid conductive via between the adjacent lines layer pattern connects on the multilayer dielectric layer.
The present invention has following advantage compared with prior art:
Adopt the inventive method can realize that the solid conductive via between the integrated circuit (IC) substrate package conductor layer connects, this kind connection is connected the area of comparing with the hollow conductive via of perforation that the traditional mechanical hole creating technology forms and takies littler, and hole corresponding line racket up and down keeps complete, do not destroyed by via hole, corresponding electric property performance is also more good.The inventive method can form the solid copper pin of undersized circuit substrate interlayer, and mechanical hole building is not to almost realizing less than 100 microns via hole processing.
Compare with traditional blind hole and buried via hole, adopt present technique can realize the solid copper pin connectivity structure of interlayer, formation is connected with the conductive via of circuit surface coplane (polish-brush exposed copper post technology) or depression very shallow (figure transfer exposed copper post technology), and its follow-up circuit forming technology is relatively easily realized.In addition, solid copper conductive via of the present invention has avoided becoming at the bottom of traditional blind, hole that buried via hole technology is easy to generate the problem of big (upside down funnel shape), has improved the reliability that via hole connects.
Also can realize the syndeton in above solid hole though adopt special electroplating technology, but implementation procedure of the present invention is different fully with it, only just can finish solid copper conductive via syndeton,, have lower realization cost than more simple and feasible with conventional traditional handicraft.
Description of drawings
The conductive via structure generalized section that Fig. 1 forms for machine drilling;
Fig. 2 is blind for tradition, bury conducting via structure generalized section;
The solid conducting via structure generalized section that Fig. 3 realizes for the present invention;
Fig. 4 implementation step 1, electroplating current conductting layer generalized section;
Fig. 5 implementation step 2, the generalized section on the film after the solid conductive via shape of formation;
Fig. 6 implementation step 3, copper are leant on the generalized section after the formation;
Fig. 7 implementation step 4, the generalized section behind the coating insulating medium layer;
Fig. 8 implementation step 5, copper is leant on the generalized section after end face exposes in the sensitization insulating barrier;
Fig. 9 implementation step 5, copper is leant on the profile after end face exposes in the non-sensitization insulating barrier;
Figure 10 implementation step 6 is transferred to profile behind the photosensitive film with wire pattern;
Embodiment
Below in conjunction with accompanying drawing the inventive method is further specified.
Profile after the solid conductive via that Fig. 3 makes for the inventive method is shaped.Wherein, (1) is substrate, and (2) are lower floor's circuit surface, and (5) are the upper layer circuit face, and (3) are insulating barrier, and (8) are solid conductive via.
The solid conductive via of the substrate of the present invention main process that is shaped is as follows:
A, go up in insulating medium layer lower floor electric wire road surface (2) that substrate (1) needs conducting to connect and to attach photosensitive film, adopting mask, exposure, development is the hole shape that figure transfer technology corresponding solid copper conductive via position on photosensitive film of feature forms the conductive via that requires;
Or go up to attach non-photosensitive film in lower floor electric wire road surface (2), adopt laser drilling technology corresponding solid copper conductive via position on non-photosensitive film to form the hole shape of the conductive via that requires.
B, in the hole shape of the conductive via of film, form solid copper pin, remove dry film then by electroplating technology.
Apply dielectric on c, the conductor wire road surface after forming solid copper pin, and make described solid copper pin end face expose insulating medium layer.
If when making insulating medium layer with photosensitive material, adopting traditional mask, exposure, development is that the graph transfer method of feature makes the solid copper pin end face expose insulating barrier.
When adopting non-photosensitive material to make insulating medium layer, adopt traditional plate face polish-brush technology to make the solid copper pin end face expose insulating barrier.
D, on solid copper pin end face that exposes and dielectric face the plated metal thin layer, and Graphics Application electroplating technology or whole plate electroplate and add the figure etch process form required circuit surface on thin metal layer, finishes the connection of solid conductive via.With microetch technology the plated metal thin layer between wire pattern is removed then.
In the specific embodiment, can be by ripe chemical deposition deposition thin copper layer on solid copper pin end face that exposes and dielectric face.
E, on the new circuit surface that is shaped, repeat the operation of above-mentioned steps a-d, finish that the solid conductive via between the adjacent lines layer pattern connects on the multilayer dielectric layer.
Concrete implementation step is:
1. the formation of electroplating current conductting layer
With reference to Fig. 4, for some wire pattern (2) that needs to form solid conductive via on the substrate (1), because some wire pattern (2) may be not to be electrically connected with the plating folder dot pattern of substrate (1) edges of boards, therefore need to deposit the thin metal deposition layer (9) of one deck by the metallochemistry depositing operation on the whole base plate face, the conduction that forms between all isolated wire patterns connects.
2. the formation of solid conductive via shape on the film
As shown in Figure 5, upward by film sticking equipment film (10) being attached to substrate (1) at substrate (1) goes up by step 1 on the formed metal deposition layer (9).Film (10) but can be with the photosensitive film (as the photosensitive resist film) of sensitization, or the film of non-sensitization.For photosensitive film, utilize mask, expose, be developed in upward formation conductive via shape (11) of film (10); For non-photosensitive film, utilize LASER HEAT pit technology to go up and form conductive via shape (11) at film (10).
3. the removal of the plating of solid copper pin, film and metal deposition layer
Utilize electro-coppering post (12) in the hole of the conductive via that electroplating technology forms on film, in moving back film liquid medicine film (10) is removed then, the metal deposition layer (9) that will expose in copper etching liquid medicine is removed, and just obtains solid copper pin structure shown in Figure 6.
4. coating insulating medium layer
Behind the completing steps 3, utilize coating device such as screen printer that the dielectric material (3) of ink-like is coated in and form copper and lean on the lead aspect at wire pattern (2) place of (12).With roasting plant the dielectric of ink-like is solidified into semi-cured state, sees shown in Figure 7.
Above-mentioned dielectric material can be selected conventional sensitization insulating material for use, the ENVISI0N PDD-9016 sensitization insulating resin of producing as U.S. Le Si company; Also can select conventional non-sensitization insulating material for use, the HRP-700 series insulating resin of producing as Japanese sun printing ink company etc.
5. the exposure of copper styletable face in the insulating medium layer
A. the exposure of copper styletable face in the sensitization insulating medium layer
With reference to Fig. 8, but when used insulating material is the sensitization insulating material in the step 4, can adopt mask, exposure, developing process that copper styletable face is exposed.
B. the exposure that copper is leant on end face in the non-sensitization insulating medium layer
When used insulating material is non-sensitization insulating material in the step 4, can utilizes Plate grinder that the plate face is carried out polish-brush and handle, make the copper styletable look like Fig. 9 and expose.
6. metallization of plate face and circuit form
The applied metal chemical deposition process is at the thin metal deposition layer of whole plate face deposition one deck, and utilize film coating process on thin metal deposition aspect, to paste photosensitive film (13), utilize mask, exposure, developing process to go up again and form required wire pattern, see Figure 10 at photosensitive film (13).
Utilize electroplating technology on the figure that photosensitive film forms, to finish graphic plating then, and just finish whole technical process after with technology identical in the step 3 photosensitive film (13) and metal deposition layer (9) being removed, obtain solid conductive via (8) shown in Figure 3 and required insulating barrier (3) upper conductor figure (5) structure.
On the new circuit surface that is shaped, repeat the operation of above-mentioned steps 1-6, can finish the solid conductive via connection between the adjacent lines layer pattern on the multilayer dielectric layer.
Claims (6)
1, a kind of solid conductive via manufacturing process of integrated circuit (IC) substrate package is characterized in that comprising the steps:
A, need insulating medium layer that conducting connects up and down on one of two-layer conductor wire road surface in integrated circuit (IC) substrate package, adhered film, corresponding solid copper conductive via position forms the hole shape of the conductive via that requires on film;
B, in the hole shape of the conductive via of film, form solid copper pin, remove film by electroplating technology;
Apply dielectric on c, the conductor wire road surface after forming the copper post, and described solid copper pin end face is exposed;
D, on solid copper pin end face that exposes and dielectric face the plated metal thin layer, and electroplate by graphic plating technology or whole plate and to add the figure etch process and on thin metal layer, form required circuit surface;
E, on the new circuit surface that is shaped, repeat the operation of above-mentioned steps a-d, finish that the solid conductive via between the adjacent lines layer pattern connects on the multilayer dielectric layer.
2, according to the described method of claim 1, it is characterized in that: when adopting photosensitive film to be attached on the conductor wire road surface among the step a, adopt graph transfer method on the photosensitive film of solid conductive via position, to form the hole shape of conductive via.
3, method according to claim 1 is characterized in that: when adopting non-photosensitive film to be attached on the conductor wire road surface among the step a, form the hole shape of conductive via by laser drilling on the non-photosensitive film of solid conductive via position.
4, method according to claim 1 is characterized in that: when adopting photosensitive material to make insulating medium layer among the step c, employing mask, exposure, development are that the graph transfer method of feature makes the solid copper pin end face expose insulating barrier.
5, method according to claim 1 is characterized in that: when adopting non-photosensitive material to make insulating medium layer among the step c, adopt plate face polish-brush technology to make the solid copper pin end face expose the insulation shop.
6, method according to claim 1 is characterized in that: deposit thin copper layer by chemical deposition in the steps d on solid copper pin end face that exposes and dielectric face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031396755A CN100505195C (en) | 2003-06-30 | 2003-06-30 | Method for forming solid conductive via hole of integrated circuit packaging base plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031396755A CN100505195C (en) | 2003-06-30 | 2003-06-30 | Method for forming solid conductive via hole of integrated circuit packaging base plate |
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| CN1567551A CN1567551A (en) | 2005-01-19 |
| CN100505195C true CN100505195C (en) | 2009-06-24 |
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| CNB031396755A Expired - Fee Related CN100505195C (en) | 2003-06-30 | 2003-06-30 | Method for forming solid conductive via hole of integrated circuit packaging base plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101716744B (en) * | 2009-11-12 | 2012-01-18 | 博敏电子股份有限公司 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286454B (en) | 2007-04-10 | 2011-03-30 | 上海美维科技有限公司 | Printed circuit board producing method |
| CN103781293A (en) * | 2012-10-18 | 2014-05-07 | 北大方正集团有限公司 | Blind hole manufacturing method of PCB |
| CN104768336B (en) * | 2014-12-17 | 2016-08-31 | 安捷利电子科技（苏州）有限公司 | A kind of interlayer interconnection process |
| CN111741604B (en) * | 2020-07-04 | 2021-05-18 | 吉安满坤科技股份有限公司 | Manufacturing method of automobile printed circuit board |
-
2003
- 2003-06-30 CN CNB031396755A patent/CN100505195C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101716744B (en) * | 2009-11-12 | 2012-01-18 | 博敏电子股份有限公司 | Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board |
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| Publication number | Publication date |
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| CN1567551A (en) | 2005-01-19 |
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