CN105321858A - Wafer buffering apparatus in semiconductor device - Google Patents
Wafer buffering apparatus in semiconductor device Download PDFInfo
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- CN105321858A CN105321858A CN201410286996.7A CN201410286996A CN105321858A CN 105321858 A CN105321858 A CN 105321858A CN 201410286996 A CN201410286996 A CN 201410286996A CN 105321858 A CN105321858 A CN 105321858A
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Abstract
The present invention belongs to the field of wafer processing in the semiconductor industry, and specifically a wafer buffering apparatus in a semiconductor device. The wafer buffering apparatus in the semiconductor device includes a first wafer box, a second wafer box, a first air cylinder, a second air cylinder and a bottom plate. The first air cylinder and the second air cylinder are mounted on the bottom plate separately. The first wafer box and the second wafer box are connected with input ends of the first air cylinder and the second air cylinder respectively, and are driven by the first air cylinder and the second air cylinder respectively to alternately move to the position that a manipulator picks up and delivers wafers, namely, the first wafer box or the second wafer box move to the position that the manipulator picks up and delivers wafers, and the second wafer box or the first wafer box locate on a vacancy position. The wafer buffering apparatus in the semiconductor device has simple structure, is convenient to operate. A plurality of wafer boxes provide the function that the manipulator picks up and delivers wafers at the same position through a linear guide way so as to ease the burden of the manipulator, reduce the defect of movement time increasing of the manipulator due to more positions, shorten the time required by processing, and improve the working efficiency.
Description
Technical field
The invention belongs to semicon industry wafer-process field, specifically a kind of for the wafer buffer storage in semiconductor equipment.
Background technology
In semicon industry, the process of wafer need through different technique units equipment not even together, wherein the task that wafer transmits born by manipulator, if wafer-process time used is different, exist speed point, so just can not directly transmit, general needs intermediate link, carrys out buffer memory and transmits wafer.In the prior art, general in the device of similar functions exist two wafer cassette for wafer buffer memory, the position of wafer cassette is fixing, or it is fixing at grade according to the angle of setting, or arrange up and down, which adds the station that wafer fetched and delivered by manipulator, not only increase the burden of manipulator, also affect the process time.
Summary of the invention
In wafer buffer storage, fetching and delivering the station of wafer in order to reduce manipulator, alleviating the burden of manipulator, reduce the manipulator drawback that run duration increases because station is more, the object of the present invention is to provide a kind of for the wafer buffer storage in semiconductor equipment.
The object of the invention is to be achieved through the following technical solutions:
The present invention includes the first wafer cassette, the second wafer cassette, the first cylinder, the second cylinder and base plate, wherein the first cylinder and the second cylinder are arranged on base plate respectively, described first wafer cassette and the second wafer cassette are connected to the output of the first cylinder and the second cylinder, and respectively by described first cylinder and the second air cylinder driven, alternately move to the station that wafer fetched and delivered by described manipulator, namely described first wafer cassette or the second wafer cassette move to the station that wafer fetched and delivered by described manipulator, and described second wafer cassette or the first wafer cassette are positioned at room.
Wherein: the station position that described base plate fetches and delivers wafer at corresponding manipulator is provided with transducer, the lower surface of described first wafer cassette and the second wafer cassette is separately installed with the sensor scan baffle plate corresponding with this transducer, and described first wafer cassette and the second wafer cassette alternately to coordinate with described transducer respectively by the described sensor scan baffle plate of below separately and be positioned the station that wafer fetched and delivered by described manipulator; Described transducer is correlation photoelectric sensor, has the groove for described sensor scan baffle plate process on a sensor, and being photophore above described groove, is light receiving device below;
Described first cylinder and the second cylinder fetch and deliver wafer side to being arranged symmetrically with manipulator, and the angle between the moving direction of the moving direction of the first air cylinder driven first wafer cassette and the second air cylinder driven second wafer cassette is acute angle; Moving direction along described first air cylinder driven first wafer cassette is provided with the first line slideway be arranged on base plate, the output of described first cylinder is connected with the first wafer cassette by the first connecting plate, and this first connecting plate is connected with the first slide block slided along described first line slideway; Moving direction along described second air cylinder driven second wafer cassette is provided with the second line slideway be arranged on base plate, the output of described second cylinder is connected with the second wafer cassette by the second connecting plate, and this second connecting plate is connected with the second slide block slided along described second line slideway; The direction that described first line slideway and the second line slideway fetch and deliver wafer with described manipulator is arranged symmetrically with, and the angle between first and second line slideway is acute angle; The guide vane end stop be arranged on base plate is respectively equipped with outside the two ends of described first slide block and the second slide block movement stroke;
The piston rod of first and second cylinder described is in retracted mode, namely first, two wafer cassette are all in room, and the distance at the center that the center that first and second wafer cassette vertical direction described projects on base plate projects on base plate to the station that wafer fetched and delivered by described manipulator is equal; First and second wafer cassette described is respectively equipped with the opening inputed or outputed for wafer, in first and second wafer cassette, is respectively equipped with the slot of accommodating described wafer; Opening in first and second wafer cassette described is offered along short transverse, and the width of described opening is greater than brilliant diameter of a circle.
Advantage of the present invention and good effect are:
1. structure of the present invention is simple, easy to use, and multiple wafer cassette, by line slideway, provides the same station of manipulator to fetch and deliver the function of wafer, can alleviate the burden of manipulator, reduces the manipulator drawback that run duration increases because station is more.
2. the present invention drives the slide block movement on line slideway by cylinder, thus drive the change of the first wafer cassette and the second wafer cassette position, judge the position residing for the first wafer cassette and the second wafer cassette by the interaction of transducer and sensor scan baffle plate simultaneously, making it successively alternately to be in manipulator fetches and delivers on the station of wafer, reduce the station that wafer fetched and delivered by manipulator, shorten technique required time, increase work efficiency.
3. be provided with guide vane end stop respectively outside the movement travel of the slide block of the present invention on line slideway, prevent cylinder piston rod end to be connected with slide block and loosen or come off, cause slide block to exceed predetermined stroke range.
Accompanying drawing explanation
Fig. 1 is the scheme of installation (vertical view) of line slideway of the present invention and base plate;
Fig. 2 is the scheme of installation (axonometric drawing) of line slideway of the present invention and base plate;
Fig. 3 is the scheme of installation (vertical view) of cylinder of the present invention, air cylinder fixed plate, connecting plate;
Fig. 4 is the scheme of installation (axonometric drawing) of cylinder of the present invention, air cylinder fixed plate, connecting plate;
Fig. 5 is the scheme of installation (vertical view) of wafer cassette of the present invention and transducer;
Fig. 6 is the scheme of installation (axonometric drawing) of wafer cassette of the present invention and transducer;
Fig. 7 is one of structure vertical view of the present invention (the first wafer cassette be in manipulator is fetched and delivered on the station of wafer, i.e. the initial condition of buffer storage of the present invention);
Fig. 8 is one of structural front view of the present invention (the first wafer cassette be in manipulator is fetched and delivered on the station of wafer, i.e. the initial condition of buffer storage of the present invention);
Fig. 9 is the partial enlarged drawing at I place in Fig. 8;
Figure 10 is one of axis of no-feathering view of the present invention (the first wafer cassette be in manipulator is fetched and delivered on the station of wafer, i.e. the initial condition of buffer storage of the present invention);
Figure 11 is structure vertical view two (the second wafer cassette is in manipulator and fetches and delivers on the station of wafer) of the present invention
Figure 12 is structural front view two (the second wafer cassette is in manipulator and fetches and delivers on the station of wafer) of the present invention;
Figure 13 is the partial enlarged drawing at II place in Figure 12;
Figure 14 is axis of no-feathering view two (the second wafer cassette is in manipulator and fetches and delivers on the station of wafer) of the present invention;
Wherein: 1 is the first wafer cassette, 2 is the second wafer cassette, and 3 is the first line slideway, 4 is the first slide block, and 5 is the second line slideway, and 6 is the second slide block, 7 is the first cylinder, 8 is the second cylinder, and 9 is base plate, and 10 is the first fixed head, 11 is the first connecting plate, 12 is the second fixed head, and 13 is the second connecting plate, and 14 is manipulator, 15 is the first guide vane end stop, 16 is the second guide vane end stop, and 17 is the 3rd guide vane end stop, and 18 is the 4th guide vane end stop, 19 is transducer, 20 is first sensor scanning baffle plate, and 21 is the second sensor scan baffle plate, and 22 is slot.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in figs. 1 to 6, the present invention includes the first wafer cassette 1, second wafer cassette 2, first line slideway 3, first slide block 4, second line slideway 5, second slide block 6, first cylinder 7, second cylinder 8, base plate 9, transducer 14, first sensor scanning baffle plate 20 and the second sensor scan baffle plate 21, wherein base plate 9 is motion platforms of whole wafer buffer storage, can be fixed on the inside of semiconductor equipment according to actual conditions.
