CN105235307B - 一种导热膜石墨复合材料 - Google Patents

一种导热膜石墨复合材料 Download PDF

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CN105235307B
CN105235307B CN201510551674.5A CN201510551674A CN105235307B CN 105235307 B CN105235307 B CN 105235307B CN 201510551674 A CN201510551674 A CN 201510551674A CN 105235307 B CN105235307 B CN 105235307B
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film
metal foil
foil layer
perforation
graphite
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CN105235307A (zh
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宋阳阳
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SHANDONG ANOK NEW MATERIAL Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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    • B32B37/1284—Application of adhesive
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    • B32—LAYERED PRODUCTS
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Abstract

本发明属于导热散热材料技术领域，涉及一种用于各种电子设备散热场合的导热膜石墨复合材料；其结构由上而下包括PET背胶膜、金属箔层、导热硅脂、石墨膜、丙烯酸类胶和离型膜，金属箔层和石墨膜上分别开设孔径和贯孔并相互对应，金属箔层与PET背胶膜相贴合并设置有金属箔层凸起，制备时先将PI薄膜经碳化和石墨化制成石墨膜后进行穿孔，形成石墨膜贯孔，再将金属箔层穿孔形成金属箔层贯孔，然后将金属箔层一侧涂覆导热硅脂后与涂抹丙烯酸类胶的石墨膜复合，再与离型膜贴合，最后将金属箔层另一侧与PET背胶膜贴合，通过胶辊压制做成复合材料；其产品结构简单，制备工艺成熟，产品耐热性能好，使用方便，功能稳定，应用环境良好。

Description

一种导热膜石墨复合材料
技术领域:
本发明属于导热散热材料技术领域，涉及一种新型多功能的导热膜石墨复合材料的结构设计，其复合材料可用于各种电子设备的散热场合。
背景技术:
随着电子行业的快速发展，电子产品集成度不断提高，功率不断增加，体积不断缩小，芯片产生的热量也大幅度增加，热密度急剧上升，电子设备的温度迅速增高，由于散热不良导致的电子设备的故障也越来越多，如何有效的解决电子器件的散热问题已经成为整个电子产业发展中亟待解决的关键技术。石墨膜因其超高的导热系数和良好的比热容，成为现在电子产品理想的导热散热材料。由于石墨容易形成层状晶体结构，而层间不存在有序的结构，所以具有显著的各向异性，即石墨膜水平方向导热率可达800-2500W/mK，但垂直方向仅为5-10W/mK，这种特性影响了石墨散热片应用在电子设备上的散热效果，特别是非金属外壳的电子设备应用上的效果。为了提高纵向导热率，中国专利申请号201420026193.3公开了一种将人造石墨膜经重叠排列而成褶皱结构，两侧分别为金属箔层和离型层，这种褶皱结构的石墨膜纵向热传导的速率仍然不能满足散热要求。也有现有技术将PI薄膜石墨化而成的石墨薄片开设数个贯孔，如中国专利申请号201520103535.1公开了一种利用石墨薄片的孔状结构增加扩散面积、透气性，增强散热效果，但纵向的散热效率依然不高。因此如何在现有条件下增加石墨膜纵向的散热效率是本领域亟待解决的技术问题。
发明内容:
本发明的目的在于克服现有技术存在的缺点，寻求提供一种导热膜石墨复合材料，在水平和垂直方向都具有较好的散热效果，以解决现有石墨散热膜纵向导热散热系数低的问题，材料具有良好的通透性、加工性、应用便利性、通用性和弯曲性，可以贴覆在任何平面和弯曲的表面上，发挥出导热散热功效。
为了实现上述目的，本发明涉及的导热膜石墨复合材料的结构由上而下依次包括PET背胶膜、金属箔层、导热硅脂、石墨膜、丙烯酸类胶和离型膜；金属箔层和石墨膜上分别开设数个孔径和孔距相同的金属箔层贯孔和石墨膜贯孔；石墨膜贯孔与金属箔层贯孔复合后对应相通或交错不通；金属箔层与PET背胶膜相贴合的一侧表面均为非平滑或粗糙结构，另一侧表面为平滑结构并设置有填充石墨膜贯孔的金属箔层凸起，金属箔层凸起的高度不大于石墨膜的厚度，凸起形状为圆柱状、椭圆柱状、多边柱状或半球状；石墨膜贯孔的孔径为0.2-1.1mm，彼此间距为0.3-6mm；金属箔层贯孔的孔径为0.2-1.1mm，彼此间距为0.3-6mm；石墨膜贯孔和金属箔层贯孔的形状为圆形、椭圆形、多边形或半球形；金属箔层的厚度为0.01-0.3mm的金属铝或厚度为0.01-0.175mm的金属铜；石墨膜厚度为0.012-0.05mm；金属箔层和石墨膜之间填充有导热硅脂；离型膜为涂有硅油的PET膜，离型膜的厚度为0.012-0.075mm；PET背胶膜的厚度为0.001-0.012mm。
本发明涉及的导热膜石墨复合材料的制备工艺步骤为：先将常规的PI薄膜经碳化和石墨化制成预烧制的石墨膜；再将层状结构的石墨膜进行穿孔后形成石墨膜贯孔，将金属箔层进行穿孔处理后形成金属箔层贯孔；然后将金属箔层一侧表面涂覆导热硅脂后与石墨膜进行复合，并通过压延机压延到厚度为0.022-0.35mm；再在石墨膜层的另一侧涂抹导热的丙烯酸类胶后再与离型膜贴合，金属箔层与PET背胶膜贴合，通过胶辊压制，压制后厚度为0.035-0.437mm；胶辊压制后根据需要直接收卷做成带离型膜的卷材；或揭下离型膜用硅胶保护膜贴合，贴合时以离型膜为传送膜，并与硅胶保护膜同时通过胶辊压制后粘在硅胶保护膜上，收卷成卷材状复合材料；最后，通过模切机模切成适合形状的尺寸，完成产品导热膜石墨复合材料制备。
本发明与现有技术相比，其导热膜石墨复合材料的热扩散、热传导的功能优于现有石墨复合材料，通过增加扩散面积，提高石墨的纵向导热系数，实现快速散热，补偿了部分电子产品金属外壳的散热作用；适用于需要散热的电子设备，特别是非金属外壳的电子设备的应用；其石墨膜层和金属箔层上的贯孔结构及金属箔非光滑表面提高了产品在垂直和水平方向的导热散热性能，应用于非金属外壳的电子设备中能将热量快速散失，产品性能高，产品使用寿命长；其组成部分金属箔层和离型膜，在成型、模切及包装时，可以对石墨膜层起到支撑作用，有利于石墨裁剪，便于操作，降低了生产和使用过程中石墨破损几率，良品率高，材料良好的弯曲性能，加工过程中可收卷成卷材，方便生产与储存，产成品使用过程中，可贴覆在任何平面和弯曲的表面，应用便利性和通用性；其产品结构简单，制备工艺成熟，原材料易得，产品耐热性能好，使用方便，功能稳定，应用环境良好。
附图说明:
图1为本发明涉及的导热膜石墨复合材料的结构原理示意图。
图2为本发明涉及的金属箔层与石墨膜复合结构原理示意图。
具体实施方式:
下面结合实施例并通过附图对本发明作进一步描述。
实施例1：
本发明涉及的导热膜石墨复合材料的结构由上而下依次包括PET背胶膜2、金属箔层3、导热硅脂4、石墨膜1、丙烯酸类胶5和离型膜6；金属箔层3和石墨膜1上分别开设数个孔径和孔距相同的金属箔层贯孔7和石墨膜贯孔9；石墨膜贯孔9与金属箔层贯孔7复合后对应相通或交错不通；金属箔层3与PET背胶膜相贴合的一侧表面均为非平滑或粗糙结构，另一侧表面为平滑结构并设置有填充石墨层贯孔9的金属箔层凸起8，其凸起高度不大于石墨层厚度，凸起的形状为圆柱状、椭圆柱状、多边柱状或半球状；石墨膜贯孔9的孔径为0.2-1.1mm，贯孔彼此间距为0.3-6mm；金属箔层贯孔7的孔径为0.2-1.1mm，贯孔彼此间距为0.3-6mm；石墨膜贯孔9和金属箔层贯孔7的形状为圆形、椭圆形、半球形或多边形；金属箔层3的厚度为0.01-0.3mm的金属铝或厚度为0.01-0.175mm的金属铜；石墨膜厚度为0.012-0.05mm；金属箔层3和石墨膜1之间填充有导热硅脂4；离型膜6为涂有硅油的PET膜，离型膜6的厚度为0.012-0.075mm；PET背胶膜2的厚度为0.001-0.012mm。
本发明涉及的导热膜石墨复合材料的制备工艺步骤为：先将PI薄膜经碳化和石墨化制成预烧制的石墨膜1；再将层状结构的石墨膜1进行穿孔后形成石墨膜贯孔9；然后，将金属箔层3进行穿孔处理后形成金属箔层贯孔7；再将金属箔层一侧表面涂覆导热硅脂4后与石墨膜1进行复合，并通过压延机，压延到厚度为0.022-0.35mm；再在石墨膜层1的另一侧涂抹导热的丙烯酸类胶5后再与离型膜6贴合，金属箔层3与PET背胶膜2贴合，通过胶辊压制，压制后厚度为0.035-0.437mm；胶辊压制后根据需要直接收卷做成带离型膜6的卷材；或揭下离型膜6用硅胶保护膜贴合，贴合时以离型膜为传送膜，并于保护膜同时通过胶辊压制后粘在硅胶保护膜上，收卷成卷材复合材料；最后，通过模切机模切成适合形状的尺寸，完成产品导热膜石墨复合材料制备。
实施例2：
本实施例涉及的导热膜石墨复合材料的结构及其制备工艺同实施例1，其石墨膜贯孔9的孔径为0.6mm，各贯孔彼此间的间距为2mm；金属箔层贯孔7的孔径为0.6mm，各贯孔彼此间的间距为2mm；石墨膜和金属箔层的贯孔形状为圆形；金属箔层3的厚度为0.2mm的金属铝；石墨膜1的厚度为0.02mm；金属箔层3和石墨膜1之间填充有导热硅脂4；离型膜6为涂有硅油的PET膜，其厚度为0.034mm；PET背胶膜2的厚度为0.006mm；
本实施例的产品经检测，其垂直导热系数为220W/mK，水平导热系数为1800W/mK，耐弯曲实验＞11000(R5/180°)。
实施例3：
本实施例涉及的导热膜石墨复合材料的结构及其制备工艺同实施例1，其石墨膜贯孔9的孔径为0.6mm，各贯孔彼此间的间距2mm；金属箔层贯孔7的孔径为0.6mm，各贯孔彼此间的间距为2mm；石墨膜和金属箔层的贯孔形状为椭圆形；金属箔层3的厚度0.2mm的金属铝；石墨膜厚度为0.02mm；金属箔层3和石墨膜1之间填充有导热硅脂4；离型膜6为涂有硅油的PET膜，其厚度0.034mm；PET背胶膜厚度0.006mm；
本实施例制备的产品的垂直导热系数为260W/mK，水平导热系数为1800W/mK，耐弯曲实验＞11000(R5/180°)。

Claims (1)

1.一种导热膜石墨复合材料，结构由上而下依次包括PET背胶膜、金属箔层、导热硅脂、石墨膜、丙烯酸类胶和离型膜；金属箔层和石墨膜上分别开设数个孔径和孔距相同的金属箔层贯孔和石墨膜贯孔；石墨膜贯孔与金属箔层贯孔复合后对应相通或交错不通；金属箔层与PET背胶膜相贴合的一侧表面均为非平滑或粗糙结构，另一侧表面为平滑结构并设置有填充石墨膜贯孔的金属箔层凸起，金属箔层凸起的高度不大于石墨膜的厚度，凸起形状为圆柱状、椭圆柱状、多边柱状或半球状；石墨膜贯孔的孔径为0.2-1.1mm，彼此间距为0.3-6mm；金属箔层贯孔的孔径为0.2-1.1mm，彼此间距为0.3-6mm；石墨膜贯孔和金属箔层贯孔的形状为圆形、椭圆形、多边形或半球形；金属箔层的厚度为0.01-0.3mm的金属铝或厚度为0.01-0.175mm的金属铜；石墨膜厚度为0.012-0.05mm；金属箔层和石墨膜之间填充有导热硅脂；离型膜为涂有硅油的PET膜，离型膜的厚度为0.012-0.075mm；PET背胶膜的厚度为0.001-0.012mm，其特征在于制备工艺步骤为：先将常规的PI薄膜经碳化和石墨化制成预烧制的石墨膜；再将层状结构的石墨膜进行穿孔后形成石墨膜贯孔，将金属箔层进行穿孔处理后形成金属箔层贯孔；然后将金属箔层一侧表面涂覆导热硅脂后与石墨膜进行复合，并通过压延机压延到厚度为0.022-0.35mm；再在石墨膜层的另一侧涂抹导热的丙烯酸类胶后再与离型膜贴合，金属箔层与PET背胶膜贴合，通过胶辊压制，压制后厚度为0.035-0.437mm；胶辊压制后根据需要直接收卷做成带离型膜的卷材；或揭下离型膜用硅胶保护膜贴合，贴合时以离型膜为传送膜，并与硅胶保护膜同时通过胶辊压制后粘在硅胶保护膜上，收卷成卷材状复合材料；最后，通过模切机模切成适合形状的尺寸，完成产品导热膜石墨复合材料制备。
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