CN105390585A - 芯片封装模块与封装基板 - Google Patents

芯片封装模块与封装基板 Download PDF

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CN105390585A
CN105390585A CN201510516498.1A CN201510516498A CN105390585A CN 105390585 A CN105390585 A CN 105390585A CN 201510516498 A CN201510516498 A CN 201510516498A CN 105390585 A CN105390585 A CN 105390585A
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circuit layer
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thermally conductive
conductive insulating
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顾淑梅
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LIGHTEN CORP
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Abstract

本发明揭露一种芯片封装模块与封装基板，其封装基板具有双面线路结构。一电路层可与芯片电性连接而另一导热线路层则延伸至下一层扩大导热面积，因此本发明可有效增加散热效率，特别是可用于需要解决散热问题的发光二极体芯片或太阳能芯片。

Description

芯片封装模块与封装基板
技术领域
本发明有关一种芯片封装技术，特别是一种需要极需良好散热的芯片封装模块与封装基板。
背景技术
发光二极体(light-emittingdiodes，LED)因具有寿命长、省电、耐用等特点，因此LED照明装置为绿能环保发展的趋势。其中，垂直式LED因为具有发光强度的优势也广泛的被使用，然而目前垂直式LED的构装中，芯片下方的导热层过多导致导热路径热阻提高，芯片在温度越高下发光效率越差，进而降低芯片的使用寿命与发光效率。此外，此问题同样会发生在太阳能电池领域，太阳能芯片再受到温度影响后会导致光发电转换效率下降，尤其是聚光型太阳能芯片更是要特别考虑解决散热的问题。
发明内容
为了解决上述问题，本发明目的之一是提供一种芯片封装模块与封装基板，其封装基板具有双面线路结构，电路层与芯片电性连接而导热线路层则延伸至下一层扩大导热面积，因此可有效增加散热效率。
本发明一实施例的芯片封装模块，包括：一金属基板；一第一导热绝缘层，设置于金属基板上；一导热线路层，设置于第一导热绝缘层上；一第二导热绝缘层，设置于导热线路层上；一电路层，设置于第二导热绝缘层上，其中电路层与导热线路层电性连接；至少一芯片，覆晶设置于电路层上；以及一封装材料，覆盖芯片与部分电路层。
本发明另一实施例的封装基板，包括：一金属基板；一第一导热绝缘层，设置于金属基板上；一导热线路层，设置于第一导热绝缘层上；一第二导热绝缘层，设置于导热线路层上；以及一电路层，设置于第二导热绝缘层上，其中电路层与导热线路层电性连接。
以下藉由具体实施例配合所附的附图详加说明，当更容易了解本发明的目的、技术内容、特点及其所达成的功效。
附图说明
图1为本发明一实施例的示意图。
图2为本发明一实施例的示意图。
图3为本发明一实施例的示意图。
图4为本发明一实施例的示意图。
具体实施方式
其详细说明如下，所述较佳实施例仅做一说明非用以限定本发明。
请参照图1，本发明一实施例芯片封装模块的示意图。芯片封装模块包括一金属基板10；依第一导热绝缘层20；一导热线路层30；一第二导热绝缘层22；一电路层32；至少一芯片40；以及一封装材料50。
如图1所示，第一导热绝缘层20设置于金属基板10的上表面。导热线路层30设置于第一导热绝缘层20上，藉由第一导热绝缘层20让导热线路层30与金属基板10电性隔绝。第二导热绝缘层22设置于导热线路层30上。电路层32设置于第二导热绝缘层上22，其中电路层32与导热线路层30电性连接。至少一芯片40，覆晶设置于电路层32上与其电性连接。封装材料50则覆盖芯片40与部分电路层32。芯片40利用导电材料42与电路层32电性连接。导电材料42可为焊球或是凸块。
接续上述说明，于本实施例中，电路层32、第二导热绝缘层22与导热线路层30为一三层结构，金属线路分布于第二导热绝缘层22的上下表面形成一双面线路结构。在第二导热绝缘层22上的电路层32用以与芯片40电性连接，芯片40所产生的热可通过电路层32延伸至第二导热绝缘层22下的导热线路层30并朝下由第一导热绝缘层20与金属基板10方向散出。
此外，于一实施例中，导热线路层30的面积大于电路层32的面积。因此，通过将电路层32的金属线路延伸至下层的导热线路层30，可有效加大导热面积，并增加其通过金属导热的速率。
请参照图1与图2，于不同实施例中，第二导热绝缘层22至少具有两开口(图上未标示)用以供电路层32与导热线路层30上下相接并电性连接。于一实施例中，封装材料50覆盖部分第二导热绝缘层22。
如图3所示，于一实施例中，金属基板10的下表面可设置一散热件60进一步帮助芯片封装模块增加其散热效率，芯片40所产生的热量传递至金属基板10后，可藉由设置于金属基板10另一表面的散热件60快速地散出。
于本芯片封装模块中，芯片40可为发光二极体芯片或是太阳能芯片。发光二极体芯片可为垂直式发光二极体芯片，其P-N电极设置于芯片40的底部，故可用以进行覆晶封装。另外，太阳能芯片也可以为需要散热效果良好的高聚光型太阳能芯片，藉由本发明中双面线路结构快速进行散热。
如图1与图2所示，本发明的封装基板包括：一金属基板10；一第一导热绝缘层20，设置于金属基板10上；一导热线路层30，设置于第一导热绝缘层20上；一第二导热绝缘层22，设置于导热线路层30上；以及一电路层32，设置于第二导热绝缘层22上，其中电路层32与导热线路层30电性连接。第二导热绝缘层22具有至少两开口(图上未标示)用以供电路层32与导热线路层30上下电性连接。
于本发明中，请参照图1与图2，电路层32、第二导热绝缘层22与导热线路层30的设计让金属线路分布于第二导热绝缘层22的上下表面形成一双面线路结构。如图4所示，电路层32用以与芯片40电性连接。导热线路层30的面积大于电路层32的面积。因此，通过将电路层32的金属线路延伸至下层的导热线路层30，可有效加大导热面积，并增加芯片40所产生热量通过金属导热的速率。如图3所示，金属基板10下表面可设置一散热件60。
根据上述说明，本发明藉由封装基板双面线路的设计，让芯片底部所产生的热由加大导热面积的线路快速地散出。双面线路中的电路层与芯片电性连接，而导热线路层则延伸至下一层扩大导热面积，因此本发明可有效增加芯片封装模块散热效率与维持其使用寿命。
以上所述的实施例仅为说明本发明的技术思想及特点，其目的在使熟习此项技艺的人士能够了解本发明的内容并据以实施，当不能以之限定本发明的专利范围，即大凡依本发明所揭示的精神所作的均等变化或修饰，仍应涵盖在本发明的专利范围内。
【符号说明】
10金属基板
20第一导热绝缘层
22第二导热绝缘层
30导热线路层
32电路层
40芯片
42导电材料
50封装材料
60散热件

Claims (10)

1.一种芯片封装模块，其特征在于，包含：
一金属基板；
一第一导热绝缘层，设置于该金属基板上；
一导热线路层，设置于该第一导热绝缘层上；
一第二导热绝缘层，设置于该导热线路层上；
一电路层，设置于该第二导热绝缘层上，其中该电路层与该导热线路层电性连接；
至少一芯片，覆晶设置于该电路层上；以及
一封装材料，覆盖该芯片与部分该电路层。
2.如权利要求1所述的芯片封装模块，其特征在于，该封装材料更包含覆盖部分该第一导热绝缘层。
3.如权利要求1所述的芯片封装模块，其特征在于，更包含一散热件设置于该金属基板下。
4.如权利要求1所述的芯片封装模块，其特征在于，该第二导热绝缘层具有至少两开口用以供该电路层与该导热线路层上下电性连接。
5.如权利要求1所述的芯片封装模块，其特征在于，该芯片为发光二极体芯片或太阳能芯片。
6.如权利要求1所述的芯片封装模块，其特征在于，该导热线路层的面积大于该电路层的面积。
7.如权利要求1所述的芯片封装模块，其特征在于，更包含一导电材料电性连接该芯片与该电路层。
8.一种封装基板，其特征在于，包含：
一金属基板；
一第一导热绝缘层，设置于该金属基板上；
一导热线路层，设置于该第一导热绝缘层上；
一第二导热绝缘层，设置于该导热线路层上；以及
一电路层，设置于该第二导热绝缘层上，其中该电路层与该导热线路层电性连接。
9.如权利要求8所述的封装基板，其特征在于，更包含一散热件设置于该金属基板下。
10.如权利要求8所述的封装基板，其特征在于，该第二导热绝缘层具有至少两开口用以供该电路层与该导热线路层上下电性连接。
CN201510516498.1A 2014-08-21 2015-08-21 芯片封装模块与封装基板 Pending CN105390585A (zh)

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