HK1220286A1 - 熱界面材料墊片及其形成方法 - Google Patents

熱界面材料墊片及其形成方法

Info

Publication number
HK1220286A1
HK1220286A1 HK16108143.1A HK16108143A HK1220286A1 HK 1220286 A1 HK1220286 A1 HK 1220286A1 HK 16108143 A HK16108143 A HK 16108143A HK 1220286 A1 HK1220286 A1 HK 1220286A1
Authority
HK
Hong Kong
Prior art keywords
forming
same
thermal interface
interface material
material pad
Prior art date
Application number
HK16108143.1A
Other languages
English (en)
Inventor
．馬塔亞
．薩勒西
Original Assignee
Western Digital Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Digital Tech Inc filed Critical Western Digital Tech Inc
Publication of HK1220286A1 publication Critical patent/HK1220286A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
HK16108143.1A 2013-05-02 2016-07-12 熱界面材料墊片及其形成方法 HK1220286A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361818756P 2013-05-02 2013-05-02
US13/913,068 US9338927B2 (en) 2013-05-02 2013-06-07 Thermal interface material pad and method of forming the same
PCT/US2014/036455 WO2014179621A1 (en) 2013-05-02 2014-05-01 Thermal interface material pad and method of forming the same

Publications (1)

Publication Number Publication Date
HK1220286A1 true HK1220286A1 (zh) 2017-04-28

Family

ID=51841334

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16108143.1A HK1220286A1 (zh) 2013-05-02 2016-07-12 熱界面材料墊片及其形成方法

Country Status (7)

Country Link
US (1) US9338927B2 (zh)
EP (1) EP2992552B1 (zh)
KR (1) KR20160005081A (zh)
CN (1) CN105324843B (zh)
AU (2) AU2014259751B2 (zh)
HK (1) HK1220286A1 (zh)
WO (1) WO2014179621A1 (zh)

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Also Published As

Publication number Publication date
AU2014259751A1 (en) 2015-12-03
EP2992552A4 (en) 2017-01-11
US20140328024A1 (en) 2014-11-06
KR20160005081A (ko) 2016-01-13
CN105324843B (zh) 2019-01-22
EP2992552B1 (en) 2019-10-23
AU2014259751B2 (en) 2017-01-12
WO2014179621A1 (en) 2014-11-06
EP2992552A1 (en) 2016-03-09
US9338927B2 (en) 2016-05-10
CN105324843A (zh) 2016-02-10
AU2017202424A1 (en) 2017-05-04

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