The cylinder body of the first cylinder 7 is fixed on base plate 9 by the first fixed head 10, second cylinder 8 cylinder body is fixed on base plate 9 by the second fixed head 12, the first line slideway 3 be fixed on base plate 9 is provided with at the outbound course of the first cylinder 7, the second line slideway 5 be fixed on base plate 9 is provided with at the outbound course of the second cylinder 8, first line slideway 3 and the second line slideway 5 are fetched and delivered wafer side with manipulator 14 and are arranged symmetrically with to (direction of arrow in Fig. 7 and Figure 11), and the angle between first and second line slideway 3,5 is acute angle.First cylinder 7 tailpiece of the piston rod is connected with the first wafer cassette 1 by the first connecting plate 11, and the first connecting plate 11 is connected with the first slide block 4 slided along the first line slideway 3, drive the first wafer cassette 1 to move along the first line slideway 3 by the stretching motion of the first cylinder 7 piston rod.Second cylinder 8 tailpiece of the piston rod is connected with the second wafer cassette 2 by the second connecting plate 13, and the second connecting plate 13 is connected with the second slide block 6 slided along the second line slideway 5, drive the second wafer cassette 2 to move along the second line slideway 5 by the stretching motion of the second cylinder 8 piston rod.First and second wafer cassette 1,2 offers along short transverse the opening inputed or outputed for wafer respectively, and the width of this opening is greater than brilliant diameter of a circle.In first and second wafer cassette 1,2, be respectively equipped with the slot 22 of accommodating wafer, first and second wafer cassette 1,2 is with preventing wafer slide out device (of the present invention with preventing the wafer cassette of wafer slide out device from being prior art).When the piston rod of first and second cylinder 7,8 is all in the state of retracting and putting in place, first, the distance at the center that wafer is fetched and delivered at the center that two wafer cassette 1,2 vertical directions project on base plate 9 station to manipulator 14 projects on base plate 9 is equal, namely the direction that first and second cylinder 7,8 fetches and delivers wafer with manipulator 14 is arranged symmetrically with, and angle is between the two acute angle.
First wafer cassette 1 and the second wafer cassette 2, respectively by the stretching motion of the first cylinder 7 piston rod and the second cylinder 8 piston rod, are alternately in the station that wafer fetched and delivered by manipulator 14.When a wafer cassette is in the station that wafer fetched and delivered by manipulator 14, another wafer cassette is in room.The station position that base plate 9 upper surface fetches and delivers wafer at corresponding manipulator 14 is provided with transducer 19, first wafer cassette 1 and the second wafer cassette 2 lower surface are separately installed with the first sensor corresponding with transducer 19 and scan baffle plate 20, second sensor scan baffle plate 21, do in the process of stretching motion at first and second cylinder 7,8 piston rod, first wafer cassette 1 or the second wafer cassette 2 scan baffle plate 20 by the first sensor separately or the second sensor scan baffle plate 21 coordinates with described transducer 19, is alternately in the station that wafer fetched and delivered by manipulator 14.
Transducer 19 of the present invention is arranged on base plate 9 upper surface, and position is positioned at the first wafer cassette 1 or the second wafer cassette 2 and is in below when wafer station fetched and delivered by manipulator 14.Transducer 19 is correlation photoelectric sensor, and transducer 19 has the groove for first and second sensor scan baffle plate 20,21 process, and being photophore above this groove, is light receiving device below.When there being object to keep off between photophore and light receiving device, light receiving device exports a switch controlling signal with regard to action, after control system receives signal, will send instruction.The first sensor scanning baffle plate 20 that first wafer cassette 1 lower surface is installed, installation site is positioned at the first wafer cassette 1 and is in manipulator 14 when fetching and delivering the station of wafer, and first sensor scanning baffle plate 20 just can the light path of block sensor 19; The second sensor scan baffle plate 21 that second wafer cassette 2 lower surface is installed, installation site is positioned at the second wafer cassette 2 and is in manipulator 14 when fetching and delivering the station of wafer, and the second sensor scan baffle plate 21 just can the light path of block sensor 19.
The upper surface of base plate 9 is separately installed with the first guide vane end stop 15, second guide vane end stop 16, the 3rd guide vane end stop 17 and the 4th guide vane end stop 18.First guide vane end stop 15 and the second guide vane end stop 16 lay respectively at the outside 5 ~ 10mm at the first slide block 4 movement travel two ends, 3rd guide vane end stop 17 and the 4th guide vane end stop 18 lay respectively at the outside 5 ~ 10mm at the second slide block 6 movement travel two ends, prevent the connection because of the first cylinder 7 and the first connecting plate 11 from loosening and the connection of the second cylinder 8 and the second connecting plate 13 loosens, cause the first slide block 4 and the second slide block 6 to exceed preset range at the volley.For the first cylinder 7, when the piston rod of the first cylinder 7 doing stretch out motion time, if loosening appears in the connection of the tailpiece of the piston rod of the first cylinder 7 and the first connecting plate 11, so may there is the first slide block 4 range of movement to transfinite, the motion of the first wafer cassette 1 is caused to go beyond the scope, do not fetch and deliver on the station of wafer at manipulator 14, at this moment the piston rod of the first cylinder 7 has stretched out and has put in place, but first sensor scanning baffle plate 20 does not stop the light path of transducer 19, after control system receives signal, warning will be sent, equipment runs and stops, so that maintenance personal keeps in repair.
First and second cylinder 7,8 of the present invention is the cylinder of carrying magnetic switch, and the stroke of piston rod is equal.The effect of magnetic switch is the position detecting cylinder piston rod, the signal of telecommunication can be sent after detecting, two cylinders are respectively with two magnetic switchs, one is positioned at position corresponding when piston rod retraction puts in place, called after bottom magnetic switch here, another is positioned at piston rod and stretches out position corresponding when putting in place, here called after top magnetic switch.
Operation principle of the present invention is:
First and second cylinder 7,8 drives first and second slide block 4,6 to slide on first and second line slideway 3,5 respectively, thus drive the change of first and second wafer cassette 1,2 position, the magnetic switch simultaneously added on first and second cylinder 7,8 by the interaction of transducer 19 and first sensor scanning baffle plate 20, second sensor scan baffle plate 21 judges the position residing for the first wafer cassette 1 and the second wafer cassette 2, making it successively alternately to be in manipulator 14 fetches and delivers on the station of wafer, carries out the loading of wafer.Be specially:
Initial condition of the present invention is as shown in Fig. 7 ~ 10: the tailpiece of the piston rod of the first cylinder 7 is in the state of stretching out, trigger top magnetic switch, send ON signal to control system, the baffle plate 20 of first sensor scanning is simultaneously on transducer 19 position, the light path of block sensor 19, transducer 19 send ON signal to control system (control system of the present invention have sensor-lodging and record wafer cassette in wafer state function, be prior art).Control system sends instruction, the wafer slide out device that prevents of the first wafer cassette 1 is in open mode, namely wafer turnover is allowed, now the piston rod of the first cylinder 7 and the piston rod of the second cylinder 8 are in halted state, first wafer cassette 1 is in manipulator 14 and fetches and delivers on the station of wafer, the tailpiece of the piston rod of the second cylinder 8 is in retracted mode, trigger bottom magnetic switch, send ON signal to control system, control system feedback signal informs that the second wafer cassette 2 is on room, for sylphon state, the wafer slide out device that prevents of the second wafer cassette 2 is in closed condition, namely wafer turnover is stoped.Wafer is sent into the buffer memory carrying out wafer in the first wafer cassette 1 by manipulator 14, and manipulator 14 also can take wafer away simultaneously, goes next technique unit or next device to carry out PROCESS FOR TREATMENT; Control system can record the wafer existence in the first wafer cassette 1, when the slot 22 in the first wafer cassette 1 all exists wafer, now transducer 19 and the first cylinder 7 top magnetic switch are all in ON state, control system will send instruction, the wafer slide out device that prevents of the first wafer cassette 1 is closed, prevent the first wafer box 1 wafer in motion process from skidding off, the piston rod of the first cylinder 7 carries out retraction movement afterwards.Now first sensor scanning baffle plate 20 leaves transducer 19, the no longer light path of block sensor 19, and the first cylinder 7 top magnetic switch is not in ON state simultaneously, and both control system no longer received the ON signal from the first cylinder 7 top magnetic switch, when the piston rod of the first cylinder 7 is retracted completely, magnetic switch bottom first cylinder 7 is triggered, be in ON state, after control system receives ON signal, know that the first wafer cassette 1 returns to assigned address, control system sends instruction, the second cylinder 8 tailpiece of the piston rod is made to start to carry out stretching out motion, put in place when the tailpiece of the piston rod of the second cylinder 8 stretches out, trigger top magnetic switch, send ON signal to control system, second sensor scan baffle plate 21 is on the position of transducer 19 simultaneously, the light path of block sensor 19, transducer 19 sends ON signal to control system, control system sends instruction, the wafer slide out device that prevents of the second wafer cassette 2 is made to be in open mode, namely wafer turnover is allowed, now the first cylinder 7 piston rod and the second cylinder 8 piston rod are in halted state, second wafer cassette 2 is in manipulator 14 and fetches and delivers on the station of wafer.First cylinder 7 tailpiece of the piston rod is in retracted mode, triggers bottom magnetic switch, sends ON signal to control system, and control system feedback signal informs that the first wafer cassette 1 is on room, is full box-like state.Wafer is sent into the buffer memory carrying out wafer in the second wafer cassette 2 by manipulator 14, manipulator 14 also can take wafer away simultaneously, next technique unit or next device is gone to carry out PROCESS FOR TREATMENT, control system can record the wafer existence in the second wafer cassette 2, when the slot 22 in the second wafer cassette 2 all exists wafer, all there is wafer in the slot 22 namely in the first wafer cassette 1 and the second wafer cassette 2, then control system can send warning, and alert is for further processing.
Also there is another kind of situation, fetch and deliver on the station of wafer when the second wafer cassette 2 is in manipulator 14, first wafer cassette 1 is in completely box-like state, namely the magnetic switch at transducer 19 and the second cylinder 8 top is in ON state, if manipulator 14 is less than the wafer number of taking-up to the wafer number that the second wafer cassette 2 is sent into, after setting-up time, wafer in second wafer cassette 2 all takes out, wafer can not be reoffered to manipulator 14, now, control system will send signal, the second cylinder 8 piston rod is made to do retraction movement, after putting in place, the piston rod of the first cylinder 7 does and stretches out motion, get back to the state shown in Fig. 7, enter next initial condition to work on.
Claims (10)
1. one kind for the wafer buffer storage in semiconductor equipment, it is characterized in that: comprise the first wafer cassette (1), second wafer cassette (2), first cylinder (7), second cylinder (8) and base plate (9), wherein the first cylinder (7) and the second cylinder (8) are arranged on base plate (9) respectively, described first wafer cassette (1) and the second wafer cassette (2) are connected to the output of the first cylinder (7) and the second cylinder (8), and driven by described first cylinder (7) and the second cylinder (8) respectively, alternately move to the station that wafer fetched and delivered by described manipulator (14), namely described first wafer cassette (1) or the second wafer cassette (2) move to the station that wafer fetched and delivered by described manipulator (14), described second wafer cassette (2) or the first wafer cassette (1) are positioned at room.
2. press described in claim 1 for the wafer buffer storage in semiconductor equipment, it is characterized in that: the station position that described base plate (9) fetches and delivers wafer at corresponding manipulator (14) is provided with transducer (19), the lower surface of described first wafer cassette (1) and the second wafer cassette (2) is separately installed with the sensor scan baffle plate corresponding with this transducer (19), described first wafer cassette (1) and the second wafer cassette (2) alternately to coordinate with described transducer (19) respectively by the described sensor scan baffle plate of below separately and are positioned the station that wafer fetched and delivered by described manipulator (14).
3. press described in claim 2 for the wafer buffer storage in semiconductor equipment, it is characterized in that: described transducer (19) is correlation photoelectric sensor, transducer (19) has the groove for described sensor scan baffle plate process, being photophore above described groove, is light receiving device below.
4. press described in claim 1 or 2 for the wafer buffer storage in semiconductor equipment, it is characterized in that: described first cylinder (7) and the second cylinder (8) fetch and deliver wafer side to being arranged symmetrically with manipulator (14), and the first cylinder (7) drives the moving direction of the first wafer cassette (1) and the second cylinder (8) to drive the angle between the moving direction of the second wafer cassette (2) to be acute angle.
5. press described in claim 4 for the wafer buffer storage in semiconductor equipment, it is characterized in that: drive the moving direction of the first wafer cassette (1) to be provided with to be arranged on the first line slideway (3) on base plate (9) along described first cylinder (7), the output of described first cylinder (7) is connected with the first wafer cassette (1) by the first connecting plate (11), and this first connecting plate (11) is connected with the first slide block (4) slided along described first line slideway (3); Drive the moving direction of the second wafer cassette (2) to be provided with to be arranged on the second line slideway (5) on base plate (9) along described second cylinder (8), the output of described second cylinder (8) is connected with the second wafer cassette (2) by the second connecting plate (13), and this second connecting plate (13) is connected with the second slide block (6) slided along described second line slideway (5).
6. press described in claim 5 for the wafer buffer storage in semiconductor equipment, it is characterized in that: the direction that described first line slideway (3) and the second line slideway (5) fetch and deliver wafer with described manipulator (14) is arranged symmetrically with, and the angle between first and second line slideway (3,5) is acute angle.
7. by described in claim 5 for the wafer buffer storage in semiconductor equipment, it is characterized in that: outside the two ends of described first slide block (4) and the second slide block (6) movement travel, be respectively equipped with the guide vane end stop be arranged on base plate (9).
8. press described in claim 1 or 2 for the wafer buffer storage in semiconductor equipment, it is characterized in that: first and second cylinder (7 described, 8) piston rod is in retracted mode, namely first, two wafer cassette (1,2) be all in room, first and second wafer cassette described (1,2) vertical direction fetches and delivers wafer to described manipulator (14) station at the center of the upper projection of base plate (9) is equal in the distance at the center of the upper projection of base plate (9).
9. press described in claim 1 or 2 for the wafer buffer storage in semiconductor equipment, it is characterized in that: first and second wafer cassette described (1,2) is respectively equipped with the opening inputed or outputed for wafer, in first and second wafer cassette (1,2), is respectively equipped with the slot (22) of accommodating described wafer.
10. by described in claim 9 for the wafer buffer storage in semiconductor equipment, it is characterized in that: the opening in first and second wafer cassette described (1,2) is offered along short transverse, and the width of described opening is greater than brilliant diameter of a circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410286996.7A CN105321858B (en) | 2014-06-24 | 2014-06-24 | For the wafer buffer storage in semiconductor equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410286996.7A CN105321858B (en) | 2014-06-24 | 2014-06-24 | For the wafer buffer storage in semiconductor equipment |
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| CN105321858A true CN105321858A (en) | 2016-02-10 |
| CN105321858B CN105321858B (en) | 2017-11-28 |
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| CN110349895A (en) * | 2019-06-28 | 2019-10-18 | 上海提牛机电设备有限公司 | A kind of mechanism and wafer transmission system mobile using cylinder |
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| CN116995025A (en) * | 2023-07-15 | 2023-11-03 | 浙江精瓷半导体有限责任公司 | Slicing equipment and method for semiconductor processing |
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| CN113270349B (en) * | 2020-12-31 | 2022-04-05 | 至微半导体(上海)有限公司 | High-speed wafer loading and conveying method and unloading and conveying method |
| CN112707148B (en) * | 2020-12-31 | 2022-07-08 | 至微半导体(上海)有限公司 | High-speed wafer loading and unloading conveying system |
| WO2023024208A1 (en) * | 2021-08-27 | 2023-03-02 | 沈阳芯源微电子设备股份有限公司 | Wafer carrying device and wafer carrying method |
| CN116995025A (en) * | 2023-07-15 | 2023-11-03 | 浙江精瓷半导体有限责任公司 | Slicing equipment and method for semiconductor processing |
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|---|---|
| CN105321858B (en) | 2017-11-28 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |