CN105321639A - 过电流保护元件 - Google Patents
过电流保护元件 Download PDFInfo
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- CN105321639A CN105321639A CN201510052876.5A CN201510052876A CN105321639A CN 105321639 A CN105321639 A CN 105321639A CN 201510052876 A CN201510052876 A CN 201510052876A CN 105321639 A CN105321639 A CN 105321639A
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
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- 229910000831 Steel Inorganic materials 0.000 description 2
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/02—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess current
- H02H9/026—Current limitation using PTC resistors, i.e. resistors with a large positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06566—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of borides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/028—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of organic substances
Abstract
本发明公开了过电流保护元件包含二金属箔片及一PTC材料层,PTC材料层叠设于二金属箔片之间,且体积电阻值在0.07至0.45Ω-cm的范围。PTC材料层包含至少一结晶性高分子聚合物、第一导电填料和第二导电填料。第一导电填料为碳黑粉末。第二导电填料的体积电阻值小于0.1Ω-cm,选自至少一种的金属粉末、导电陶瓷粉末或其组合。第一和第二导电填料均匀分散于结晶性高分子聚合物之中,且第二导电填料除以第一导电填料的重量比值小于4。过电流保护元件的电阻再现性R300/Ri比值在1.5~5。上下金属箔片可连于电源而形成一导电回路,PTC材料层在过电流的状况下动作,从而保护回路。
Description
技术领域
本发明涉及一种过电流保护元件,尤其涉及一种具低电阻率、良好的电阻再现性及优异的循环寿命测试(cyclelifetest)结果的过电流保护元件。
背景技术
由于具有正温度系数(PositiveTemperatureCoefficient;PTC)特性的导电复合材料的电阻对温度变化具有反应敏锐的特性,可作为电流感测元件的材料,目前已被广泛应用于过电流保护元件或电路元件上。由于PTC导电复合材料在正常温度下的电阻可维持极低值,使电路或电池得以正常运作。但是,当电路或电池发生过电流(over-current)或过高温(over-temperature)的现象时,其电阻值会瞬间提高至一高电阻状态(至少102Ω以上),而将过量的电流降低,以达到保护电池或电路元件的目的。
一般而言,PTC导电复合材料由一种或一种以上具结晶性的聚合物及导电填料所组成,该导电填料均匀分散于该聚合物之中。该聚合物一般为聚烯烃类聚合物,例如:聚乙烯,而导电填料一般为碳黑。然而,碳黑所能提供的导电度较低,而不符应用上低阻值的需求。
我国专利公布号CN102903469A公开了利用导电陶瓷混合碳黑作为导电填料,使得使用该等导电填料的过电流保护元件具有优异的体积电阻率及电阻再现性,其电阻再现性R100/Ri约在3至20之间,其中Ri为起始电阻值,R100为触发100次后的电阻值。随着过电流保护元件的需求和发展,为避免元件于长期使用时烧毁的潜在风险,对产品的循环寿命测试的要求更为严格。本发明即针对CN102903469A专利作进一步改良,以期得到更好的循环寿命等电气特性。
发明内容
本发明提供一种过电流保护元件,选用碳黑以及金属或陶瓷导电粉末作为导电填料,并以适当比例均匀散布于结晶性高分子聚合物中,从而使得该过电流保护元件具有低电阻率、良好的电阻再现性以及可通过严格的循环寿命测试。
本发明一实施例的过电流保护元件包含二金属箔片及一PTC材料层。PTC材料层叠设于该二金属箔片之间,且其体积电阻值在0.07至0.45Ω-cm的范围。PTC材料层包含至少一结晶性高分子聚合物、第一导电填料和第二导电填料。第一导电填料为碳黑粉末。第二导电填料选自至少一种的金属粉末、导电陶瓷粉末或其组合,且该第二导电填料的体积电阻值小于0.1Ω-cm。第一导电填料和第二导电填料均匀分散于该结晶性高分子聚合物之中,且第二导电填料除以第一导电填料的重量比值小于4。该过电流保护元件的电阻再现性R300/Ri比值在1.5~5,其中Ri为起始电阻值,R300为触发300次后的电阻值。
一实施例中,该结晶性高分子聚合物占PTC材料层的重量百分比为10%~30%,第一导电填料占PTC材料层的重量百分比为15%~40%,第二导电填料占PTC材料层的重量百分比介于30%~70%。
一实施例中,该过电流保护元件的电阻再现性R300/Ri比值在1.5~3。
一实施例中,该过电流保护元件的电阻再现性R100/Ri比值在1~3,R100为触发100次后的电阻值。
一实施例中,该过电流保护元件可通过16V/50A的300次循环寿命测试而无烧毁。该循环寿命测试重复300次施加电压16V和电流50A,每次持续电压电流10秒后停止60秒。
一实施例中,该结晶性高分子聚合物选自:聚烯烃类聚合物、烯烃类单体与压克力类单体的共聚合物、烯烃类单体与乙烯醇类单体的共聚合物及其组合。
一实施例中,该结晶性高分子聚合物选自:高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、聚乙烯蜡、乙烯聚合物、聚丙烯、聚氯乙烯、聚氟乙烯、乙烯-压克力酸共聚合物、乙烯-压克力脂共聚合物、乙烯-乙烯醇共聚合物及其组合。
一实施例中,该金属粉末选自镍、钴、铜、铁、锡、铅、银、金、铂及其合金。
一实施例中,该导电陶瓷粉末选自:碳化钨、碳化钒、碳化钛、碳化硼、碳化硅、碳化锗、碳化钽、碳化锆、碳化铬、碳化钼、硼化钛、硼化钒、硼化锆、硼化铌、硼化钼、硼化铪、氮化锆及其组合,例如混合物、固溶体(solidsolution)或核壳体(core-shell)。
一实施例中,第二导电填料包含碳化钛,且该过电流保护元件可通过30V/50A的循环寿命测试而无烧毁。
一实施例中,金属或导电陶瓷粉末的粒径大小主要介于0.01μm至100μm之间,较佳粒径大小介于0.1μm至50μm之间。导电碳黑粉末的粒径大小主要介于15nm至75nm之间。
一实施例中,该PTC材料层的厚度大于0.1mm,或较佳大于0.2mm。
一实施例中,金属箔片含瘤状(nodule)突出的粗糙表面,并与该PTC材料层直接物理性接触。
本发明的过电流保护元件,其中该二金属箔片可与另二金属电极片借着锡膏(solder)经回焊或借着点焊方式接合成一组装体(assembly),通常是成一轴型(axial-leaded)、插件型(radial-leaded)、端子型(terminal)或表面粘着型(surfacemount)的元件。本发明的过电流保护元件,其中该上下金属箔片可连于电源而形成一导电回路(circuit),PTC材料层在过电流的状况下动作,而达到保护回路的作用。
附图说明
图1本发明一实施例的过电流保护元件的示意图。
附图标记说明:
10过电流保护元件
11PTC材料层
12金属箔片
具体实施方式
导电复合材料的导电度由导电填料的种类及含量而定。近年来,消费型电子产品对于可重复使用电池(例如锂电池)或单次用电池(例如碳锌电池),在延长使用寿命上比例逐年增加。由于碳黑所能提供的导电度较金属或陶瓷填料低,因此本发明加入导电碳化陶瓷填料,以增加导电度。然而,由于导电碳化陶瓷填料以堆叠的方式形成导电通路,当该复合材料中的结晶性高分子受热产生再结晶现象,使得材料中陶瓷填料的导电通路减少,造成该导电复合材料在反复发生过电流(over-current)或反复过高温(over-temperature)事件时,其电阻再现性比值(tripjump)过高,因而缩短电池使用的寿命。
由于碳黑表面呈凹凸状,与聚烯烃类聚合物的附着性较佳,所以具有较佳的电阻再现性。为有效降低过电流保护元件经过反复触发(trip)后的电阻值,并且维持低的导电复合材料的体积电阻值,本发明于结晶性高分子聚合物材料中同时添加碳黑粉末及金属或导电陶瓷粉末,使得过电流保护元件兼具碳黑填料较佳的电阻再现性,以及导电碳化陶瓷粉末的高导电特性,并使用适当的重量比例,使过电流保护元件可通过严格的循环寿命测试而不致烧毁。
以下说明本发明过电流保护元件的组成成份,包括实施例和比较例,以及其相关制作过程。
本发明过电流保护元件所使用的PTC材料层的成份及重量百分比如表一所示。其中结晶性高分子聚合物选用聚乙烯(polyethylene;PE)或特别是高密度结晶性聚乙烯,例如使用台湾塑胶TAISOXHDPE/9001高密度结晶性聚乙烯(密度:0.951g/cm3,熔点:130℃)。导电填料包含碳黑(carbonblack;CB)粉末,其他则可选用金属及/或导电陶瓷粉末。金属粉末可使用镍粉,如AEE(AtlanticEquipmentEngineers)NI-102,3μm大小的片状镍粉(nickelflake),其体积电阻值介于6至15μΩ-cm。导电陶瓷粉末则使用碳化钨(WC)或碳化钛(TiC),WC如AEE(AtlanticEquipmentEngineers)WP-301导电填料,其体积电阻值约80μΩ-cm,粒径约1-5μm。TiC则可使用AEE(AtlanticEquipmentEngineers)TI-301导电填料,其体积电阻值介于180至250μΩ-cm,粒径约1-5μm。
本发明的实施例中,导电填料除碳黑粉末外,另外混合碳化钛(TiC)、碳化钨(WC)或镍(Ni)粉末,比较例1仅单纯使用碳黑作为导电填料,比较例2-4使用CB搭配TiC、WC或Ni粉,但相较于实施例使用较高重量比例的TiC、WC或Ni粉,其中CB粉末与TiC、WC或Ni粉末的重量比例约1:5。结晶性高分子聚合物于PTC材料层中的重量百分比约10%~30%。导电碳黑粉末于PTC材料层中的重量百分比介于15%至40%之间,或可为20%、25%、30%、35%或45%。金属或导电陶瓷粉末占PTC材料层的重量百分比介于30%~70%,或可为35%、40%、45%、50%、55%、60%或65%。本发明实施例中,CB粉末与TiC、WC或Ni粉末的重量比例都小于1:4,也就是说金属或陶瓷导电粉末除以碳黑粉末的重量比值小于4。其中实施例1~3的(CB:TiC、CB:WC、CB:Ni)比例约1:3.9(重量比值约3.9),实施例4~6的CB:TiC、CB:WC、CB:Ni比例约1:1(重量比值约1)。比较例1的导电填料仅包含碳黑粉末,比较例2~4的CB:TiC、CB:WC、CB:Ni的重量比约1:5(重量比值约5)。
表一
聚合物 | 碳黑 | TiC | WC | Ni | CB:TiC | CB:WC | CB:Ni | ρ | |
比较例1 | 44.0% | 56.0% | - | - | - | - | - | - | 0.5140 |
比较例2 | 17.0% | 19.5% | 35.5% | - | - | 1:5 | - | - | 0.2807 |
比较例3 | 12.0% | 14.7% | - | 73.3% | - | - | 1:5 | - | 0.1998 |
比较例4 | 13.0% | 14.5% | - | - | 72.5% | - | - | 1:5 | 0.0981 |
实施例1 | 17.0% | 16.6% | 65.0% | - | - | 1:3.9 | - | - | 0.3163 |
实施例2 | 13.0% | 17.4% | - | 68.2% | - | - | 1:3.9 | - | 0.2206 |
实施例3 | 14.0% | 17.2% | - | - | 67.3% | - | - | 1:3.9 | 0.1532 |
实施例4 | 27.0% | 36.5% | 36.5% | - | - | 1:1 | - | - | 0.4261 |
实施例5 | 27.0% | 36.5% | - | 36.5% | - | - | 1:1 | - | 0.3169 |
实施例6 | 29.6% | 35.2% | - | - | 35.2% | - | - | 1:1 | 0.3925 |
本发明的过电流保护元件的制作过程如下:将批式混炼机(Haake-600)进料温度定在160℃,进料时间为2分钟,进料顺序为按表一所示的重量,加入定量的结晶性高分子聚合物,搅拌数秒钟,再加入导电粉末(碳黑、碳化钛、碳化钨或镍粉)。碳化钛、碳化钨或镍粉的粒径大小介于0.1μm至50μm之间,碳黑粉末的粒径大小介于15nm至75nm之间。混炼机旋转的转速为40rpm。3分钟之后,将其转速提高至70rpm,继续混炼7分钟后下料,而形成一具有PTC特性的导电复合材料。
将上述导电复合材料以上下对称方式置入外层为钢板,中间厚度为0.33mm及0.2mm的模具中,模具上下各置一层铁弗龙脱模布,先预压3分钟,预压操作压力50kg/cm2,温度为180℃。排气之后进行压合,压合时间为3分钟,压合压力控制在100kg/cm2,温度为180℃,之后再重复一次压合动作,压合时间为3分钟,压合压力控制在150kg/cm2,温度为180℃,之后形成一PTC材料层11,如图1所示。本实施例中,该PTC材料层11的厚度为0.3mm,通常大于0.1mm,或较佳地大于0.2mm。
将该PTC材料层11裁切成20mm×20mm的正方形,再利用压合将二金属箔片12直接物理性接触于该PTC材料层11的上下表面,其于该PTC材料层11表面以上下对称方式依序覆盖金属箔片12。该金属箔片12可含瘤状(nodule)突出的粗糙表面并与PTC材料层11直接物理性接触。接着,压合专用缓冲材、铁弗龙脱模布及钢板而形成一多层结构。该多层结构再进行压合,压合时间为3分钟,操作压力为70kg/cm2,温度为180℃。之后,以模具冲切形成3mm×4mm的过电流保护元件10。
PTC材料层11的体积电阻值(ρ)可根据式(1)计算而得:
其中R为PTC材料层11的电阻值(Ω),A为PTC材料层11的面积,L为PTC材料层11的厚度。各实施例和比较例经上述公式换算后,PTC材料层11的体积电阻值(volumetricresistivity)记载于表一。由表一可知,本发明实施例的体积电阻值介于0.07至0.45Ω-cm之间,其亦可为0.1Ω-cm、0.15Ω-cm、0.2Ω-cm、0.3Ω-cm、0.4Ω-cm。
以下表二显示过电流保护元件的电阻再现性(Rjump)和循环寿命测试结果。过电流保护元件10在触发100次及300次的状态下的电阻值R100及R300和初始电阻值Ri的比值亦显示在表二中。以下利用触发300次的电阻再现性进行说明。由实施例1~6的数值显示,本发明的电阻再现性R300/Ri均小于5,或约在1.5至5之间。R100/Ri则约在1~3的范围。以实施例4~6而言,R300/Ri约在1.5~3。然而,比较例1单纯使用碳黑者虽然R300/Ri较低,约2.74,但是其体积电阻率ρ过高,约0.51Ω-cm。比较例2~4分别使用TiC、WC和Ni者,虽然体积电阻率ρ较低,但其R300/Ri均大于5,或R100/Ri大于3。
另外,将各比较例和实施例的过电流保护元件进行300次循环寿命测试,以8V/50A测试为例,每次循环施加电压8V和电流50A维持10秒,之后于无电压电流情况下维持60秒,总共执行300次,并查看元件是否有烧毁现象。另外施加不同电压和电流12V/50A、16V/50A、20V/50A和30V/50A按同样步骤进行测试,若并将测试结果记载于表二。仅使用碳黑的比较例1,除了有电阻率较高的缺点外,且无法通过20V/50A和30V/50A的循环寿命测试。同时添加CB和TiC的比较例2,其R300/Ri过高(约8.31),且无法通过20V/50A和30V/50A的循环寿命测试。同时添加CB和WC的比较例3,其R300/Ri较高,约6.53,且无法通过16V/50A、20V/50A和30V/50A的循环寿命测试。同时添加CB和Ni的比较例4,其R300/Ri约5.47,且无法通过16V/50A、20V/50A和30V/50A的循环寿命测试。反观本发明的实施例1~6,同时具有体积电阻率小于0.45Ω-cm,R300/Ri小于5,以及通过16V/50A的300次循环寿命测试。另外,选择CB和TiC作为导电填料的实施例1和4,其可通过全部的循环寿命测试(包含20V/50A、30V/50A),而不致烧毁,具有最佳的循环寿命测试结果。
表二
显然碳黑可有效改善单纯使用陶瓷填料的电阻再现性不佳的情况,而金属或导电陶瓷粉末可有效降低体积电阻率。另外,选择适当重量比例的碳黑粉末和金属或导电陶瓷粉末,可进一步改善循环寿命测试的结果。
除上述表列的材料外,PTC材料层可选用具结晶性的聚烯烃类聚合物(例如高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、聚乙烯蜡、乙烯聚合物、聚丙烯、聚氯乙烯或聚氟乙烯等)、烯烃类单体与压克力类单体的共聚合物(例如乙烯-压克力酸共聚合物、乙烯-压克力脂共聚合物)或烯烃类单体与乙烯醇类单体的共聚合物(例如乙烯-乙烯醇共聚合物)等,并且可以选用一种或多种聚合物材料。该低密度聚乙烯可用传统Ziegler-Natta催化剂或用Metallocene催化剂聚合而成,亦可经由乙烯单体与其它单体(例如:丁烯(butene)、己烯(hexene)、辛烯(octene)、丙烯酸(acrylicacid)或醋酸乙烯酯(vinylacetate))共聚合而成。
金属粉末可选自:镍、钴、铜、铁、锡、铅、银、金、铂及其合金。
上述导电陶瓷粉末可选自:碳化钨、碳化钒、碳化钛、碳化硼、碳化硅、碳化锗、碳化钽、碳化锆、碳化铬、碳化钼、硼化钛、硼化钒、硼化锆、硼化铌、硼化钼、硼化铪、氮化锆及其组合,例如混合物、固溶体(solidsolution)或核壳体(core-shell)。导电陶瓷粉末外型包含破碎状、多角型、球形或片状,粒径大小介于0.1μm至50μm之间。
因为当PTC材料达到低于1Ω-cm的体积电阻值时,因为阻值低,常无法承受较高的电压。本发明相较于习知技术已相当程度提升耐电压特性。然而若需进一步提升耐电压性,亦可考虑另外添加以无机化合物为主的非导电填料于PTC材料中。例如:氮化硼、氮化铝、氧化铝或氢氧化镁(其粒径大小介于0.1μm至30μm之间),以增加承受较高的电压和电流。
本发明采用适当比例的碳黑和导电金属或陶瓷粉末作为PTC材料层的导电填料,可有效改善单纯使用陶瓷填料的电阻再现性不佳的情况,而金属或导电陶瓷粉末可有效降低体积电阻率。另外,可进一步改善循环寿命的特性,可耐较高的电压而不致烧毁。
本发明的技术内容及技术特点已公开如上,然而本领域的技术人员仍可能基于本发明的启示及公开而作种种不背离本发明精神的替换及修饰。因此,本发明的保护范围应不限于实施例所公开的内容,而应包括各种不背离本发明的替换及修饰,并被本申请的保护范围所涵盖。
Claims (13)
1.一种过电流保护元件,其特征在于,包括:
二金属箔片;以及
一PTC材料层,叠设于所述二金属箔片之间,且其体积电阻值在0.07至0.45Ω-cm的范围,其包含:
至少一结晶性高分子聚合物;
第一导电填料,其为碳黑粉末;
第二导电填料,选自至少一种的金属粉末、导电陶瓷粉末或其组合,第二导电填料的粒径大小介于0.1μm至50μm之间,且体积电阻值小于0.1Ω-cm;
其中所述第一导电填料和第二导电填料分散于所述结晶性高分子聚合物之中,且第二导电填料除以第一导电填料的重量比值小于4;
其中所述过电流保护元件的电阻再现性R300/Ri比值在1.5~5,Ri为起始电阻值,R300为触发300次后的电阻值。
2.根据权利要求1所述的过电流保护元件,其中所述结晶性高分子聚合物占PTC材料层的重量百分比为10%~30%,第一导电填料占PTC材料层的重量百分比为15%~40%,第二导电填料占PTC材料层的重量百分比介于30%~70%。
3.根据权利要求1所述的过电流保护元件,其中所述过电流保护元件的电阻再现性R300/Ri比值在1.5~3。
4.根据权利要求1所述的过电流保护元件,其中所述过电流保护元件的电阻再现性R100/Ri比值在1~3,R100为触发100次后的电阻值。
5.根据权利要求1所述的过电流保护元件,其中所述过电流保护元件可通过16V/50A的300次循环寿命测试而无烧毁。
6.根据权利要求1所述的过电流保护元件,其中所述结晶性高分子聚合物选自:聚烯烃类聚合物、烯烃类单体与压克力类单体的共聚合物、烯烃类单体与乙烯醇类单体的共聚合物及其组合。
7.根据权利要求1所述的过电流保护元件,其中所述结晶性高分子聚合物选自:高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、聚乙烯蜡、乙烯聚合物、聚丙烯、聚氯乙烯、聚氟乙烯、乙烯-压克力酸共聚合物、乙烯-压克力脂共聚合物、乙烯-乙烯醇共聚合物及其组合。
8.根据权利要求1所述的过电流保护元件,其中所述金属粉末选自镍、钴、铜、铁、锡、铅、银、金、铂及其合金。
9.根据权利要求1所述的过电流保护元件,其中所述导电陶瓷粉末选自:碳化钨、碳化钒、碳化钛、碳化硼、碳化硅、碳化锗、碳化钽、碳化锆、碳化铬、碳化钼、硼化钛、硼化钒、硼化锆、硼化铌、硼化钼、硼化铪、氮化锆及其组合。
10.根据权利要求1所述的过电流保护元件,其中所述第二导电填料包含碳化钛,且可通过30V/50A的循环寿命测试而无烧毁。
11.根据权利要求1所述的过电流保护元件,其中碳黑粉末的粒径大小介于15nm至75nm。
12.根据权利要求1所述的过电流保护元件,其中所述PTC材料层的厚度大于0.1mm。
13.根据权利要求1所述的过电流保护元件,其中所述金属箔片含瘤状突出的粗糙表面,并与所述PTC材料层直接物理性接触。
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