CN113270349A - High-speed wafer loading and conveying method and unloading and conveying method - Google Patents
High-speed wafer loading and conveying method and unloading and conveying method Download PDFInfo
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- CN113270349A CN113270349A CN202011636187.6A CN202011636187A CN113270349A CN 113270349 A CN113270349 A CN 113270349A CN 202011636187 A CN202011636187 A CN 202011636187A CN 113270349 A CN113270349 A CN 113270349A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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Abstract
The invention discloses a high-speed loading and conveying method and an unloading and conveying method for wafers, wherein the high-speed loading and conveying method for the wafers comprises the following steps: firstly, transferring a wafer in a wafer box from a wafer output mechanism to a wafer receiving mechanism; secondly, transferring the wafer box from the wafer receiving mechanism to a transfer mechanism; thirdly, transferring the wafer box from one end of the transfer mechanism to the other end of the transfer mechanism; the wafer high-speed unloading and conveying method comprises the following steps: firstly, transferring a wafer box from one end of a transfer mechanism to one end close to a receiving mechanism; secondly, transferring the wafer box to a receiving mechanism from a transfer mechanism; thirdly, transferring the wafer in the wafer box from the wafer receiving mechanism to the wafer output mechanism; the invention has compact process, improves the cleaning efficiency of the wafer and saves the manufacturing cost of wet cleaning equipment.
Description
Technical Field
The invention belongs to the technical field of semiconductor cleaning equipment, and particularly relates to a high-speed wafer loading and conveying method and an unloading and conveying method.
Background
In a semiconductor wet process equipment, different configurations are often set up according to different use requirements, and the semiconductor process equipment adjusts the wafer load throughput according to the configuration. The overall equipment structure for wafer transportation corresponding to semiconductor process equipment is often required to be configured with a high-efficiency wafer transmission structure in a loading area and a unloading area of a wafer product, and particularly, the loading area and the unloading area of semiconductor wet process equipment are limited in the effect of increasing the wafer loading capacity because the wafer product is generally configured with one to two wafer boxes, so that the improvement of the execution efficiency of the process is driven by the structural design of wafer transmission. Due to the arrangement of the space, the wafer loading area, the wafer output area and other process areas are not in a straight line, so that the wafer box in the loading area or the wafer box in the output area needs to be connected to the clamping position of the manipulator, and the conventional process usually realizes the transfer of the position of the wafer box through a transfer clamping mechanism. The clamping mechanism for transferring occupies a large space, and meanwhile, the operation process is complicated, and the transfer efficiency of the wafer is influenced.
Disclosure of Invention
The invention provides a high-speed wafer loading and conveying method aiming at the problems in the prior art, which can improve the wafer conveying efficiency, does not occupy the space of wet equipment additionally in the wafer transfer process, and improves the wafer conveying efficiency. In addition, the invention also provides a wafer high-speed unloading and conveying method.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a high-speed wafer loading and conveying method, which is applied to a feeding end of wet cleaning equipment and is characterized by comprising the following steps of:
firstly, transferring a wafer in a wafer box from a wafer output mechanism to a wafer receiving mechanism;
the wafer output mechanism comprises a first mounting frame, a first placing frame, a first wafer box and a sliding pushing handle, wherein the first placing frame comprises a first horizontal placing plate and a first vertical placing plate, the first horizontal placing plate and the first vertical placing plate are mutually and vertically arranged, the middle part of the first horizontal placing plate is provided with a hollow structure, the bottom of the first wafer box is placed on the first horizontal placing plate, the hollow structure at the bottom of the first wafer box is communicated with the hollow structure on the first horizontal placing plate, the side part of the first wafer box is fixedly connected with a first vertical fixing plate, the joint of the first horizontal placing plate and the first vertical placing plate is connected with the first mounting frame shaft, the sliding pushing handle comprises a sliding rail and a pushing arm, and the pushing arm is slidably mounted on the sliding rail, the push arm is arranged on one side, away from the receiving mechanism, of the first placing frame; the receiving mechanism comprises a second mounting frame, a second placing frame and a second wafer box, the second placing frame comprises a second horizontal placing plate and a second vertical placing plate, the second horizontal placing plate and the second vertical placing plate are perpendicular to each other, a hollow structure is arranged in the middle of the second horizontal placing plate, the bottom of the second wafer box is provided with a hollow structure, the bottom of the second wafer box is placed on the second horizontal placing plate, the hollow structure in the bottom of the second wafer box is communicated with the hollow structure in the second horizontal placing plate, the side of the second wafer box is fixedly connected with a second vertical fixing plate, and the joint of the second horizontal placing plate and the second vertical placing plate is connected with the second mounting frame shaft; the first rack is connected with the first mounting rack through a first driving mechanism, the second rack is connected with the second mounting rack through a second driving mechanism, and the first driving mechanism and the second driving mechanism are identical in structure;
the first step specifically comprises:
step 1-1, initial state; the first horizontal placing plate and the second horizontal placing plate are both in a horizontal state, the first vertical placing plate and the second vertical placing plate are in a vertical state, a wafer is loaded in the first wafer box, no load is generated in the second wafer box, and the sliding push handle is far away from the first wafer box;
step 1-2, transferring the wafer; the driving mechanism at the first placing frame and the driving mechanism at the second placing frame act simultaneously to drive the first placing frame and the second placing frame to rotate ninety degrees simultaneously, the openings of the first wafer box and the second wafer box are in a relative state, the pushing handle is slid to act, and the wafer in the first wafer box is pushed into the second wafer box from the hollow part at the bottom of the first wafer box;
step 1-3, detecting a wafer; the driving mechanism at the first placing frame and the driving mechanism at the second placing frame act simultaneously to drive the first placing frame and the second placing frame to rotate in opposite directions for ninety degrees simultaneously, the openings of the first wafer box and the second wafer box are upward, and the detection cylinder pushes the detection sensor to move upward simultaneously to detect wafers in the second wafer box;
step 1-4, clamping a wafer cassette; the second limiting cylinder resets, and the mechanical clamping hand clamps the second wafer box to the next station;
secondly, transferring the wafer box from the wafer receiving mechanism to a transfer mechanism;
and step three, transferring the wafer box from one end of the transfer mechanism to the other end of the transfer mechanism.
As a preferred technical solution, in the second step, the transferring mechanism includes a transferring rail, a transferring bearing plate, a joining rail, a joining slider, a pushing cylinder and a pushing plate, the transferring rail is disposed at one side of the wafer loading area, one end of the transferring rail is flush with a second horizontal placing plate of the wafer loading area, the joining rail is disposed between the wafer supporting plate and the transferring rail, the joining slider is slidably mounted on the joining rail, a base of the pushing cylinder is mounted on the joining slider, the pushing plate is mounted at an output end of the pushing cylinder through a pushing arm, a hollow structure on the second horizontal placing plate is capable of being passed through by the pushing plate, a transferring channel for the pushing arm to pass through is further formed on the horizontal placing plate, the transferring channel on the second horizontal placing plate faces the transferring rail, the hollow structure is communicated with the transfer channel, the transfer bearing plate is provided with the hollow structure for the pushing plate to pass through and the transfer channel for the pushing arm to pass through, and the transfer channel on the transfer bearing plate faces the wafer supporting plate;
the second step specifically comprises:
2-1, resetting the second limiting cylinder, enabling the connecting slide block to be located under the second horizontal placing plate, enabling the pushing cylinder to act to move the pushing plate to a hollow structure on the second horizontal placing plate, enabling the pushing plate to be in contact with the bottom of the second wafer box, enabling the pushing cylinder to continue to act, and pushing the second wafer box away from the second horizontal placing plate;
and 2-2, moving the linking slide block towards the direction of the transfer track along the linking track, enabling the pushing arm to penetrate through the transfer channel on the transfer bearing plate, conveying the second wafer box to the position right above the hollow structure on the transfer bearing plate, pushing the air cylinder to act, driving the pushing plate to move downwards, and placing the second wafer box on the transfer bearing plate.
According to the preferable technical scheme, the first driving mechanism and the second driving mechanism comprise a cylinder mounting seat, a driving cylinder and a driving plate, the fixed end of the driving cylinder is hinged to the cylinder mounting seat, the output end of the driving cylinder is hinged to the driving plate, the driving plate is fixedly connected with the first placing frame or the second placing frame, and the driving plate is connected with the first mounting frame or the second mounting frame through a shaft.
As an optimal technical scheme, the drive plate is a right triangle, one right-angle side of the drive plate is fixedly mounted on the first placing frame or the second placing frame, the output end of the drive cylinder is hinged to one end point of the bevel edge of the drive plate, and the middle point of the inclined plate of the drive plate is connected with the first mounting frame or the second mounting frame shaft.
As a preferred technical scheme, two wafer placing point locations are arranged on the transfer bearing plate, when a wafer cassette signal is sensed at the first wafer placing point location, the controller controls the third driving mechanism to drive the transfer bearing plate to move by one working point location, and the step 2-1 and the step 2-2 are repeated.
According to the preferable technical scheme, the first horizontal placing plate is provided with a first limiting fixing mechanism, the second horizontal placing plate is provided with a second limiting fixing mechanism, the first limiting fixing mechanism comprises a first limiting supporting block and a first limiting cylinder, the first limiting supporting block is arranged at four corners of the hollow structure of the first horizontal placing plate, the first limiting cylinder is arranged at one side far away from the first vertical placing plate, the second limiting fixing mechanism comprises a second limiting supporting block and a second limiting cylinder, the second limiting supporting block is arranged at four corners of the hollow structure of the second horizontal placing plate, the second limiting cylinder is arranged at one side far away from the second vertical plate, and the transfer bearing plate is provided with a third limiting supporting block at four corners of the hollow structure.
As a preferred technical scheme, a first inductive switch is arranged in the first limit support block, a second inductive switch is arranged in the second limit support block, a third inductive switch is arranged in the third limit support block, the transfer bearing plate is driven by a third driving mechanism, the connecting slider is driven by a fourth driving mechanism, and the first inductive switch, the second inductive switch, the third inductive switch, the first driving mechanism, the second driving mechanism, the third driving mechanism, the fourth driving mechanism and the pushing cylinder are connected with a controller.
As an optimized technical scheme, a support frame is arranged between the output mechanism and the receiving mechanism, locking blocks are symmetrically arranged on the support frame, the top of the first wafer box faces one side of the second wafer box, and a locking groove matched with the locking blocks is formed in one side of the top of the second wafer box, which faces the first wafer box.
The invention provides a wafer high-speed unloading and conveying method, which is applied to a blanking end of wet cleaning equipment and is characterized by comprising the following steps of:
firstly, transferring a wafer box from one end of a transfer mechanism to one end close to a receiving mechanism;
wafer transfer mechanism includes transfer track, transfer loading board, links up the track, links up the slider, promotes cylinder and catch plate, the transfer track sets up in the regional one side of wafer uninstallation, orbital one end of transfer with the regional second level of wafer uninstallation is placed the board and is flushed, transfer loading board slidable mounting is on the transfer track, and the board one end is placed to orbital second level that is close to of transfer loading board motion to the transfer.
Secondly, transferring the wafer box to a receiving mechanism from a transfer mechanism;
the linking track is arranged between the wafer supporting plate and the transfer track, the linking slide block is slidably mounted on the linking track, the base of the pushing cylinder is mounted on the linking slide block, the pushing plate is mounted at the output end of the pushing cylinder through a pushing arm, the hollow structure on the second horizontal placing plate can be passed through by the pushing plate, the horizontal placing plate is also provided with a transfer channel for the pushing arm to pass through, the transfer channel on the second horizontal placing plate faces the transfer track, the hollow structure is communicated with the transfer channel, the transfer bearing plate is provided with the hollow structure for the pushing plate to pass through and the transfer channel for the pushing arm to pass through, and the transfer channel on the transfer bearing plate faces the wafer supporting plate;
the second step specifically comprises the following steps:
step 2-1, the connecting slide block is positioned right below the wafer box placing point position of the transfer bearing plate, the pushing cylinder is pushed to act to move the pushing plate to the hollow structure on the transfer bearing plate, the pushing plate is contacted with the bottom of the wafer box, the pushing cylinder is pushed to act continuously to push the wafer box away from the transfer bearing plate, and the connecting slide block penetrates through a transfer channel on the transfer bearing plate;
2-2, moving the connecting slide block towards the direction of the second horizontal placing plate along the connecting track, enabling the pushing arm to penetrate through the transfer channel on the second horizontal placing plate, conveying the wafer box to the position right above the hollow structure on the second horizontal placing plate, pushing the air cylinder to act, driving the pushing plate to move downwards, and placing the wafer box on the second horizontal placing plate;
thirdly, transferring the wafer in the wafer box from the wafer receiving mechanism to the wafer output mechanism;
as a preferred technical solution, in the third step, the wafer output mechanism includes a first mounting frame, a first rack, a first wafer box and a sliding pusher, the first rack includes a first horizontal placing plate and a first vertical placing plate, the first horizontal placing plate and the first vertical placing plate are perpendicular to each other, a hollow structure is disposed in the middle of the first horizontal placing plate, a hollow structure is disposed at the bottom of the first wafer box, the bottom of the first wafer box is placed on the first horizontal placing plate, the hollow structure at the bottom of the first wafer box is communicated with the hollow structure on the first horizontal placing plate, the side of the first wafer box is fixedly connected with the first vertical fixing plate, the joint of the first horizontal placing plate and the first vertical placing plate is connected with the first shaft mounting frame, the sliding pusher includes a sliding track and a pushing arm, the push arm is slidably arranged on the sliding track and is arranged on one side, away from the receiving mechanism, of the first placing frame; the receiving mechanism comprises a second mounting frame, a second placing frame and a second wafer box, the second placing frame comprises a second horizontal placing plate and a second vertical placing plate, the second horizontal placing plate and the second vertical placing plate are perpendicular to each other, a hollow structure is arranged in the middle of the second horizontal placing plate, the bottom of the second wafer box is provided with a hollow structure, the bottom of the second wafer box is placed on the second horizontal placing plate, the hollow structure in the bottom of the second wafer box is communicated with the hollow structure in the second horizontal placing plate, the side of the second wafer box is fixedly connected with a second vertical fixing plate, and the joint of the second horizontal placing plate and the second vertical placing plate is connected with the second mounting frame shaft; the first rack is connected with the first mounting rack through a first driving mechanism, the second rack is connected with the second mounting rack through a second driving mechanism, and the first driving mechanism and the second driving mechanism are identical in structure;
the third step is specifically as follows:
step 3-1, the first horizontal placing plate and the second horizontal placing plate are in contact with the bearing frame in a horizontal state, the first vertical placing plate and the second vertical placing plate are in a vertical state, wafers are loaded in the second wafer box, no load exists in the first wafer box, and the sliding push handle is far away from the second wafer box;
and 3-2, simultaneously actuating a driving mechanism at the first placing frame and a driving mechanism at the second placing frame to drive the first placing frame and the second placing frame to rotate ninety degrees, wherein the openings of the first wafer box and the second wafer box are in a relative state, a sliding pushing hand at the receiving mechanism is actuated, and wafers in the second wafer box are pushed into the first wafer box from the hollow part at the bottom of the second wafer box.
Compared with the prior art, the invention has the beneficial effects that:
(1) the wafer box conveying device has the advantages that the output mechanism and the receiving mechanism are arranged, so that the wafer can be quickly transferred to the grabbing station of the manipulator, the movement stroke is simple, the efficient transmission of the wafer box is realized, the wafer can be detected in real time, the cleaning efficiency of the wafer is ensured, and the utilization rate of semiconductor wet process equipment is greatly improved.
(2) The wafer box conveying device is compact in structure, a new clamping mechanism is not introduced, the wafer box conveying process is simple, the clamping points of the wafer box are connected to be located in a loading area or a unloading area of wet cleaning equipment through the alternate synergistic effect of the rail and the sliding block, the wafer cleaning efficiency is improved, and the manufacturing cost of the wet cleaning equipment is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a high-speed wafer handling system according to the present invention.
FIG. 2 is a second schematic view of the high-speed wafer handling system according to the present invention.
FIG. 3 is a third schematic view of the high-speed wafer handling system according to the present invention.
FIG. 4 is a schematic structural diagram of a wafer output mechanism and a wafer receiving mechanism according to one embodiment of the present invention.
FIG. 5 is a second schematic view of the structure of the wafer output mechanism and the wafer receiving mechanism according to the present invention.
FIG. 6 is a third schematic view of the structure of the wafer output mechanism and the wafer receiving mechanism of the present invention.
FIG. 7 is a fourth schematic view of the structure of the wafer output mechanism and the wafer receiving mechanism of the present invention.
FIG. 8 is a partially enlarged view of the wafer carrying out mechanism and the wafer receiving mechanism according to the present invention.
FIG. 9 is a second enlarged view of the wafer carrying out mechanism and the wafer receiving mechanism according to the present invention.
FIG. 10 is a third enlarged view of the wafer output mechanism and the wafer receiving mechanism of the present invention.
FIG. 11 is a fourth partial enlarged view of the wafer carrying out mechanism and the wafer receiving mechanism according to the present invention.
Fig. 12 is a schematic structural view of the turning mechanism of the present invention.
Fig. 13 is a second schematic structural view of the turning mechanism of the present invention.
Fig. 14 is a third schematic structural view of the turning mechanism of the present invention.
Fig. 15 is a partially enlarged view of the pivoting mechanism of the present invention.
Fig. 16 is a second enlarged view of the turning mechanism of the present invention.
Wherein the reference numerals are specified as follows: the wafer transfer device comprises a first wafer box 1, a first horizontal placing plate 2, a first vertical placing plate 3, a second wafer box 4, a second horizontal placing plate 5, a second vertical placing plate 6, a first mounting frame 7, a second mounting frame 8, a sliding rail 9, a push arm 10, a bearing frame 11, a detection cylinder 12, a detection sensor 13, a locking groove 14, a support frame 15, a locking block 16, a cylinder mounting seat 17, a driving cylinder 18, a driving plate 19, a first limiting block 20, a first limiting cylinder 21, a second limiting support block 22, a second limiting cylinder 23, a transfer rail 24, a transfer bearing plate 25, a third limiting support block 26, a joining rail 27, a joining slider 28, a push cylinder 29, a hollow structure 30, a transfer channel 31, a push plate 32 and a push arm 33.
Detailed Description
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Example 1
The present embodiment provides a high-speed wafer loading/unloading conveying system, which includes a wafer output mechanism, a wafer receiving mechanism and a transferring mechanism.
The output mechanism comprises a first mounting frame 7, a first placing frame, a first wafer box 1 and a sliding pushing hand, the first placing frame comprises a first horizontal placing plate 2 and a first vertical placing plate 3, the first horizontal placing plate 2 and the first vertical placing plate 3 are placed in a mutually perpendicular mode, the middle of the first horizontal placing plate 2 is provided with a hollow structure 30, the bottom of the first wafer box 1 is arranged on the first horizontal placing plate 2, the hollow structure 30 at the bottom of the first wafer box 1 is communicated with the hollow structure 30 on the first horizontal placing plate 2, and the side portion of the first wafer box 1 is fixedly mounted with a first vertical fixing plate. The joint of the first horizontal placing plate 2 and the first vertical placing plate 3 is connected with a first mounting frame 7 through a shaft. The sliding push handle comprises a sliding track 9 and a push arm 10, the push arm 10 is slidably mounted on the sliding track 9, and the push arm 10 is arranged on one side of the first placing frame, which is far away from the receiving mechanism.
Receiving mechanism includes second mounting bracket 8, the second rack, second wafer box 4, the second rack includes that the second level is placed board 5 and the second and is placed board 6 perpendicularly, the second level is placed board 5 and the second and is placed board 6 mutually perpendicular setting perpendicularly, the second level is placed the middle part of board 5 and is provided with hollow out construction 30, the bottom of second wafer box 4 is provided with hollow out construction 30, place the bottom of second wafer box 4 on the board 5 is placed to the second level, the bottom hollow out construction 30 of second wafer box 4 is placed the hollow out construction 30 intercommunication on board 5 with the second level, the lateral part and the perpendicular fixed plate fixed connection of second wafer box 4, board 5 is placed to the second level, the second is placed the junction of board 6 perpendicularly and is connected with second mounting bracket 8 hub connections.
The first rack is connected with the first mounting rack 7 through a first driving mechanism, the second rack is connected with the second mounting rack 8 through a second driving mechanism, and the first driving mechanism and the second driving mechanism are identical in structure. The first driving mechanism and the second driving mechanism comprise an air cylinder mounting seat 17, a driving air cylinder 18 and a driving plate 19, the fixed end of the driving air cylinder 18 is hinged to the air cylinder mounting seat 17, the output end of the driving air cylinder 18 is hinged to the driving plate 19, the driving plate 19 is fixedly connected with a first placing frame or a second placing frame, and the driving plate 19 is connected with the first mounting frame 7 or the second mounting frame 8 through a shaft. The driving plate 19 is a right triangle, a right-angle side of the driving plate 19 is fixedly mounted on the first placing frame or the second placing frame, the output end of the driving cylinder 18 is hinged to one end point of the oblique side of the driving plate 19, and the middle point of the inclined plate of the driving plate 19 is connected with the first mounting frame 7 or the second mounting frame 8 through a shaft.
The bearing frames 11 are respectively arranged below the first bearing frame and the second bearing frame. A support frame 15 is arranged between the output mechanism and the receiving mechanism, locking blocks 16 are symmetrically arranged on the support frame 15, the top of the first wafer box 1 faces one side of the second wafer box 4, and a locking groove 14 matched with the locking blocks 16 is arranged on one side of the top of the second wafer box 4 facing the first wafer box 1.
The first horizontal placing plate 2 is provided with a first limiting and fixing mechanism, the second horizontal placing plate 5 is provided with a second limiting and fixing mechanism, the first limiting and fixing mechanism comprises a first limiting support block and a first limiting cylinder 21, the first limiting block 20 is arranged at four corners of the hollow structure 30 of the first horizontal placing plate 2, and the first limiting cylinder 21 is arranged at one side far away from the first vertical placing plate 3; the second limiting fixing mechanism comprises a second limiting supporting block 22 and a second limiting cylinder 23, the second limiting supporting block 22 is arranged at four corners of the hollow structure 30 of the second horizontal placing plate 5, and the second limiting cylinder 23 is arranged on one side far away from the second vertical plate.
The transfer mechanism comprises a transfer rail 24, a transfer bearing plate 25, a joining rail 27, a joining slider 28, a pushing cylinder 29 and a pushing plate 32, wherein the transfer rail 24 is arranged on one side of the wafer loading area, and one end of the transfer rail 24 is flush with the second horizontal placing plate 5 of the wafer loading area. The transfer carrier plate 25 is slidably mounted on the transfer rail 24, and the transfer carrier plate 25 is driven by a third driving mechanism. The engaging rail 27 is disposed between the second horizontal placement plate 5 and the transfer rail 24, the engaging slider 28 is slidably mounted on the engaging rail 27, and the engaging slider 28 is driven by the fourth driving mechanism.
The base of promotion cylinder 29 is installed on linking up slider 28, install in the output of promotion cylinder 29 through catch arm 33 catch arm 32, the second level is placed and is offered the hollow out construction 30 that supplies catch arm 32 to pass through on the board 5, the transfer passageway 31 that supplies catch arm 33 to pass through, the transfer passageway 31 that the second level was placed on the board 5 is towards transfer track 24, hollow out construction 30 and transfer passageway 31 intercommunication, offer the hollow out construction 30 that supplies catch arm 32 to pass through on the transfer loading board 25, the transfer passageway 31 that supplies catch arm 33 to pass through, the board 5 is placed towards the second level to the transfer passageway 31 on the transfer loading board 25. The hollow structure 30 and the transfer passage 31 of the transfer loading plate 25 are located between the second horizontal placing plate 5 and the transfer rail 24. The transfer carrier plate 25 is provided with two wafer cassette placement sites.
The transfer bearing plate 25 has a rectangular hollow structure 30, a third limit support block 26 for supporting the wafer box is arranged at four corners of the hollow structure 30, and four corners of the wafer box are supported on the third limit support block 26. A third inductive switch is arranged on the inner side of the third limit supporting block 26. The first inductive switch, the second inductive switch, the third inductive switch, the first driving mechanism, the second driving mechanism, the third driving mechanism and the fourth driving mechanism push the cylinder 29 to be connected with the controller.
Example 2
The structure of this embodiment is substantially the same as that of embodiment 1, and a wafer detector is added on the basis of embodiment 1, the wafer detector includes a detection cylinder 12 and a detection sensor 13, the detection sensor 13 is connected to the detection cylinder 12, and the detection cylinder 12 is disposed right below the structure of the first horizontal placement plate 2. The first wafer box 1 is provided with a plurality of wafer clamping grooves inside, a clamping groove gap is formed between adjacent wafer clamping grooves, and the detection sensor 13 comprises a plurality of detection sensing pieces arranged in parallel. A slot gap is formed between adjacent wafer slots, the detection sensor 13 comprises a plurality of detection sensors 13 arranged in parallel, and the positions of the detection sensor sheets correspond to the positions of the slot gaps. A sliding push handle is additionally arranged in the receiving mechanism and comprises a sliding rail 9 and a push arm 10, the push arm 10 is slidably arranged on the sliding rail 9, and the push arm 10 is arranged on one side, far away from the receiving mechanism, of the first placing frame.
Example 3
The embodiment provides a wafer loading and conveying method, which comprises the following working processes:
in the first step, the first horizontal placing board 2 and the second horizontal placing board 5 are both in a horizontal state and are in contact with the loading frame 11, and the first vertical placing board 3 and the second vertical placing board 6 are in a vertical state. The first wafer box 1 is loaded with wafers, the second wafer box 4 is empty, and the sliding pushing hand is far away from the first wafer box 1. The first and second limiting cylinders 21 and 23 are operated to fix the first wafer cassette 1 on the first horizontal mounting plate 2 and the second wafer cassette 4 on the second horizontal mounting plate 5.
Step two, the driving mechanism at the first placing frame and the driving mechanism at the second placing frame act simultaneously to drive the first placing frame and the second placing frame to rotate ninety degrees simultaneously, the openings of the first wafer box 1 and the second wafer box 4 are in a relative state, and the locking grooves 14 on the first wafer box 1 and the second wafer box 4 are clamped on the locking block 16. The sliding pushing hand at the conveying mechanism acts to push the wafer in the first wafer box 1 to the second wafer box 4 from the hollow-out part at the bottom of the first wafer box 1.
And step three, resetting the second limiting cylinder 23, enabling the connecting slide block 28 to be located under the second horizontal placing plate 5, enabling the pushing cylinder 29 to act to move the pushing plate 32 to the position of the hollow structure 30 on the second horizontal placing plate 5, enabling the pushing plate 32 to be in contact with the bottom of the second wafer box 4, enabling the pushing cylinder 29 to continue to act to push the second wafer box 4 away from the second horizontal placing plate 5, enabling the controller to control the fourth driving mechanism to drive the connecting slide block 28 to penetrate through the transfer channel 31 on the second horizontal placing plate 5 and move towards the direction of the transfer bearing plate 25 when the second sensing switch senses a signal that the second wafer box 4 leaves.
Step four, the engaging slide block 28 moves along the engaging track 27 towards the direction of the transferring track 24, the pushing arm 33 penetrates through the transferring channel 31 on the transferring bearing plate 25, the second wafer box 4 is conveyed to the position right above the hollow structure 30 on the transferring bearing plate 25, the pushing cylinder 29 is pushed to act to drive the pushing plate 32 to move downwards, the second wafer box 4 is placed on the transferring bearing plate 25, and when the third inductive switch senses a signal for placing the second wafer box 4, the pushing cylinder 29 is pushed to act to drive the pushing plate 32 to leave the second wafer box 4.
And step five, after a wafer box signal is sensed on the first wafer placement point, the controller controls the third driving mechanism to drive the transfer bearing plate 25 to move by one working point, and the step one and the step two are repeated.
And step six, after the wafer box signals are sensed on the two wafer box placing points, the controller controls the third driving mechanism to drive the transfer bearing plate 25 to move to the other end of the transfer track 24.
Example 4
The embodiment provides a wafer unloading and conveying method, which comprises the following working processes:
step one, after the two wafer box placing points sense the wafer box signals, the controller controls the third driving mechanism to drive the transfer bearing plate 25 to move to one end of the transfer rail 24, which is close to the second horizontal placing plate 5.
And step two, the connecting slide block 28 is positioned right below the first wafer box placing point of the transfer bearing plate 25, the pushing cylinder 29 moves to move the pushing plate 32 to the hollow structure 30 on the transfer bearing plate 25, the pushing plate 32 is in contact with the bottom of the wafer box, the pushing cylinder 29 continues to move to push the wafer box away from the transfer bearing plate 25, when the third inductive switch senses a signal that the wafer box leaves, the signal is transmitted to the controller, and the controller controls the fourth driving mechanism to drive the connecting slide block 28 to penetrate through the transfer channel 31 on the transfer bearing plate 25 and move towards the direction of the second horizontal placing plate 5.
Step three, the joining slide block 28 moves towards the direction of the second horizontal placing plate 5 along the joining track 27, the pushing arm 33 penetrates through the transfer channel 31 on the second horizontal placing plate 5, the wafer box is conveyed to the position right above the hollow structure 30 on the second horizontal placing plate 5, the pushing cylinder 29 acts to drive the pushing plate 32 to move downwards, the wafer box is placed on the second horizontal placing plate 5, and when the second sensing switch senses a signal of placing the wafer box, the pushing cylinder 29 acts to drive the pushing plate 32 to leave the wafer box.
And step four, after the signal that the wafer box leaves is sensed on the first wafer placing point, the controller controls the first driving mechanism to drive the transfer bearing plate 25 to move by one working point, and the step two and the step three are repeated.
And step five, the first horizontal placing plate 2 and the second horizontal placing plate 5 are both in a horizontal state and are in contact with the bearing frame 11, and the first vertical placing plate 3 and the second vertical placing plate 6 are in a vertical state. The second wafer box 4 is loaded with wafers, the first wafer box 1 is empty, and the sliding pushing hand is far away from the second wafer box 4. The first and second limiting cylinders 21 and 23 are operated to fix the first wafer cassette 1 on the first horizontal mounting plate 2 and the second wafer cassette 4 on the second horizontal mounting plate 5.
Step two, the driving mechanism at the first placing frame and the driving mechanism at the second placing frame act simultaneously to drive the first placing frame and the second placing frame to rotate ninety degrees simultaneously, the openings of the first wafer box 1 and the second wafer box 4 are in a relative state, and the locking grooves 14 on the first wafer box 1 and the second wafer box 4 are clamped on the locking block 16. The sliding pushing hand at the receiving mechanism acts to push the wafers in the second wafer box 4 to the first wafer box 1 from the hollow-out part at the bottom of the second wafer box 4.
Although the present invention has been described in detail with respect to the above embodiments, it will be understood by those skilled in the art that modifications or improvements based on the disclosure of the present invention may be made without departing from the spirit and scope of the invention, and these modifications and improvements are within the spirit and scope of the invention.
Claims (10)
1. A high-speed wafer loading and conveying method is applied to a feeding end of wet cleaning equipment and is characterized by comprising the following steps:
firstly, transferring a wafer in a wafer box from a wafer output mechanism to a wafer receiving mechanism;
the wafer output mechanism comprises a first mounting frame, a first placing frame, a first wafer box and a sliding pushing handle, wherein the first placing frame comprises a first horizontal placing plate and a first vertical placing plate, the first horizontal placing plate and the first vertical placing plate are mutually and vertically arranged, the middle part of the first horizontal placing plate is provided with a hollow structure, the bottom of the first wafer box is placed on the first horizontal placing plate, the hollow structure at the bottom of the first wafer box is communicated with the hollow structure on the first horizontal placing plate, the side part of the first wafer box is fixedly connected with a first vertical fixing plate, the joint of the first horizontal placing plate and the first vertical placing plate is connected with the first mounting frame shaft, the sliding pushing handle comprises a sliding rail and a pushing arm, and the pushing arm is slidably mounted on the sliding rail, the push arm is arranged on one side, away from the receiving mechanism, of the first placing frame; the receiving mechanism comprises a second mounting frame, a second placing frame and a second wafer box, the second placing frame comprises a second horizontal placing plate and a second vertical placing plate, the second horizontal placing plate and the second vertical placing plate are perpendicular to each other, a hollow structure is arranged in the middle of the second horizontal placing plate, the bottom of the second wafer box is provided with a hollow structure, the bottom of the second wafer box is placed on the second horizontal placing plate, the hollow structure in the bottom of the second wafer box is communicated with the hollow structure in the second horizontal placing plate, the side of the second wafer box is fixedly connected with a second vertical fixing plate, and the joint of the second horizontal placing plate and the second vertical placing plate is connected with the second mounting frame shaft; the first rack is connected with the first mounting rack through a first driving mechanism, the second rack is connected with the second mounting rack through a second driving mechanism, and the first driving mechanism and the second driving mechanism are identical in structure;
the first step specifically comprises:
step 1-1, initial state; the first horizontal placing plate and the second horizontal placing plate are both in a horizontal state, the first vertical placing plate and the second vertical placing plate are in a vertical state, a wafer is loaded in the first wafer box, no load is generated in the second wafer box, and the sliding push handle is far away from the first wafer box;
step 1-2, transferring the wafer; the driving mechanism at the first placing frame and the driving mechanism at the second placing frame act simultaneously to drive the first placing frame and the second placing frame to rotate ninety degrees simultaneously, the openings of the first wafer box and the second wafer box are in a relative state, the pushing handle is slid to act, and the wafer in the first wafer box is pushed into the second wafer box from the hollow part at the bottom of the first wafer box;
step 1-3, detecting a wafer; the driving mechanism at the first placing frame and the driving mechanism at the second placing frame act simultaneously to drive the first placing frame and the second placing frame to rotate in opposite directions for ninety degrees simultaneously, the openings of the first wafer box and the second wafer box are upward, and the detection cylinder pushes the detection sensor to move upward simultaneously to detect wafers in the second wafer box;
step 1-4, clamping a wafer cassette; the second limiting cylinder resets, and the mechanical clamping hand clamps the second wafer box to the next station;
secondly, transferring the wafer box from the wafer receiving mechanism to a transfer mechanism;
and step three, transferring the wafer box from one end of the transfer mechanism to the other end of the transfer mechanism.
2. The wafer high-speed loading and conveying method as claimed in claim 1, wherein in the second step, the transferring mechanism includes a transferring rail, a transferring plate, a connecting rail, a connecting slider, a pushing cylinder and a pushing plate, the transferring rail is disposed at one side of the wafer loading area, the transferring plate is slidably mounted on the transferring rail, one end of the transferring rail is flush with the second horizontal plate of the wafer loading area, the connecting rail is disposed between the wafer supporting plate and the transferring rail, the connecting slider is slidably mounted on the connecting rail, the base of the pushing cylinder is mounted on the connecting slider, the pushing plate is mounted at the output end of the pushing cylinder through a pushing arm, the hollow structure on the second horizontal plate is used for the pushing plate to pass through, the horizontal plate is further provided with a transferring channel for the pushing arm to pass through, the transfer channel on the second horizontal placing plate faces the transfer track, the hollow structure is communicated with the transfer channel, the transfer bearing plate is provided with the hollow structure for the pushing plate to pass through and the transfer channel for the pushing arm to pass through, and the transfer channel on the transfer bearing plate faces the wafer supporting plate;
the second step specifically comprises:
2-1, resetting the second limiting cylinder, enabling the connecting slide block to be located under the second horizontal placing plate, enabling the pushing cylinder to act to move the pushing plate to a hollow structure on the second horizontal placing plate, enabling the pushing plate to be in contact with the bottom of the second wafer box, enabling the pushing cylinder to continue to act, and pushing the second wafer box away from the second horizontal placing plate;
and 2-2, moving the linking slide block towards the direction of the transfer track along the linking track, enabling the pushing arm to penetrate through the transfer channel on the transfer bearing plate, conveying the second wafer box to the position right above the hollow structure on the transfer bearing plate, pushing the air cylinder to act, driving the pushing plate to move downwards, and placing the second wafer box on the transfer bearing plate.
3. The wafer high-speed loading and conveying method as claimed in claim 1, wherein the first driving mechanism and the second driving mechanism comprise a cylinder mounting seat, a driving cylinder and a driving plate, a fixed end of the driving cylinder is hinged to the cylinder mounting seat, an output end of the driving cylinder is hinged to the driving plate, the driving plate is fixedly connected with the first placing frame or the second placing frame, and the driving plate is connected with the first installing frame or the second installing frame through a shaft.
4. The wafer high-speed loading and conveying method as claimed in claim 3, wherein the driving plate is a right triangle, one right-angled side of the driving plate is fixedly mounted with the first placing frame or the second placing frame, the output end of the driving cylinder is hinged with one end point of the bevel edge of the driving plate, and the middle point of the inclined plate of the driving plate is connected with the first mounting frame or the second mounting frame through a shaft.
5. The wafer high-speed loading/unloading conveying system as claimed in claim 1, wherein the transfer plate has two wafer placement locations, and when a cassette signal is sensed at the first wafer placement location, the controller controls the third driving mechanism to drive the transfer plate to move by one working location, and repeats step 2-1 and step 2-2.
6. The wafer high-speed handling system of claim 2, wherein, the first horizontal placing plate is provided with a first limit fixing mechanism, the second horizontal placing plate is provided with a second limit fixing mechanism, the first limit fixing mechanism comprises a first limit supporting block and a first limit air cylinder, the first limit supporting block is arranged at four corners of the hollow structure of the first horizontal placing plate, the first limit cylinder is arranged on one side far away from the first vertical placing plate, the second limit fixing mechanism comprises a second limit supporting block and a second limit cylinder, the second limit supporting block is arranged at four corners of the hollow structure of the second horizontal placing plate, the second limiting cylinder is arranged on one side far away from the second vertical plate, and the transfer bearing plate is provided with third limiting support blocks at four corners of the hollow structure.
7. The wafer high-speed loading, unloading and conveying system as claimed in claim 6, wherein a first inductive switch is disposed in the first limit support block, a second inductive switch is disposed in the second limit support block, a third inductive switch is disposed in the third limit support block, the transfer carrier plate is driven by a third driving mechanism, the connecting slider is driven by a fourth driving mechanism, and the first inductive switch, the second inductive switch, the third inductive switch, the first driving mechanism, the second driving mechanism, the third driving mechanism, the fourth driving mechanism, and the pushing cylinder are connected to a controller.
8. The wafer high-speed loading, unloading and conveying system as claimed in claim 2, wherein a support frame is disposed between the output mechanism and the receiving mechanism, the support frame is symmetrically provided with locking blocks, the top of the first wafer cassette faces one side of the second wafer cassette, and the top of the second wafer cassette faces one side of the first wafer cassette and is provided with locking grooves matched with the locking blocks.
9. A wafer high-speed unloading and conveying method is applied to a discharging end of wet cleaning equipment and is characterized by comprising the following steps:
firstly, transferring a wafer box from one end of a transfer mechanism to one end close to a receiving mechanism;
wafer transfer mechanism includes transfer track, transfer loading board, links up the track, links up the slider, promotes cylinder and catch plate, the transfer track sets up in the regional one side of wafer uninstallation, orbital one end of transfer with the regional second level of wafer uninstallation is placed the board and is flushed, transfer loading board slidable mounting is on the transfer track, and the board one end is placed to orbital second level that is close to of transfer loading board motion to the transfer.
Secondly, transferring the wafer box to a receiving mechanism from a transfer mechanism;
the linking track is arranged between the wafer supporting plate and the transfer track, the linking slide block is slidably mounted on the linking track, the base of the pushing cylinder is mounted on the linking slide block, the pushing plate is mounted at the output end of the pushing cylinder through a pushing arm, the hollow structure on the second horizontal placing plate can be passed through by the pushing plate, the horizontal placing plate is also provided with a transfer channel for the pushing arm to pass through, the transfer channel on the second horizontal placing plate faces the transfer track, the hollow structure is communicated with the transfer channel, the transfer bearing plate is provided with the hollow structure for the pushing plate to pass through and the transfer channel for the pushing arm to pass through, and the transfer channel on the transfer bearing plate faces the wafer supporting plate;
the second step specifically comprises the following steps:
step 2-1, the connecting slide block is positioned right below the wafer box placing point position of the transfer bearing plate, the pushing cylinder is pushed to act to move the pushing plate to the hollow structure on the transfer bearing plate, the pushing plate is contacted with the bottom of the wafer box, the pushing cylinder is pushed to act continuously to push the wafer box away from the transfer bearing plate, and the connecting slide block penetrates through a transfer channel on the transfer bearing plate;
2-2, moving the connecting slide block towards the direction of the second horizontal placing plate along the connecting track, enabling the pushing arm to penetrate through the transfer channel on the second horizontal placing plate, conveying the wafer box to the position right above the hollow structure on the second horizontal placing plate, pushing the air cylinder to act, driving the pushing plate to move downwards, and placing the wafer box on the second horizontal placing plate;
and step three, transferring the wafer in the wafer box from the wafer receiving mechanism to the wafer output mechanism.
10. The wafer high-speed unloading and conveying method according to claim 9, wherein in the third step, the wafer output mechanism comprises a first mounting frame, a first placing frame, a first wafer box and a sliding pusher, the first placing frame comprises a first horizontal placing plate and a first vertical placing plate, the first horizontal placing plate and the first vertical placing plate are arranged perpendicular to each other, a hollow structure is arranged in the middle of the first horizontal placing plate, a hollow structure is arranged at the bottom of the first wafer box, the bottom of the first wafer box is placed on the first horizontal placing plate, the hollow structure at the bottom of the first wafer box is communicated with the hollow structure on the first horizontal placing plate, the side of the first wafer box is fixedly connected with the first vertical fixing plate, and the joint of the first horizontal placing plate and the first vertical placing plate is connected with the first mounting frame shaft, the sliding push handle comprises a sliding track and a push arm, the push arm is slidably mounted on the sliding track, and the push arm is arranged on one side, away from the receiving mechanism, of the first placing frame; the receiving mechanism comprises a second mounting frame, a second placing frame and a second wafer box, the second placing frame comprises a second horizontal placing plate and a second vertical placing plate, the second horizontal placing plate and the second vertical placing plate are perpendicular to each other, a hollow structure is arranged in the middle of the second horizontal placing plate, the bottom of the second wafer box is provided with a hollow structure, the bottom of the second wafer box is placed on the second horizontal placing plate, the hollow structure in the bottom of the second wafer box is communicated with the hollow structure in the second horizontal placing plate, the side of the second wafer box is fixedly connected with a second vertical fixing plate, and the joint of the second horizontal placing plate and the second vertical placing plate is connected with the second mounting frame shaft; the first rack is connected with the first mounting rack through a first driving mechanism, the second rack is connected with the second mounting rack through a second driving mechanism, and the first driving mechanism and the second driving mechanism are identical in structure;
the third step is specifically as follows:
step 3-1, the first horizontal placing plate and the second horizontal placing plate are in contact with the bearing frame in a horizontal state, the first vertical placing plate and the second vertical placing plate are in a vertical state, wafers are loaded in the second wafer box, no load exists in the first wafer box, and the sliding push handle is far away from the second wafer box;
and 3-2, simultaneously actuating a driving mechanism at the first placing frame and a driving mechanism at the second placing frame to drive the first placing frame and the second placing frame to rotate ninety degrees, wherein the openings of the first wafer box and the second wafer box are in a relative state, a sliding pushing hand at the receiving mechanism is actuated, and wafers in the second wafer box are pushed into the first wafer box from the hollow part at the bottom of the second wafer box.
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