JP2011187890A - Capacitor device and method of manufacturing the same - Google Patents

Capacitor device and method of manufacturing the same Download PDF

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JP2011187890A
JP2011187890A JP2010054506A JP2010054506A JP2011187890A JP 2011187890 A JP2011187890 A JP 2011187890A JP 2010054506 A JP2010054506 A JP 2010054506A JP 2010054506 A JP2010054506 A JP 2010054506A JP 2011187890 A JP2011187890 A JP 2011187890A
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hollow
hollow portion
surface side
welded
connection terminal
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Keijiro Okabe
形次郎 岡部
Daisuke Yamashita
大介 山下
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Hitachi Automotive Systems Engineering Co Ltd
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Hitachi Car Engineering Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To visually confirm a place of connection between a chip type ceramic capacitor and a connection terminal. <P>SOLUTION: A case in a rectangular parallelepiped shape is used which has one surface linked to the other surface by hollow parts such that the hollow part on the one surface side is wider than the hollow part on the other surface side, and which has through-holes linked to the hollow part on the one surface side and not linked to the hollow part on the other surface side. An external connection terminal for an electrode which leads a weld part and leads an external led part to outside the case in the rectangular parallelepiped shape is fitted to a base comprising the large and small hollow parts, and an external connection terminal for grounding which leads a weld part and leads an external led part to outside the case in the rectangular parallelepiped shape is fitted to a part where the large and small hollow parts comes into contact with each other. A capacitor element is installed in the hollow part on the one surface side, terminals thereof are welded to the weld parts of the external connection terminals, respectively, and the hollow parts are filled with resin. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、例えば整流子モータに生ずる火花ノイズを除去するために使用されるチップ型のコンデンサ装置とその製造方法に関する。   The present invention relates to a chip-type capacitor device used for removing spark noise generated in, for example, a commutator motor, and a manufacturing method thereof.

一般に整流子モータの整流時に発生する火花ノイズを除去して、車輌等に搭載される電子機器への影響を低減するために、ブラシ間にチップ型コンデンサを配置することは例えば特許文献1により広く知られている。   In order to remove spark noise generally generated during commutation of a commutator motor and reduce the influence on an electronic device mounted on a vehicle or the like, it is more widely disclosed in, for example, Patent Document 1 to arrange a chip-type capacitor between brushes. Are known.

上記チップ型コンデンサは、近年ノイズ除去機能を高めたセラミックコンデンサ素子の開発によって急速に普及しつつあるが、実用化されているものは例えば特許文献2にあるように、セラミックコンデンサを単にプラスチックケースにコンデンサチップを配置してモールドするものが主流であった。   In recent years, the above-mentioned chip type capacitors are rapidly spreading due to the development of ceramic capacitor elements having an improved noise removal function. However, as disclosed in Patent Document 2, for example, a ceramic capacitor is simply used as a plastic case. The mainstream was to place and mold the capacitor chip.

特開2001−57765号公報JP 2001-57765 A 特開平9−232196号公報JP-A-9-232196

特許文献2に記載の手法により製造されるコンデンサ装置は、モールドされてしまっているためにコンデンサと接続端子の接続箇所を外観上確認することができない。コンデンサ装置の仕上がり確認の検査観点として、コンデンサと接続端子の接続箇所は重要なところで有るにもかかわらず、その状態を完成品以前に確認できる手法は確立されていない。   Since the capacitor device manufactured by the method described in Patent Document 2 has been molded, it is impossible to visually confirm the connection location between the capacitor and the connection terminal. As an inspection point for confirming the finish of the capacitor device, there is no established method for confirming the state of the capacitor device before the finished product even though the connection location between the capacitor and the connection terminal is important.

結果的に完成品後に計測器機を用いて導通確認を行うのが一般的であった。勿論、X線検査装置等を利用して確認することも可能であるが検査装置が大型になることは避けられず、経済的にも不利なものであった。   As a result, it was common to check continuity using a measuring instrument after the finished product. Of course, it is possible to confirm using an X-ray inspection apparatus or the like, but it is inevitable that the inspection apparatus becomes large and economically disadvantageous.

本発明のコンデンサ装置は、直方体状ケースの一方面と他方面の間が連通してモールド封止され、一方面の内部でチップ型コンデンサと外部接続端子の溶接部分とが溶接され、他方面のモールド領域は、一方面のモールド領域よりも狭く、かつ他方面には複数のモールド領域を有する。   In the capacitor device of the present invention, the one surface and the other surface of the rectangular parallelepiped case communicate with each other and are mold-sealed. Inside the one surface, the chip capacitor and the welded portion of the external connection terminal are welded, and the other surface is welded. The mold area is narrower than the mold area on one side and has a plurality of mold areas on the other side.

また、他方面側から外部接続端子が導かれている。   An external connection terminal is led from the other side.

本発明のコンデンサ装置は、一方面と他方面の間が中空部で連通し、一方面側の中空部が他方面側の中空部よりも広いとともに、一方面側の中空部に連通して他方面側の中空部に連通しない貫通孔を有する直方体状ケース、大小の中空部で形成する台部に、溶接部分を導き、直方体状ケース外に外部取り出し部分を導く電極用の外部接続端子、大小の中空部が接する部分に、溶接部分を導き、直方体状ケース外に外部取り出し部分を導くアース用の外部接続端子、一方面側の中空部内に設けられ、その端子が外部接続端子の溶接部分にそれぞれ溶接されたコンデンサ素子、中空部に充填された樹脂とから成る。   In the capacitor device of the present invention, the one surface and the other surface communicate with each other through a hollow portion, the hollow portion on one surface side is wider than the hollow portion on the other surface side, and communicates with the hollow portion on the one surface side. A rectangular parallelepiped case having a through-hole that does not communicate with the hollow portion on the direction side, an external connection terminal for an electrode for guiding the welded portion to the base portion formed by a large and small hollow portion, and leading the external extraction portion outside the rectangular parallelepiped case, large and small The external connection terminal for ground that leads the welded part to the part where the hollow part of the lead contacts and leads the external takeout part outside the rectangular parallelepiped case, is provided in the hollow part on one side, and that terminal is connected to the welded part of the external connection terminal Each consists of a welded capacitor element and a resin filled in the hollow portion.

本発明のコンデンサ装置の製造方法は、一方面と他方面の間を中空部で連通し、一方面側の中空部が他方面側の中空部よりも広いとともに、一方面側の中空部に連通して他方面側の中空部に連通しない貫通孔を有する直方体状ケースを使用し、大小の中空部で形成する台部に、溶接部分を導き、直方体状ケース外に外部取り出し部分を導く電極用の外部接続端子を取り付け、大小の前記中空部が接する部分に、溶接部分を導き、直方体状ケース外に外部取り出し部分を導くアース用の外部接続端子を取り付け、一方面側の中空部内にコンデンサ素子を設置してその端子を外部接続端子の溶接部分にそれぞれ溶接し、中空部に樹脂を充填してなる。   The manufacturing method of the capacitor device of the present invention communicates between one side and the other side with a hollow part, the hollow part on one side is wider than the hollow part on the other side, and communicates with the hollow part on one side. For the electrode that uses a rectangular parallelepiped case with a through hole that does not communicate with the hollow portion on the other side, guides the welded part to the base formed by the large and small hollow parts, and leads the external extraction part outside the rectangular parallelepiped case The external connection terminal is attached, the welded portion is guided to the portion where the large and small hollow portions are in contact, the external connection terminal for grounding is guided to the outside of the rectangular parallelepiped case, and the capacitor element is placed in the hollow portion on one side And the terminals are welded to the welded portions of the external connection terminals, respectively, and the hollow portion is filled with resin.

また、コンデンサ素子の端子と外部接続端子の溶接作業を、一方面側の中空部内で実施し、他方面側の中空部から溶接作業とその溶接結果を監視するのがよい。   Further, it is preferable to perform the welding operation of the capacitor element terminal and the external connection terminal in the hollow portion on the one surface side, and monitor the welding operation and the welding result from the hollow portion on the other surface side.

また、中空部に樹脂を充填するときに、直方体状ケースを一方面側の中空部を下にして載置台上に載置し、他方面側の中空部から樹脂を充填するのがよい。   Further, when filling the hollow portion with the resin, it is preferable to place the rectangular parallelepiped case on the mounting table with the hollow portion on one side facing down, and fill the resin from the hollow portion on the other side.

また、中空部に樹脂を充填するときに、貫通孔を空気抜き用の孔とするのがよい。   Further, when the resin is filled in the hollow portion, the through hole is preferably a hole for venting air.

また、溶接作業とその溶接結果を監視したあとで、直方体状ケースを一方面側の中空部を下にして載置台上に載置し、他方面側の中空部から樹脂を充填するのがよい。   In addition, after monitoring the welding operation and the welding result, it is preferable to place the rectangular parallelepiped case on the mounting table with the hollow part on one side facing down and to fill the resin from the hollow part on the other side. .

チップ型セラミックコンデンサと接続端子の接続箇所を、裏面の穴から目視で確認することができる。   The connection location of the chip-type ceramic capacitor and the connection terminal can be visually confirmed from the hole on the back surface.

溶接切片部分が整列配置された中空部内に、チップ型コンデンサ素子を載置した図The figure shows a chip-type capacitor element placed in the hollow part where the welded sections are aligned. 本発明のコンデンサ装置を装着したモータの縦断面図Vertical section of a motor equipped with the capacitor device of the present invention 本発明のコンデンサ装置を装着したモータの横断面図Cross-sectional view of a motor equipped with the capacitor device of the present invention プラスチック製コンデンサケース15の表面を示す図The figure which shows the surface of the plastic capacitor | condenser case 15 プラスチック製コンデンサケース15の裏面を示す図The figure which shows the back surface of plastic capacitor case 15 図4のプラスチック製コンデンサケース15のBB断面を示す図The figure which shows the BB cross section of the plastic capacitor | condenser case 15 of FIG. プラスチック製コンデンサケース15に取り付けられる接続端子16及びアース端子17を示す図The figure which shows the connecting terminal 16 and the earthing terminal 17 which are attached to the plastic capacitor | condenser case 15. 接続端子16及びアース端子17をプラスチック製コンデンサケース15に取り付けた状態を示す図The figure which shows the state which attached the connection terminal 16 and the ground terminal 17 to the plastic capacitor | condenser case 15. 図8を表面側から見た時の中空部を示した図The figure which showed the hollow part when FIG. 8 is seen from the surface side 図6の断面図の上に、溶接切片部分16b、17bを表示した図The figure which displayed welding section part 16b, 17b on the sectional view of Drawing 6 モールド樹脂充填時の図6のBB断面を示す図The figure which shows the BB cross section of FIG. 6 at the time of mold resin filling 本発明により製造されたコンデンサ装置の表側外観を示す図The figure which shows the front side external appearance of the capacitor | condenser apparatus manufactured by this invention 本発明により製造されたコンデンサ装置の裏側外観を示す図The figure which shows the back side external appearance of the capacitor | condenser apparatus manufactured by this invention

以下、本発明を実施する一形態について説明する。   Hereinafter, an embodiment for carrying out the present invention will be described.

図2と図3は、本発明のコンデンサ装置を適用可能な一般的なモータ構成を示しており、このうち図2はモータの軸方向縦断面図を示している。また、図3は図2の破断線A−Aでの断面を示している。   2 and 3 show a general motor configuration to which the capacitor device of the present invention can be applied. Of these, FIG. 2 shows an axial longitudinal sectional view of the motor. FIG. 3 shows a cross section taken along line AA in FIG.

図2において、モータ1は円筒状のケーシング2の内周に固定磁極を構成する複数個のマグネット3を固定していて、図2右側の開口部をエンドブラケット4にて閉蓋している。ロータ5は回転軸となるシャフト6の左側端を前記ケーシング2の側面中心に軸受7を介して保持され、右側端を同様に前記エンドブラケット4の側面中心に軸受71を介して保持されている。   In FIG. 2, the motor 1 fixes a plurality of magnets 3 constituting a fixed magnetic pole to the inner periphery of a cylindrical casing 2, and the opening on the right side of FIG. The rotor 5 has the left end of the shaft 6 serving as a rotation shaft held at the center of the side surface of the casing 2 via a bearing 7 and the right end similarly held at the center of the side surface of the end bracket 4 via a bearing 71. .

また、図2の破断線A−Aから見たときの位置関係を示す図3によく描かれているように、整流子8に摺動するブラシ9はそれぞれブラシホルダー10を介してブラシベース11に装着され、該ブラシベース11は前記エンドブラケット4の内側面に固定されている。   Further, as well illustrated in FIG. 3 showing the positional relationship when viewed from the broken line AA in FIG. 2, the brushes 9 that slide on the commutator 8 are respectively connected to the brush base 11 via the brush holder 10. The brush base 11 is fixed to the inner side surface of the end bracket 4.

また、図3において、コンデンサ装置12が前記ブラシ9の正、負極間に設置されている。つまり、図の例ではブラシ9の正、負極間に並列接続する様にコンデンサ装置12の接続端子板16が位置付けされ、コンデンサ装置12のアース端子17が、エンドブラケット4側に接続されている。   In FIG. 3, a capacitor device 12 is installed between the positive and negative electrodes of the brush 9. That is, in the illustrated example, the connection terminal plate 16 of the capacitor device 12 is positioned so as to be connected in parallel between the positive and negative electrodes of the brush 9, and the ground terminal 17 of the capacitor device 12 is connected to the end bracket 4 side.

上記のモータに適用される本発明のコンデンサ装置は、本体であるコンデンサ以外に大きく2つの部品から構成される。プラスチック製コンデンサケース15と、当該ケースに取り付けられる接続端子16及びアース端子17である。   The capacitor device of the present invention applied to the motor is mainly composed of two parts other than the capacitor as the main body. A plastic capacitor case 15 and a connection terminal 16 and a ground terminal 17 attached to the case.

熱可塑性のプラスチック製コンデンサケース15は、図4に表側、図5に裏側の立体図を示すように直方体状に構成されており、図4表側の中央部に第1の中空部13を有し、図5裏側の中央部に第1の中空部より小さい第2の中空部14を有する。   The thermoplastic plastic capacitor case 15 is formed in a rectangular parallelepiped shape as shown in a front view in FIG. 4 and a rear view in FIG. 5, and has a first hollow portion 13 in the center on the front side in FIG. 5 has a second hollow portion 14 smaller than the first hollow portion at the center of the back side.

また、小さいほうの中空部13は、大きい中空部14の中に形成されている。従って、直方体状のプラスチック製コンデンサケース15の断面は、図4のBB断面図を示す図6に示すように、1つの中空部が表側からと裏側では異なる大きさに形成されたものであり、中間に台部18を形成する。また、コンデンサケース15には、第1の中空部に連通し、第2の中空部14には連通しない位置に貫通孔19が設けられている。この貫通孔19の設置位置は、2つの中空部により形成された台部18に設けられたことになる。なお、貫通孔19の役割については、逐次適宜の場面で説明する。   The smaller hollow portion 13 is formed in the larger hollow portion 14. Therefore, the cross section of the rectangular parallelepiped plastic capacitor case 15 is such that one hollow portion is formed in a different size from the front side to the back side as shown in FIG. 6 showing the BB cross section of FIG. A base 18 is formed in the middle. The capacitor case 15 is provided with a through hole 19 at a position communicating with the first hollow portion and not communicating with the second hollow portion 14. The installation position of the through hole 19 is provided on the base portion 18 formed by two hollow portions. In addition, the role of the through-hole 19 is demonstrated in an appropriate scene sequentially.

当該ケース15に取り付けされる接続端子16及びアース端子17は、図7に示すように階段状に形成されており、それぞれ、外部取り出し部分16a、17aと、ケース取り付け部分16c、17cと、溶接切片部分16b、17bからなる。このうち、ケース取り付け部分16c、17cは、接続端子16及びアース端子17をプラスチック製コンデンサケース15に取り付ける機能を果たす。また接続端子16は、2つ備えられ、最終的には、これがコンデンサの正極と負極に接続されて、コンデンサ装置12の外部接続端子となる。また、溶接切片部分16bには、異なる位置に孔20が形成されている。   The connection terminal 16 and the ground terminal 17 attached to the case 15 are formed in a step shape as shown in FIG. 7, and are respectively provided with external extraction parts 16 a and 17 a, case attachment parts 16 c and 17 c, and welded pieces. It consists of portions 16b and 17b. Of these, the case attachment portions 16 c and 17 c serve to attach the connection terminal 16 and the ground terminal 17 to the plastic capacitor case 15. In addition, two connection terminals 16 are provided. Finally, these are connected to the positive electrode and the negative electrode of the capacitor and become external connection terminals of the capacitor device 12. Moreover, the hole 20 is formed in the different position in the welding section | part 16b.

図8は、接続端子16及びアース端子17をプラスチック製コンデンサケース15に取り付けた状態を示している。但し、取り付け状況が良くわかるように、敢えて溶接切片部分16b、17bを表示していない。このことから判るように、接続端子16及びアース端子17は、そのケース取り付け部分16c、17cが、プラスチック製コンデンサケース15の中空部13内の相対する面に置かれ、かつ外部取り出し部分16a、17aを底面から外側に向けて取り付けられる。なお、この位置に設置するに当り、プラスチック製コンデンサケース15に適宜、設置用の孔などが形成されていることは言うまでもない。   FIG. 8 shows a state in which the connection terminal 16 and the ground terminal 17 are attached to the plastic capacitor case 15. However, the welding section portions 16b and 17b are not displayed so as to clearly understand the mounting state. As can be seen from this, the connection terminal 16 and the ground terminal 17 have the case mounting portions 16c and 17c placed on the opposing surfaces in the hollow portion 13 of the plastic capacitor case 15 and the external extraction portions 16a and 17a. Can be attached from the bottom to the outside. Needless to say, an installation hole or the like is appropriately formed in the plastic capacitor case 15 for installation at this position.

図9は、図8を表面側(図9の上方)から見た時の中空部を示したものであり、この図を用いて、図9に敢えて表示しなかった溶接切片部分16b、17bの位置関係を説明する。図9において、まず、外側の線14が大きい中空部14を、内側の線13が小さい中空部13を示している。従って、右下方向の斜線で示す部分が、2つの中空部により形成された台部18であり、白抜きの部分が表から裏まで貫通した中空部14(小さい中空部)である。   FIG. 9 shows a hollow portion when FIG. 8 is viewed from the front surface side (upper part of FIG. 9). Using this figure, the welding sections 16b and 17b which are not shown in FIG. 9 are shown. The positional relationship will be described. In FIG. 9, first, the hollow portion 14 in which the outer line 14 is large and the hollow portion 13 in which the inner line 13 is small are shown. Therefore, the part shown by the oblique line in the lower right direction is the base part 18 formed by two hollow parts, and the white part is the hollow part 14 (small hollow part) penetrating from the front to the back.

そして、図8の接続端子16及びアース端子17の取り付け位置から理解できるように、アース端子17の溶接切片部分17bが、同図の上から下に向けて中空部14内を延伸しており、溶接切片部分17bの両側に2つの接続端子16の溶接切片部分16bが同図の下から上に向かって、台部18内を延伸している。   As can be understood from the attachment positions of the connection terminal 16 and the ground terminal 17 in FIG. 8, the welded piece portion 17 b of the ground terminal 17 extends in the hollow portion 14 from the top to the bottom in the figure, On both sides of the welded piece portion 17b, welded piece portions 16b of the two connection terminals 16 extend in the base 18 from the bottom to the top of the figure.

図10は、図9の位置関係を、図6の断面図の上に、溶接切片部分16b、17bを表示したものであり、2つの中空部13と14で形成する高さ位置の台部18上に、溶接切片部分16bが17bを挟み込む様に位置付けされる。また、2つの接続端子16の溶接切片部分16bに形成された孔20は、図8の貫通孔19に対応する位置に設けられており、ここにピンを挿すことで、図8の状態まで組み上げたときに、接続端子16及びアース端子17の取り付け位置を固定することができる。   FIG. 10 shows the positional relationship of FIG. 9 with the welded piece portions 16b and 17b displayed on the cross-sectional view of FIG. 6, and the base portion 18 at the height position formed by the two hollow portions 13 and 14 is shown. On top, the welding section 16b is positioned so as to sandwich 17b. Further, the hole 20 formed in the welded piece portion 16b of the two connection terminals 16 is provided at a position corresponding to the through-hole 19 in FIG. 8, and is assembled to the state in FIG. 8 by inserting a pin therein. The attachment positions of the connection terminal 16 and the ground terminal 17 can be fixed.

また、図9によれば、線14と13に囲まれた右下がり斜線の領域はコンデンサケース15の一部を成す部材(台部18)であり、透視不可能であるが、線13の内部は中空であることから溶接切片部分16b、17bの取り付け状況を視認可能である。このため、アース端子17の溶接切片部分17bは、中空部13の横幅に対して十分に狭い幅の部材とされている。   Further, according to FIG. 9, the downward slanted line region surrounded by the lines 14 and 13 is a member (base part 18) forming a part of the capacitor case 15 and cannot be seen through. Since it is hollow, it is possible to visually recognize the mounting state of the welded sections 16b and 17b. For this reason, the welded piece portion 17 b of the ground terminal 17 is a member having a sufficiently narrow width with respect to the lateral width of the hollow portion 13.

図1は、16b、17b、16bの順に溶接切片部分が整列配置された中空部14内に、チップ型コンデンサ素子30を載置した図である。ここで、チップ型コンデンサ素子30を載置したときに、その左右両面31,32は正あるいは負の電極端子となる部分であり、前後両面33,34はアース端子となる部分である。このチップ型コンデンサ素子30は、溶接切片部分への取り付けに際し、左右両面31,32の電極端子は、接続端子16の溶接切片部分16bの上に置かれ、前後両面33,34はアース端子17の溶接切片部分17bの上に置かれる。   FIG. 1 is a diagram in which a chip-type capacitor element 30 is placed in a hollow portion 14 in which weld sections are aligned and arranged in the order of 16b, 17b, and 16b. Here, when the chip-type capacitor element 30 is placed, the left and right sides 31 and 32 are portions that become positive or negative electrode terminals, and the front and rear sides 33 and 34 are portions that become ground terminals. When the chip-type capacitor element 30 is attached to the welded piece portion, the electrode terminals on the left and right sides 31 and 32 are placed on the welded piece portion 16 b of the connection terminal 16, and the front and rear sides 33 and 34 are on the ground terminal 17. It is placed on the welded piece portion 17b.

この状態で、左右両面31,32の電極端子と、接続端子16のそれぞれの溶接切片部分16bの間が、40,41のように溶接あるいはろう付け(以下単にろう付けという)され、前後両面33,34と、アース端子17の溶接切片部分17bの間が、42のようにろう付けされる。このろう付けは、大きい中空部13の側から溶接装置を差し込んで行なうわけであるが、このときに、溶接切片部分16bと17bの間が、図1の43のように接触しないことを確認したい。然るところ、図9あるいは図10の説明から十分に理解できるように、本発明では、中空部13の側からの溶接作業とその結果を、この反対側の空間部分14側を用いて、工業用カメラなどでろう付け状態を目視可能である。   In this state, the electrode terminals of the left and right surfaces 31 and 32 and the respective welded piece portions 16b of the connection terminal 16 are welded or brazed (hereinafter simply referred to as brazing) as 40 and 41, and the front and rear surfaces 33 , 34 and the welded piece portion 17b of the ground terminal 17 are brazed as indicated by 42. This brazing is performed by inserting a welding device from the side of the large hollow portion 13. At this time, it is desired to confirm that the welded section portions 16b and 17b do not contact each other as indicated by 43 in FIG. . However, as can be fully understood from the description of FIG. 9 or FIG. 10, in the present invention, welding work and its result from the side of the hollow portion 13 are used for the industrial use of the opposite space portion 14 side. The state of brazing can be visually observed with a camera.

次に、コンデンサケース15の中空部13,14にモールド樹脂を注入する。図11は、図4のB−B断面を示す図であり、下側が大きい中空部13、上側が小さい中空部14となるように台50上に置かれる。また、中空部13内には、チップ型コンデンサ素子30が、溶接切片部分16b、17bにろう付けされている。   Next, mold resin is injected into the hollow portions 13 and 14 of the capacitor case 15. 11 is a cross-sectional view taken along the line B-B of FIG. 4, and is placed on the table 50 so that the lower side is a large hollow portion 13 and the upper side is a small hollow portion 14. In the hollow portion 13, the chip capacitor element 30 is brazed to the welded piece portions 16 b and 17 b.

この上下位置関係において、プラスチックケース15を載置台50上に置き、モールド樹脂21を中空部14側から上方から充填することにより、チップ型コンデンサ素子30と、接続端子15,16の内部接続部分16b、17bを中空部13内に密閉保持する。モールド樹脂21が中空部13に充填されたことにより排斥される空気35は、貫通孔19を通って、大気排出される。   In this vertical position relationship, the plastic case 15 is placed on the mounting table 50, and the mold resin 21 is filled from above from the hollow portion 14 side, whereby the chip capacitor element 30 and the internal connection portions 16b of the connection terminals 15 and 16 are filled. , 17b are hermetically held in the hollow portion 13. The air 35 that is exhausted by filling the hollow portion 13 with the mold resin 21 passes through the through hole 19 and is discharged to the atmosphere.

このとき、接続端子を接合したコンデンサケース15は、モールド樹脂との融合性を高めるために事前に加熱炉で暖められていて、100度以上に暖められたモールド樹脂が充填される。このモールド樹脂は自重で降下するように滴下され中空部13に充満されていくが、モールド樹脂内に発生する気泡は同様に暖められるため、貫通孔19から徐々に外気に抜けて充填効率を高め、機密性を高めていく。   At this time, the capacitor case 15 to which the connection terminals are joined is preheated in a heating furnace in order to enhance the fusion with the mold resin, and is filled with the mold resin heated to 100 degrees or more. This mold resin is dropped so as to drop by its own weight, and fills the hollow portion 13. However, since the air bubbles generated in the mold resin are similarly warmed, it gradually escapes from the through hole 19 to the outside air to increase the filling efficiency. , Increase confidentiality.

この機密性は、コンデンサ素子30と接続端子15,16のろう付け部の酸化を防止して電気接続部の信頼性を高める結果となる。なお、チップ型コンデンサ素子30は、チップ型セラミックコンデンサ素子とされるのがよい。また、コンデンサケースはPBT(ポリブチレンテレフタレート)樹脂を主体として成形したものとするのがよく、充填する樹脂はエポキシ樹脂とするのがよい。   This confidentiality results in an increase in the reliability of the electrical connection portion by preventing oxidation of the brazed portions of the capacitor element 30 and the connection terminals 15 and 16. The chip capacitor element 30 is preferably a chip ceramic capacitor element. The capacitor case is preferably molded mainly from PBT (polybutylene terephthalate) resin, and the resin to be filled is preferably an epoxy resin.

図12と図13は、本発明により製造されたコンデンサ装置の外観を示している。図12は、表面であり、中空部13はモールド封止領域である。また、裏面の図13によれば、中空部14以外にも貫通孔19がモールド領域になっている。つまり、裏のモールド領域は表のモールド領域より狭く且つ、複数のモールド領域がある点に特徴がある。さらに、本発明により製造されたコンデンサ装置の内部のモールド領域は連通しており、かつ表側のモールド領域内にコンデンサ素子がある。また、外部接続端子は複数のモールド領域がある側から取り出されている点に外観あるいは、内部構造の特徴がある。   12 and 13 show the appearance of the capacitor device manufactured according to the present invention. FIG. 12 shows the surface, and the hollow portion 13 is a mold sealing region. Further, according to FIG. 13 on the back surface, the through hole 19 is a mold region in addition to the hollow portion 14. That is, the back mold area is narrower than the front mold area and has a plurality of mold areas. Further, the mold region inside the capacitor device manufactured according to the present invention is in communication, and the capacitor element is in the mold region on the front side. Further, the external connection terminal has a feature of appearance or internal structure in that it is taken out from the side having a plurality of mold regions.

本発明によれば、製造過程においてコンデンサと電極などのろう付けの状態を目視観測できるので、品質の高い高性能のコンデンサ装置を得ることができるので、モータ装置に限らず広範囲の製品に広く適用することができる。   According to the present invention, since the state of brazing of capacitors and electrodes can be visually observed in the manufacturing process, a high-quality and high-performance capacitor device can be obtained, so that it can be widely applied not only to motor devices but also to a wide range of products. can do.

1:モータ
2:ケーシング
3:マグネット
4:エンドブラケット
5:ロータ
6:シャフト
7:軸受
8:整流子
9:ブラシ
10:ブラシホルダー
11:ブラシベース
12:チップ型コンデンサ装置
13、14:中空部
15:コンデンサケース
16:接続端子
17:アース端子
16a、17a:外部取り出し部分
16b、17b:内部接続部分
18:台部
19:貫通孔
20:孔
21:モールド樹脂(エポキシ)
30:チップ型コンデンサ素子
31,32:電極
33,34:アース端子
35:排出空気
40、41、42:ろう付け部
50:載置台
1: Motor 2: Casing 3: Magnet 4: End bracket 5: Rotor 6: Shaft 7: Bearing 8: Commutator 9: Brush 10: Brush holder 11: Brush base 12: Chip type capacitor device 13, 14: Hollow part 15 : Capacitor case 16: Connection terminal 17: Ground terminal 16a, 17a: External extraction part 16b, 17b: Internal connection part 18: Base part 19: Through hole 20: Hole 21: Mold resin (epoxy)
30: Chip-type capacitor elements 31, 32: Electrodes 33, 34: Earth terminal 35: Exhaust air 40, 41, 42: Brazing part 50: Mounting table

Claims (8)

直方体状ケースの一方面と他方面の間が連通してモールド封止され、前記一方面の内部でチップ型コンデンサと外部接続端子の溶接部分とが溶接され、前記他方面のモールド領域は、前記一方面のモールド領域よりも狭く、かつ前記他方面には複数のモールド領域を有することを特徴とするコンデンサ装置。   The one side and the other side of the rectangular parallelepiped case communicate with each other and are mold-sealed. Inside the one side, the chip-type capacitor and the welded portion of the external connection terminal are welded. A capacitor device characterized by being narrower than a mold region on one side and having a plurality of mold regions on the other side. 第1項記載のコンデンサ装置において、前記他方面側から前記外部接続端子が導かれていることを特徴とするコンデンサ装置。   2. The capacitor device according to claim 1, wherein the external connection terminal is led from the other surface side. 一方面と他方面の間が中空部で連通し、前記一方面側の中空部が他方面側の中空部よりも広いとともに、前記一方面側の中空部に連通して前記他方面側の中空部に連通しない貫通孔を有する直方体状ケース、大小の前記中空部で形成する台部に、溶接部分を導き、前記直方体状ケース外に外部取り出し部分を導く電極用の外部接続端子、大小の前記中空部が接する部分に、溶接部分を導き、前記直方体状ケース外に外部取り出し部分を導くアース用の外部接続端子、前記一方面側の中空部内に設けられ、その端子が前記外部接続端子の溶接部分にそれぞれ溶接されたコンデンサ素子、前記中空部に充填された樹脂とから成るコンデンサ装置。   The one surface and the other surface communicate with each other through a hollow portion, the one surface side hollow portion is wider than the other surface side hollow portion, and the one surface side hollow portion communicates with the other surface side hollow. A rectangular parallelepiped case having a through-hole that does not communicate with the part, an external connection terminal for an electrode for guiding a welded portion to a base portion formed by the large and small hollow portions, and leading an external extraction portion outside the rectangular parallelepiped case, An external connection terminal for ground that leads a welded portion to a portion where the hollow portion is in contact and leads an external extraction portion outside the rectangular parallelepiped case, provided in the hollow portion on the one surface side, and the terminal is welded to the external connection terminal A capacitor device comprising a capacitor element welded to each portion and a resin filled in the hollow portion. 一方面と他方面の間を中空部で連通し、前記一方面側の中空部が他方面側の中空部よりも広いとともに、前記一方面側の中空部に連通して前記他方面側の中空部に連通しない貫通孔を有する直方体状ケースを使用し、大小の前記中空部で形成する台部に、溶接部分を導き、前記直方体状ケース外に外部取り出し部分を導く電極用の外部接続端子を取り付け、大小の前記中空部が接する部分に、溶接部分を導き、前記直方体状ケース外に外部取り出し部分を導くアース用の外部接続端子を取り付け、前記一方面側の中空部内にコンデンサ素子を設置してその端子を前記外部接続端子の溶接部分にそれぞれ溶接し、前記中空部に樹脂を充填してなるコンデンサ装置の製造方法。   The one surface and the other surface communicate with each other through a hollow portion, the one surface side hollow portion is wider than the other surface side hollow portion, and the one surface side hollow portion communicates with the other surface side hollow. Use a rectangular parallelepiped case having a through-hole that does not communicate with the part, lead the welded part to the base part formed by the large and small hollow parts, and provide an external connection terminal for the electrode that guides the external extraction part outside the rectangular parallelepiped case Attach, connect the large and small hollow parts to the welded part, attach an external connection terminal for grounding that leads the external extraction part outside the rectangular parallelepiped case, and install the capacitor element in the hollow part on the one side A capacitor device manufacturing method in which the terminal is welded to a welded portion of the external connection terminal, and the hollow portion is filled with resin. 第4項記載のコンデンサ装置の製造方法において、
前記コンデンサ素子の端子と前記外部接続端子の溶接作業を、前記一方面側の中空部内で実施し、前記他方面側の中空部から溶接作業とその溶接結果を監視することを特徴とするコンデンサ装置の製造方法。
In the method for manufacturing a capacitor device according to item 4,
Capacitor device characterized in that welding operation of terminal of capacitor element and external connection terminal is carried out in hollow portion on one surface side, and welding operation and welding result are monitored from hollow portion on the other surface side. Manufacturing method.
第4項記載のコンデンサ装置の製造方法において、
前記中空部に樹脂を充填するときに、直方体状ケースを前記一方面側の中空部を下にして載置台上に載置し、前記他方面側の中空部から樹脂を充填することを特徴とするコンデンサ装置の製造方法。
In the method for manufacturing a capacitor device according to item 4,
When filling the hollow part with resin, the rectangular parallelepiped case is placed on a mounting table with the hollow part on one side facing down, and the resin is filled from the hollow part on the other side. Manufacturing method for capacitor device.
第6項記載のコンデンサ装置の製造方法において、
前記中空部に樹脂を充填するときに、前記貫通孔を空気抜き用の孔とすることを特徴とするコンデンサ装置の製造方法。
In the method for manufacturing a capacitor device according to claim 6,
A method of manufacturing a capacitor device, wherein when the resin is filled in the hollow portion, the through hole is used as an air vent hole.
第5項記載のコンデンサ装置の製造方法において、
溶接作業とその溶接結果を監視したあとで、前記直方体状ケースを前記一方面側の中空部を下にして載置台上に載置し、前記他方面側の中空部から樹脂を充填することを特徴とするコンデンサ装置の製造方法。
In the method for manufacturing a capacitor device according to claim 5,
After monitoring the welding operation and the welding result, placing the rectangular parallelepiped case on the mounting table with the hollow portion on one side facing down, and filling the resin from the hollow portion on the other surface side A method of manufacturing a capacitor device.
JP2010054506A 2010-03-11 2010-03-11 Capacitor device and method of manufacturing the same Pending JP2011187890A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105374553A (en) * 2015-12-02 2016-03-02 益阳市格林电子元件有限公司 Sucker-type chip capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105374553A (en) * 2015-12-02 2016-03-02 益阳市格林电子元件有限公司 Sucker-type chip capacitor
CN105374553B (en) * 2015-12-02 2020-11-17 益阳市格林电子元件有限公司 Sucking disc formula paster condenser

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