CN101477960A - Transmission device and method for semiconductor wafer - Google Patents
Transmission device and method for semiconductor wafer Download PDFInfo
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- CN101477960A CN101477960A CNA2008100559640A CN200810055964A CN101477960A CN 101477960 A CN101477960 A CN 101477960A CN A2008100559640 A CNA2008100559640 A CN A2008100559640A CN 200810055964 A CN200810055964 A CN 200810055964A CN 101477960 A CN101477960 A CN 101477960A
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Abstract
The invention relates to a transmission device of a semiconductor chip. The transmission device comprises a front end opening device, an atmospheric transmission unit and a loading lock which are connected in sequence, wherein, the atmospheric transmission unit comprises an atmospheric manipulator for picking and placing chips, and the atmospheric transmission unit further comprises at least a buffer matched with the motion range of the atmospheric manipulator. The invention also relates to a transmission method of the semiconductor chip. Because one or more buffers are integrated at an atmospheric transmission terminal, the transmission device can bear chips which are processed or not processed, the simultaneous storage of the processed chips and the non-processed chips in a chip box on the front end opening device is avoided, and finally the cross contamination between the processed chips and the non-processed chips can be avoided through active isolation, so that the adverse effect on the product yield caused by the cross contamination can be obviously reduced.
Description
Technical field
The present invention relates to a kind of transmitting device of semiconductor wafer and the transmission method of semiconductor wafer.
Background technology
In semi-conductive making technology, the wafer that need handle or substrate need progressively be sent to from atmospheric environment and carry out PROCESS FOR TREATMENT in the reaction chamber, such as etching technics, physics vapor phase deposition etc.As well-known to those skilled in the art, wafer handling to reaction chamber, is needed a wafer transmission system of being made up of a series of atmosphere equipment and vacuum equipment etc.
Conventional semiconductor technology wafer transmission equipment has been shown among Fig. 1 and Fig. 2, has comprised front end opening device 10, propagation in atmosphere unit 20 and locator (not shown in figure 1).Wherein locator 22 is positioned at propagation in atmosphere unit 20 (as shown in Figure 2); Also include load locking device 30, transmission chamber 40 and reaction chamber 50.An atmosphere manipulator 21 (as shown in Figure 2) is arranged in the propagation in atmosphere unit 20 usually, and it can transmit wafer between front end opening device 10 and load locking device 30; Front end opening device 10 is used for opening the side door of wafer case, so that atmosphere manipulator 21 can pick and place wafer in wafer case.Locator 22 is used to detect the calibration chip center, and load locking device 30, transmission chamber 40 and reaction chamber 50 have constituted vacuum transmission system, wherein transmission chamber 40 contains a vacuum mechanical-arm (not shown), and its effect is to transmit wafer between load locking device 30 and reaction chamber 50.Loadlock closed chamber 30 is comparatively special parts, it can switch under atmosphere and vacuum environment two states continually, when its chamber interior is inflated to atmospheric pressure, just can open the passage between itself and the propagation in atmosphere unit 20, thereby carrying is from the wafer on the atmosphere manipulator 21, shut this passage afterwards and be evacuated to vacuum state, and then open passage between itself and the transmission chamber 40, allow vacuum mechanical-arm take wafer away, and finish the various manufacturing process that wafer is carried out by reaction chamber 50.
In the actual process process, the wafer case that wafer is housed is placed on the front end opening device 10 by artificial or other automation equipment, front end opening device 10 is opened the wafer case side door then, the atmosphere manipulator 21 that is arranged in propagation in atmosphere unit 20 takes out a wafer and passes to locator 22 from wafer case, through continuing to be sent in the load locking device 30 after the locator 22, pathway closure between load locking device 30 and the propagation in atmosphere unit 20 afterwards, and air wherein extracted out up to the specified vacuum degree, wafer just is in the vacuum environment, the vacuum machine handgrip loadlock that be arranged in transmission chamber 40 this moment is closed the wafer handling of device 30 and is carried out PROCESS FOR TREATMENT to reaction chamber 50, and the technology back wafer that finishes is sent in the wafer case according to opposite flow process and removes (wafer is without locator 22 in return course).
Directions X among Fig. 2 is atmosphere manipulator 21 whole horizontal linear orbital directions, as shown in Figure 2, the formed space of rectangular circular arc in the middle of the perforate panel 23 promptly is the scope of manipulator in the directions X move left and right, mechanical arm can also be with reference to the central motion of self in addition, arm 60 can rotate around center 70 as shown in Figure 3, also can carry out the expanding-contracting action at sensing center 70, can also carry out vertical up-or-down movement, the end of arm 60 is used for bearing wafer 80 (as shown in Figure 3) in addition.
If will seek out the wafer of the wafer case on the front end opening device 10 that is arranged in the leftmost side among Fig. 2, atmosphere manipulator 21 need move to left along directions X, and arm also rotates accordingly and stretches afterwards, so that reach in the wafer case and shift out wafer; After shifting out wafer, whole manipulator moves to right along directions X, arm stretches to locator 22 then, after wafer positioned, take out wafer again and be sent in the load locking device 30 and go, in passing to reaction chamber 50 and finish PROCESS FOR TREATMENT, this wafer is transferred back in the wafer case on the front end opening device 10 of the leftmost side at last.
The shortcoming of above-mentioned prior art: in the practical semiconductor wafer process, front end opening device 10 and reaction chamber 50 majorities are to concern one to one, and this mainly is a demand of being convenient to quality control, detecting and satisfying kinds of processes.Wafer in the wafer case on the same like this front end opening device 10 (being generally 25) requires to be sent in the same reaction chamber 50 to carry out PROCESS FOR TREATMENT, sends back the original place at last.But for some technologies (such as etching technics), after wafer is finished PROCESS FOR TREATMENT, in returning the process of wafer case, the chemical volatile matter that exists on it is such as hydrogen chloride (HCl), not volatilization fully, after wafer returned wafer case, owing to be in the atmospheric environment, volatile matter combined and accumulates in steam on interior other the wafer of wafer case, especially do not pass through the wafer of PROCESS FOR TREATMENT, thereby cause the cross pollution between them and finally have influence on the product yield.
Summary of the invention
Technical problem to be solved by this invention is, overcome the defective of above-mentioned prior art and provide a kind of can avoid fully cross pollution, simple in structure, be easy to realize, the transmitting device of semiconductor wafer with low cost.
For achieving the above object, the present invention takes following design:
The transmitting device of a kind of semiconductor wafer of the present invention, comprise the front end opening device, propagation in atmosphere unit and the load locking device that connect successively, wherein said propagation in atmosphere unit comprises the atmosphere manipulator that picks and places wafer, and described propagation in atmosphere unit also comprises at least one and the suitable buffer of described atmosphere manipulator scope of activities.
Preferably, described buffer is positioned at described propagation in atmosphere unit, and the opening part of contiguous described load locking device.Described transmitting device also comprises and is used to detect and/or the locator of calibration chip position, preferably, this locator be positioned at described buffer above or below.Further, preferably described load locking device is two, and described buffer also is two, and each buffer is respectively adjacent in the opening part of a load locking device.Described locator is between described two load locking devices, and the upper end of described locator highly is lower than the height of wafer transmission face.
Preferably, have at least two wafer slots on the described buffer, preferably have 25 wafer slots.
Another object of the present invention is to provide a kind of semiconductor wafer is carried out transmission method, comprise the step of utilizing the atmosphere manipulator from the ccontaining mechanism of wafer, to grasp wafer, utilize vacuum mechanical-arm that wafer is sent to reaction chamber to carry out the step of wafer process and utilize the atmosphere manipulator wafer to be put back to the step of the ccontaining mechanism of wafer, wherein, also comprise wafer to be processed or the wafer processed are positioned over buffer memory step in the buffer, make wafer after raw wafer and the processing isolate and place.
Preferably, comprise also that by the finish step of carrying out observing and controlling of measure and control device when the buffer memory step had been finished, measure and control device sent instruction and carries out next step to the buffer memory step, when the buffer memory step was carried out, measure and control device sent instruction and repeats buffer memory step treatment step before.Further, when all being placed on buffer, finish the wafer of described buffer memory step in whole these process treatment process, and to the measure and control device feedback signal.
Advantage of the present invention is: because the present invention's integrated one or more buffers in the propagation in atmosphere end, it can be used for carrying through PROCESS FOR TREATMENT or without the wafer of PROCESS FOR TREATMENT, avoid depositing simultaneously in the wafer case on the front end opening device without processing and wafer through processing, by finally avoiding the cross pollution between them to effective isolation of these wafers, thereby significantly reduce the adverse effect of this cross pollution to the product yield.
Description of drawings
Fig. 1 and Fig. 2 are semiconductor wafer transmitting device schematic diagram of the prior art;
Fig. 3 is the structural representation of atmosphere manipulator;
Fig. 4 is the structural representation of an embodiment of the present invention;
Fig. 5 is the cutaway view of Fig. 4 along the A-A direction;
Fig. 6 A and Fig. 6 B are the flow chart of transmission method of the present invention.
Embodiment
Referring to Fig. 4 and Fig. 5, the preferred embodiment of a kind of semiconductor wafer transmitting device of the present invention shown in it, comprise the front end opening device 1, propagation in atmosphere unit 2, load locking device 3 and the vacuum reaction chamber 4 that connect successively, wherein, propagation in atmosphere unit 2 comprises the atmosphere manipulator 5 that picks and places wafer, and described propagation in atmosphere unit 2 also comprises at least one and the suitable buffer 6 of described atmosphere manipulator 5 scopes of activities.Preferably, described buffer 6 is positioned at described propagation in atmosphere unit, and the opening part of contiguous described load locking device 3, is convenient to described atmosphere manipulator 5 transferring wafer between buffer 6 and load locking device 3 easily and efficiently like this.
Referring to Fig. 5, described transmitting device also comprises and is used for detecting and/or calibration chip position locator 7, preferably, this locator 7 has the effect of detection and calibration chip center, to proofread and correct position deviation or the angular deviation that in the mechanical transfer process, is produced owing to atmosphere manipulator 5, and this locator 7 can be positioned at described buffer 6 above or below, in the present embodiment, be preferably placed at the vacant position, below of right side buffer 6, wasting space so neither also is convenient to simultaneously picking and placeing and transmitting of 5 pairs of wafers of atmosphere manipulator.
Referring to Fig. 4 and Fig. 5, preferably, described load locking device is two 3 and 3 ', and described buffer also is two 6 and 6 ', and each buffer 6 and 6 ' is respectively adjacent in the opening part of a load locking device 3 and 3 '.At this moment, preferably, described locator 7 is between described two load locking devices, and as shown in Figure 5, at this moment, the upper end of described locator 7 highly is lower than the height of wafer transmission face.Preferably, the upper end of locator 7 highly will significantly be lower than the height (SEMI standard) of wafer transmission face.
Further, in the present embodiment, have at least two wafer slots on the described buffer 6, preferably, have 25 wafer slots on the described buffer.Like this can be corresponding with wafer (the being generally 25) quantity in the common wafer case.
Referring to Fig. 6 A and Fig. 6 B, a kind of two kinds of preferred embodiments that semiconductor wafer carried out the method for PROCESS FOR TREATMENT of the present invention shown in it, comprise the step of utilizing the atmosphere manipulator from the ccontaining mechanism of wafer, to grasp wafer, utilize vacuum mechanical-arm that wafer is sent to reaction chamber to carry out the step of wafer process and utilize the atmosphere manipulator wafer to be put back to the step of the ccontaining mechanism of wafer, wherein, also comprise wafer to be processed or the wafer processed are positioned over buffer memory step in the buffer, make wafer after raw wafer and the processing isolate and place.
Further, referring to Fig. 6 A, utilize the atmosphere manipulator to grasp wafer from the ccontaining mechanism of wafer, the ccontaining mechanism of described wafer is the front end opening device in the present embodiment, then wafer to be processed is put into buffer by the atmosphere manipulator, at this moment, by measure and control device whether finishing of this buffer memory step carried out observing and controlling, promptly when the wafer in the wafer case all was placed on buffer, the buffer memory step was finished, and to the measure and control device feedback signal, measure and control device sends instruction and carries out next step; When the wafer in the wafer case was not placed on buffer fully, measure and control device sent instruction and repeats buffer memory step treatment step before, and the wafer in wafer case all is placed in the buffer.After this utilize the atmosphere manipulator from buffer, to grasp wafer and position, carry out the follow-up reaction chamber that enters then and carry out operations such as processed by locator.Certainly, also can set measure and control device, be positioned over the wafer of some in the buffer as required after, measure and control device is considered as the buffer memory step with it and finishes.
Referring to Fig. 6 B, the main difference part of embodiment is shown in this embodiment and Fig. 6 A, earlier all wafers is carried out processed, then the wafer after the processed is put in the buffer by the atmosphere manipulator, by measure and control device whether finishing of this buffer memory step carried out observing and controlling equally afterwards, when promptly being placed on buffer after the wafer in the wafer case is all through processed, the buffer memory step is finished, and to the measure and control device feedback signal, measure and control device sends instruction and carries out next step; When the wafer in the wafer case did not pass through processed fully, measure and control device sent instruction and repeats buffer memory step treatment step before, and the wafer in wafer case is processed disposing all, and are placed in the buffer.Certainly, also can set measure and control device, as required with the wafer of some is processed finish dealing with and be positioned in the buffer after, measure and control device is considered as the buffer memory step with it and finishes.
Obviously, those of ordinary skill in the art can constitute various types of chip processing devices or propagation in atmosphere device with the transmitting device and the processing method of a kind of semiconductor wafer of the present invention.
The foregoing description is only for the usefulness that the present invention is described; and be not to be limitation of the present invention; the those of ordinary skill in relevant technologies field; without departing from the present invention; can also make various variations and modification; therefore all technical schemes that are equal to also should belong to category of the present invention, and scope of patent protection of the present invention should be limited by each claim.
Claims (10)
1, a kind of transmitting device of semiconductor wafer, it is characterized in that: comprise the front end opening device, propagation in atmosphere unit and the load locking device that connect successively, wherein said propagation in atmosphere unit comprises the atmosphere manipulator that picks and places wafer, and described propagation in atmosphere unit also comprises at least one and the suitable buffer of described atmosphere manipulator scope of activities.
2, transmitting device according to claim 1 is characterized in that: described buffer is positioned at described propagation in atmosphere unit, and the opening part of contiguous described load locking device.
3, transmitting device according to claim 1 is characterized in that: described transmitting device also comprises and is used to detect and/or the locator of calibration chip position.
4, transmitting device according to claim 2 is characterized in that: described load locking device is two, and described buffer also is two, and each buffer is respectively adjacent in the opening part of a load locking device.
5, transmitting device according to claim 4 is characterized in that: described locator is between described two load locking devices, and the upper end of described locator highly is lower than the height of wafer transmission face.
6, transmitting device according to claim 1 is characterized in that: have at least two wafer slots on the described buffer.
7, transmitting device according to claim 6 is characterized in that: described wafer slots is 25.
8, a kind of transmission method of semiconductor wafer, it is characterized in that: comprise the step of utilizing the atmosphere manipulator from the ccontaining mechanism of wafer, to grasp wafer, utilize vacuum mechanical-arm that wafer is sent to reaction chamber to carry out the step of wafer process and utilize the atmosphere manipulator wafer to be put back to the step of the ccontaining mechanism of wafer, wherein, also comprise wafer to be processed or the wafer processed are positioned over buffer memory step in the buffer, make wafer after raw wafer and the processing isolate and place.
9, transmission method according to claim 8, it is characterized in that: also comprise by the step of carrying out observing and controlling of finishing of measure and control device to the buffer memory step, when the buffer memory step has been finished, measure and control device sends instruction and carries out next step, when the buffer memory step was carried out, measure and control device sent instruction and repeats buffer memory step treatment step before.
10, transmission method according to claim 9 is characterized in that: when all being placed on buffer, finish the wafer of described buffer memory step in whole these process treatment process, and to the measure and control device feedback signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100559640A CN101477960A (en) | 2008-01-03 | 2008-01-03 | Transmission device and method for semiconductor wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100559640A CN101477960A (en) | 2008-01-03 | 2008-01-03 | Transmission device and method for semiconductor wafer |
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| CN101477960A true CN101477960A (en) | 2009-07-08 |
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| CNA2008100559640A Pending CN101477960A (en) | 2008-01-03 | 2008-01-03 | Transmission device and method for semiconductor wafer |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102024734A (en) * | 2009-09-14 | 2011-04-20 | 东京毅力科创株式会社 | Substrate processing apparatus and method |
| CN102110588A (en) * | 2010-12-31 | 2011-06-29 | 北京七星华创电子股份有限公司 | Semiconductor wafer transfer and process pretreatment equipment |
| CN102347207A (en) * | 2010-07-29 | 2012-02-08 | 中芯国际集成电路制造(上海)有限公司 | System for plasma process |
| CN102560406A (en) * | 2010-12-24 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Physical vapor deposition (PVD) device and method for processing wafers by adopting same |
| CN102820245A (en) * | 2012-08-16 | 2012-12-12 | 上海华力微电子有限公司 | Thin-film process system with wafer storage groove and wafer accessing method thereof |
| CN102867768A (en) * | 2011-07-05 | 2013-01-09 | 北京中科信电子装备有限公司 | Method for improving wafer transmission efficiency of target chamber |
| CN102074443B (en) * | 2009-11-19 | 2013-04-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Atmospheric transmission chamber and change method of inner airflow thereof and plasma processing equipment |
| CN105321858A (en) * | 2014-06-24 | 2016-02-10 | 沈阳芯源微电子设备有限公司 | Wafer buffering apparatus in semiconductor device |
| CN105977123A (en) * | 2016-06-29 | 2016-09-28 | 中国电子科技集团公司第四十八研究所 | SiC injection machine chip-conveying system and method |
| CN110858559A (en) * | 2018-08-23 | 2020-03-03 | 细美事有限公司 | Buffer unit and apparatus and method for processing substrate using the same |
| CN114823432A (en) * | 2022-06-28 | 2022-07-29 | 江苏邑文微电子科技有限公司 | Semiconductor vacuum transmission platform and control method thereof |
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2008
- 2008-01-03 CN CNA2008100559640A patent/CN101477960A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102024734A (en) * | 2009-09-14 | 2011-04-20 | 东京毅力科创株式会社 | Substrate processing apparatus and method |
| CN102024734B (en) * | 2009-09-14 | 2013-01-02 | 东京毅力科创株式会社 | Substrate processing apparatus and method |
| TWI455231B (en) * | 2009-09-14 | 2014-10-01 | Tokyo Electron Ltd | Substrate processing apparatus and method |
| CN102074443B (en) * | 2009-11-19 | 2013-04-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Atmospheric transmission chamber and change method of inner airflow thereof and plasma processing equipment |
| CN102347207A (en) * | 2010-07-29 | 2012-02-08 | 中芯国际集成电路制造(上海)有限公司 | System for plasma process |
| CN102560406A (en) * | 2010-12-24 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Physical vapor deposition (PVD) device and method for processing wafers by adopting same |
| CN102560406B (en) * | 2010-12-24 | 2013-10-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Physical vapor deposition (PVD) device and method for processing wafers by adopting same |
| CN102110588A (en) * | 2010-12-31 | 2011-06-29 | 北京七星华创电子股份有限公司 | Semiconductor wafer transfer and process pretreatment equipment |
| CN102110588B (en) * | 2010-12-31 | 2012-08-01 | 北京七星华创电子股份有限公司 | Semiconductor wafer transfer and process pretreatment equipment |
| CN102867768B (en) * | 2011-07-05 | 2016-02-24 | 北京中科信电子装备有限公司 | Method for improving wafer transmission efficiency of target chamber |
| CN102867768A (en) * | 2011-07-05 | 2013-01-09 | 北京中科信电子装备有限公司 | Method for improving wafer transmission efficiency of target chamber |
| CN102820245A (en) * | 2012-08-16 | 2012-12-12 | 上海华力微电子有限公司 | Thin-film process system with wafer storage groove and wafer accessing method thereof |
| CN102820245B (en) * | 2012-08-16 | 2015-02-11 | 上海华力微电子有限公司 | Thin-film process system with wafer storage groove and wafer accessing method thereof |
| CN105321858A (en) * | 2014-06-24 | 2016-02-10 | 沈阳芯源微电子设备有限公司 | Wafer buffering apparatus in semiconductor device |
| CN105321858B (en) * | 2014-06-24 | 2017-11-28 | 沈阳芯源微电子设备有限公司 | For the wafer buffer storage in semiconductor equipment |
| CN105977123A (en) * | 2016-06-29 | 2016-09-28 | 中国电子科技集团公司第四十八研究所 | SiC injection machine chip-conveying system and method |
| CN105977123B (en) * | 2016-06-29 | 2018-07-24 | 中国电子科技集团公司第四十八研究所 | A kind of SiC implanters pass piece system and its pass piece method |
| CN110858559A (en) * | 2018-08-23 | 2020-03-03 | 细美事有限公司 | Buffer unit and apparatus and method for processing substrate using the same |
| CN110858559B (en) * | 2018-08-23 | 2023-04-07 | 细美事有限公司 | Buffer unit and apparatus and method for processing substrate using the same |
| CN114823432A (en) * | 2022-06-28 | 2022-07-29 | 江苏邑文微电子科技有限公司 | Semiconductor vacuum transmission platform and control method thereof |
| CN114823432B (en) * | 2022-06-28 | 2022-09-02 | 江苏邑文微电子科技有限公司 | Semiconductor vacuum transmission platform and control method thereof |
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