CN105419674A - 一种漂浮式全方位导电胶膜 - Google Patents

一种漂浮式全方位导电胶膜 Download PDF

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CN105419674A
CN105419674A CN201610029259.8A CN201610029259A CN105419674A CN 105419674 A CN105419674 A CN 105419674A CN 201610029259 A CN201610029259 A CN 201610029259A CN 105419674 A CN105419674 A CN 105419674A
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杨宜丰
张志伟
余逸群
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JIANGSU YUANJING ELECTRONIC TECHNOLOGY Co.,Ltd.
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Abstract

本发明公开了一种漂浮式全方位导电胶膜，属于导电胶技术领域。包括上部胶层、下部胶层和导电胶层，导电胶层包括绝缘基材、导电粒子和镀银纤维，绝缘基材由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯组成。导电胶层中各组分的质量分数为：甲基丙烯酸正丁酯10～15％、苯乙烯单体8～15％、甲基丙烯酸羟丙酯10～20％、乙二醇二甲基丙烯酸酯8～15％、导电粒子25～35％；所述的导电粒子为镀铜银球导电粒子。本发明的导电胶膜具有柔性好、导电性能稳定、电磁波屏蔽效果好等优点，适用于轻薄短小的驱动IC与基板的连接。

Description

一种漂浮式全方位导电胶膜
技术领域
本发明属于导电胶技术领域，更具体地说，涉及一种漂浮式全方位导电胶膜。
背景技术
不同电子组件之间的实体连接最常使用焊接方式，主要是利用具较低熔点的铅锡合金当作焊料，在适当加热下瞬间熔化焊料以接触两电子组件的接脚，当移除加热时，焊料即可固化而稳固的连接两电子组件。另一方式是使用高温锡炉，将表面黏着技术(Surface-mounttechnology，SMT)的电子组件事先安置在具有焊料的电气电路上，再经高温炉的瞬间加热、冷却后，焊料即可连接所有电子组件。
不过传统的锡铅回焊制程无法适用于需要轻薄短小且较低耗电量的应用领域，比如薄膜晶体管液晶显示器(ThinFilmTransistorLiquidCrystalDisplay，TFT-LCD)中驱动(IntegratedCircuit，IC)与基板的连接，因为驱动IC中用以连接外部电路的金凸块(GoldBumping)的间距一般较小，约20um～40um，且金凸块的熔点相对于锡铅凸块高很多。
目前关于导电胶膜的研究报道有很多，例如，中国专利申请号为201120474755.7，授权公告日为2012年7月11日的专利申请文件公开了一种异方性导电胶带/膜，包括第一胶材层、金属薄膜层和第二胶材层，所述第一胶材层和第二胶材层分别由绝缘胶和多个导电粒子形成，所述导电粒子分布在该绝缘胶内；所述金属薄膜层具有相对的两个侧面，所述第一、二胶材层分别设于该金属薄膜层的两个侧面上。中国专利申请号为201310011479.4，申请公布日为2013年7月17日的专利申请文件公开了导电粒子、绝缘被覆导电粒子以及各向异性导电性粘接剂；该发明的导电粒子具备树脂粒子和设置于该树脂粒子的表面的金属层；上述金属层包含镍和铜，且具有铜相对于镍的元素比率随着远离树脂粒子的表面而变高的部分。中国专利申请号为201310100592.X，申请公布日为2013年5月29日的专利申请文件公开了环氧导电胶粘剂，其重量组分为：环氧树脂40～60份；银粉30～35份；促进剂3～5份；紫外线吸收剂1～3份；抗氧剂0.5～1.5份；偶联剂2～4份；将上述成分充分混合即得成品。该专利中的导电粒子为银粉，存在导电能力差、导电性能不稳定等不足之处。现有的导电胶膜中通常添加镍球导电粒子，镍球具有易氧化，接点脆弱亦破坏的缺点，而且现有的导电胶膜电磁波屏蔽效果差，不适合应用于现在设计的越轻薄短小的驱动IC上。
发明内容
1.要解决的问题
针对现有的导电胶膜存在接点脆弱亦破坏、电磁波屏蔽效果差、导电性能不用稳定等问题，本发明提供一种漂浮式全方位导电胶膜，包括上部胶层、下部胶层和导电胶层，所述的导电胶层包括绝缘基材、导电粒子和镀银纤维，绝缘基材由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯组成。本发明的导电胶膜具有柔性好、导电性能稳定、电磁波屏蔽效果好等优点，适用于轻薄短小的驱动IC与基板的连接。
2.技术方案
为了解决上述问题，本发明所采用的技术方案如下：
一种漂浮式全方位导电胶膜，包括上部胶层、下部胶层和导电胶层，所述的导电胶层包括绝缘基材和导电粒子，绝缘基材由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯组成，导电胶层中各组分的质量分数为：甲基丙烯酸正丁酯10～15％、苯乙烯单体8～15％、甲基丙烯酸羟丙酯10～20％、乙二醇二甲基丙烯酸酯8～15％、导电粒子25～35％；所述的导电粒子为镀铜银球导电粒子。
优选地，所述导电胶层中还包括镀银纤维，镀银纤维在导电胶层中的质量分数为20～27％。
优选地，所述导电胶层中各组分的质量分数为：甲基丙烯酸正丁酯15％、苯乙烯单体9％、甲基丙烯酸羟丙酯11％、乙二醇二甲基丙烯酸酯9％、导电粒子35％、镀银纤维21％。
优选地，所述镀铜银球导电粒子平均粒径为30～70nm，密度1.5～3g/cm3；所述镀银纤维的直径5～10μm，长度10～30μm，密度1-2g/cm3。
优选地，所述的上部胶层为聚酰亚胺补强板，所述的下部胶层为离型膜。
优选地，所述导电胶层的制备方法为：
(1)按比例将甲基丙烯酸正丁酯和苯乙烯单体在55～70℃条件下搅拌混合0.8～1.5h，得到混合物X1；
(2)按比例将甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯在55～70℃条件下搅拌0.5～1h，得到混合物X2；
(3)按比例将步骤(1)中得到的混合物X1与导电粒子搅拌混合0.8～1.5h，得到物质A；
(4)按比例将步骤(2)中得到的混合物X2与镀银纤维搅拌混合0.5～1h，得到物质B；
(5)将步骤(3)中的物质A与步骤(4)中的物质B在55～70℃条件下搅拌混合2～3h得到胶液，将制成的胶液经真空脱气后涂布、烘干得到所述的导电胶层。
优选地，步骤(1)中的搅拌速度为800～1000rpm；步骤(2)和步骤(5)中的搅拌速度为400～600rpm；步骤(3)和步骤(4)中的搅拌速度为250～400rpm。
优选地，步骤(1)和步骤(2)中的搅拌混合温度为60℃。
3.有益效果
相比于现有技术，本发明的有益效果为：
(1)本发明导电胶膜适用于轻薄短小的驱动IC与基板的连接，导电胶层包括绝缘基材镀银纤维和导电粒子，由于绝缘基材在加热下具有黏滞性，且在外来垂直压力下，其中的导电粒子向受压方向上移动，进而相互接触或挤压变形，因而形成受压垂直纵方向上具有电气导通的效应，当经过一段时间使绝缘胶材固化后，导电粒子及导电镀银纤维便不再受外力而移动而形成全方位导通稳定结构，因此，使用本发明的全方位导电胶膜能使TFT-LCD驱动IC与基板形成良好的电气连接；
(2)本发明的导电胶层中导电粒子是镀铜银球导电粒子，能克服现有的镍球导电粒子存在易氧化、接点脆弱亦破坏的缺点，银球表面镀铜能增加其导电性，增加更好的导电能力；
(3)本发明的导电胶层中具有镀银纤维层，能带来电磁波屏蔽效应(屏蔽性能＞85dB)；由于现在IC的设计越越来越轻薄短小，很多的电子组件上都有电磁波，有时会彼此干扰影响性能的运用，而本发明的导电胶膜能有效的对接点上产生的电磁波产生有效的屏蔽效果；
(4)本发明的上部胶层以及下部胶层在受热加压时的流动性大于导电胶层中的绝缘基材在受热加压时的流动性，使得整个导电胶膜在受热加压时，上部胶层以及下部胶层的流动速率或变形程度会大于绝缘基材；
(5)本发明的导电胶层中的导电胶由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯、乙二醇二甲基丙烯酸酯，在本发明的比例条件下制成的胶水具有黏性好、电绝缘性好等优点，导电粒子和镀银纤维能均匀分散在导电胶中；
(6)本发明的导电胶膜具有电阻低(导通电阻低于10mΩ)、冲型时变形率低，耐热性能好(85℃条件下实验1000h以上电阻变化率小于15％)、耐湿性能好(65℃、湿度95％条件下实验1000h以上电阻变化率小于25％)和回焊性能好等优点。
附图说明
图1为本发明的漂浮式全方位导电胶膜的结构示意图。
图中：1、上部胶层；2、下部胶层；3、镀银纤维；04、导电粒子；05、导电胶层。
具体实施方式
下面结合具体实施例对本发明进一步进行描述。
实施例1
如图1所示，一种漂浮式全方位导电胶膜，包括上部胶层01、下部胶层02和导电胶层05，上部胶层01为聚酰亚胺补强板，下部胶层02为离型膜。导电胶层05包括绝缘基材、镀银纤维03和导电粒子04，绝缘基材由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯组成，导电胶层中各组分的质量分数为：甲基丙烯酸正丁酯15％、苯乙烯单体9％、甲基丙烯酸羟丙酯11％、乙二醇二甲基丙烯酸酯9％、导电粒子35％、镀银纤维21％；导电粒子为镀铜银球导电粒子，其粒径分布在30～50nm范围内，密度分布在1.5～2.5g/cm3范围内。本实施例中镀银纤维的直径为5～8μm，长度10～20μm，密度1-2g/cm3；本实施例中导电胶层的厚度为40μm，离型膜的厚度为34μm，聚酰亚胺补强板的厚度为50μm。
本实施例中导电胶层的制备方法为：
(1)按比例将甲基丙烯酸正丁酯和苯乙烯单体在60℃条件下搅拌(采用直流高速混合机搅拌，速度为1000rpm)混合1h，得到混合物X1；
(2)按比例将甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯在60℃条件下搅拌(采用直流高速混合机搅拌，速度为500rpm)0.7h，得到混合物X2；
(3)按比例将步骤(1)中得到的混合物X1与镀铜银球导电粒子在室温下搅拌(采用游心式液体搅拌机，速度为300rpm)混合1h，得到物质A；
(4)按比例将步骤(2)中得到的混合物X2与镀银纤维在室温下搅拌(采用游心式液体搅拌机，速度为300rpm)混合0.8h，得到物质B；
(5)将步骤(3)中的物质A与步骤(4)中的物质B在60℃条件下搅拌(采用游心式液体搅拌机，速度为500rpm)混合2h得到胶液，将制成的胶液经真空脱气后涂布、烘干得到所述的导电胶层。
本实施例中制备得到的导电胶膜经测定，接著性能好(对铜箔、PI的接著强度均大于15N/cm)，其导通电阻为8mΩ，回焊前后电阻变化率为20.2％，在85℃条件下实验1000h电阻变化率为12％；在65℃、湿度95％条件下实验1000h电阻变化率为20％。
实施例2
如图1所示，一种漂浮式全方位导电胶膜，包括上部胶层01、下部胶层02和导电胶层05，上部胶层01为聚酰亚胺补强板，下部胶层02为离型膜。导电胶层05包括绝缘基材、镀银纤维03和导电粒子04，绝缘基材由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯组成，导电胶层中各组分的质量分数为：甲基丙烯酸正丁酯10％、苯乙烯单体8％、甲基丙烯酸羟丙酯10％、乙二醇二甲基丙烯酸酯15％、导电粒子30％、镀银纤维为27％；导电粒子为镀铜银球导电粒子，其粒径分布在40～70nm范围内，密度分布在2～3g/cm3范围内。本实施例中镀银纤维的直径为7～10μm，长度15～30μm，密度1-2g/cm3。本实施例中导电胶层的厚度为45μm，离型膜的厚度为38μm，聚酰亚胺补强板的厚度为60μm。
本实施例中导电胶层的制备方法为：
(1)按比例将甲基丙烯酸正丁酯和苯乙烯单体在55℃条件下搅拌(采用直流高速混合机搅拌，速度为800rpm)混合1.5h，得到混合物X1；
(2)按比例将甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯在55℃条件下搅拌(采用直流高速混合机搅拌，速度为600rpm)0.5h，得到混合物X2；
(3)按比例将步骤(1)中得到的混合物X1与镀铜银球导电粒子在室温下搅拌(采用游心式液体搅拌机，速度为400rpm)混合0.8h，得到物质A；
(4)按比例将步骤(2)中得到的混合物X2与镀银纤维在室温下搅拌(采用游心式液体搅拌机，速度为400rpm)混合0.5h，得到物质B；
(5)将步骤(3)中的物质A与步骤(4)中的物质B在55℃条件下搅拌(采用游心式液体搅拌机，速度为600rpm)混合2.5h得到胶液，将制成的胶液经真空脱气后涂布、烘干得到所述的导电胶层。
本实施例中制备得到的导电胶膜柔性好，导电性能稳定，经测定，接著性能好(对铜箔、PI的接著强度均大于18N/cm)，其导通电阻为8.5mΩ，回焊前后电阻变化率为22.5％，在85℃条件下实验1200h电阻变化率为14％；在65℃、湿度95％条件下实验1200h电阻变化率为23％。
实施例3
如图1所示，一种漂浮式全方位导电胶膜，包括上部胶层01、下部胶层02和导电胶层05，上部胶层01为聚酰亚胺补强板，下部胶层02为离型膜。导电胶层05包括绝缘基材、镀银纤维03和导电粒子04，绝缘基材由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯组成，导电胶层中各组分的质量分数为：甲基丙烯酸正丁酯12％、苯乙烯单体15％、甲基丙烯酸羟丙酯20％、乙二醇二甲基丙烯酸酯8％、导电粒子25％、镀银纤维为20％；导电粒子为镀铜银球导电粒子，其粒径分布在30～70nm范围内，密度分布在1.5～3g/cm3范围内。本实施例中镀银纤维的直径为5～10μm，长度10～30μm，密度1-2g/cm3。本实施例中导电胶层的厚度为35μm，离型膜的厚度为34μm，聚酰亚胺补强板的厚度为50μm。
本实施例中导电胶层的制备方法为：
(1)按比例将甲基丙烯酸正丁酯和苯乙烯单体在70℃条件下搅拌(采用直流高速混合机搅拌，速度为900rpm)混合0.8h，得到混合物X1；
(2)按比例将甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯在70℃条件下搅拌(采用直流高速混合机搅拌，速度为400rpm)0.7h，得到混合物X2；
(3)按比例将步骤(1)中得到的混合物X1与镀铜银球导电粒子在室温下搅拌(采用游心式液体搅拌机，速度为250rpm)混合1.5h，得到物质A；
(4)按比例将步骤(2)中得到的混合物X2与镀银纤维在室温下搅拌(采用游心式液体搅拌机，速度为250rpm)混合1h，得到物质B；
(5)将步骤(3)中的物质A与步骤(4)中的物质B在70℃条件下搅拌(采用游心式液体搅拌机，速度为400rpm)混合3h得到胶液，将制成的胶液经真空脱气后涂布、烘干得到所述的导电胶层。
本实施例中制备得到的导电胶膜经测定，接著性能好(对铜箔、PI的接著强度均大于20N/cm)，其导通电阻为10mΩ，回焊前后电阻变化率为25％，在85℃条件下实验1000h电阻变化率为15％；在65℃、湿度95％条件下实验1000h电阻变化率为25％。

Claims (8)

1.一种漂浮式全方位导电胶膜，包括上部胶层(01)、下部胶层(02)和导电胶层(05)，其特征在于：所述的导电胶层(05)包括绝缘基材和导电粒子(04)，绝缘基材由甲基丙烯酸正丁酯、苯乙烯单体、甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯组成，导电胶层(05)中各组分的质量分数为：甲基丙烯酸正丁酯10～15％、苯乙烯单体8～15％、甲基丙烯酸羟丙酯10～20％、乙二醇二甲基丙烯酸酯8～15％、导电粒子25～35％；所述的导电粒子为镀铜银球导电粒子。
2.根据权利要求1所述的一种漂浮式全方位导电胶膜，其特征在于：所述导电胶层(05)中还包括镀银纤维(03)，镀银纤维在导电胶层中的质量分数为20～27％。
3.根据权利要求2所述的一种漂浮式全方位导电胶膜，其特征在于：所述导电胶层(05)中各组分的质量分数为：甲基丙烯酸正丁酯15％、苯乙烯单体9％、甲基丙烯酸羟丙酯11％、乙二醇二甲基丙烯酸酯9％、导电粒子35％、镀银纤维21％。
4.根据权利要求2所述的一种漂浮式全方位导电胶膜，其特征在于：所述镀铜银球导电粒子平均粒径为30～70nm，密度1.5～3g/cm3；所述镀银纤维的直径5～10μm，长度10～30μm，密度1-2g/cm3。
5.根据权利要求1所述的一种漂浮式全方位导电胶膜，其特征在于：所述的上部胶层(01)为聚酰亚胺补强板，所述的下部胶层(02)为离型膜。
6.根据权利要求1所述的一种漂浮式全方位导电胶膜，其特征在于：所述导电胶层(05)的制备方法为：
(1)按比例将甲基丙烯酸正丁酯和苯乙烯单体在55～70℃条件下搅拌混合0.8～1.5h，得到混合物X1；
(2)按比例将甲基丙烯酸羟丙酯和乙二醇二甲基丙烯酸酯在55～70℃条件下搅拌0.5～1h，得到混合物X2；
(3)按比例将步骤(1)中得到的混合物X1与导电粒子搅拌混合0.8～1.5h，得到物质A；
(4)按比例将步骤(2)中得到的混合物X2与镀银纤维搅拌混合0.5～1h，得到物质B；
(5)将步骤(3)中的物质A与步骤(4)中的物质B在55～70℃条件下搅拌混合2～3h得到胶液，将制成的胶液经真空脱气后涂布、烘干得到所述的导电胶层。
7.根据权利要求6所述的一种漂浮式全方位导电胶膜，其特征在于：步骤(1)中的搅拌速度为800～1000rpm；步骤(2)和步骤(5)中的搅拌速度为400～600rpm；步骤(3)和步骤(4)中的搅拌速度为250～400rpm。
8.根据权利要求6所述的一种漂浮式全方位导电胶膜，其特征在于：步骤(1)和步骤(2)中的搅拌混合温度为60℃。
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