CN105474373B - 用于半导体设备的密封槽方法 - Google Patents

用于半导体设备的密封槽方法 Download PDF

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Publication number
CN105474373B
CN105474373B CN201480044379.4A CN201480044379A CN105474373B CN 105474373 B CN105474373 B CN 105474373B CN 201480044379 A CN201480044379 A CN 201480044379A CN 105474373 B CN105474373 B CN 105474373B
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CN
China
Prior art keywords
seal groove
dovetail
chamber
wall
sealing groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480044379.4A
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English (en)
Chinese (zh)
Other versions
CN105474373A (zh
Inventor
D·卢博米尔斯基
Q·梁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN105474373A publication Critical patent/CN105474373A/zh
Application granted granted Critical
Publication of CN105474373B publication Critical patent/CN105474373B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Gasket Seals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
CN201480044379.4A 2013-08-16 2014-08-06 用于半导体设备的密封槽方法 Expired - Fee Related CN105474373B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361866802P 2013-08-16 2013-08-16
US61/866,802 2013-08-16
PCT/US2014/050008 WO2015023493A1 (en) 2013-08-16 2014-08-06 Sealing groove methods for semiconductor equipment

Publications (2)

Publication Number Publication Date
CN105474373A CN105474373A (zh) 2016-04-06
CN105474373B true CN105474373B (zh) 2019-04-05

Family

ID=52465965

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480044379.4A Expired - Fee Related CN105474373B (zh) 2013-08-16 2014-08-06 用于半导体设备的密封槽方法

Country Status (6)

Country Link
US (1) US9646807B2 (enExample)
JP (1) JP6463755B2 (enExample)
KR (1) KR102178150B1 (enExample)
CN (1) CN105474373B (enExample)
TW (1) TWI641043B (enExample)
WO (1) WO2015023493A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6339866B2 (ja) * 2014-06-05 2018-06-06 東京エレクトロン株式会社 プラズマ処理装置およびクリーニング方法
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
WO2017127163A1 (en) * 2016-01-22 2017-07-27 Applied Materials, Inc. Ceramic showerhead with embedded conductive layers
WO2018105094A1 (ja) * 2016-12-08 2018-06-14 株式会社ハーモニック・ドライブ・システムズ Ｏリングを用いたシール構造
JP7077072B2 (ja) * 2018-03-08 2022-05-30 株式会社アルバック プラズマ処理装置、および、プラズマ処理方法
JP7281968B2 (ja) * 2019-05-30 2023-05-26 東京エレクトロン株式会社 アリ溝加工方法及び基板処理装置
US20210020484A1 (en) * 2019-07-15 2021-01-21 Applied Materials, Inc. Aperture design for uniformity control in selective physical vapor deposition
CN113309905B (zh) * 2021-06-22 2022-03-01 中国核动力研究设计院 一种热室用保温贯穿装置
US12421826B1 (en) 2024-08-30 2025-09-23 Schlumberger Technology Corporation Sealing device

Citations (3)

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Publication number Priority date Publication date Assignee Title
US2889183A (en) * 1955-12-07 1959-06-02 Renault Packing ring
US5050534A (en) * 1989-08-03 1991-09-24 Cryco Twenty-Two, Inc. Mobile injector system
CN102753727A (zh) * 2010-03-31 2012-10-24 东京毅力科创株式会社 等离子体处理装置和等离子体处理方法

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US1303090A (en) * 1919-05-06 Thomas mcceay
US4264009A (en) * 1977-04-27 1981-04-28 Tattam Francis E Box having a security strip
US4400137A (en) * 1980-12-29 1983-08-23 Elliott Turbomachinery Co., Inc. Rotor assembly and methods for securing a rotor blade therewithin and removing a rotor blade therefrom
US4564732A (en) * 1982-05-19 1986-01-14 Hi-Tek Corporation Dovetail base assembly for keyswitches
US4632060A (en) * 1984-03-12 1986-12-30 Toshiba Machine Co. Ltd Barrel type of epitaxial vapor phase growing apparatus
JPH04127460A (ja) * 1990-09-18 1992-04-28 Nec Corp 混成集積回路装置
US5080556A (en) * 1990-09-28 1992-01-14 General Electric Company Thermal seal for a gas turbine spacer disc
US6138353A (en) * 1998-01-05 2000-10-31 Mpr Associates, Inc. Method for repairing vertical welds in a boiling water reactor shroud
US6189821B1 (en) * 1999-03-25 2001-02-20 Raymond James Apparatus for plastic particle reduction using dove-tailed blade
US6245149B1 (en) * 1999-07-01 2001-06-12 Applied Materials, Inc. Inert barrier for high purity epitaxial deposition systems
FR2807976B1 (fr) * 2000-04-20 2002-06-28 Plastic Omnium Cie Reservoir a carburant de vehicule automobile
JP3590794B2 (ja) * 2002-02-21 2004-11-17 益岡産業株式会社 アリ溝用シール材
JP3988557B2 (ja) * 2002-07-17 2007-10-10 株式会社ジェイテクト 転がり軸受装置
JP4962687B2 (ja) * 2005-08-30 2012-06-27 Ｎｏｋ株式会社 密封構造
GB0721383D0 (en) * 2007-10-31 2007-12-12 Aes Eng Ltd Bearing plate
US9349621B2 (en) * 2011-05-23 2016-05-24 Lam Research Corporation Vacuum seal arrangement useful in plasma processing chamber
KR101248382B1 (ko) * 2012-06-27 2013-04-02 시스템디엔디(주) 다단 밀봉구조를 갖는 밸브장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2889183A (en) * 1955-12-07 1959-06-02 Renault Packing ring
US5050534A (en) * 1989-08-03 1991-09-24 Cryco Twenty-Two, Inc. Mobile injector system
CN102753727A (zh) * 2010-03-31 2012-10-24 东京毅力科创株式会社 等离子体处理装置和等离子体处理方法

Also Published As

Publication number Publication date
TW201513216A (zh) 2015-04-01
TWI641043B (zh) 2018-11-11
WO2015023493A1 (en) 2015-02-19
CN105474373A (zh) 2016-04-06
KR102178150B1 (ko) 2020-11-12
KR20160044011A (ko) 2016-04-22
JP6463755B2 (ja) 2019-02-06
JP2016534299A (ja) 2016-11-04
US20150047786A1 (en) 2015-02-19
US9646807B2 (en) 2017-05-09

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Granted publication date: 20190405

Termination date: 20200806