CN105466626A - A thin film pressure transducer and a manufacturing method thereof - Google Patents
A thin film pressure transducer and a manufacturing method thereof Download PDFInfo
- Publication number
- CN105466626A CN105466626A CN201510915107.3A CN201510915107A CN105466626A CN 105466626 A CN105466626 A CN 105466626A CN 201510915107 A CN201510915107 A CN 201510915107A CN 105466626 A CN105466626 A CN 105466626A
- Authority
- CN
- China
- Prior art keywords
- core body
- pressure sensor
- sensitive core
- diaphragm pressure
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
Abstract
The invention discloses a thin film pressure transducer and a manufacturing method thereof. The thin film pressure transducer comprises a pedestal and a sensitive core body. A pressure guiding hole is arranged in the pedestal. A buffer assembly used for transmitting a medium pressure and obstructing transmission of medium temperatures is also arranged between the pedestal and the sensitive core body. The manufacturing method comprises the following steps: S1, the pedestal, a sealing membrane and a buffer main body with a through hole are fixedly connected to the sensitive core body from the bottom up; the sensitive core body and the sealing membrane enclose the through hole to form a sealed cavity; S2, the temperature buffer medium is injected into the sealed cavity through a medium guiding hole, and a sealing member is used to seal the medium guiding hole; and S3: wire leading is carried out on the sensitive core body to obtain the thin film pressure transducer. The thin film pressure transducer is advantaged by being little influenced by the medium temperature, resistant to an instantaneous temperature impact, etc.
Description
Technical field
The invention belongs to art of pressure sensors, particularly relate to a kind of diaphragm pressure sensor and manufacture method thereof.
Background technology
The sensitive core body of diaphragm pressure sensor adopts thin film technique manufacture in modern age to form, namely magnetic control technology or ion beam sputtering technology is utilized, insulating material, resistance material are deposited on elastic stainless steel diaphragm with molecular forms, form insulation film and the resistive material film of molecular linkage at elastic stainless steel membrane surface, and combine together with elastic stainless steel diaphragm.Again through photoetching, resistance trimming, the operations such as temperature compensation, process film, form firm and stable resistance bridge, namely complete the preparation of sensitive core body.When measured medium pressure acts on pressure sensitive core, resistance bridge can produce the weak voltage linearly changed with pressure signal and output signal.Be aided with the Electric signal processing structure and other structures of being amplified by this signal and regulating, just constitute the diaphragm pressure transducers be applied in every field.
Well mate owing to having between resistance bridge with elastic stainless steel diaphragm and become to be integrated, and there is not any tackifier, so diaphragm pressure sensor demonstrates high reliability and long-time stability than adhesive type strain-ga(u)ge transducer.17-4PH elastic stainless steel generally selected by the material of elastic stainless steel diaphragm, can directly contact with general Korrosionsmedium.Therefore, diaphragm pressure sensor can be used for pressure survey and the control of Korrosionsmedium, has very wide range of application.
But applicant finds in the use procedure to existing diaphragm pressure sensor, when tested pressure medium temperature departure room temperature, often there is deviation with actual value in pressure measuring value, and tested pressure medium temperature more departs from room temperature, and this deviation is larger.And the impact of existing diaphragm pressure sensor resistance to transient temperature is limited in one's ability, TRANSIENT HIGH TEMPERATURE or instantaneous low temperature all may damage sensitive core body.
Summary of the invention
The technical problem to be solved in the present invention overcomes the deficiencies in the prior art, provides a kind of diaphragm pressure sensor and the manufacture method thereof that affect the impact of little, resistance to transient temperature by medium temperature.
For solving the problems of the technologies described above, the present invention by the following technical solutions:
A kind of diaphragm pressure sensor, comprises pedestal and sensitive core body, is provided with tracting pressuring hole in described pedestal, is also provided with for Transfer Medium pressure and intercepts the Buffer Unit of medium temperature transmission between described pedestal and sensitive core body.
Further improvement as technique scheme:
Described Buffer Unit comprises buffering main body and seal membrane, described buffering main body offers through hole, described sensitive core body is fixed on described buffering main body one end along through hole direction, described seal membrane is fixed on the other end of described buffering main body along through hole direction, described through hole is surrounded annular seal space by described sensitive core body and seal membrane, and described annular seal space is filled with temperature buffer medium.
The side opening of described buffering main body be provided be communicated with described annular seal space draw matter hole, described in draw in matter hole and be provided with seal.
Described temperature buffer medium is silicone oil.
Described seal membrane comprises flat diaphragm or convoluted diaphragm.
Described diaphragm pressure sensor also comprises buffering stand, and described buffering stand is provided with cavity, and described buffering main body, seal membrane and sensitive core body are all positioned at described cavity, and described buffering stand is fixedly connected with described pedestal near one end of seal membrane.
Described diaphragm pressure sensor also comprises lead plate, and described lead plate is fixedly connected with described buffering stand one end near sensitive core body, and the surface of described sensitive core body is provided with resistance bridge, and described resistance bridge is electrically connected with described lead plate.
Described diaphragm pressure sensor also comprises circuit board support and circuit board, described circuit board support is fixedly connected with described buffering stand one end near sensitive core body, described circuit board rack is located on described circuit board support, and described circuit board is electrically connected with described lead plate.
Described diaphragm pressure sensor also comprises shell, and one end of described shell is fixedly connected with described buffering stand one end near sensitive core body, and described lead plate, circuit board support and circuit board are all positioned at described shell.
Described diaphragm pressure sensor also comprises electric connector, and described electric connector is fixed on the other end of described shell, and described electric connector is electrically connected with described circuit board.
The manufacture method of above-mentioned diaphragm pressure sensor, comprises the following steps:
S1: by the buffering main body of pedestal, seal membrane, band through hole being fixedly connected with sensitive core body from top to bottom, described through hole is surrounded annular seal space by sensitive core body and seal membrane;
S2: temperature buffer medium is injected in described annular seal space by drawing matter hole, and matter hole is drawn described in seal sealing;
S3: described sensitive core body is gone between, obtains diaphragm pressure sensor.
Compared with prior art, the invention has the advantages that:
Applicant is not suitable for the pressure medium of measuring tempeature deviation or temperature fluctuation reason to existing diaphragm pressure sensor is studied, research finds, in existing diaphragm pressure sensor design, normally directly welded with sensitive core body by the pedestal of band tracting pressuring hole, pressure medium directly acts on sensitive core body by tracting pressuring hole.In sensitive core body, resistance bridge directly sputters at elastic stainless steel diaphragm, and due to stressed singularity, the diameter of elastic stainless steel diaphragm is usually very little, and thickness is also thinner.Stainless steel material heat conduction is fast, and the pressure-bearing place thickness of sensitive core body is usually very thin and little in addition, and area of dissipation is limited, so sensitive core body is subject to the impact of measuring media temperature, is easy to tested dielectric heating or refrigeration.Company's debugging and calibration product are in ecotopia, such as room temperature 25 DEG C usually, and during debugging, medium temperature fluctuation is very little, and the process of debugging and calibration is ideal.And product in actual use, the pressure medium temperature of actual measurement and scheduling and planning or pressure medium temperature when calibrating often differ greatly, pressure sensitive core is heated rapidly or is freezed, and the measuring accuracy temperature influence of resistance bridge is comparatively large, thus pressure measuring value and actual value is caused to there is relatively large deviation.In addition, because pressure sensitive core is little and thin, it is limited in one's ability that resistance to transient temperature is impacted, and TRANSIENT HIGH TEMPERATURE or instantaneous low temperature all may damage pressure sensitive core.Thus, existing diaphragm pressure sensor should not be used for the measurement of the larger pressure medium of high temperature, low temperature or temperature fluctuation.
Diaphragm pressure sensor of the present invention, be provided with for external pressure being passed to sensitive core body and the Buffer Unit of alleviation sensitive core body temperature change between pedestal and sensitive core body, due to the existence of this Buffer Unit, add the distance between tracting pressuring hole and sensitive core body, pressure is first passed to this Buffer Unit by measuring media, then passes to sensitive core body by this Buffer Unit.Pressure passes in the process of Buffer Unit by measuring media, because Buffer Unit specific heat capacity is larger, the transient state heat that measuring media passes over is buffered assembly and absorbs, the temperature of Buffer Unit slowly changes, the temperature of sensitive core body can remain unchanged substantially, namely this Buffer Unit can provide certain resisting temperature damping of shocks ability, and the actual pressure not affecting product is measured, and makes measurement pressure more steadily true.Namely diaphragm pressure sensor of the present invention can reduce the error of testing and calibration, improves the resistance to transient temperature impact capacity of product.
Diaphragm pressure sensor of the present invention, further, Buffer Unit comprises buffering main body and seal membrane, buffering main body offers through hole, sensitive core body is fixed on buffering main body one end along through hole direction, seal membrane is fixed on the other end of buffering main body along through hole direction, and through hole is surrounded annular seal space by sensitive core body and seal membrane, is filled with temperature buffer medium in annular seal space.Pressure is first passed to seal membrane by the tracting pressuring hole on pedestal by measuring media, deformation is produced after seal membrane pressure-sensitive, this deformation pressure passes to sensitive core body by the temperature buffer medium in annular seal space, and finally cause the pressure-sensitive deformation of sensitive core body, this process does not affect the transmission of pressure medium.Temperature buffer medium adopts the chemical substance that specific heat is higher mostly, the transient state heat that front end diaphragm passes over, by temperature buffer Absorption of Medium, because temperature buffer medium specific heat is high, temperature variation is not obvious, thus the transmission of temperature is blocked, and the temperature of sensitive core body can remain unchanged substantially, thus ensures that the error that measuring tempeature causes is less.
Accompanying drawing explanation
Fig. 1 is the diagrammatic cross-section of the diaphragm pressure sensor of the embodiment of the present invention 1.
Fig. 2 is the manufacture method process flow diagram of the diaphragm pressure sensor of the embodiment of the present invention 1.
Marginal data: 1, pedestal; 2, sensitive core body; 3, tracting pressuring hole; 4, main body is cushioned; 5, seal membrane; 6, annular seal space; 7, matter hole is drawn; 8, seal; 9, buffering stand; 10, lead plate; 11, circuit board support; 12, circuit board; 13, shell; 14, electric connector.
Embodiment
Below in conjunction with Figure of description and concrete preferred embodiment, the invention will be further described, but protection domain not thereby limiting the invention.
embodiment 1:
As shown in Figure 1, the diaphragm pressure sensor of the present embodiment, comprises pedestal 1 and sensitive core body 2, is provided with tracting pressuring hole 3 in pedestal 1, be also provided with between pedestal 1 and sensitive core body 2 for Transfer Medium pressure and intercept medium temperature transmit Buffer Unit.Due to the existence of this Buffer Unit, add the distance between tracting pressuring hole and sensitive core body, pressure is first passed to this Buffer Unit by measuring media, then passes to sensitive core body by this Buffer Unit.Pressure passes in the process of Buffer Unit by measuring media, the transient state heat that measuring media passes over is buffered assembly and absorbs, the temperature of Buffer Unit slowly changes, the temperature of sensitive core body can remain unchanged substantially, namely this Buffer Unit can provide certain resisting temperature damping of shocks ability, and the actual pressure not affecting product is measured, make measurement pressure more steadily true.
In the present embodiment, Buffer Unit comprises buffering main body 4 and seal membrane 5, buffering main body 4 offers through hole, sensitive core body 2 is fixed on buffering main body 4 one end along through hole direction, seal membrane 5 is fixed on the other end of buffering main body 4 along through hole direction, through hole is surrounded annular seal space 6 by sensitive core body 2 and seal membrane 5, and annular seal space 6 is filled with temperature buffer medium.Pressure is first passed to seal membrane by the tracting pressuring hole on pedestal by measuring media, deformation is produced after seal membrane pressure-sensitive, this deformation pressure passes to sensitive core body by the temperature buffer medium in annular seal space, and finally cause the pressure-sensitive deformation of sensitive core body, this process does not affect the transmission of pressure medium.Temperature buffer medium adopts the chemical substance that specific heat is higher mostly, the transient state heat that front end diaphragm passes over, by temperature buffer Absorption of Medium, because temperature buffer medium specific heat is high, temperature variation is not obvious, thus the transmission of temperature is blocked, and the temperature of sensitive core body can remain unchanged substantially, thus ensures that the error that measuring tempeature causes is less.
Size and the position of buffering main body 4 and through hole thereof can be designed according to actual needs.The shape of through hole does not limit, the cylindrical hole of preferably convenient processing.
In the present embodiment, buffering main body 4 side opening be provided be communicated with annular seal space 6 draw matter hole 7, draw in matter hole 7 and be provided with seal 8.Temperature buffer medium draws after matter hole 7 injects annular seal space 6 by this, seals it with seal 8.Seal 8 is pin preferably.
In the present embodiment, the preferred silicone oil of temperature buffer medium.
In the present embodiment, seal membrane 5 comprises flat diaphragm or convoluted diaphragm.Seal membrane 5 is exotic material preferably, can improve the ability that the resistance to TRANSIENT HIGH TEMPERATURE of diaphragm pressure sensor is impacted like this.The diameter of diaphragm can according to measuring the corresponding adjustment of pressure to thickness.
In the present embodiment, diaphragm pressure sensor also comprises buffering stand 9, and buffering stand 9 is provided with cavity, and buffering main body 4, seal membrane 5 and sensitive core body 2 are all positioned at cavity, and buffering stand 9 is fixedly connected with pedestal 1 near one end of seal membrane 5.To cushion main body 4 to separate with buffering stand 9 and design, and form split-type structural, the external diameter of buffering main body 4 does not need the external diameter being equal to sensor, and being more convenient for, according to the size adjustment seal membrane 5 of sensitive core body 2 and the diameter of annular seal space 6, increases its design freedom.
In the present embodiment, diaphragm pressure sensor also comprises lead plate 10, and lead plate 10 is fixedly connected with buffering stand 9 one end near sensitive core body 2, and the surface of sensitive core body 2 is provided with resistance bridge, and resistance bridge is electrically connected with lead plate 10.Pressure medium causes the pressure-sensitive deformation of sensitive core body after being delivered to sensitive core body, resistance bridge produces the electrical output signal that is proportional to this pressure.This electrical output signal is introduced in lead plate and carries out temperature compensation, to eliminate the impact that variation of ambient temperature is brought.
In the present embodiment, diaphragm pressure sensor also comprises circuit board support 11 and circuit board 12, circuit board support 11 is fixedly connected with buffering stand 9 one end near sensitive core body 2, and circuit board 12 is set up on circuit board support 11, and circuit board 12 is electrically connected with lead plate 10.The electrical output signal produced due to resistance bridge is less, needs to be introduced in circuit board and carries out amplifying and offseting, to produce the industrial voltage signal of standard pressure transmitter after temperature compensation.
In the present embodiment, diaphragm pressure sensor also comprises shell 13, and one end of shell 13 is fixedly connected with buffering stand 9 one end near sensitive core body 2, and lead plate 10, circuit board support 11 and circuit board 12 are all positioned at shell 13.
In the present embodiment, diaphragm pressure sensor also comprises electric connector 14, and electric connector 14 is fixed on the other end of shell 13, and electric connector 14 is electrically connected with circuit board 12.Electric signal after circuit board amplifies exports to user by electric connector.
A manufacture method for the diaphragm pressure sensor of the present embodiment, as shown in Figure 2, comprises the following steps:
S1: by the buffering main body 4 of pedestal 1, seal membrane 5, band through hole being fixedly connected with sensitive core body 2 from top to bottom, through hole is surrounded annular seal space 6 by sensitive core body 2 and seal membrane 5;
S2: temperature buffer medium is injected in annular seal space 6 by drawing matter hole 7, and draw matter hole 7 with seal 8 sealing;
S3: go between to sensitive core body 2, wiring harness plate 12, welding buffering stand 9 and shell 13, install electric connector 14, obtain diaphragm pressure sensor.
The manufacture method of traditional diaphragm pressure sensor is as follows: be first welded on pedestal by sensitive core body, then to go between circuit board from sensitive core body, assemble circuit board, then just can carry out shell welding and install with electric connector, namely complete the assembling process of whole product.Manufacture method and the classic method difference of the diaphragm pressure sensor of the present embodiment are mainly: the assembling process adding Buffer Unit, first the order welding of pedestal, seal membrane and buffering main body is pressed, then sensitive core body is welded in buffering main body, then oil-filled, pin sealing, just can carry out elastic body lead-in wire afterwards, namely consistent with traditional handicraft.
The above is only the preferred embodiment of the present invention, and protection scope of the present invention is also not only confined to above-described embodiment.All technical schemes belonged under thinking of the present invention all belong to protection scope of the present invention.It is noted that for those skilled in the art, improvements and modifications under the premise without departing from the principles of the invention, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (11)
1. a diaphragm pressure sensor, comprise pedestal (1) and sensitive core body (2), be provided with tracting pressuring hole (3) in described pedestal (1), it is characterized in that, be also provided with between described pedestal (1) and sensitive core body (2) for Transfer Medium pressure and intercept medium temperature transmit Buffer Unit.
2. diaphragm pressure sensor according to claim 1, it is characterized in that, described Buffer Unit comprises buffering main body (4) and seal membrane (5), described buffering main body (4) offers through hole, described sensitive core body (2) is fixed on described buffering main body (4) one end along through hole direction, described seal membrane (5) is fixed on the other end of described buffering main body (4) along through hole direction, described through hole is surrounded annular seal space (6) by described sensitive core body (2) and seal membrane (5), and described annular seal space (6) is filled with temperature buffer medium.
3. diaphragm pressure sensor according to claim 2, is characterized in that, the side opening of described buffering main body (4) be provided be communicated with described annular seal space (6) draw matter hole (7), described in draw in matter hole (7) and be provided with seal (8).
4. diaphragm pressure sensor according to claim 3, is characterized in that, described temperature buffer medium is silicone oil.
5. diaphragm pressure sensor according to claim 4, is characterized in that, described seal membrane (5) comprises flat diaphragm or convoluted diaphragm.
6. the diaphragm pressure sensor according to any one of claim 2 ~ 5, it is characterized in that, described diaphragm pressure sensor also comprises buffering stand (9), described buffering stand (9) is provided with cavity, described buffering main body (4), seal membrane (5) and sensitive core body (2) are all positioned at described cavity, and described buffering stand (9) is fixedly connected with described pedestal (1) near one end of seal membrane (5).
7. diaphragm pressure sensor according to claim 6, it is characterized in that, described diaphragm pressure sensor also comprises lead plate (10), described lead plate (10) is fixedly connected with described buffering stand (9) one end near sensitive core body (2), the surface of described sensitive core body (2) is provided with resistance bridge, and described resistance bridge is electrically connected with described lead plate (10).
8. diaphragm pressure sensor according to claim 7, it is characterized in that, described diaphragm pressure sensor also comprises circuit board support (11) and circuit board (12), described circuit board support (11) is fixedly connected with described buffering stand (9) one end near sensitive core body (2), described circuit board (12) is set up on described circuit board support (11), and described circuit board (12) is electrically connected with described lead plate (10).
