CN105357887B - 自动刻蚀设备 - Google Patents
自动刻蚀设备 Download PDFInfo
- Publication number
- CN105357887B CN105357887B CN201510641837.9A CN201510641837A CN105357887B CN 105357887 B CN105357887 B CN 105357887B CN 201510641837 A CN201510641837 A CN 201510641837A CN 105357887 B CN105357887 B CN 105357887B
- Authority
- CN
- China
- Prior art keywords
- etching
- bulk
- delivery section
- circuit board
- development
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005530 etching Methods 0.000 title claims abstract description 151
- 230000007246 mechanism Effects 0.000 claims abstract description 122
- 239000007921 spray Substances 0.000 claims abstract description 85
- 239000007788 liquid Substances 0.000 claims abstract description 64
- 238000012546 transfer Methods 0.000 claims abstract description 31
- 238000007599 discharging Methods 0.000 claims abstract description 10
- 238000011161 development Methods 0.000 claims description 77
- 238000004140 cleaning Methods 0.000 claims description 34
- 238000002156 mixing Methods 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 description 19
- 230000007306 turnover Effects 0.000 description 18
- 238000003860 storage Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005422 blasting Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510641837.9A CN105357887B (zh) | 2015-09-28 | 2015-09-28 | 自动刻蚀设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510641837.9A CN105357887B (zh) | 2015-09-28 | 2015-09-28 | 自动刻蚀设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105357887A CN105357887A (zh) | 2016-02-24 |
CN105357887B true CN105357887B (zh) | 2018-06-08 |
Family
ID=55333706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510641837.9A Active CN105357887B (zh) | 2015-09-28 | 2015-09-28 | 自动刻蚀设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105357887B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117241483B (zh) * | 2023-10-25 | 2024-04-12 | 广东达源设备科技有限公司 | 用于电路板生产的喷淋装置和方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164384A (ja) * | 1999-12-07 | 2001-06-19 | Nippon Aqua Kk | エッチング装置およびエッチング制御装置 |
CN102492946A (zh) * | 2011-12-30 | 2012-06-13 | 特新电路材料(东莞)有限公司 | 一种蚀刻机 |
CN203136340U (zh) * | 2013-03-20 | 2013-08-14 | 宁波东盛集成电路元件有限公司 | 一种带清洗、烘干装置的蚀刻、去膜生产线系统 |
CN203760432U (zh) * | 2013-12-20 | 2014-08-06 | 昆山国显光电有限公司 | 一种湿法刻蚀设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102707562A (zh) * | 2012-06-17 | 2012-10-03 | 无锡市优耐特石化装备有限公司 | 一种显影液搅拌装置 |
-
2015
- 2015-09-28 CN CN201510641837.9A patent/CN105357887B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164384A (ja) * | 1999-12-07 | 2001-06-19 | Nippon Aqua Kk | エッチング装置およびエッチング制御装置 |
CN102492946A (zh) * | 2011-12-30 | 2012-06-13 | 特新电路材料(东莞)有限公司 | 一种蚀刻机 |
CN203136340U (zh) * | 2013-03-20 | 2013-08-14 | 宁波东盛集成电路元件有限公司 | 一种带清洗、烘干装置的蚀刻、去膜生产线系统 |
CN203760432U (zh) * | 2013-12-20 | 2014-08-06 | 昆山国显光电有限公司 | 一种湿法刻蚀设备 |
Also Published As
Publication number | Publication date |
---|---|
CN105357887A (zh) | 2016-02-24 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Automatic circuit board etching equipment Effective date of registration: 20200323 Granted publication date: 20180608 Pledgee: China Co. truction Bank Corp Huizhou branch Pledgor: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980000897 |
|
CP03 | Change of name, title or address |
Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Patentee after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: 516000 taiyangao Industrial Zone, Baihua Town, Huizhou City, Guangdong Province Patentee before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
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CP03 | Change of name, title or address | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220614 Granted publication date: 20180608 Pledgee: China Co. truction Bank Corp Huizhou branch Pledgor: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980000897 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Automatic etching equipment Effective date of registration: 20221213 Granted publication date: 20180608 Pledgee: China Co. truction Bank Corp Huidong branch Pledgor: Huizhou techuang Electronic Technology Co.,Ltd. Registration number: Y2022980026914 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |