CN105390602A - LED package body - Google Patents
LED package body Download PDFInfo
- Publication number
- CN105390602A CN105390602A CN201510925855.XA CN201510925855A CN105390602A CN 105390602 A CN105390602 A CN 105390602A CN 201510925855 A CN201510925855 A CN 201510925855A CN 105390602 A CN105390602 A CN 105390602A
- Authority
- CN
- China
- Prior art keywords
- led
- silicon substrate
- substrate carrier
- led chip
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The invention discloses an LED package body. The LED package body comprises an LED chip, a packaged silicon-based carrier, a metal reflective layer, glass and a fixed resin layer; a reflective-cup-shaped downward-concave cavity is formed in the metal reflective layer; a cavity matched with the reflective-cup-shaped downward-concave cavity is formed in the packaged silicon-based carrier; the metal reflective layer is laminated on the upper surface of the packaged silicon-based carrier; an LED placement boss is arranged in the cavity of the packaged silicon-based carrier; the LED chip is fixed on the LED placement boss; the bottom of the LED chip is connected with a positive electrode and a negative electrode; the fixed resin layer is arranged on the external of the positive electrode, the negative electrode and the packaged silicon-based carrier in a sleeving manner; an electrode abdicating opening is formed in the fixed resin layer; the glass is arranged above the packaged silicon-based carrier; the glass and the packaged silicon-based carrier are connected by filling adhesive; a silicon island is arranged on the back surface of the LED chip; the lower surface of the silicon island is covered with a metal layer; and a radiator is arranged on the lower surface of the metal layer. The LED package body is simple in structure, high in reflective efficiency, good in radiation performance and low in cost.
Description
Technical field
The present invention relates to LED technical field, more specifically relate to a kind of LED body.
Background technology
The solid-state semiconductor device of LED to be a kind of can be by electric energy conversion visible ray, it is widely applied to the fields such as illumination, LCD backlight plate, control panel, flasher.
At present, LED particle is mainly sealed in the support that cross section is the reflective cup-shaped of inverted trapezoidal, plastics or pottery+metal electrode composition by traditional LED support, is provided with two electrode pins and extends outside support bottom LED chip.Traditional handicraft can have the following disadvantages: one is, employing plastics are reflectorized material, and reflector efficiency can be caused low; Two are, because sheathing material is plastics, its heat conductivility is poor, and heat radiation is only by two electrode pins, and cause integral heat sink poor performance, heat when allowing LED work can not distribute smoothly, thus reduce the light efficiency of LED; Three are, according to the packaging of pottery+metal electrode, although its heat conductivility improves, it is low that its light penetrates efficiency, and integrated cost is high.
Summary of the invention
In order to solve the problem, the invention provides that reflector efficiency is high, a kind of LED body of good heat dissipation effect.
According to an aspect of the present invention, provide a kind of LED body, it comprises LED chip, encapsulation silicon substrate carrier, metallic reflective layer, glass and fixing resin layer, metallic reflective layer is provided with reflective cup-shaped concave shape chamber, encapsulation silicon substrate carrier is provided with the die cavity matched with described reflective cup-shaped concave shape chamber, metallic reflective layer fits in the upper surface of encapsulation silicon substrate carrier, be provided with LED in the die cavity of encapsulation silicon substrate carrier and place boss, LED chip is fixed on LED to be placed on boss, positive electrode and negative electrode is connected with bottom LED chip, fixing resin layer is sheathed is fixed on positive electrode, negative electrode is with outside encapsulation silicon substrate carrier, fixing resin layer is provided with electrode and steps down opening, the top of encapsulation silicon substrate carrier is located at by glass, glass is connected by filling glue with encapsulation silicon substrate carrier, the back side of LED chip is provided with silicon isolated island, the lower surface of silicon isolated island is coated with metal level, the lower surface of metal level is provided with radiator.
In some embodiments, the lower surface of glass is provided with phosphor powder layer.
In some embodiments, the longitudinal section in reflective cup-shaped concave shape chamber is inverted trapezoidal.
Advantage of the present invention is: structure of the present invention is simple, scientific and reasonable, and employing metallic reflective layer substitutes the plastics reflector layer in traditional handicraft, improves reflector efficiency; The positive electrode that LED chip connects, negative electrode area are large, improve conduction and the heat-sinking capability of packaging body; Radiator is set, the heat energy Quick diffusing on LED chip is gone out.
Accompanying drawing explanation
Fig. 1 is the structural representation of an execution mode of a kind of LED body of the present invention.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
As shown in Figure 1, a kind of LED body of an execution mode of the present invention, comprises LED chip 1, encapsulation silicon substrate carrier 2, metallic reflective layer 3, glass 4 and fixing resin layer 5.Metallic reflective layer 3 is provided with reflective cup-shaped concave shape chamber 31, and the longitudinal section in reflective cup-shaped concave shape chamber 31 is inverted trapezoidal.Encapsulation silicon substrate carrier 2 is provided with the die cavity matched with reflective cup-shaped concave shape chamber 31, metallic reflective layer 3 fits in the upper surface of encapsulation silicon substrate carrier 2, be provided with LED in the die cavity of encapsulation silicon substrate carrier 2 and place boss 21, LED chip 1 is fixed on LED to be placed on boss 21, positive electrode 11 and negative electrode 12 is connected with bottom LED chip 1, fixing resin layer 5 is sheathed is fixed on positive electrode 11, negative electrode 12 is with outside encapsulation silicon substrate carrier 2, fixing resin layer 5 is provided with electrode and steps down opening 51, the top of encapsulation silicon substrate carrier 2 is located at by glass 4, glass 4 is connected by filling glue 6 with encapsulation silicon substrate carrier 2, silicon isolated island 7 is posted by gluing in the back side of LED chip 1, the lower surface of silicon isolated island 7 is coated with metal level 8, the lower surface of metal level 8 connects radiator 9 by soldering mode.
The lower surface of glass 4 is provided with phosphor powder layer 10.Phosphor powder layer 10 is located at the lower surface of glass 4, leaves LED chip 1 one segment distance, can extend the life-span of fluorescent material.
Structure of the present invention is simple, scientific and reasonable, and employing metallic reflective layer 3 substitutes the plastics reflector layer in traditional handicraft, improves reflector efficiency; The positive electrode 11 that LED chip 1 connects, negative electrode 12 area are large, improve conduction and the heat-sinking capability of packaging body; Radiator 9 is set, the heat energy Quick diffusing on LED chip 1 is gone out.
Above-described is only some embodiments of the present invention, it should be pointed out that for the person of ordinary skill of the art, and under the prerequisite not departing from creation design of the present invention, can also make other distortion and improve, these all belong to protection scope of the present invention.
Claims (3)
1. a LED body, it is characterized in that, comprise LED chip (1), encapsulation silicon substrate carrier (2), metallic reflective layer (3), glass (4) and fixing resin layer (5), described metallic reflective layer (3) is provided with reflective cup-shaped concave shape chamber (31), described encapsulation silicon substrate carrier (2) is provided with the die cavity matched with described reflective cup-shaped concave shape chamber (31), described metallic reflective layer (3) fits in the upper surface of encapsulation silicon substrate carrier (2), be provided with LED in the die cavity of described encapsulation silicon substrate carrier (2) and place boss (21), described LED chip (1) is fixed on LED to be placed on boss (21), described LED chip (1) bottom is connected with positive electrode (11) and negative electrode (12), described fixing resin layer (5) is sheathed is fixed on positive electrode (11), negative electrode (12) and encapsulation silicon substrate carrier (2) are outward, described fixing resin layer (5) is provided with electrode and steps down opening (51), the top of encapsulation silicon substrate carrier (2) is located at by described glass (4), described glass (4) is connected by filling glue (6) with encapsulation silicon substrate carrier (2), the back side of described LED chip (1) is provided with silicon isolated island (7), the lower surface of described silicon isolated island (7) is coated with metal level (8), the lower surface of described metal level (8) is provided with radiator (9).
2. a kind of LED body according to claim 1, is characterized in that, the lower surface of described glass (4) is provided with phosphor powder layer (10).
3. a kind of LED body according to claim 1 and 2, is characterized in that, the longitudinal section of described reflective cup-shaped concave shape chamber (31) is inverted trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510925855.XA CN105390602A (en) | 2015-12-14 | 2015-12-14 | LED package body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510925855.XA CN105390602A (en) | 2015-12-14 | 2015-12-14 | LED package body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105390602A true CN105390602A (en) | 2016-03-09 |
Family
ID=55422666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510925855.XA Pending CN105390602A (en) | 2015-12-14 | 2015-12-14 | LED package body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105390602A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070267642A1 (en) * | 2006-05-16 | 2007-11-22 | Luminus Devices, Inc. | Light-emitting devices and methods for manufacturing the same |
| CN102832330A (en) * | 2012-08-24 | 2012-12-19 | 江阴长电先进封装有限公司 | Wafer level LED packaging structure |
| CN203746908U (en) * | 2014-01-27 | 2014-07-30 | 江阴长电先进封装有限公司 | Wafer level LED chip packaging structure |
| CN205177881U (en) * | 2015-12-14 | 2016-04-20 | 江阴乐圩光电股份有限公司 | LED packaging body |
-
2015
- 2015-12-14 CN CN201510925855.XA patent/CN105390602A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070267642A1 (en) * | 2006-05-16 | 2007-11-22 | Luminus Devices, Inc. | Light-emitting devices and methods for manufacturing the same |
| CN102832330A (en) * | 2012-08-24 | 2012-12-19 | 江阴长电先进封装有限公司 | Wafer level LED packaging structure |
| CN203746908U (en) * | 2014-01-27 | 2014-07-30 | 江阴长电先进封装有限公司 | Wafer level LED chip packaging structure |
| CN205177881U (en) * | 2015-12-14 | 2016-04-20 | 江阴乐圩光电股份有限公司 | LED packaging body |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160309 |