CN106328832A - Removal method of anisotropic conductive adhesive film - Google Patents
Removal method of anisotropic conductive adhesive film Download PDFInfo
- Publication number
- CN106328832A CN106328832A CN201610954874.XA CN201610954874A CN106328832A CN 106328832 A CN106328832 A CN 106328832A CN 201610954874 A CN201610954874 A CN 201610954874A CN 106328832 A CN106328832 A CN 106328832A
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- Prior art keywords
- anisotropic conductive
- conductive film
- laser
- minimizing technology
- adhesive film
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a removal method of an anisotropic conductive adhesive film. The method comprises the steps that the anisotropic conductive adhesive film on a chip bonding area of a display panel is irradiated by a laser to be carbonized; a cleaning solution is applied to the anisotropic conductive adhesive film; the anisotropic conductive adhesive film is scraped off with an adhesive scraping bar. According to the method, the anisotropic conductive adhesive film of a defective product is irradiated by the laser, the anisotropic conductive adhesive film is carbonized through the characteristic that the laser is high in energy density, the adhesive force of the anisotropic conductive adhesive film is reduced, the anisotropic conductive adhesive film is cleaned with the cleaning solution and scraped off with the adhesive scraping bar, and then the anisotropic conductive adhesive film is easily removed on the condition that the chip bonding area is not scratched; damage to raw materials of the defective product is low, the reworking success rate of the defective product is increased, and the production cost of an AMOLED display screen is reduced.
Description
Technical field
The present invention relates to display device manufacturing technology field, especially relate to the removal side of a kind of anisotropic conductive film
Method.
Background technology
Along with the continuous progress of Display Technique, active matrix organic light-emitting diode (Active-matrix organic
Light emitting diode, AMOLED) application of display screen is more and more extensive.AMOLED display screen mainly uses anisotropy
Conductive adhesive film (Anisotropic Conductive Film, ACF) is by chip on film (Chip On Flex/Chip On
Film, COF) driving chip is bonded on the chip land of display floater.Due to existing COF bonding processing procedure yields relatively
Low, defective products situation about reforming of doing over again also gets more and more, relatively costly between COF chip and display floater, improves the matter done over again
Amount is particularly important.In process of rework, how to remove cured in the case of not damaging chip land and to be bonded in core
Anisotropic conductive film on sheet land is the ring improving success rate most critical of doing over again.
In prior art, cleaning solution is utilized after soaking the anisotropic conductive film of defective products, to use rubber scraping bar to strike off different side
Property conductive adhesive film, due to anisotropic conductive film solidify after harder, it is more difficult to scraped clean, if firmly scraped finish, easy scratch core
The circuit of sheet land, it is impossible to be used for doing over again bonding COF chip again.
Summary of the invention
The technical problem to be solved in the present invention is to provide the minimizing technology of a kind of anisotropic conductive film, existing in order to solve
Firmly scraped finish anisotropic conductive film, the circuit of easy scratch chip land, it is impossible to be used for doing over again the COF that again bonds in technology
The problem of chip.
For solving above-mentioned technical problem, the present invention provides the minimizing technology of a kind of anisotropic conductive film, including:
Laser irradiates the described anisotropic conductive film on the chip land of display floater, makes described anisotropic conductive
Film carbonization；
Described anisotropic conductive film is coated with cleaning solution；
Rubber scraping bar is used to strike off described anisotropic conductive film.
It is further, described that " laser irradiates the described anisotropic conductive film on the chip land of display floater, makes described
Anisotropic conductive film carbonization " step includes: described laser linearly scans described anisotropy with the speed of no more than 200mm/s
Conductive adhesive film.
Further, the power of described laser is not more than 10W, is unlikely to ensure described anisotropic conductive film to be carbonized
Damage display floater.
Further, during described laser scanning, described anisotropic conductive film continuous surface is applied protective gas,
For preventing the smog produced in scanning process from hindering described laser to be irradiated in described anisotropic conductive film.
Further, described protective gas is nitrogen.
Further, the hot spot that described laser is irradiated on described anisotropic conductive film is circle, to obtain energy concentration
Described laser.
Further, a diameter of 10um～308um of described hot spot.
Further, it is strip that described laser is irradiated in the hot spot on described anisotropic conductive film, described sharp to improve
The scan efficiency of light.
Further, described optical maser wavelength is 355nm or 532nm or 1064nm, to improve described anisotropic conductive film pair
The absorbance of described laser.
Further, described cleaning solution is ethanol or aqueous isopropanol.
Beneficial effects of the present invention is as follows: laser irradiates the anisotropic conductive film of defective products, utilizes laser energy density
High feature makes anisotropic conductive film carbonization, reduces the adhesive force of anisotropic conductive film, re-use clean solution clean and
Rubber scraping bar strikes off anisotropic conductive film, easier removes anisotropic conductive in the case of not scratch chip land
Film, damages little to the former material of defective products, improves the success rate of doing over again of defective products, reduce the production cost of AMOLED display screen.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other obvious mode of texturing is obtained according to these accompanying drawings.
The flow chart of the minimizing technology of the anisotropic conductive film that Fig. 1 provides for the embodiment of the present invention.
Fig. 2 is the side schematic view that laser irradiates anisotropic conductive film process.
Fig. 3 is the front schematic view that laser irradiates anisotropic conductive film process.
Fig. 4 is coating cleaning solution process schematic.
Fig. 5 is for striking off anisotropic conductive film process schematic.
Fig. 6 is the schematic diagram of rubber scraping bar shape.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
The flow chart of the minimizing technology of the anisotropic conductive film that Fig. 1 provides for the embodiment of the present invention, as it can be seen, different side
The minimizing technology of property conductive adhesive film comprises the steps:
S101, laser irradiate the anisotropic conductive film on the chip land of display floater, make anisotropic conductive film
Carbonization.
High energy can be promptly gathered on the less zone of action by laser, i.e. laser energy density is high, makes
Irradiated anisotropic conductive film is brought rapidly up, and then carbonization.Attached to display floater of anisotropic conductive film after carbonization
Put forth effort to reduce, it is simple to follow-up strike off.
In the lump refering to Fig. 2 and Fig. 3, the substrate 20 of display floater is provided with the chip land 30 for connecting driving chip,
Chip land 30 is linearly arranged in a row, and anisotropic conductive film 10 is layed on chip land 30 and covers each chip
Land 30.Concrete, it is spaced about 26um between each chip land 30.Laser head 40 sends laser and irradiates anisotropic conductive
Film 10, the position that laser is irradiated on anisotropic conductive film 10 surface forms hot spot 402, and regulation laser head 40 is led with anisotropy
The distance on electricity glued membrane 10 surface can change the size of hot spot 402.Laser head 40 and the distance on anisotropic conductive film 10 surface
Closer to focal length, then hot spot 402 size is the least, and the energy density that hot spot 402 is assembled is the highest, when hot spot 402 is in focus position
When putting place, hot spot 402 is minimum, and energy density is maximum.Laser head 40 can obtain difference by using different focusing lens
The hot spot 402 of shape, in a kind of embodiment, hot spot 402 generally circular in shape, circular light spot 402 can be easily obtained, and energy divides
Cloth is uniform, and the carbonization to anisotropic conductive film 10 is effective, concrete, and circular light spot 402 uses a diameter of 10um～308um
Time best results；In other embodiments, hot spot 402 can also be strip, owing to surface, chip land 30 is generally square
Shape, strip hot spot 402 is big to the area coverage of chip land 30, and laser scanning efficiency is high.
In the present embodiment, laser head 40 linearly level at the uniform velocity moves, laser uniform speed scanning anisotropic conductive film
10 surfaces, i.e. hot spot 402 are the most at the uniform velocity moved, and make the time that each part of anisotropic conductive film 10 is irradiated with a laser
Length is identical, therefore anisotropic conductive film 10 each portions under heat situation is identical, and carbonizing degree is uniform, follow-up is stripped off.
Concrete, laser head 40 translational speed is not more than 200mm/s, and laser power is not more than 10W, this laser scanning speed and laser merit
Rate makes anisotropic conductive film 10 can receive enough heats and carbonization, is unlikely to again due to the excessive damaged substrate of heat
20, obtain the optimal carbonization effect of anisotropic conductive film 10.
Preferably, the present embodiment uses the circular light spot 402 of a diameter of 50um, and laser scanning speed is 200mm/s, laser
Power setting is 10W.Further, laser scanning process comprises the following steps: 1, laser instrument Output of laser, laser is with first party
To linearly scanning to the second end 104 from first end 102 on anisotropic conductive film 10 surface；2, laser instrument stopping output swashing
Light, laser head 40 is with second direction linearly displacement 40um～50um；3, laser instrument Output of laser, laser with first direction phase
Anti-direction is linearly scanned to the first end 102 from second end 104 on anisotropic conductive film 10 surface；4, laser instrument stops defeated
Going out laser, laser head 40 is with second direction linearly displacement 40um～50um；5, above step is repeated, until anisotropic conductive
Film 10 all surfaces is all complete by laser scanning.Laser is along above track Uniform Scanning anisotropic conductive film 10, scan area
Covering all surfaces of anisotropic conductive film 10, and anisotropic conductive film 10 each several part is heated evenly, carbonization effect is preferable.
In the present embodiment, during laser scanning, anisotropic conductive film 10 continuous surface is applied protective gas simultaneously,
For preventing the smog produced in scanning process from hindering laser to be irradiated in anisotropic conductive film 10.Laser is irradiated in anisotropy
During conductive adhesive film 10, while anisotropic conductive film 10 is carbonized, surface can produce smog and swims in anisotropic conductive film 10
And between laser head 40, the smog between anisotropic conductive film 10 and laser head 40 is blown away by protective gas, prevents laser light
Restraint the laser energy deficiency that portion of energy during smog is caused anisotropic conductive film 10 to obtain by fume absorbent
Or uneven, improve laser utilization, reduce processing cost.Further, protective gas uses nitrogen, and nitrogen chemical property is steady
Fixed, it is difficult to react with anisotropic conductive film 10, does not affect carbonization anisotropic conductive film 10, and nitrogen low cost, from
And reduce course of processing holistic cost.
Laser irradiates anisotropic conductive film 10, and the feature utilizing laser energy density high makes anisotropic conductive film 10 carbon
Change, reduce the adhesive force of anisotropic conductive film 10, follow-up strike off anisotropic conductive film 10.
In the present embodiment, using solid state laser as lasing light emitter, solid state laser volume is little, easy to use, light beam matter
Measuring, solid state laser and Digit Control Machine Tool assembly system of processing, and the fixture fixed display panel of Digit Control Machine Tool arranges display
The translational speed of panel or the translational speed of laser head make laser scanning anisotropic conductive film 10 with carbonization anisotropic conductive
Film 10.Solid state laser is as the lasing light emitter of scanning anisotropic conductive film 10, and controllability is strong, laser power and laser beam matter
Amount meets the requirement of carbonization anisotropic conductive film 10, and carbonization is effective, and solid state laser volume is little and conveniently form processing
System, the step removing anisotropic conductive film 10 is easily achieved.
Further, the wavelength using laser is 355nm or 532nm or 1064nm, and anisotropic conductive film 10 is to this ripple
Long laser reflectivity is little, and absorbance is big, therefore quick heating, capacity usage ratio is high, reduces processing cost, and carbonization is effective.
S102, on anisotropic conductive film 10 be coated with cleaning solution 50.
In conjunction with Fig. 4, cleaning solution 50 is coated on the anisotropic conductive film 10 of carbonization uniformly, cleaning solution 50
Point dissolve the anisotropic conductive film 10 of carbonization, facilitate and follow-up strike off anisotropic conductive film 10.Concrete, cleaning solution 50 makes
With ethanol or isopropanol (IPA) solution.Ethanol and IPA solution are strong to the solvability of anisotropic conductive film 10, facilitate follow-up
Strike off anisotropic conductive film 10.
The anisotropic conductive film 10 that laser is carbonized after irradiating is loss of adhesion, re-uses clean solution and cleans dissolving carbon
After the anisotropic conductive film 10 changed, anisotropic conductive film 10 is easily stripped off in the case of not scratch chip land 30
Totally.
S103, use rubber scraping bar 60 strike off anisotropic conductive film 10.
In conjunction with Fig. 5, rubber scraping bar 60 and substrate 20 are in 45 degree, and anisotropic conductive film 10 is inserted on the top 600 of rubber scraping bar 60
And between chip land 30, strike off anisotropic conductive film 10 from one end of anisotropic conductive film 10.Further, frictioning
Structure such as Fig. 6 of rod 60, rubber scraping bar 60 includes portion of the handle 602 and the scraping part 604 being connected, and portion of the handle 602 is cross section
For circular or square straight-bar, it is simple to operator is hand-held；Scraping part 604 is the taper that top 600 is flat and sharp, and being beneficial to will
Top 600 is inserted and is struck off anisotropic conductive film 10 between anisotropic conductive film 10 and chip land 30.Laser irradiate and
The anisotropic conductive film 10 after cleaning solution 50 dissolving adhesive force on chip land 30 is substantially reduced, and rubber scraping bar 60 will
Anisotropic conductive film 10 scraped clean thoroughly, and do not damage chip land 30, it is removed anisotropic conductive film 10
Display floater can be directly used for again coating new anisotropic conductive film 10 and carries out COF bonding processing procedure, again makes AMOLED
Display screen.
Laser irradiates anisotropic conductive film 10, and the feature utilizing laser energy density high makes anisotropic conductive film 10 carbon
Change, reduce the adhesive force of anisotropic conductive film 10, re-use clean solution cleaning and rubber scraping bar 60 strikes off anisotropic conductive
Film 10, easier removes anisotropic conductive film 10 in the case of not scratch chip land 30, improves returning of defective products
Work success rate, reduces the production cost of AMOLED display screen.
Above disclosed it is only several preferred embodiment of the present invention, certainly can not limit the power of the present invention with this
Profit scope, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and weighs according to the present invention
Profit requires the equivalent variations made, and still falls within the scope that invention is contained.
Claims (10)
1. the minimizing technology of an anisotropic conductive film, it is characterised in that including:
Laser irradiates the described anisotropic conductive film on the chip land of display floater, makes described anisotropic conductive film carbon
Change；
Described anisotropic conductive film is coated with cleaning solution；
Rubber scraping bar is used to strike off described anisotropic conductive film.
The minimizing technology of anisotropic conductive film the most according to claim 1, it is characterised in that described " laser irradiates aobvious
Show the described anisotropic conductive film on the chip land of panel, make described anisotropic conductive film carbonization " step includes: institute
State laser and linearly scan described anisotropic conductive film with the speed of no more than 200mm/s.
The minimizing technology of anisotropic conductive film the most according to claim 2, it is characterised in that the power of described laser is not
More than 10W, it is unlikely to ensure described anisotropic conductive film to be carbonized to damage display floater.
The minimizing technology of anisotropic conductive film the most according to claim 3, it is characterised in that in described laser scanning
Cheng Zhong, applies protective gas to described anisotropic conductive film continuous surface, for preventing the smog resistance produced in scanning process
Described laser is hindered to be irradiated on described anisotropic conductive film.
The minimizing technology of anisotropic conductive film the most according to claim 4, it is characterised in that described protective gas is nitrogen
Gas.
The minimizing technology of anisotropic conductive film the most according to claim 2, it is characterised in that described laser is irradiated in institute
Stating the hot spot on anisotropic conductive film is circle, to obtain the described laser that energy is concentrated.
The minimizing technology of anisotropic conductive film the most according to claim 6, it is characterised in that described hot spot a diameter of
10um～308um.
The minimizing technology of anisotropic conductive film the most according to claim 2, it is characterised in that described laser is irradiated in institute
Stating the hot spot on anisotropic conductive film is strip, to improve the scan efficiency of described laser.
The minimizing technology of anisotropic conductive film the most according to claim 1, it is characterised in that described optical maser wavelength is
355nm or 532nm or 1064nm, to improve the described anisotropic conductive film absorbance to described laser.
The minimizing technology of anisotropic conductive film the most according to claim 1, it is characterised in that described cleaning solution is
Ethanol or aqueous isopropanol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610954874.XA CN106328832A (en) | 2016-10-27 | 2016-10-27 | Removal method of anisotropic conductive adhesive film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610954874.XA CN106328832A (en) | 2016-10-27 | 2016-10-27 | Removal method of anisotropic conductive adhesive film |
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| CN106328832A true CN106328832A (en) | 2017-01-11 |
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| CN201610954874.XA Pending CN106328832A (en) | 2016-10-27 | 2016-10-27 | Removal method of anisotropic conductive adhesive film |
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Cited By (5)
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| CN107068728A (en) * | 2017-05-05 | 2017-08-18 | 武汉华星光电技术有限公司 | The method for dismounting of electronic device in OLED display panel |
| CN107180918A (en) * | 2017-04-25 | 2017-09-19 | 深圳市立德通讯器材有限公司 | A kind of AMOLED display screens IC does over again cleaning method |
| CN110337237A (en) * | 2019-04-23 | 2019-10-15 | 深圳市丰泰工业科技有限公司 | The method for losing viscosity by UV glue with ultraviolet laser |
| CN113781921A (en) * | 2020-11-10 | 2021-12-10 | 友达光电股份有限公司 | Display device |
| CN114799534A (en) * | 2022-03-30 | 2022-07-29 | 深圳市海目星激光智能装备股份有限公司 | Method and apparatus for repairing light emitting device |
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Application publication date: 20170111 |