CN105324843A - 热界面材料垫片及其形成方法 - Google Patents

热界面材料垫片及其形成方法 Download PDF

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CN105324843A
CN105324843A CN201480031558.4A CN201480031558A CN105324843A CN 105324843 A CN105324843 A CN 105324843A CN 201480031558 A CN201480031558 A CN 201480031558A CN 105324843 A CN105324843 A CN 105324843A
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interfacial material
thermal interfacial
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CN105324843B (zh
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R·A·马塔亚
N·M·萨勒西
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Western Digital Technologies Inc
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    • H—ELECTRICITY
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    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
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Abstract

公开了用于耗散来自部件的热量的热界面材料(TIM)垫片。所述TIM垫片包括多个热界面材料层以及插入在所述多个TIM层之间的至少一个石墨烯层。用于形成所述TIM垫片的方法包括将多个TIM层与插入在所述多个TIM层之间的至少一个石墨烯层堆叠，以达到所述TIM垫片的长度。对应于用于压缩紧贴所述部件的所述TIM垫片的厚度来切割堆叠的层。

Description

热界面材料垫片及其形成方法
背景技术
热界面材料(TIM)常用于部件之间的电子器件中以增大部件之间的热传递效率。TIM也被称为间隙垫片，因为它可以柔性地填充部件上的表面缺陷。否则，这样的表面缺陷将妨碍部件之间的热量传递，因为空气是热量的具有0.024W/mK的热传导率的不良导体。
尽管TIM可以典型地实现大约1W/mK至5W/mK的热传导率，但是该热传导率仍远低于诸如铝等其它较不具柔性但却具有热传导性的材料的热传导率。
附图说明
当结合附图考虑时，根据下文所陈述的具体实施方式，本公开内容的实施例的特征和优点将变得更加明显。提供附图和相关联的描述以说明本公开内容的实施例而非限制所要求保护的范围。
图1A是根据实施例的部件上的热界面材料(TIM)垫片的顶部透视图。
图1B是图1A的TIM垫片和部件的底部透视图。
图2是根据实施例的被压缩在边框和部件之间的TIM垫片的横截面图。
图3A图示了根据实施例的TIM层与插入在TIM层之间的石墨烯层的堆叠体。
图3B图示了根据实施例的对图3A的堆叠体的切割。
图3C图示了根据实施例的对图3B的堆叠体的进一步切割以形成TIM垫片。
图4是根据实施例的TIM垫片的形成和放置的流程图。
具体实施方式
在以下具体实施方式中，陈述了许多具体细节以提供对本公开内容的充分理解。然而，对本领域的普通技术人员将显而易见的是，可以无需这些具体细节中的一些具体细节来实现所公开的各种实施例。在其它实例中，并未详细地示出公知的结构和技术以免不必要地使各种实施例难以理解。
图1A和图1B示出了部件120上的热界面材料(TIM)垫片110的顶部和底部透视图。本领域的普通技术人员将领会的是，不必按比例绘出图1A和图1B。
在图1A和图1B的示例中，部件120是在操作期间产生热量的片上系统(SOC)并且TIM垫片110被设置为耗散来自部件120的热量。如图1A所示，TIM垫片110包括TIM材料层112以及插入或条带化在TIM层112之间的石墨烯层114。在其它实施例中，部件120可以是在操作期间产生热量的另一类型的电子部件。
TIM层112可以包括任何柔性TIM或本领域中已知的用于传导热量并且填充部件上的表面缺陷的材料的组合。在这方面，TIM层112还可以包括允许它们粘附到表面的粘合属性。这样的柔性TIM的示例可以包括悬浮在硅酮基介质中的某些金属、碳或陶瓷颗粒。在一个示例中，TIM层112可以具有1W/mK至5W/mK的热传导率。
石墨烯层114可以包括在大体垂直于部件120的顶表面的方向上延伸的一片或多片的石墨烯(即，石墨片)。在这样的构造中，石墨烯层114可以在大体垂直于部件120的顶表面的方向上具有大约1500W/mK的热传导率，并且在大体平行于部件120的顶表面的方向上具有大约25W/mK的热传导率。作为结果，TIM垫片110在大体垂直于部件120的顶表面的方向上的热传导率大于其在大体平行于部件120的顶表面的方向上的热传导率。
由于石墨烯层114的高的热传导率，通常可以通过增加石墨烯层114来显著增大TIM垫片110的热传导率，同时仍允许TIM层112的压缩性和气隙填充能力。
如本领域的普通技术人员将会理解的是，其它实施例可以包括与图1A和图1B所示的数量不同的数量的TIM层112和石墨烯层114，而不背离本公开内容的精神和范围。
在一些实施例中，石墨烯层114可以形成TIM垫片110的总体积的5％至15％。在一个这样的实施例中，TIM垫片110的体积由90.9％的TIM层112和9.1％的石墨烯层114组成，其中，在大体垂直于部件120的顶表面的方向上，TIM层112具有5W/mK的热传导率并且石墨烯层114具有1500W/mK的热传导率。在此示例中，通过将石墨烯层114插入到TIM层112之间，TIM垫片110在大体垂直的方向上的总的热传导率从5W/mK增大到大约141W/mK。这通过关于TIM垫片110中的TIM层112和石墨烯层114的比例体积来将TIM层112和石墨烯层114的热传导率相加而示出。即，上文的示例中的TIM垫片110的总的热传导率可以被计算为：
总的热传导率＝(90.9％×5W/mK)+(9.1％×1500W/mK)，其约等于141W/mK。
图1B示出了部件120和TIM垫片110的底部透视图。如图1B所示，许多焊球122附接到部件120的底表面。球122可以是用于将部件120安装到印刷电路板(PCB)上的球栅阵列(BGA)的一部分。本领域的普通技术人员将理解的是，图1B中的球的数量用于说明性的目的并且球122的实际数量可能不同。
图2提供了设备200的横截面图，例如，设备200可以是数据存储设备。如图2所示，设备200包括边框230和PCB224。边框230可以由热传导材料组成以耗散来自设备200的热量。例如，这样的边框材料可以包括诸如具有167W/mK的热传导率的6061-T6等铝合金。
通过焊球222将部件220安装到PCB224上，焊球222可以允许部件220和PCB224中的过孔(未示出)之间的热传导和/或电传导。部件220可以包括诸如SOC、闪存存储器或双倍数据速率同步动态随机存取存储器(DDRSDRAM)等热量产生部件。
在图2中，部件220包括基板218和作为部件220的外部层的接地的热量分流板216。热量分流板216接地并且覆盖基板218以降低石墨烯层214和基板218之间的接触的可能性，因为石墨烯具有电传导性。
如图2所示，TIM垫片210被压缩在边框230和部件220之间。在图2的示例中，在TIM垫片210的左侧和右侧上所示出的TIM垫片210的外层包括TIM层212以允许TIM垫片210向外变形。在这方面，TIM垫片210的底表面在未被压缩的状态下可以具有与用于接触TIM垫片210的部件220的顶表面大约相同的面积。当被压缩紧贴部件220时，TIM垫片210可以延伸到部件220的接触表面的边缘之外。这样的超覆在图2被示出并且可以允许在平行于TIM垫片210的方向上的附加的热量分流。
在图2中，TIM垫片210包括插入或条带化在TIM层212之间的石墨烯层214。TIM层212为可压缩的以填充部件220和边框230上的表面缺陷，否则，该表面缺陷将与较不可压缩的材料形成气隙。尽管石墨烯通常不是非常柔性，但是石墨烯层214足够薄以至于仍允许TIM垫片210的压缩。在一个实施例中，石墨烯层214可以是大约0.1mm厚(即，在0.08mm和0.12mm厚之间)。
石墨烯层214包括在大体垂直于部件220的方向上设置的至少一片石墨烯。石墨烯层214在此方向上的高的热传导率通常提高部件220和边框230之间的热传递，以允许经由边框230从设备200耗散更多的热量。
图3A至图3C图示了根据实施例的TIM垫片310的形成。在图3A中，将TIM层332与插入或条带化在TIM层332之间的石墨烯层334堆叠以形成堆叠的层330。在这方面，TIM层332可以包括允许TIM层332粘附到石墨烯层334的粘合属性。将石墨烯层334堆叠，以使得石墨烯层334在平行于TIM层332的方向(即，图3A中的水平方向)上具有较高的热传导率。
在一个示例中，TIM层332可以为大约1mm厚(即，在0.08mm和1.20mm厚之间)，并且石墨烯层334可以为大约0.1mm厚(即，在0.08mm和1.20mm厚之间)。堆叠的层330的整体高度可以与如图3C所示的TIM垫片310的长度对应。在一个实施例中，石墨烯层334形成堆叠的层330的总体积的大约9％。
在图3B中，对应于TIM垫片310的厚度，用切割工具336来切割堆叠的层330。切割工具336可以包括任何双分工具，其用于实现TIM垫片310的规定厚度的特定容差。例如，切割工具336可以包括激光切割工具，其用于实现规定厚度的相对小的容差，或者切割工具336可以包括锯或剃刀，其用于较大容差。
TIM垫片310的厚度可以稍厚于要由TIM垫片310填充的空间。这允许TIM垫片310的压缩，其典型地通过填充沿部件和/或边框表面的气隙来提高TIM垫片310的热效率。在一个示例中，将TIM垫片310切割为大约1mm的厚度。
在图3C中，随着穿过堆叠的层330的切割的完成，形成了TIM垫片310。如图3C所示，产生的TIM垫片310包括TIM层312和石墨烯层314。
尽管图3A至图3C描绘了具有垂直堆叠的TIM层312和石墨烯层314的TIM垫片310的形成，但是其它实施例可以不同地(例如，水平地而不是垂直地)定向这些层和切割工具336。
图4是根据实施例的TIM垫片的形成和放置的流程图。在块400中，该过程开始，并且在块402中，将TIM层和所插入的石墨烯层堆叠以达到期望的TIM垫片长度。在一个实施例中，石墨烯层可以形成堆叠的层的总体积的5％至15％。如上文所述，TIM层可以包括允许TIM层粘附到石墨烯层的粘合属性。此外，TIM垫片的期望长度可以允许TIM垫片在被压缩紧贴特定部件(例如，图2中的部件220)时在部件之上的超覆。
在块404中，按照与TIM垫片的期望厚度和压缩对应的厚度来切割堆叠的层。特别地，可以切割TIM垫片以用TIM垫片的一定量的压缩来填充部件和边框之间(例如，图2中的部件220和边框230之间)的特定空间。TIM垫片的压缩通常通过填充沿边框和/或部件表面的气隙来提高TIM垫片的热效率。
在块406中，在从堆叠的层切割下TIM垫片后，移除TIM垫片。在移除后，可以可选地将可移除的衬背施加到TIM垫片以在处理或封装期间减少与TIM垫片的接触。
在从堆叠的层移除后，邻近诸如图2中的部件220等部件(在部件顶上)来放置TIM垫片，或邻近诸如图2中的边框230等边框来放置TIM垫片。作为TIM垫片的邻近部件或边框的放置的一部分，可以移除先前施加到TIM垫片的任何衬背。
TIM垫片可以被放置为邻近部件或边框，使得石墨烯层在大体垂直于部件的接触表面的方向上延伸。这通常允许TIM垫片的热传导率在大体垂直于部件的表面的方向上增大并且从而提高经由TIM垫片的热量传导。如上文所述，TIM垫片在大体垂直于部件的表面的方向上的热传导率大于其在大体平行于部件的表面的方向上的热传导率。
在一个实施例中，石墨烯层可以形成TIM垫片的总体积的约9％，使得可以如上文所计算地增大TIM垫片的热传导率。
在块408中，TIM垫片被压缩在边框和部件之间。压缩可以作为将边框的一部分固定到边框的另一部分的结果而发生。例如，可以通过将边框的顶部分固定到边框的上面安装了部件的底部分来压缩TIM垫片。压缩还可以通过将边框固定到如图2所示的PCB而发生。然后，在块410中，图4的过程结束。
提供所公开的示例性实施例的以上描述以使本领域的任何普通技术人员能够实现或使用本公开内容的实施例。对本领域的普通技术人员而言，对这些示例的各种修改将显而易见，并且本文所公开的原则可以应用于其它示例而不背离本公开内容的精神或范围。所描述的实施例将在各方面均仅被视为说明性的而非限制性的。

Claims (24)

1.一种热界面材料(TIM)垫片，其用于在电子设备中耗散来自部件的热量，所述热界面材料(TIM)垫片包括：
多个热界面材料(TIM)层；以及
插入在所述多个热界面材料(TIM)层之间的至少一个石墨烯层。
2.根据权利要求1所述的热界面材料(TIM)垫片，其中：
所述热界面材料(TIM)垫片与所述部件的表面接触；并且
所述至少一个石墨烯层在大体垂直于所述部件的所述表面的方向上延伸，使得所述热界面材料(TIM)垫片在所述大体垂直于所述部件的所述表面的方向上的热传导率大于所述热界面材料(TIM)垫片在大体平行于所述部件的所述表面的方向上的热传导率。
3.根据权利要求1所述的热界面材料(TIM)垫片，其中，所述至少一个石墨烯层形成所述热界面材料(TIM)垫片的总体积的5％至15％。
4.根据权利要求1所述的热界面材料(TIM)垫片，其中：
所述电子设备包括数据存储设备；并且
所述热界面材料(TIM)垫片形成所述数据存储设备的一部分。
5.根据权利要求4所述的热界面材料(TIM)垫片，其中，所述部件包括片上系统(SOC)、闪存存储器、以及双倍数据速率同步动态随机存取存储器(DDRSDRAM)的至少其中之一。
6.根据权利要求1所述的热界面材料(TIM)垫片，其中，所述热界面材料(TIM)垫片与所述部件的接地热量分流板接触。
7.根据权利要求1所述的热界面材料(TIM)垫片，其中，所述热界面材料(TIM)垫片与所述部件的表面接触并且所述多个热界面材料(TIM)层为柔性的，使得当所述多个热界面材料(TIM)层被压缩紧贴所述部件的所述表面时，所述多个热界面材料(TIM)层的外热界面材料(TIM)层在大体平行于所述部件的所述表面的方向上向外变形。
8.根据权利要求1所述的热界面材料(TIM)垫片，其中，所述热界面材料(TIM)垫片被压缩在所述部件和容纳所述部件的边框之间。
9.一种用于耗散来自电子设备的部件的热量的方法，所述方法包括：
通过至少以下方式来形成热界面材料(TIM)垫片：
将多个热界面材料(TIM)层与插入在所述多个热界面材料(TIM)层之间的至少一个石墨烯层堆叠，以达到所述热界面材料(TIM)垫片的长度；以及
对应于用于压缩紧贴所述部件的所述热界面材料(TIM)垫片的厚度来切割堆叠的层。
10.根据权利要求9所述的方法，还包括：
邻近所述部件放置所述热界面材料(TIM)垫片，使得所述热界面材料(TIM)垫片与所述部件的表面接触，
其中，所述至少一个石墨烯层在大体垂直于所述部件的所述表面的方向上延伸，使得所述热界面材料(TIM)垫片在所述大体垂直于所述部件的所述表面的方向上的热传导率大于所述热界面材料(TIM)垫片在大体平行于所述部件的所述表面的方向上的热传导率。
11.根据权利要求9所述的方法，其中，所述至少一个石墨烯层形成所述热界面材料(TIM)垫片的总体积的5％至15％。
12.根据权利要求9所述的方法，其中，所述多个热界面材料(TIM)层包括粘合属性，所述粘合属性允许所述多个热界面材料(TIM)层粘附到所述至少一个石墨烯层。
13.根据权利要求9所述的方法，其中，所述至少一个石墨烯层为大约0.1mm厚。
14.根据权利要求9所述的方法，其中，切割所述堆叠的层包括用激光切割工具、锯或剃刀来切割所述堆叠的层。
15.根据权利要求9所述的方法，其中，将所述堆叠的层切割为大于要由所述热界面材料(TIM)垫片填充的空间的厚度。
16.根据权利要求9所述的方法，还包括：
从所述堆叠的层移除所述热界面材料(TIM)垫片；
邻近所述部件或所述电子设备的边框来放置所述TIM垫片；以及
将所述热界面材料(TIM)垫片压缩在所述边框和所述部件之间。
17.根据权利要求16所述的方法，其中，压缩所述热界面材料(TIM)垫片包括将所述边框的第一部分固定到所述边框的第二部分。
18.根据权利要求16所述的方法，其中，压缩所述热界面材料(TIM)垫片包括将所述边框固定到所述电子设备的印刷电路板(PCB)。
19.根据权利要求16所述的方法，其中：
所述电子设备包括数据存储设备；并且
所述热界面材料(TIM)垫片、所述边框和所述部件形成所述数据存储设备的一部分。
20.一种数据存储设备，包括：
产生热量的部件；以及
用于耗散来自所述部件的热量的热界面材料(TIM)垫片，所述热界面材料(TIM)垫片包括：
多个热界面材料(TIM)层；以及
插入在所述多个热界面材料(TIM)层之间的至少一个石墨烯层。
21.根据权利要求20所述的数据存储设备，其中，所述部件包括片上系统(SOC)、闪存存储器、以及双倍数据速率同步动态随机存取存储器(DDRSDRAM)的至少其中之一。
22.根据权利要求20所述的数据存储设备，其中，所述热界面材料(TIM)垫片与所述部件的接地的热量分流板接触。
23.根据权利要求20所述的数据存储设备，其中，所述热界面材料(TIM)垫片与所述部件的表面接触并且所述多个热界面材料(TIM)层为柔性的，使得当所述多个热界面材料(TIM)层被压缩紧贴所述部件的所述表面时，所述多个热界面材料(TIM)层的外热界面材料(TIM)层在大体平行于所述部件的所述表面的方向上向外变形。
24.根据权利要求20所述的数据存储设备，还包括容纳所述部件的边框，其中，所述热界面材料(TIM)垫片被压缩在所述部件和所述边框之间。
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