CN105374553B - Sucking disc formula paster condenser - Google Patents
Sucking disc formula paster condenser Download PDFInfo
- Publication number
- CN105374553B CN105374553B CN201510871240.3A CN201510871240A CN105374553B CN 105374553 B CN105374553 B CN 105374553B CN 201510871240 A CN201510871240 A CN 201510871240A CN 105374553 B CN105374553 B CN 105374553B
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- sucker
- lead
- external connection
- shell
- connection point
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Abstract
A sucker type chip capacitor comprises a shell, a core bag arranged in the shell and a lead wire led out from the core bag, wherein a sucker is connected to the lead wire, a suction part of the sucker is perpendicular to the shell, and a rubber plug plane at one end of the shell is in close contact with a connecting part of the sucker. When the sucker type chip capacitor is used, soldering tin is firstly coated on the lead wire or the external connection point on the sucker, and the sucker is fixed on the circuit board for reflow soldering.
Description
Technical Field
The invention relates to an electronic product, in particular to a sucker type chip capacitor.
Background
The current capacitor base is an important accessory of paster aluminum electrolytic capacitor, play support and thermal-insulated effect to paster electric capacity, big electrolytic capacitor is bulky, in the transportation, or can rock in high-speed automatic equipment process, arouse the lead wire rupture easily, because there is not any isolation measure between two pins of paster aluminum electrolytic capacitor, when carrying out backward flow blow welding with the circuit board soldering after, the soldering that leads to easily melting trickles to the opposite side from base one side, cause the short circuit phenomenon to appear between two polarities of condenser, influence the normal practicality of whole circuit board.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a sucker type chip capacitor convenient to weld.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: the utility model provides a sucking disc formula paster condenser, includes the shell, arranges the core package in the shell and the lead wire of drawing forth from the core package in, be connected with a sucking disc on the lead wire, the portion of inhaling of sucking disc is perpendicular with the shell, the rubber buffer plane of shell one end and the connecting portion in close contact with of sucking disc.
In the above sucker type chip capacitor, preferably, the sucker is provided with two lead slots, and two leads of the capacitor pass through respective lead holes on the connecting portion and are respectively arranged in the two lead slots.
In the above sucker type chip capacitor, preferably, the lead is sealed in the lead hole by pressing.
In the above sucker type chip capacitor, preferably, the thicknesses of the suction portions of the suckers from the outer edges to the connecting portions are sequentially increased.
In the above sucker type chip capacitor, preferably, the two lead slots are arranged in a straight line in an opposite manner, and a welding rod is arranged between the two lead slots. The solder rod is separated to prevent the short circuit between two polarities of the capacitor caused by the melting of tin soldering during reflow blowing welding.
The sucking disc type patch capacitor is preferred, the inside of the sucking part of the sucking disc is provided with the lead connecting wire, the connecting part of the sucking disc is provided with the lead connecting hole, the lead connecting hole is internally provided with the conductive adhesive ring, and the lead connecting wire is connected with the conductive adhesive ring. In the invention, a lead is inserted into a lead connecting hole and connected with a conductive rubber ring; at this time, the lead wire of the capacitor of the present invention can be set very short and is not easily broken during the assembly and transportation.
The sucker type patch capacitor is preferable, the sucker is provided with an external connection point, the lead wire connecting wire is connected with the external connection point, and the external connection point is arranged in the welding isolation ring. In reflow soldering, excessive solder is melted and then absorbed in the solder dam when flowing away from the external connection point.
In the above sucker type patch capacitor, preferably, the external connection point includes a metal sheet and an external connection hole, and the metal sheet is disposed in the external connection hole and connected to the lead connection line. Through the welding of the welding point on sheetmetal and the circuit board, it is more firm.
In the above sucker type patch capacitor, preferably, the sucker is made of transparent PVC material.
Compared with the prior art, the invention has the advantages that: when the sucker type chip capacitor is used, soldering tin is firstly coated on the lead wire or the external connection point on the sucker, and the sucker is fixed on the circuit board for reflow soldering.
Drawings
Fig. 1 is a schematic structural diagram of a suction cup type chip capacitor in embodiment 1 of the present invention.
Fig. 2 is a schematic structural view of the suction cup in fig. 1.
Fig. 3 is a schematic bottom view of a suction cup according to embodiment 2 of the present invention.
Fig. 4 is a schematic top view of a chuck in embodiment 2 of the present invention.
Description of the figures
1. A housing; 2. a lead wire; 3. a suction cup; 4. a connecting portion; 5. a lead slot; 6. a suction part; 7. separating welding rods; 8. a lead connecting hole; 9. welding rings are separated; 10. a metal sheet; 11. is externally connected with a connecting hole.
Detailed Description
In order to facilitate an understanding of the invention, the invention will be described more fully and in detail below with reference to the accompanying drawings and preferred embodiments, but the scope of the invention is not limited to the specific embodiments below.
It should be particularly noted that when an element is referred to as being "fixed to, connected to or communicated with" another element, it can be directly fixed to, connected to or communicated with the other element or indirectly fixed to, connected to or communicated with the other element through other intermediate connecting components.
Unless otherwise defined, all terms of art used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention.
Example 1
As shown in fig. 1 and fig. 2, the suction cup type chip capacitor comprises a housing 1, a core bag arranged in the housing 1 and a lead 2 led out from the core bag, wherein the lead 2 is connected with a suction cup 3, a suction part 6 of the suction cup 3 is vertical to the housing 1, and a rubber plug plane at one end of the housing 1 is in close contact with a connecting part 4 of the suction cup 3. Two lead wire grooves 5 are formed in the sucker 3, two lead wires 2 of the capacitor penetrate through respective lead wire holes in the connecting portion 4 and are arranged in the two lead wire grooves 5 respectively, the two lead wire grooves 5 are arranged in a straight line in a relative mode, and a welding isolating rod 7 is arranged in the middle of the two lead wire grooves 5. The lead 2 is sealed in the lead hole by pressing. In this embodiment, the suction cup 3 is made of transparent PVC material, and the thickness of the suction portion 6 of the suction cup 3 from the outer edge to the connecting portion 4 is increased in sequence.
Example 2
As shown in fig. 3 and 4, in the suction cup type chip capacitor, a lead connection line is provided inside the suction portion 6 of the suction cup 3, a lead connection hole 8 is provided on the connection portion 4 of the suction cup 3, a conductive adhesive ring is provided in the lead connection hole 8, and the lead connection line is connected to the conductive adhesive ring.
In this embodiment, the suction cup 3 is provided with an external connection point, the lead wire connection line is connected with the external connection point, and the external connection point is arranged in the welding isolation ring 9; the external connection point comprises a metal sheet 10 and an external connection hole 11, and the metal sheet 10 is arranged in the external connection hole 11 and connected with the lead connecting wire.
The other portions of this example are the same as example 1.
Claims (3)
1. The utility model provides a sucking disc formula paster condenser, includes the shell, arranges the core package in the shell and the lead wire of drawing forth from the core package which characterized in that: the lead is connected with a sucker, the sucking part of the sucker is perpendicular to the shell, the plane of the rubber plug at one end of the shell is in close contact with the connecting part of the sucker, and the sucker is made of transparent PVC material; a lead connecting wire is arranged inside the sucking part of the sucker, a lead connecting hole is arranged on the connecting part of the sucker, a conductive rubber ring is arranged in the lead connecting hole, and the lead connecting wire is connected with the conductive rubber ring; the sucking disc is provided with an external connection point, the lead wire connecting wire is connected with the external connection point, and the external connection point is arranged in the welding isolation ring.
2. The suction cup patch capacitor of claim 1, wherein: the thickness of the suction part of the sucker from the outer edge to the connecting part is increased in sequence.
3. The suction cup patch capacitor of claim 1, wherein: the external connection point comprises a metal sheet and an external connection hole, and the metal sheet is arranged in the external connection hole and connected with the lead wire connection line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510871240.3A CN105374553B (en) | 2015-12-02 | 2015-12-02 | Sucking disc formula paster condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510871240.3A CN105374553B (en) | 2015-12-02 | 2015-12-02 | Sucking disc formula paster condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105374553A CN105374553A (en) | 2016-03-02 |
| CN105374553B true CN105374553B (en) | 2020-11-17 |
Family
ID=55376657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510871240.3A Expired - Fee Related CN105374553B (en) | 2015-12-02 | 2015-12-02 | Sucking disc formula paster condenser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105374553B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011187890A (en) * | 2010-03-11 | 2011-09-22 | Hitachi Car Eng Co Ltd | Capacitor device and method of manufacturing the same |
| CN202150357U (en) * | 2011-07-15 | 2012-02-22 | 苏州唐峰电器有限公司 | Improved capacitor pedestal |
| CN103317200A (en) * | 2013-06-20 | 2013-09-25 | 上海三思电子工程有限公司 | Welding method and jig for adhering lead on circuit board |
| CN105070507A (en) * | 2015-09-08 | 2015-11-18 | 湖南艾华集团股份有限公司 | Base for surface-mounted aluminum electrolytic capacitor and application |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008306015A (en) * | 2007-06-08 | 2008-12-18 | Fujitsu Ten Ltd | Electronic component for insertion and mounting, and method for mounting the same |
-
2015
- 2015-12-02 CN CN201510871240.3A patent/CN105374553B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011187890A (en) * | 2010-03-11 | 2011-09-22 | Hitachi Car Eng Co Ltd | Capacitor device and method of manufacturing the same |
| CN202150357U (en) * | 2011-07-15 | 2012-02-22 | 苏州唐峰电器有限公司 | Improved capacitor pedestal |
| CN103317200A (en) * | 2013-06-20 | 2013-09-25 | 上海三思电子工程有限公司 | Welding method and jig for adhering lead on circuit board |
| CN105070507A (en) * | 2015-09-08 | 2015-11-18 | 湖南艾华集团股份有限公司 | Base for surface-mounted aluminum electrolytic capacitor and application |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105374553A (en) | 2016-03-02 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201117 Termination date: 20211202 |
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| CF01 | Termination of patent right due to non-payment of annual fee |