9. diaphragm pressure sensor according to claim 8, it is characterized in that, described diaphragm pressure sensor also comprises shell (13), one end of described shell (13) is fixedly connected with described buffering stand (9) one end near sensitive core body (2), and described lead plate (10), circuit board support (11) and circuit board (12) are all positioned at described shell (13).
10. diaphragm pressure sensor according to claim 9, it is characterized in that, described diaphragm pressure sensor also comprises electric connector (14), and described electric connector (14) is fixed on the other end of described shell (13), and described electric connector (14) is electrically connected with described circuit board (12).
The manufacture method of 11. 1 kinds of diaphragm pressure sensors as described in any one of claim 2 ~ 10, comprises the following steps:
S1: by the buffering main body (4) of pedestal (1), seal membrane (5), band through hole being fixedly connected with sensitive core body (2) from top to bottom, described through hole is surrounded annular seal space (6) by sensitive core body (2) and seal membrane (5);
S2: temperature buffer medium is injected in described annular seal space (6) by drawing matter hole (7), and matter hole (7) is drawn described in seal (8) sealing;
S3: described sensitive core body (2) is gone between, obtains diaphragm pressure sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510915107.3A CN105466626B (en) | 2015-12-11 | 2015-12-11 | Diaphragm pressure sensor and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510915107.3A CN105466626B (en) | 2015-12-11 | 2015-12-11 | Diaphragm pressure sensor and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105466626A true CN105466626A (en) | 2016-04-06 |
CN105466626B CN105466626B (en) | 2019-01-11 |
Family
ID=55604569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510915107.3A Active CN105466626B (en) | 2015-12-11 | 2015-12-11 | Diaphragm pressure sensor and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105466626B (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106404272A (en) * | 2016-11-21 | 2017-02-15 | 浙江福立分析仪器股份有限公司 | High-pressure infusion pump pressure buffer sensor and pressure buffer method |
CN106546363A (en) * | 2016-09-29 | 2017-03-29 | 中国电子科技集团公司第四十八研究所 | A kind of diaphragm pressure sensor and its method for packing |
CN106595910A (en) * | 2016-11-08 | 2017-04-26 | 中国电子科技集团公司第四十八研究所 | Stress sensor and preparation method thereof |
CN107560785A (en) * | 2017-10-10 | 2018-01-09 | 广西玉柴机器股份有限公司 | The overtemperature protection system of pressure sensor |
CN107631833A (en) * | 2017-10-17 | 2018-01-26 | 北京中航兴盛测控技术有限公司 | Superhigh temperature pressure sensor and its manufacture method |
CN108593185A (en) * | 2018-03-21 | 2018-09-28 | 江苏盛仕铭科技有限公司 | A kind of Antiimpact pressure transmitter |
CN108680460A (en) * | 2018-07-06 | 2018-10-19 | 曲靖伯通智联商贸有限公司 | A kind of split type gravimetre and its measurement method |
CN108981971A (en) * | 2018-06-20 | 2018-12-11 | 马鞍山松鹤信息科技有限公司 | A kind of pressure sensor device based on Internet of Things |
CN109489728A (en) * | 2018-12-14 | 2019-03-19 | 中国电子科技集团公司第四十八研究所 | A kind of sensor |
CN110514346A (en) * | 2019-08-16 | 2019-11-29 | 李芳芳 | A kind of shock proof pressure transmitter sensing device of novel bradyseism |
US10578504B1 (en) | 2019-09-04 | 2020-03-03 | Custom Control Sensors, LLC. | Systems and methods for high voltage rating thin film sensors |
CN111721467A (en) * | 2020-07-13 | 2020-09-29 | 昆山双桥传感器测控技术有限公司 | Anti-freezing pressure sensor |
CN113865772A (en) * | 2021-09-17 | 2021-12-31 | 苏州森斯缔夫传感科技有限公司 | Heat dissipation structure, pressure sensor with heat dissipation structure and preparation method of pressure sensor |
CN114659561A (en) * | 2022-03-25 | 2022-06-24 | 湖南启泰传感科技有限公司 | Temperature and pressure integrated sensor and packaging method |
CN116222652A (en) * | 2022-12-26 | 2023-06-06 | 松诺盟科技有限公司 | Nanometer film core and composite sensor |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000337983A (en) * | 1999-05-25 | 2000-12-08 | Nippon Seiki Co Ltd | Pressure detector and its manufacturing method |
CN1975358A (en) * | 2006-12-14 | 2007-06-06 | 中国航天科技集团公司第六研究院第十一研究所 | Low-temperature film pressure sensor and producing method thereof |
CN100561156C (en) * | 2008-01-16 | 2009-11-18 | 西安维纳信息测控有限公司 | The SOI complete silicon structure silicone-oil-filling high-temperature-resistance pressure sensor |
CN101532898A (en) * | 2009-04-13 | 2009-09-16 | 周化章 | Damping device |
CN101975637A (en) * | 2010-07-28 | 2011-02-16 | 杭州博翔传感器有限公司 | Compact-type automobile pressure transformer and manufacturing process thereof |
CN103454032A (en) * | 2013-08-16 | 2013-12-18 | 中国电子科技集团公司第四十八研究所 | Pressure sensitive core with thermistor |
CN204202804U (en) * | 2014-09-12 | 2015-03-11 | 中法渤海地质服务有限公司 | A kind of impact damper for quartz crystal pressure flowmeter sensor |
-
2015
- 2015-12-11 CN CN201510915107.3A patent/CN105466626B/en active Active
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106546363A (en) * | 2016-09-29 | 2017-03-29 | 中国电子科技集团公司第四十八研究所 | A kind of diaphragm pressure sensor and its method for packing |
CN106546363B (en) * | 2016-09-29 | 2019-09-20 | 中国电子科技集团公司第四十八研究所 | A kind of diaphragm pressure sensor and its packaging method |
CN106595910A (en) * | 2016-11-08 | 2017-04-26 | 中国电子科技集团公司第四十八研究所 | Stress sensor and preparation method thereof |
CN106404272B (en) * | 2016-11-21 | 2022-03-18 | 浙江福立分析仪器股份有限公司 | Pressure buffering sensor and pressure buffering method for high-pressure infusion pump |
CN106404272A (en) * | 2016-11-21 | 2017-02-15 | 浙江福立分析仪器股份有限公司 | High-pressure infusion pump pressure buffer sensor and pressure buffer method |
CN107560785A (en) * | 2017-10-10 | 2018-01-09 | 广西玉柴机器股份有限公司 | The overtemperature protection system of pressure sensor |
CN107631833A (en) * | 2017-10-17 | 2018-01-26 | 北京中航兴盛测控技术有限公司 | Superhigh temperature pressure sensor and its manufacture method |
CN107631833B (en) * | 2017-10-17 | 2023-11-03 | 松诺盟科技有限公司 | Ultra-high temperature pressure sensor and manufacturing method thereof |
CN108593185A (en) * | 2018-03-21 | 2018-09-28 | 江苏盛仕铭科技有限公司 | A kind of Antiimpact pressure transmitter |
CN108981971A (en) * | 2018-06-20 | 2018-12-11 | 马鞍山松鹤信息科技有限公司 | A kind of pressure sensor device based on Internet of Things |
CN108680460A (en) * | 2018-07-06 | 2018-10-19 | 曲靖伯通智联商贸有限公司 | A kind of split type gravimetre and its measurement method |
CN109489728A (en) * | 2018-12-14 | 2019-03-19 | 中国电子科技集团公司第四十八研究所 | A kind of sensor |
CN110514346A (en) * | 2019-08-16 | 2019-11-29 | 李芳芳 | A kind of shock proof pressure transmitter sensing device of novel bradyseism |
US10876915B1 (en) | 2019-09-04 | 2020-12-29 | Custom Control Sensors, LLC. | Systems and methods for high voltage rating thin film sensors |
US11579032B2 (en) | 2019-09-04 | 2023-02-14 | Custom Control Sensors, LLC | Systems and methods for high voltage rating thin film sensors |
US10578504B1 (en) | 2019-09-04 | 2020-03-03 | Custom Control Sensors, LLC. | Systems and methods for high voltage rating thin film sensors |
CN111721467B (en) * | 2020-07-13 | 2022-03-04 | 昆山双桥传感器测控技术有限公司 | Anti-freezing pressure sensor |
CN111721467A (en) * | 2020-07-13 | 2020-09-29 | 昆山双桥传感器测控技术有限公司 | Anti-freezing pressure sensor |
CN113865772A (en) * | 2021-09-17 | 2021-12-31 | 苏州森斯缔夫传感科技有限公司 | Heat dissipation structure, pressure sensor with heat dissipation structure and preparation method of pressure sensor |
CN114659561A (en) * | 2022-03-25 | 2022-06-24 | 湖南启泰传感科技有限公司 | Temperature and pressure integrated sensor and packaging method |
CN114659561B (en) * | 2022-03-25 | 2024-03-15 | 湖南启泰传感科技有限公司 | Temperature and pressure integrated sensor |
CN116222652A (en) * | 2022-12-26 | 2023-06-06 | 松诺盟科技有限公司 | Nanometer film core and composite sensor |
CN116222652B (en) * | 2022-12-26 | 2023-12-15 | 松诺盟科技有限公司 | Nanometer film core and composite sensor |
Also Published As
Publication number | Publication date |
---|---|
CN105466626B (en) | 2019-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105466626A (en) | A thin film pressure transducer and a manufacturing method thereof | |
CN107436205B (en) | On-chip temperature compensation graphene pressure sensor | |
CN202141554U (en) | Ceramic structure metal sensitive diaphragm capacitance pressure transducer | |
CN103454032A (en) | Pressure sensitive core with thermistor | |
CN205785644U (en) | MEMS minute-pressure pressure transducer | |
CN108169294A (en) | Film hydrogen gas sensor with self-heating and temperature compensation function | |
CN203163913U (en) | Diaphragm type fiber bragg grating pressure sensor with temperature compensation | |
CN212807437U (en) | Core body of differential pressure sensor | |
CN102768094B (en) | A kind of fiber bragg grating pressure sensor | |
US10330547B2 (en) | Pressure measuring device | |
CN208833416U (en) | A kind of high temperature modification film absolute pressure sensor | |
CN202304895U (en) | Sputtered film chip for realizing simultaneous test of temperature and pressure signals | |
CN200989838Y (en) | Pressure sensor | |
CN101526404A (en) | Temperature and pressure compound sensor | |
CN207816885U (en) | Film hydrogen gas sensor with self-heating and temperature compensation function | |
CN111141430A (en) | Film core body sealing assembly in sputtering film pressure sensor and preparation thereof | |
CN207395944U (en) | A kind of one-piece type sensor of new construction pressure and temp | |
CN102507036A (en) | MMW (millimeter wave) power sensor and calorimeter provided with same | |
CN205027465U (en) | Two remaining pressure tube structures | |
CN1885047B (en) | Piezoresistance type microwave power sensor and microwave power sensing method thereof | |
CN109341935A (en) | A kind of differential pressure sputtered film pressure-sensing device and its packaging method | |
CN109238525A (en) | Metallic film type pressure-temperature compound sensor and preparation method thereof | |
CN209961389U (en) | Monocrystalline silicon high overvoltage protection type pressure sensor | |
CN106908163A (en) | A kind of highly sensitive film thermocouple sensor chip and preparation method | |
CN202141553U (en) | A sensing element for pressure measuring and a capacitive pressure sensor having the sensing element for pressure measuring |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |